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WETWARES The technology, its applications and future prospects VISHAL ANAND RAJESH ROSHAN

Wet Wares

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Page 1: Wet Wares

WETWARES

The technology, its

applications and future

prospects

VISHAL ANAND

RAJESH ROSHAN

Page 2: Wet Wares

The structure of this presentation

o Introduction to the topic.

o Characterization

o Description of same

o Concept Involved

o Inspiration

o Advantages

o Application Today and Tomorrow

o Conclusion

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INTRODUCTIONSo What areWetwares ?

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What is Wetwares?

• Wetwares is the newest technology for Integrated

Circuits fabrication which uses liquid electrolyte for

cooling providing better temperature control and

improved reliability of our various hardwares.

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Characterisation

3C TECHNOLOGY

ELECTRONIC BLOOD TECH.

WETWARES

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3C TECHNOLOGY

• 3C technology stands for Complementary Cooling Chip.

In this process a chip containing liquid cooling micro-

channels are prepared which are attached to the back of

the conventional integrated chip packages.

• One of the approaches allows a simple monolithic

fabrication of cooling channels directly onto integrated

circuits using a CMOS-compatible technique.

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Researcher Bing

Dang,of Georgia

tech university

holds a silicon

wafer containing

chips with

embedded

microchannels

and a printed

circuit board

containing two

microfluidic

chips.

Continued…...

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PRESENT BULKY COOLING SYSTEM

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FUTURE IS HERE !!!!!

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By integrating the cooling microchannels

directly into the chip, we can eliminate a lot of

the thermal interface issues that are of great

concern.

Conventional cooling techniques, which depend

on heat sinks on the backs of ICs to transfer heat

into streams of forced air, will be unable to meet

the needs of future power-hungry devices –

especially 3D multi-chip modules that will pack

more processing power into less space.

HOW ITS BETTER

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Drawbacks IC is connected electronically – using a

conventional automated process known as flip-chip

bonding at a temperature around 400 to 700

celsius which can potential damage the host chip.

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ELECTRONIC BLOOD

Parallel to the 3C technology

IBM is working on similar

concept but in an advanced &

scientific way ,where they are

preparing Integrated chips

replicating brain structure and

its working.

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Inspiration behind the technology

• The engineers wanted to fit a supercomputer inside a

sugarcube but to do that they needed a paradigam shift

in electronics – they needed to replicate the human brain

as it is 10,000 times more efficient and dense than any

computer today.

• That’s possible because it uses only one efficient

network of capillaries and blood vessels to transport heat

and energy.

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• The liquid-cooling system not only keeps the computer's

chips at operating temperatures, but also delivers power,

similar to the human circulatory system that transports

heat as well as energy. It could be used to process power

that's densely packed into 3D space (pictured) rather than

spread out across flat circuit boards

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HOW IT WORKS

• IBM’s system, known as ‘redox flow’, moves an

electrolyte ‘blood’ which carries power in and takes heat

out.

• Two liquids called electrolytes, each with oppositely

charged electrical ions, will circulate through the system

to distribute power.

• The fluid-based power supply works similar to a battery:

Using central electrodes to charge the fluid – the

electrolyte – and discharging electrodes directly in the

chip stack.

• The electrolytes will travel through ever-smaller

tubes,going down to about the width of a human hair,

where they will pass their power to conventional

electrical wires

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A PROTOTYPE OF BRAIN ARCHITECTURE

IBM announced a new

programming

architecture for chips

inspired by mind.

It’s said the model is

tailored for a new class

of distributed, highly

interconnected,

parallel, large-scale

cognitive computing

systems.

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PROGRESS MADE SO FAR

Current test chips have been built by IBM researchers using

vanadium redox flow chemistry, which relies on the

electrochemical discharge of vanadium in different

oxidation states

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ADVANTAGES

• IT will lead to compactness of computers,reducing their

sizes manyfold.

• IT would increase the processing speed of the computer

• IT would process data more consuming very less power

• IT would increase the efficiency and lifetime of the

integrated circuits .

• IT can ultimately lead to failure of the “MOORE’S LAW”

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TECHNOLOGY CHALLENGING THE MOORE’S LAW

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VISION OF FUTURE

• If we combine our understanding of the brain with

CMOS (complementary metal–oxide–semiconductor)

devices, we can quickly create biomorphic computers,

which benefit from the best of nature and technology.

• By 2060, IBM envisions a one petaflop computer- which

takes up half a football field today- to fit on a desktop.

• chips could pave the way for smart sensor networks

that mimic the brain’s capacity for perception, action,

and thought.

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SOURCES

The following sources have been

indispensable throughout the making of

this presentation:

1. IEEE spectrum website

2. Wikipedia page on electronic blood

3. Howstuffworks.com

4. Pennstate student resources

5. Ramesh Raskar, Greg Welch,

Henry Fuchs Spatially Augmented

Reality

6. Rosen, Kenneth. "Contact Lenses

Can Display Your Text Messages“

7. Graham, M., Zook, M., and

Boulton, A. “COmaputer in urban

places: contested content and the

duplicity of code

Page 22: Wet Wares

Web reference for more.

• http://www.arcane-technologies.com/en/• en.wikipedia.org/wiki/wetwares

• http://www.bannerblog.com.IBM/news/2009/06/35_a

wesomeexamples.php• http://www.howstuffworks.com/electronic blood.htm

• http://www.ariser.info/

• http://www.dailymail.co.uk

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