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The top documents tagged [electrical interconnect]
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On-Chip Communication Architectures Emerging On-Chip Interconnect Technologies ICS 295 Sudeep Pasricha and Nikil Dutt Slides based on book chapter 13 1©
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Aero Industrial Sales - MRO AFRICA 2015
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13 SEER Ductless Mini Splits Product, Applications, Installation & Troubleshooting 2009 QUI-QSMSPAL-002
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IC Processing. Initial Steps: Forming an active region Si 3 N 4 is etched away using an F-plasma: Si3dN4 + 12F → 3SiF 4 + 2N 2 Or removed in hot
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© 2006 IBM Corporation The Young Faculty Workshop July 27, 2009 Working with Industry Shishpal Rawat VP, Technical Initiatives, CEDA Director, Business
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Optical I/O Technology for Chip-to-Chip Digital VLSI Ian Young Intel Fellow Director, Advanced Circuits and Technology Integration Logic Technology Development
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Hybrid Solar Thermal Integration at Existing Fossil Generation Facilities
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