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SPONSORSHIP OPPORTUNITIES: For more information, contact Mike Hendrickson at [email protected] or 617.499.7463

Software/Hardware/Everywhere San Francisco, CA | May 21 – 22, 2014

We placed big bets on Web 2.0 and Big Data, and now, with our new conference, Solid, we’re betting on the opportunities we see coalescing around software-enhanced, networked hardware.

We invite you to join us.

©2014 O’Reilly Media, Inc. The O’Reilly logo is a registered trademark of O’Reilly Media, Inc. 14228

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S O L I D C O N F E R E N C EM AY 2 1 – 2 2, 201 4

S A N F R A N C I S C O, C A

F O R M O R E I N F O R M AT I O N C O N TAC T M I K E H E N D R I C K S O N

M I K E H@O R E I L LY.C O M

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S O L I D C O N F.C O M

THE BIG IDEAThe physical world is about to experience the disruption of the Internet. Software and hardware are blurring together and new ways of manufacturing are emerging. Now you can create products never before imagined, exploit new efficiencies, and build entirely new business models.

SIGNALS THAT IT’S CATCHING ONSearches for the common terms that describe this space—Internet of Things, Internet of Everything, Industrial Internet, the Programmable World, Intelligent Things, M2M, Maker-Pro, Generative Things, and Machine-Data—are increasing dramatically, pointing to growing interest in this emerging market.

HOW BIG IS THE MARKET? HUGEOpinions on how fast the industry will grow (and even how the industry is defined) vary. Rob Lloyd, Cisco’s president of development and sales, predicts the Internet of Things will be a $14.4 trillion industry within the next decade; IDC predicts a $7.3 trillion market by 2017; and Gartner predicts a $1.9 trillion dollar market by 2020. But all signs point towards phenomenal growth.

“The O’Reilly conferences are the gold standard for drawing together a critical mass of thought leaders.”

STEVE GILLMOR

CRN

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The O’Reilly Solid Conference is where engineers, software programmers, researchers, product managers, roboticists, designers, venture capitalists, innovators, and business leaders will gather to explore how the worlds of programming and engineering are colliding—and what opportunities this perfect storm of intelligent things will bring.

CORE THEMES & TRACKSThe collision of software and hardware is fueling the creation of a software-enhanced, networked physical world. The impact of this phenomenon goes far beyond the development of intelligent new consumer products, exploiting new efficiencies, and creating entirely new business models. Some of the themes that we see as essential:

■■ Manufacturing made frictionless

■■ APIs for the physical world

■■ Software intelligence above the level of a single machine

■■ Every company is a software company

■■ Data-driven things as a service

■■ Designing for the post-screen world

Solid will be tackling the full depth and breadth of the disruption. Sessions are organized into 5 main tracks:

■■ Solid Companies: Funding, product development, marketing—everything you need for success, whether your organization is a nimble start-up or a long-established business.

■■ Solid Machines: Design, prototyping, manufacturing, implementation—the entire process of making things real, from idea to manufacturing and shipping.

■■ Solid Society: Cities, health, developing world, economics—how to build products and services which improve our cities, personal health, and the world economy.

■■ Solid Foundations: Materials, synthetic biology, fundamental technologies—all the underlying technologies that compose and power our connected world.

■■ Solid Tools: The protocols, technologies, and techniques necessary to make ideas become reality.

“Hardware startups are looking like the software startups of the previous digital age.”

JOI ITO

DIRECTOR, MIT MEDIA LAB, AND SOLID CONFERENCE CO-CHAIR

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WHAT IS SOLID?A new market is emerging at the intersection of hardware and software. Solid is telling the story and convening the players.

The Solid Program Committee, led by Program Chairs Joi Ito of MIT Media Lab and Jon Bruner of O’Reilly Radar, have lined up a stellar lineup of the movers, shakers, experts, designers, innovators, investors, and visionaries in this nascent space to provide a clear vision of what the future holds.

But Solid will also showcase how to use these technologies today to create new products, go from idea to prototype to market in weeks rather than years; to optimize their operations; to instrument inexpensively; and to bring their products into new markets.

This industry requires something more than a typical butts-in-seats, heads-on-stage conference. That’s why Solid isn’t being held at some cookie-cutter conference center. It’s being held on the San Francisco waterfront at Fort Mason. Expect an Expo Hall with some jaw-dropping demos and a crowd of thought leaders, decision makers, and influencers from fields as diverse as manufacturing, supply chain, wearables, robotics, environmental sensing, health monitoring, and 3D printing, who are all looking for the chance to get up close with the tools and technologies they’ll need to chart their future.

So it’s also not a cookie-cutter conference exhibiting opportunity. Solid is a great opportunity to break out of your booth and use your imagination. Want to make a really big splash? Solid is the place to do it.

WHY O’REILLY?From Web 2.0 to web performance to big data, we have a knack for knowing what’s important now and what will be important next. That’s why the company is followed by venture capitalists, business analysts, news pundits, tech journalists, and thought leaders who don’t want to miss out on the next big thing.

In the US, Europe, and Asia, O’Reilly’s Conferences and Summits have forged new ties between industry leaders, raised awareness of technology issues we think are important, and crystallized the critical issues around emerging technologies.

We don’t say this to brag. We say it to make a point: we’re not easily hypnotized by hype. We’ve seen the bubbles build and burst. We’ve been tapping into a deep network of alpha geeks and thought leaders to recognize the truly disruptive technologies amidst the fluff for over three decades. So when we invest in a conference, we’re not just following the hype, we’re committed to creating a community around an issue we believe is transformative.

We believe the programmable world—by whatever name you want to call it—is hugely transformative. That’s why we‘ve created Solid.

“The barriers between software and the physical world are falling.”

JON BRUNER

SOLID CONFERENCE CO-CHAIR

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WHO WILL ATTEND SOLID?■■ Business Leaders who want to harness the upcoming disruptive innovation, stay

competitive, and understand uncharted business models where things are also services.

■■ Investors who want to stay ahead of this disruptive innovation—and prosper from it.

■■ Innovators and Start-ups in the new digital industrial economy actively seeking the latest solutions to optimize efficiencies, increase productivity, attract funding, and grow.

■■ Software Developers who create intelligent, cost-effective, and beautifully designed things that join the digital world to the physical world.

■■ Hardware Engineers who want their elegantly engineered things to be well designed, connected, intelligent, and adaptive.

■■ Product Managers and Marketing Execs looking for new ways to connect with customers in an era of screen fatigue and fragmented attention.

■■ Academics carrying out the basic research in engineering and the sciences that will enable the connected, sensor-enabled world.

■■ Government Policy Makers and Engineers who define and build connected infrastructures like intelligent transportation, pollutant sensor-networks, and better social-services delivery.

“We should be looking at it as a way to address our needs as human beings… to connect people to the Internet more elegantly, not just as a source for more toys.”

KELSEY BRESEMAN

ENTREPRENEUR AT TECHNICAL MACHINE AND SOLID CONFERENCE PRESENTER

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“Rather than seeing industrial device owners as barriers to progress, we should be looking for ways to help industrial devices become as connected as appropriate.”

VARUN NAGARAJ

SVP OF INTERNET OF THINGS, ECHELON

REGISTERED TITLES

5% CTO

14% DIRECTOR

9% PRINCIPAL

4% MANAGING DIRECTOR

4% SOFTWARE ENGINEER

3% SENIOR EDITOR

3% CREATIVE DIRECTOR

3% ENGINEER

4% CO-FOUNDER

9% VP

9% SENIOR

MANAGER

2% GRADUATE STUDENTOWNERPRODUCT MANAGERSTUDENTSVP

14% CEO

10% FOUNDER

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VP, Product IoT Accenture

VP, Platform Engineering Aeris Communications

Product Manager Aerofex

Director of Marketing Alaska Airlines

UX Designer Alaska Airlines

Mechanical Engineer ARM

Senior Technical PM Ars Electronica Futurelab

Senior User Experience Designer Autodesk

Enterprise Architect Cascade Engineering

CEO Cinco Capital GmbH

Product Manager Cisco

Senior Business Analyst Comcast Cable

Principal Engineer Comcast Silicon Valley Innovation Center

Director, Strategic Innovation Danaher Corporation

Head of Strategy Deloitte–Center for the Edge

Director of Research Eli Lilly and Company

Principal Systems Engineer Enphase Energy

Manager Innovation FedEx

VP, Business Innovation Fujitsu Labs of America

Senior Software Engineer General Dynamics

Technology Analyst General Motors

Innovation Design Director Google Creative Lab

Head of Technology Acquisition Hasbro

Principal Scientist HP

Principal Standards and iControl Networks Ecosystem Evangelist

Interaction Designer IDEO

VP, Strategy Interana

VP, Engineering Interana

CEO Lellan LLC

Director, Software Engineering Marvel Semiconductor

Diretcor of Technology Maxus Global

Founder & President MINIMAL

Product Manager Moxa

Lead Software Engineer NAVTEQ

VP, Business Development Neo Innovation, Inc.

Chief Strategy Officer NGRAIN

VP, Advanced Engineering Nokia

Principal Designer Nokia/Here

Director Research & Development NTT Data

Technical Director Nurun Reseach & Development

Technology Analyst Orange

Agile SoftwareEngineer Pivotal Labs

Senior Mechanical Engineer Purdue University

Senior Manager, Engineering Raven Standard LLC.

Director of Engineering Re/code

CEO ReZolt

Information Security Senior Analyst Samsung Mobile

UX Director Samsung Research

Diretor, Marketing Research SapientNitro & Analytics

Manager, Corporate Shasta Ventures Business Development

Systems Test Business Development ShopLocket

Wireless Business Devlopment Silicon Valley Robotics

VP, Corporate Development SK Planet

VP, and Chief Architect Smart Design

Chief Software Architecture SNUPI Technologies

CEO SNUPI Technologies

Design Technologist Sociometric Solutions

Senior Technical Director Spacehack.org

Creative Technology Consultant Stamen Design

Executive Vice President Stanford

Executive Vice President Superhuman Limited

Executive Vice President Symantec

Executive Vice President Synthetos

President T4G Limited

Senior Product Manager Telenav

Director, Wireless Business Teradyne Development

Head of Corporate Development Teradyne

VP, Marketing and The Center for Bits and Atoms at MIT Ecosystem Development

Agilist and Tinker The Kippworks

Art Director The Register

Head of Technology ThoughtWorks

Senior Software Developmer ThoughtWorks

Advisor to the CEO & CTO Tindie

VP, Corporate Strategy TinyPipes

Senior Director, Experience Design Twitter

Co-Founder Twitter

Technical Director USC Annenberg Innovation Lab

VP, Product Strategy VeriSign

Product Strategy Version One Ventures

UX Designer Watershed

SVP, Innovation West Cary Group

SAMPLE SNAPSHOT OF PRE-REGISTERED ATTENDEES

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Exclusive sponsorship of one of four main areas in the Solid Expo Hall, built for showcasing demos of innovation and immersive experience:

■■ Solid Companies: Funding, product development, marketing; managing innovation inside companies large and small; building sustainable businesses

■■ Solid Machines: Design, prototyping, manufacturing, implementation■■ Solid Society: Cities, health, developing world, economics; finding ways to drive

democratization with technology■■ Solid Foundations: Materials, synthetic biology, fundamental technologies;

new technologies from universities and research organizations

THOUGHT LEADERSHIP■■ (2) Article sponsorships on a Solid-related topic*■■ (3) Guest blogs posted on our sites (consultation and approval from an O’Reilly

editor required)*■■ (1) 5-minute video, depicting your company’s innovative story (curated and produced

by O’Reilly), shown during Solid and distributed in all O’Reilly channels after the event

ACCESS■■ (10) 2-day conference passes plus up to (6) booth staff passes■■ Additional 2-day passes at a 25% discount

EXPOSURE■■ Company logo, link, and description on event website and mobile app■■ Opportunity to host a private event at Solid (F&B charges not included)■■ Top-tier sponsorship designation on event website and in the Solid event app■■ Main Stage branding: sponsor message shown in housekeeping slides■■ Onsite signage: double-sided meter board placed in a high-traffic location■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house)■■ Access to press list and press kit distribution

PRESENCE■■ 20' x 20' exhibit space or turn-key demo area for one of the four main

showcasing areas

* Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the

year of the conference

SPONSORSHIP LEVELS

CARBON FIBER SPONSORSHIP $100,000 (LIMIT 4)

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THOUGHT LEADERSHIP■■ (1) Article sponsorship on a Solid-related topic*■■ (2) Guest blogs posted on our sites (consultation and approval from an O’Reilly

editor required)*■■ Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo,

and link)*

ACCESS■■ (6) 2-day conference passes plus up to (4) booth staff passes■■ Additional 2-day passes at a 25% discount

EXPOSURE■■ Company logo, link, and description on event website and mobile app■■ Main Stage branding: sponsor message shown in housekeeping slides■■ Content alignment sponsorship: Exclusive sponsorship of one Solid program track.

Includes signage onsite and three handouts of sponsor literature outside of related sessions of sponsor’s choice

■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house)■■ Access to press list and press kit distribution

PRESENCE■■ 10' x 20' space for demo at Solid



SPONSORSHIP LEVELS

THERMOPLASTIC SPONSORSHIP $50,000 (LIMIT 3)

Premier Area and Demo Space. Deploy demo of innovation and immersive experience to showcase your system, tools, equipment, lab, etc. Multiple opportunities available per area.

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THOUGHT LEADERSHIP

■ (1) Guest blog posted on our sites (consultation and approval from an O’Reilly editor required)*

■■■Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo, and link)*

ACCESS■■■(1) 2-day conference pass plus up to (4) booth staff passes■■■Additional 2-day passes at a 25% discount

EXPOSURE■■■Company logo, link, and description on event website and mobile app■■■Access to press list and press kit distribution

PRESENCE■■■10' x 10' space for demo at Solid



ACCESS■■■(1) 2-day conference pass plus up to (4) booth staff passes■■■Additional 2-day passes at a 25% discount

EXPOSURE■■■Company logo, link, and description on event website and mobile app■■■Access to press list and press kit distribution

PRESENCE■■■6' table-top space for demo, including electrical and internet

SPONSORSHIP LEVELS

ALUMINUM SPONSORSHIP $25,000

Premier Area and Demo Space. Showcase your company’s innovations in the Solid space. Multiple opportunities available.

EMERGENT INNOVATOR $5,500

Unique Sponsor Demo. Provide attendees with a state-of-the-art demo showcasing your company’s innovations in the Solid space.

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EXPECTED PRESS COVERAGE

“Very much a work in progress, the stack for IoT will require rethinking every layer of the protocol stack.”

MATTHEW GAST

AEROHIVE NETWORKS

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PROGRAM COMMITTEEMarko Ahtisaari

Chris Anderson, 3D Robotics

Paola Antonelli, Museum of Modern Art

Ayah Bdeir, littleBits

Matt Biddulph, Product Club

Mike Bove, MIT Media Lab

Kipp Bradford, Kippworks

Rodney Brooks, Rethink Robotics

Liam Casey, PCH International

Tom Coates, Product Club

Rob Coneybeer, Shasta Ventures

David Cranor, MIT Media Lab

Kenneth Cukier, The Economist

Michael Dewar, New York Times

Renee DiResta, O’Reilly AlphaTech Ventures

Ian Ferguson, Formlabs

Brady Forrest, Highway1

Limor Fried, Adafruit

José Gómez-Márquez, MIT Little Devices Lab

Horst Hoertner, Ars Electronica Futurelab

Henry Holtzman, MIT Media Lab

Rachel Kalmar, Misfit Wearables

Michael Korpi, Baylor University Film & Digital Media

Coco Krumme, MIT

Natan Linder, MIT Media Lab

Pranav Mistry, Samsung Think Tank Team

Joe Paradiso, MIT Media Lab

Amanda Parkes, Columbia University

Arthur Petron, MIT Media Lab

Amanda Peyton, Grand St.

Ivan Poupyrev, Walt Disney Research

Venkatesh Prasad, Ford Motor

Colin Raney, IDEO

Antonio Rodriguez, Matrix Partners

Andy Rubin, Google

Peter Semmelhack, Bug Labs

Yodit Stanton, opensensors.io

Gerfried Stocker, Ars Electronica Center

Linda Stone, Generalist

Phil Torrone, Adafruit

Bruce Upbin, Forbes

Trae Vassallo, Kleiner Perkins Caulfield & Byers

Ben Waber, Sociometric Solutions

Jenn Webb, O’Reilly Media

“The imbrication of digital and analog environments is bringing us to a revolutionary information crossroads.”

ANDY FITZGERALD

DELOITTE DIGITAL

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ASSIGNMENT OF SPACE: O’Reilly shall assign the booth, display and/or tabletop space as agreed to under this Agreement for the period of the display and such assignment will generally be made no later than four weeks before the Event. Location assignments will be on a first-come, first-served basis, may be modified by O’Reilly due to changes in Event layout, venue or other factors, and will be made solely at the discretion of O’Reilly.

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