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Member Biographies

Peter J. Nowosad - President and Director of Operations 20+ yrs. experience in project and customer support management

WW Broad semiconductor and equipment background CAD design for high-tech chemical/gas distribution systems Knowledgeable in diffusion, CVD, ALD, PVD, and Etch Based and living in Taiwan since 2000

Michel D. Ouaknine - Vice-President of European Operations µProcessor Apps Mgr. for 12 years with Intel, Intersil, and Zilog Authored 2 books on µP’s and ~ 40 technical & scientific papers CNAM ingénieur thesis on selective EPROM programming, 1976 Coordinator with EU organizations: CE standardization, working

with IMEC, LETI & Fraunhofer Institute SEMI S23 standard on Energy Conservation. Paris resident

Todd O. Curtis - V.P. and Chief Technical Officer 40 yrs. experience in III-V and Silicon: CVD/ALD processing and

integration R&D with IBM, Intel, TI, Motorola, SEMATECH, SELETE Japan, TSMC,

ST… Semi-Materials R&D Apps. Lab Mngr: equip, metro, staff, training,

facilities… Over 25 articles: CVD & ALD, silicon and III-V materials, device

integration Technology consultant to the 22nm node, selective deposition

patent Semi, Solar, LED, and Raw Materials Engineering. Taiwan resident

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Todd O. Curtis: Expanded Bio

Todd started his semiconductor career in 1973 at the Hewlett-Packard Opto-Electronics Division in Palo Alto California. He spent the next 15 years in L.E.D. and MESFET III-V materials production and development epitaxial operations at such notable companies as Siemens, Fairchild, Avantek, Gould-Dexcel, and Watkins-Johnson Microwave Group.

In 1989 he began his silicon materials career in Watkins-Johnson Semiconductor Products Division in Scotts Valley California at the cusp of the industry evolution from 150mm to 200mm wafers. Todd spent the next 15 years with Watkins-Johnson in equipment and process engineering working in production and R&D device and materials operations. Todd worked with and co-published technical papers with companies world-wide including INTEL, TSMC, UMC, Texas Instruments, ST Microelectronics, Motorola, IBM, Chartered, Samsung, Sematech, SMIC, Toshiba, Sony, and NEC.

His process development work in the early 1990’s on STI (shallow trench isolation), ILD (inter-level dielectrics) and IMD (inter-metal dielectrics) became mainstream production processes used in over 80% of the semiconductor factories world-wide. His last R&D project was at the 22 nano-meter technology node for ALD (atomic layer deposition) for high-K gate dielectrics and ALD tunable work-function metal gates.

His 40+ years of materials research and production experience includes III-V's for L.E.D. and MESFET's, and over 30 types of silicon related oxides, nitrides, and metals utilized in front-end and back-end applications.

He has been an independent technology consultant since 2003 for equipment and process in the fields of semiconductor, solar, and LED operations. He has lived in Taiwan since the year 2000 and travels frequently to Vietnam in support of his current projects.

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Todd O. Curtis Companies-Position-R&D Sites

Technicon 1971

Electrician

Hewlett-Packard 1973-1978 LED Epi & Xtal

Growth Ops.

Siemens Opto 1978-1979

GaAsP Epi R&D

Fairchild Opto 1979-1982 LPE, MOCVD III-V EPI R&D

Avantek GaAs 1982-1983

Military GaAs Epi & Implant

Dexcel-Gould 1983-1986

Military GaAs AsCl3 Epi &

Dev.

Si-Fab 1986-1988 Silicon Fab Equipment

WJ Microwave 1988-89

Military III-V MBE

WJ Semi. Equip. 1989-2000 APCVD, MOCVD Apps.

Lab R&D

ASML Thermal 2000-2003 ALD, APCVD, MOCVD R&D

Consulting 03-06

Genus-Aixtron 2006-2007 ALD R&D CVD

W

2007-Current Used Equip.

Technical Consulting

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GaAs ~ III-VProcess, Materials, Device, Equip.

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Hewlett-Packard 1973-1978Epi & Xtal

Growth GaAs, GaAsP, GaP

Siemens Opto 1978-1979

GaAsP VPE Epi R&D

Fairchild Opto 1979-1982 LPE, MOCVD III-V EPI R&D

Ternary & Quaternary

Avantek Microwave

1982-1983 Military GaAs

VPE Epi & Implant

Dexcel-Gould 1983-1986

Military GaAs AsCl3, MBE Epi & Device Process

WJ Microwave 1988-89

Military III-V MBE

Genus-Aixtron 2006-2007 ALD & EPI R&D

MOCVD

Over 15 yrs. of III-V

ExperienceProcess Materials Device Equipme

nt

AVANTEK

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GaAs ~ III-VProcess, Materials, Device, Equip.

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Process Epitaxy

MBE-MOCVDLPE-VPE

Cl3 & AsCl3Solid and Semi Solid

Sources

Materials

GaAsGaAsPGaP

AlGaAsInAlGaAs

P or N Doped

DeviceL.E.D.

MESFETSLo-noise

Power T and Y-gates Air Bridges

HEMT-Quad-Layers

Equip.ReactorsMetals

MetrologyParametric

TestCleans

All Types

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Michel D. Ouaknine: Expanded Bio

• Designed various frequency counters and real time control equipment. • Managed the design of a digital intelligent clock for industrial applications.• Microprocessors and communications controller support specialist.• Designed microprocessor application boards & data acquisition systems. • Managed Intel, then Intersil, microprocessor courses, launched Zilog Z800 & Z8000 microprocessor families, handled technical seminars & started the Intel European DRAM/EPROM test & analysis laboratory.• Created the subsidiary organization: sales, applications, marketing, customer service, bonded warehouse... • Addressed 3 different markets with a single organization, without conflicts nor duplicates.• Qualified WDC X.25 communications products with all key South Europe organizations (CNET, Transpac, Telefonica…) and customers (Olivetti, Bull, HP …).• Reorganized European operations: sales, service & process engineers, inventories in strategic locations...• Introduced WSi (tungsten silicide) and high energy implant processes into key European accounts.• Strategically re-focused European resources & grew EU sales to approximately 12 % of Genus revenues.• Initiated sales in South Europe, developed the company visibility & qualified Mattson into all major semiconductor manufacturers in France & Italy (& their US operations).• Global Account Manager for a major EU manufacturer, directly reporting to the president of our company, developed the strategy & the necessary high level contacts. Developed a strong partnership: joint papers & seminars; filed 2 joint patents.• Promoted to the responsibility of RTP European Sales on January 1st, 2000.

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Michel D. Ouaknine: Expanded Bio

• Technical presentations for new equipment & processes; organizing demos: preparation, execution & results review & analysis.• Participation to new process developments; lectures to scientific seminars.• Design engineer then applications manager for 12 years: design & support of microcomputers, real time and data acquisition systems with Intel, Intersil and Zilog Europe subsidiaries.• Initiated microprocessor & microcomputer courses for Intel customers & representatives.• Started the European DRAM memory test & analysis laboratory and designed the first EPROM programmer for Intel development systems.• Author of « La pratique des microprocesseurs », 1977, Paris & Intersil IM6100 µP course book.• Published ~40 papers in French & US magazines and for scientific symposia.• Quality operations to provide total customer satisfaction: technical support, well controlled deliveries & adequate follow up of customer requests.• Familiar with EU organizations while involved in Corporate projects : CE standardization, design center in Nice, France, distribution center in Amsterdam, The Netherlands...• Started the European operations for 4 different US companies: Western Digital (1984), Genus (1992), Mattson Technology (1996) and WaferMasters (2001).• Set up & organized the European branch office in France, in synchronization with operations growth: sales, applications, marketing, customer service, bonded warehouse & administration. • Developed sales with key EU companies through partnership: JDP, joint patents, papers and participation to scientific symposiums.• Global Account Manager at Mattson Technology for a major semiconductor manufacturer, reporting directly to the president.

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Michel D. Ouaknine Companies-Position

Dyna Electronique 1972-1974 Design Mngr.

Intel 1974 to

Apps. Engineer

Intersil Applications

Manager

Zilog to 1983

Applications Manager

Western Digital 1984-1990

Managing Director

Genus Inc. 1992-1996

Europe Director of Operations

Mattson Tech. 1996-2001

RTP Sales Manager

Wafer Masters 2001-2004

Europe Operations Manager

Technical and Sales Consulting 2004 to current