X-ray Inspection of Plated Throughhole Devices

X-Ray Inspection of Plated Throughhole Using X-ray

Bob Wettermann, MITNovember 2017

Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net

X-Ray Inspection-Plated Throughholes IPC-A-

610 G CriteriaYou DO NOT HAVE to x-ray inspect BTCs

according to the IPC-A-610 G


Plated Throughhole

Table 7-4 Plated-Through Holes with Component Leads - Minimum Acceptable Solder Conditions1

Criteria Class 1 Class 2 Class 3

A.

Vertical fill of solder for component with less than 14 leads2,3 (see 7.3.5.1)

Not Specified

75%

75%Vertical fill of solder for component with 14 leads or more2,3 (see 7.3.5.1)

50% or 1.2 mm [0.05 in],

whichever is lessNote 2. The 25% unfilled height includes both source and destination side depressions.Note 3: Less than 100% solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance. The user is responsible for identifying these situations to the manufacturer.

IPC–A-610 Rev G


Plated Throughhole 50% Hole Fil l


Plated Throughhole >75% Hole Fil l


Plated ThroughholeNon-inspectable visually


Plated Throughhole x-ray


Plated Throughhole x-ray


Improper Fil l


QC and Measurement

Screening Criteria Using x-ray

Voids in Throughhole

Courtesy of NPL

X-Ray Inspection of Plated Throughhole Using X-ray

[email protected]

Engineering

X-ray Inspection of Plated Throughhole Devices