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© 2016 Paumanok Group Consulting
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Ceramic Chip Inductors: Mul6layered and Thin Film Ceramic Inductors World Markets, Technologies & Opportuni6es:
FY 2016-‐2021
Ceramic Chip Inductors: Mul6layered and Thin Film Ceramic Inductors World Markets, Technologies & Opportuni6es:
FY 2016-‐2021
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Copyright ©July 2016 Paumanok Publica6ons, Inc. Published by: Paumanok Publica6ons, Inc.
Publica6on Date: JULY 2016
Paumanok Publica-ons, Inc. 502 Ballad Creek Court Cary NC, 27519 USA
www.paumanokgroup.com Customer Service: (919) 468-‐0384 Email: [email protected]
MARKET RESEARCH BY
Dennis M. Zogbi [email protected]
© 2016 Paumanok Group Consulting
A NEW MARKET RESEARCH REPORT COVERING THE WORLD MARKET FOR:
• Mul6layered Ceramic Chip Inductors
• Thin Film Ceramic Chip Inductors
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TABLE OF CONTENTS • SECTION ONE: INDUCTORS: GLOBAL MARKET UPDATE: FY 2016 (OUTPERFORMING IN PASSIVES) 13 • SECTION TWO: CERAMIC CHIP INDUCTORS: GLOBAL MARKETS: FY 2016 (HIGH GROWTH FOR HIGH FREQUENCY)
25 • High Frequency Ceramic Inductors: (Thick Versus Thin Film): FY 2016 27 • Global ConsumpFon Value For Ceramic Chip Inductors World Region: FY 2016 EsFmates 30 • Ceramic Inductor Chip Markets By Case Size: FY 2016 35 • Ceramic Chip Inductor Markets by Thickness (The Fast Growth Low Profile Market); FY 2016 45 • Ceramic Chip Inductor Markets By Inductance Range (Nanohenry nH Profit Centers): FY 2016 50 • Ceramic Chip Inductors: Demand By Q Range (In Ghz): 57 • Ceramic Chip Inductor Markets By Maximum Rated Current (In Milliamps) 65 • VENDOR MARKET SHARES: CERAMIC INDUCTORS: FY 2016 73 • Thick Film MulFlayered Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares: 77 • Thin Film Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares: 79 • CORPORATE STRATEGIES IN DISCRETE INDUCTORS-‐ THE RIGHT PRODUCT FOR THE RIGHT MARKET 81 • THICK FILM MULTILAYERED CERAMIC CHIP INDUCTORS: GLOBAL PRODUCT OFFERINGS AND COMPETITIVE ANALYSIS BY VENDOR: FY
2017 83 • THIN FILM CERAMIC CHIP INDUCTORS: GLOBAL PRODUCT OFFERINGS AND COMPETITIVE ANALYSIS BY VENDOR: FY 2017 93 • SECTION THREE: CERAMIC INDUCTORS: MARKET FORECASTS TO 2021 (HIGH GROWTH IN HIGH GHZ) 100 • FORECASTS: HIGH FREQUENCY CERAMIC INDUCTOR FORECASTS TO 2021 100 • FORECASTS: GLOBAL CONSUMPTION VALUE FOR CERAMIC CHIP INDUCTORS: 2016-‐2021 105 • Market Forecasts By End-‐Use Market Segment: FY 2016-‐2021 108 • Ceramic Inductor Markets: Forecasts By Frequency Band: FY 2016-‐2021 115 • SECTION FOUR: PRODUCER PROFILES (COMPARING TECHNOLOGY PLATFORMS) 123
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List of Tables • Figure 1: Global Value of Consumption for Discrete Inductors FY 2003 to FY 2016 Actual 14 • Figure 2: Global Volume of Consumption for Discrete Inductors: FY 2007-2016 In Billions of Pieces: 16 • Figure 3: Average Unit Selling Price for Discrete Inductors: FY 2007-2016 (In USD Per Thousand Pieces) 18 • Figure 4: Inductor Manufacturer's Index: Trends & Directions (Part 1) 20 • Figure 5: Inductor Manufacturer's Index: Trends & Directions (Part 2) 21 • Figure 6: Global Consumption Value for Discrete Inductor, Coils and Cores By Configuration: FY 2016 (Surface Mount,
Throughole and Core) 22 • Figure 7: Global Consumption Value For Surface Mount Inductors By Type: FY 2016 24 • Figure 8: Global Consumption Value for Multilayered Ceramic Chip Capacitors By End-Use Market Segment: FY 2016 29 • Figure 9: Global Consumption Value for Ceramic Chip Capacitors By World Region: FY 2016 32 • Figure 10: High Frequency Ceramic Chip Inductor Markets By Type: (Thick Versus Thin Film): FY 2016 34 • Figure 11: High Frequency Ceramic Chip Inductor Markets By Case Size: (O1OO5, O2O1, O4O2, O6O3, O8O5, Other): FY
2016 37 • Figure 12: High Frequency Ceramic Chip Inductors: Competition by Case Size: (Thick Versus Thin Film): FY 2016 42 • Figure 13: Number of Manufacturers Globally for Ceramic Chip Inductors by Case Size: FY 2016 44 • Figure 14: Minimum Thickness of MLCI and Thin Film Chip Inductors: 2016 By Case Size (In mm) 47 • Figure 15: Ceramic Vendors by Case Size and Inductor Thickness (Thick and Thin Film): FY 2016 49 • Figure 16: Maximum Inductance Capabilities By Chip Inductor Case Size: 52 • Figure 17: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O1OO5 Case Size (0.2
to 47 nH) 53 • Figure 18: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O2O1 Case Size (47 to
100 nH) 54 • Figure 19: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O4O2 Case Size (101 to
330 nH) 55 • Figure 20: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: 0603 Case Size (331 to
680 nH) 56 • Figure 21: Competitive Environment in Ceramic Chip Inductors By Case Size and Inductance Range: O8O5 Case Size
(Legacy Part) 57 • Figure 22: Technology Trends & Directions: Q Factor By Ceramic Chip Case Size: FY 2016 58 • Figure 23: High Frequency Ceramic Chip Inductor Market by Minimum Q Factor: FY 2016 60 • Figure 24: 2 to 3 Minimum Q Factor and Competitive Environment: Leading Edge In Inductive Technology 61 • Figure 25: 4 to 8 Minimum Q Factor and Competitive Environment: FY 2016 62 • Figure 26: 9 to 12 Minimum Q Factor and Competitive Environment: FY 2016 63 • Figure 27: 13+ Minimum Q Factor and Competitive Environment: FY 2016 64 • Figure 28: Maximum Rated Current In MilliAmps (mA) for Multilayered and Ceramic Thin Film Inductors By Case Size: FY
2016 66 • Figure 29: Estimated Ceramic Inductor Consumption Value by MilliAmp Range: FY 2016 68 • Figure 30: Competition In The 80 to 350 mA Range in Ceramic Inductors: FY 2016 69 • Figure 31: Competition In the 351 to 470 mA Range in Ceramic Inductors: FY 2016 70 • Figure 32: Competition in the 471 to 900 mA Ceramic Chip Inductor Markets: FY 2016 71 • Figure 33: Competition in the 900 to 1200 mA Ceramic Chip Inductor Markets: FY 2016 72 • Figure 34: Competition in the Legacy Ceramic Chip Inductor Markets: FY 2016 73 • Figure 35: High Frequency Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares 76 • Figure 36: Multilayered Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares 78 • Figure 37: Corporate Strategies in Inductors- The Right Product For The Right Market: FY 2017 82 • Figure 38: TDK (EPCOS) MLCI Product Offering BY Case Size and Performance Criteria for FY 2017 83
Figure 39: Taiyo Yuden MLCI Product Offering BY Case Size and Performance Criteria for FY 2017 84 Figure 40: Samsung EMCO- MLCI Product Offering BY Case Size and Performance Criteria for FY 2017
85 Figure 41: Murata MLCI Product Offering BY Case Size and Performance Criteria for FY 2017 86 Figure 42: Mag Layers: Product Offering BY Case Size and Performance Criteria for FY 2017 86 Figure 43: AVX Corporation: Product Offering BY Case Size and Performance Criteria for FY 2017 87 Figure 44: Johanson Technology: Product Offering BY Case Size and Performance Criteria for FY 2017
88 Figure 45: Vishay-Dale: Product Offering By Case Size and Performance Criteria for FY 2017 88 Figure 46: Darfon: Product Offering By Case Size and Performance Criteria for FY 2017 89 Figure 46: Token: Product Offering BY Case Size and Performance Criteria for FY 2017 90 Figure 47: Viking: Product Offering BY Case Size and Performance Criteria for FY 2017 90 Figure 48: Chilisin: Product Offering BY Case Size and Performance Criteria for FY 2017 91 Figure 49: AEM Components: Product Offering By Case Size and Performance Criteria for FY 2017 91 Figure 51: Feng Hua Advanced Technology (Yingda Inductor Factory) Product Offering By Case Size and Performance Criteria for FY 2017 92 Figure 52: Shenzhen Microgate: Product Offering By Case Size and Performance Criteria for FY 2017
93 Figure 50: Thin Film Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares 80 Figure 51: Murata: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
94 Figure 52: AVX: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
95 Figure 53: Vishay-Dale: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017 95 Figure 54: Token: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
96 Figure 55: AEM: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
97 Figure 56: Darfon: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
97 Figure 57: Viking: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
98 Figure 58: Viking: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
98 Figure 59: Cyntec: Thin Film Inductor Product Offering By Case Size and Performance Criteria for FY 2017
99 Figure 60: High Frequency Bands and Related Nomenclature 101 Figure 61: Ultra Hi-Q Market Drivers (1 to 2.9 GHz): FY 2017-2021 102 Figure 62: Hi-Q Market Drivers (3.1 to 30 GHz): FY 2017-2021 103 Figure 63: Extremely Hi-Q Market Drivers (3.1 to 30 GHz): FY 2017-2021 104 Figure 64: Ceramic Chip Inductors: Global Market Forecasts for Consumption: FY 2016-2021 106 Figure 65: Forecasted Growth In Ceramic Inductors By End-Use Market Segment FY 2016-2021 108 Figure 66: Ceramic Inductor Forecasts By Frequency Range: FY 2016-2021 122
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Key Findings of Study
• Inductors outperforming other passive component products in FY 2016
• Key focus in Japan, Korea and China on producing inductors for increasingly higher frequencies.
• Mul6layered ceramic chip inductors and thin film ceramic inductors are driving component growth within the magne6cs segment.
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Cri6cal Points of Technology Differen6a6on: Volumetric Efficiency
• GOOD-‐Mul6layered Ferrite Metal Bead
Technology – Limited by Frequency – Limited by Case Size
• BETTER-‐ Mul6layered Ceramic Coil 3-‐D Technology – Ultra-‐High Frequency Capabili6es – Ultra-‐Small Case Sizes Available
• THINNER Profile-‐ Thin Film Chip – Ultra-‐thin technology required to – keep up with MLCC technology.
8 © 2016 Paumanok Group Consul6ng
Discrete Inductors: Type, Construction, Markets, Case Sizes and Vendors: 2007Product Case
Inductor Photo Inductor Type Construction Markets Sizes VendorsTDK
Wireless Handset Taiyo YudenMultilayered Computer Motherboard MurataStacked HDTV Tuner Vishay-Dale
Multilayered Ceramic Inductor Ceramic HDD O2O1 to O8O5 Kyocera/AVXCordless Phone Bourns/JW MillerDigital Camera Johanson TechnologiesGame Console AEM
Gang Song ElectronicsTaiyo YudenTT Electronics
Single Layered Wireless Handset Vishay-DaleFerrite Bead Extruded Ferrite Computer Motherboard O4O2 to 1206 Ceratech (Korea)
or Aluminum HDTV Tuner AEMOxide Materials. AOBA Technology Co. Ltd
Gang Song ElectronicsSkymos Microelectronics Ltd,
Castellated Wireless Handset TDKSingle Layered Computer Motherboard Taiyo YudenExtruded Ferrite HDTV Tuner Qauds and Octels TT Electronicsor Aluminum HDTV Backlight Vishay-Dale
Ferrite Bead Array Oxide Chips MP3 Ceratech (Korea)Connected By Alumina Digital Camera PanasonicBridge. AEMPhotolithography of Wireless Handset Kyocera/AVXInductive Film GPS Products O2O1 to O6O3 Vishay
Thin Film Inductive Chip Deposited On Pagers MurataCeramic Substrate Wireless LAN
TDKNikel-Chromium Wireless Handset Taiyo YudenWire Wrapped around Computer Motherboard Murata
Wirewound Vertical Chip a Vertical Alumina HDTV Tuner 1206 to 2525 PanasonicCore Tokin
CoilcraftVishayEPCOSMurataPanasonicTT Electronics
Nikel-Chromium Wireless LAN Vishay-DaleWire Wrapped around Computer Motherboards 03015 to 0805 Bourns/JW Miller
Wirewound Horizonal Chip a Horizontal Alumina Broadband Infrastructure Ceratech (Korea)Core and Epxoy Johanson TechnologiesMolded API Delevan
AOBA Technology Co. LtdGang Song ElectronicsTechnitrol/Pulse EngineeringABC Taiwan GroupSkymos Microelectronics Ltd,TDKTaiyo Yuden
Molded Ferrite CRT TV Monitor CoilcraftAxial Inductor Materials Thru CRT Computer Monitor Vishay-Dale
Axial Lead Wire VCR 2030 to 5080 API DelevanCD Player GowandaHousehold Appliances Gang Song Electronics
Bourns/JW MillerTDK
Molded Ferrite Household Appliances 5440 To 7080 Taiyo YudenMaterials Through Television Sets Coilcraft
Radial Inductor Radial Lead Frame TT ElectronicsVishay-DaleAPI DelevanBourns/JW MillerTDK
Molded and shaped EPCOSE Ferrite Core Ferrite Materials Telecom Infrastructure Ferroxcube (Yageo)
Into an E Mold SMPS Varies
TDKTelecom Infrastructure Taiyo YudenSMPS EPCOS
Pot Ferrite Core Pot and Fill Design Ultrasonics Ferroxcube (Yageo)Electrolysis Varies API DelevanWelding Gowanda
Spang/Magnetics
Varia%ons in Coil Technology Key Technology Pla4orms: 2016
Movement to Mul6layered Ceramic 3-‐Dimensional Ultra Small Case Size Chips {Lawsuit Murata/Samsung} Big Growth Here. Module Integra6on.
Extruded Single Layer Ferrite and Mul6layered Ferrite Metals. Limited Frequency Handling.
Extruded Single Layer Ferrite and Mul6layered Ferrite Metals. Pick and Place Solu6on. Limited Frequency Handling.
Barium Stron6um Titanate Thin Film Chips Samsung Has Entered. TDK Major Investment FY 2017. Big Growth Here. Hi-‐Q Markets.
Volumetric Efficiency Push is Constant.
Volumetric Efficiency Push is Constant.
Automo6ve Legacy product-‐ Shape is Key.
Legacy Products: White Goods
Some Innova6on in Germany
Some Innova6on in Germany 9
The Movement To Mul6layered Ceramic and Thin Film Inductor Chips
– Clear movement away from mul6layered ferrite beads in favor of mul6layered 3D formulated (P90 and NPO/COG) ceramic inductors for Smartphones for Hi-‐Q and small case size-‐ EIA 0201.
– Clear movement to thin film barium stron6um 6tanate induc6ve chips for high Q applica6ons for telema6cs, transport and power.
10 © 2016 Paumanok Group Consulting
End-‐Markets Discussed
• Wireless Handsets (Communica6on Modules) • Computers and Peripherals • Consumer Audio and Video Imaging • Automo6ve and Transport • Specialty Value-‐added and App Spec.
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Technology Markets Discussed
• MLCI Markets, Technologies & Opportuni6es: 2016-‐2021 (NPO Formula6ons, P90 Porcelain)
• Thin Film Markets, Technologies & Opportuni6es: 2016-‐2021 (Barium Stron6um Titanate)
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Ceramic Chip Inductor Demand By Case Size (EIA)
• NextGen 008004 • 01005 • 0201 • 0402 • 0603 • 0805 • 1206+
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Ceramic Chip Inductor Market Dichotomy: FY 2017
• Chip Thickness (Low Profile) • Inductance By Case Size • Q Factor Trends • Rated Current
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Market Shares FY 2016
• Mul6layered Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares
• Thin Film Ceramic Chip Inductor Vendors: FY 2016 Sales and Market Shares
• Corporate Strategies in Ceramic Chip Inductors: 2016-‐2021
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Detailed Compe66ve Analysis
• Vendors of Ceramic Chip Inductors Comparison by-‐ – Compe66on by Technology Base: Thick or Thin Film
– Compe66on by Case Size – Compe66on by Maximum Inductance Value and Case Size
– Compe66on by Frequency Range and Case Size – Compe66on by Rated Current and Case Size
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Forecasts To 2021
• Ceramic Inductors: Market Forecasts to 2021 (High Growth In High GHz)
• Ultra-‐Hi-‐Q Market Drivers (1 to 2.9 GHz): FY 2017-‐2021
• Super Hi-‐Q Market Drivers (3.1 to 30 GHz): FY 2017-‐2021
• Extremely Hi-‐Q Market Drivers (31 to 300 GHz): FY 2017-‐2021
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Producer Profiles
• Detailed analysis of 14 Manufacturers of Ceramic Chip Inductors in Both Thick and Thin Film: FY 2017
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Press Release Ceramic Chip Inductors World Markets, Technologies & Opportunities for Multilayered and Thin Film Ceramic Chip Inductors: 2016-2021 A Profitable Look At One of The Next Generation of Passive Electronic Component CARY NC USA- Paumanok Publications, Inc. has published“Ceramic Chip Inductors: World Markets, Technologies & Opportunities: 2016-2021 ISBN #:1-893211-99-1 (MLCI2016).” This new study is a detailed market and competitive analysis covering both the multilayered thick film ceramic chip inductor and thin film ceramic chip inductor markets worldwide. This study begins with a worldwide overview and update on the global inductor markets for FY 2016 and recent changes in the market regarding the global value, volume and pricing. The study then focuses specifically on the rapidly growing segment of the market for high frequency applications that employs frequency stable ceramic dielectrics, including NPO formulations, P90 porcelain and barium strontium titanate to achieve the desired inductance. The study offers a granular look at the ceramic chip inductor market and discusses the technology movement toward sputtering ceramic thin layers to augment or compete with ceramic green sheet stacking using air fired or gas fired techniques. The study compares the performance characteristics of thick versus thin film inductors in terms of thickness (low profile), inductance range, frequency range and rated current. A competitive analysis of all known product offerings in multilayered and thin film inductors is given by vendor and direct comparisons made in terms of volumetric efficiency and overall inductor performance. The study offers global demand for ceramic inductors by end-use market segment and by world region and forecasts growth for ceramic inductors in key end-use markets based upon operating frequency in modules, handsets, computers, TV sets, base stations, medical equipment, and much more. Detailed market share data for thick film and thin film ceramic chip inductors for FY 2016. Detailed forecasts for global consumption of ceramic chip inductors to 2021. Ceramic Chip Inductors: World Markets, Technologies & Opportunities: 2016-2021 ISBN #:1-893211-99-1 (MLCI2016),” 154 Pages, 66 Graphs, Published July 2016. $2750.00 USD. Ceramic Chip Inductors: World Markets, Technologies & Opportunities: 2016-2021 ISBN #:1-893211-99-1 (MLCI2016).” http://www.paumanokgroup.com/inductors-analysis/ceramic-chip-inductors-world-markets-technologies-opportunities-2016-2021-isbn-1-893211-99-1-mlci2016.html
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For Further Informa6on… • Complete Table of Contents and List of Figures • To Purchase and Download The Study
Ceramic Chip Inductors: World Markets, Technologies & Opportuni6es: 2016-‐2021 ISBN #:1-‐893211-‐99-‐1 (MLCI2016).”
Paumanok Publica-ons, Inc. 502 Ballad Creek Court Cary NC, 27519 USA
www.paumanokgroup.com Customer Service: (919) 468-‐0384 Email: [email protected]
MARKET RESEARCH BY
Dennis M. Zogbi [email protected]
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