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From Technologies
to Market
Equipment and Materials for
Fan-Out Packaging
Sample
Jérôme Azémar - [email protected]
Santosh Kumar - [email protected]
From Technologies to Market
2
REPORT SCOPE
This report’s main objectives are as follows:
o Describe technologies that can be classified as “fan-out packaging”
o Identify and detail the fan-out packaging platform’s key process steps
o Analyze the manufacturing chain for fan-out technologies
o Pinpoint the equipment and materials suppliers for key process steps
o For these steps, provide a market forecast for the coming years and an prediction of future trends
o Elaborate on key market drivers, benefits, and challenges for equipment and materials in fan-out packages
Fan-out equipment and materials are studied from the following perspectives:
o Available technologies and their inherent challenges
o Players involved and their market share
o Market value
©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
4
REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
5©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
EQUIPMENT AND MATERIALS FOR FAN-OUT PACKAGING - TABLE OF CONTENTS (1/2)
• Market and Technologies Analysis per Process
Step
• Carrier Bonding and Debonding 110
• Carriers
• Bonding/debonding equipment
• Pick-and-Place 127
• Pick-and-place equipment
• Molding 141
• Compression molding tools
• Epoxy mold compounds
• Report Scope & Definitions
• Report scope 5
• Companies cited in this report 7
• Glossary
• Related Reports 8
10
• Executive Summary 13
• Fan-Out Packaging - Context 29
• Drivers for fan-out 36
• Fan-out market growth and hype 45
• General Market Forecast 53
• Fan-Out Processes
• Generic process descriptions, step by step 67
• Key challenges and issues: die shift, warpage, reliability 82
• Panel processing 98
6©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
EQUIPMENT AND MATERIALS FOR FAN-OUT PACKAGING - TABLE OF CONTENTS (2/2)
• Market and Technologies Analysis per Process
Step, cont.
• RDL Processing 158
• Dielectric Passivation 160
• Coating equipment
• Dielectric materials
• Photolithography 175
• Photolithography tools and coating equipment
• Photoresists
• RDL Metal Layers 200
• PVD equipment
• Meterology and Inspection 217
• Conclusions 222
• About the Authors / Company Presentation 224
Biography & contact
7©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
ABOUT THE AUTHORS
Jérôme Azémar
Jérôme Azémar is a senior member of the Advanced Packaging & Manufacturing team at Yole Développement. As a Technology & Market
Analyst, Jérôme provides numerous market research and strategy analyses on power electronics, advanced packaging, and semiconductor
manufacturing, and he has given several presentations and market briefings at semiconductor conferences.
Upon graduating from INSA Toulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for
three years as an Application Support Engineer, specializing in immersion scanners. During this time he acquired photolithography skills
which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. While with STMicroelectronics he developed new
processes, co-authored an international publication, and worked on metrology structures embedded on reticules before joining Yole
Développement in 2013.
Santosh Kumar
Santosh Kumar currently works as Senior Technology & Market Research Analyst at Yole Développement. Prior to Yole, Santosh was Senior R&D
Engineer at MK Electron Co. Ltd., where he was engaged in electronic packaging materials development and technical marketing. His main interests are
advanced electronic packaging materials and technology, including TSV and 3D packaging, modeling and simulation, reliability and material
characterization, wire bonding, novel solder materials, and process. He received a bachelor’s and a master’s degree in Engineering from the Indian
Institute of Technology (IIT) Roorkee and the University of Seoul, respectively. He has published 20+ papers in peer-reviewed journals and has
obtained two patents. Santosh has also presented and spoken at numerous conferences and technical symposiums related to advanced
microelectronics packaging.
9©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
• “Fan-out packaging” can be defined several different ways, depending on who we are talking to. It is especially confusingbecause when the hype began around this package type, many players erroneously used the term “fan-out” to describe theirsolution and gain more attention from the market.
• An even more confusing aspect is that acknowledged fan-out solutions are/were not even called “fan-out” by their creators. Forinstance, Infineon, creator of eWLB (one of the most widespread fan-out solutions), did not describe eWLB as “fan-out” in its IP.Instead, for a long time Infineon termed it an “embedded die” solution.
• An acknowledged characteristic of “fan-out” packages is that, as the name implies, interconnections are “fanned out” of thechip.Thus, bumping is not dependent on die surface.
• This means fan-out can potentially achieve any number of interconnects with standard pitches, at any shrink stage of the wafernode technology
• If fan-out’s only definition is that it is “a package from which connections and bumping are out of the chip scale”, then almostall packages can be defined as fan-out! Flip-chip BGA, flip-chip CSP, embedded die, etc. This has created much confusionwithin the industry.
• To make a fair comparison and clarify the situation, Yole has focused this report on selected fan-out technologies possessingtwo additional characteristics:
• Fan-out solutions that use mold compound (and not laminated materials) to embed dies
• Fan-out solutions’ RDL that does not use advanced substrate (PCB layer-type)
Mold Chip
FAN-OUT - DEFINITION (1/2)
Different interpretations, and Yole’s scope
Fan-out can be many
different things
No advanced substrate (PCB-type) used for redistribution layers
Mold compound is used to embed the chips
Connections are fanned out of the chip
scale area
10©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FAN-OUT - DEFINITION (2/2)
What about other technologies called “fan-out”?
Fan-out can be many
different things
• Dies embedded in laminated materials:
• This package type, also known as “embedded die” package, is based on PCB manufacturing capability andtherefore is not in the same category as fan-out technologies that use molding compound. Resolution is lower(L/S of 10µm or higher), tool types are different, the actors are often different (more substrate makers thanOSATs or IDMs), and end-markets are different, with simpler applications targeted.
• Examples of known technologies falling into this category: J-Devices’ PLP, AT&S’ ECP
• Mold compound embedded atop advanced-substrate (PCB-type) solution (standard or coreless):
• This package type can also be considered a flip-chip CSP. Similar to the category described above, our reportis not focused on this technology type due to differences in resolution achieved and end-markets targeted.
• Another critical difference is that “fan-out hype” started with fan-out wafer-level package (FOWLP) solutionslike eWLB and RCP, and became famous because of substrate removal - compared to FC-CSP and FC-BGA,which made the packages much thinner. If we include fan-out solutions that imply a substrate, then thesituation is different.
• An example of a known technology falling into this category: ASE’s fan-out chip last
11©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FAN-OUT - TECHNOLOGY PRINCIPLE
Fan-out: dies embedded in mold
compound, no advanced
substrate, and interconnections fanned out of chip
surface
eWLB example (chip-first, face-
down)
Pick and place
Wafer-level
molding
Carrier removal/debonding
Tape lamination
Standard WLB process
(passivation, pattern, RDL,
bonding)
Dicing
Source: Infineon
Carrier
Carrier with foil and chips
Molding with liquid mold compound
WLP fan-out wafer
After singulation
Reconstituted wafer
after molding
12©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
Smaller footprint and thinner package than
flip-chip BGA
Lower thermal resistance compared
to flip-chip BGA
Simplified supply chain and manufacturing
infrastructure
No laminate substrate required
No restriction in bump pitch
Shorter interconnections
Fan-out zone adaptable to customer
needs
FAN-OUT - KEY DIFFERENTIATORS
Fan-out provides several
advantages
Mold Chip
Other advantages:
• Better board-level reliability
compared to WLCSP
• RoHS is a REACH-compliant
package
• Excellent electrical
performance
• High degree of package design
freedom
• Reliable, miniaturized, high-
performance package
13©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
Topography
Due to different device sizes to embed, non-planarity can
become an issue for SiP integration Chip-to-mold
non-planarity
Die protrusion at the interface can
lead to RDL distortion
Die shift
Lack of precision in die positioning during
pick and place induces challenges for
lithography steps/alignments
Reliability
With large packages (above 15x15mm), creep fatigue and
solder joint problemsappear Issue for large die embedding
and PoP
Warpage
Nonuniform stress during process steps
like molding compound deposition
and die placing can impact wafer flatness
and die stress
IC 1 IC 2
FAN-OUT PACKAGING - TECHNICAL CHALLENGES
Despite its manydrivers and
advantages, fan-out packaging has challenges to
overcome whichrequire innovation,
investment, and improvements
14©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FAN-OUT ACTIVITY - MARKET FORECAST
Apple’s example will
show competitors
the way
15©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FAN-OUT APPLICATIONS
Where do we find fan-out? Some examples below
Orange: devices found in FOWLP packages
today
Green: future devices that could be found in
FOWLP
Grey: devices that will likely remain on WLCSP
or flip-chip package, or move to 3DIC or
embedded die
Apple iPhone 7 (2016)A10 APE – InFO package (TSMC)
Samsung Galaxy S7 (2016)Qualcomm Audio Codec
WCD9335 – eWLB package
(Nanium/STATSChipPAC)
Bosch MRR1Plus Radar (2015)Infineon RASIC™ (77GHz RADAR System
IC Chipset) – eWLB package
BK Ultrasound Sonic Window (2015)Multichip Module – eWLB Package (Nanium)
BasebandSpreadtrumSC8502
Intel-Mobile/InfineonPMB7900, PMB9810, PMB9801
RFSpreadtrumSC8502
Intel-Mobile/InfineonPMB5712, PMB5726 Power Management
MarvellPM820
SpreadtrumSC2712A
Continental ARS400 Radar (2015)NXP MR2001 (77GHz multichannel
RADAR) – RCP Package
16©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FAN-OUT - DETAILED PROCESS FLOW (1/3)
Chip-first face-down scenario
These four « front-end »
steps are critical for fan-out packages
(the rest of the process exists
in other manufactured packages, and
is more mature)
Specific tools & equipment Specific materials
Chip-to-wafer bonding tool
Wafer debonding equipment
Dual-attached film spill-off
Mold compound
(liquid or granular)
Dual-attached film
+
Carrier (Si, ceramic, glass, metal)
Compression wafer-level
molding tool
Vacuum lamination tool
Cleaning solutions
Grinding & CMP tools CMP pad and slurries
Tape lamination
Pick and place
Molding
Debonding
Critical materials: • Choice of adhesive is key for
debonding step
• Choice of carrier type
strongly impacts warpage and
debonding capability
Critical material: • Mold compound deposition
induces stress on the die, die
shift, and warpage
Critical step: • High accuracy required to
limit die shift
Critical step:
• High impact on warpage
and reliability
• Cost greatly depends on
carrier choice
17©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
Passivation for RDL
Redistribution layer (RDL)
Patterning for RDLPhotolithography for patterning
- Stepper or mask aligner
Wet bench (photoresist stripping)
- Seed layer deposition (PVD)
- Thick-resist deposition
- Resist patterning/lithography
(Stepper or mask aligner)
- Cu local ECD plating
- Polymer/thick-resist stripping
- Seed layer etching
- Sputtering targets
- Thick photoresist
- ECD chemistry
- Wet etch chemistry
- Cleaning chemistry
Dielectric material deposited by spin
coating
Dielectric materials for passivation
- BCB, PI, PBO, epoxy, Al-X
FAN-OUT - DETAILED PROCESS FLOW (2/3)
Chip-first face-down scenario
Specific materials
Critical materials: • Choice of dielectric polymer
is key for reliability and curing
temperature (mold
compound cannot handle high
temperature)
Specific tools & equipment
18©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
UBM etching via wet etch
Final test + singulation
Ball mount + wafer test
Re-passivation layer
UBM deposition + etching
Dicing tool- Laser
- Blade
- Stealth
- Dielectric material deposited by spin coating
- Exposure (stepper/mask aligner)
- Resist stripping
Materials for passivation
- BCB, PBO, epoxy, Al-X
- Stripping chemistries
UBM deposition techniques:
- PVD + ECD
or
- Electroless
or
- PVD
Consumables
- Sputtering targets + ECD
chemistry
or
- Electroless chemistry
or
- Sputtering targets
UBM wet-etch chemistry materials
(dependent on metal type for etching)
Final test tool
FAN-OUT - DETAILED PROCESS FLOW (3/3)
Chip-first face-down scenario
- Balling (ball drop, printing)
- Wafer test tool
Critical materials: • Choice of dielectric polymer
is key for reliability and curing
temperature (mold
compound cannot handle high
temperature)
Specific materialsSpecific tools & equipment
19©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FAN-OUT PROCESS STEPS TO FOCUS ON (1/2)
• In this report, Yole focuses on some specific process steps. These steps are considered more specific and illustrative offan-out packaging, as well as areas showing strong innovation from different players:
• Pick and place:
• Pick-and-place is a key step for FOWLP. The process speed directly impacts the production pace, and die positioning accuracy hasconsequences on RDL manufacturing.
• Bonding/debonding:
• A trademark step of fan-out packaging is the bonding of chips on carriers’ surface and debonding them once the reconstituted wafer ismolded. This step directly impacts package reliability and defines this platform’s feasibility. It impacts warpage, defectiveness, and packagemanufacturing success.
• Mold compound deposition:
• Mold deposition is fan-out packaging’s most illustrative step. Mold constitutes the package itself, and embeds the chips. Creating areconstituted wafer/panel and processing it is at the very core of fan-out manufacturing.
• RDL process:
• Redistribution layers are the source of the “fan-out” packaging name. They allow the connections to transcend the chip surface and not belimited by it. All steps are essential: polymers’ passivation coating, patterning them thanks to photolithography, and creating copperconnection layers through plating (after first sputtering the seed).This process impacts package thickness and efficiency
• Metrology:
• Metrology steps are very important for guaranteeing good process execution. In the case of fan-out, some steps that are not commonlymeasured in advanced packaging (i.e. warpage) become mandatory to follow.
20©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FAN-OUT PROCESS STEPS TO FOCUS ON (2/2)
• What about other process steps?
• All manufacturing steps are important for an optimum process, but some steps were not considered during our investigation.Several reasons for this: either we did not have enough information on these steps, or they were closed markets, or we deemedthem less characteristic of FOWLP. For relevance and information quantity’s sake, Yole has focused its investigation on theprocess steps listed on the previous slide. However, we are capable of studying other steps and their associated equipment andmaterials upon request, if desired.
• List of steps not investigated in this report:
• UBM deposition and etching
• Ball mounting
• Wafer testing
• Dicing
• Some steps were investigated only at a technical level, and a market study was not performed:
• Carriers (market forecasts available only for glass carriers)
• Metrology steps
21©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FOWLP* - TOTAL MARKET FORECAST FOR EQUIPMENT AND MATERIALS
* The market estimated here only includes process steps investigated by Yole for this report, and is not exhaustive. For details, see the following slides for breakdowns, along with the “fan-out process steps to focus on” slides in the “Challenges” section.
22©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FOWLP - EQUIPMENT MARKET FORECAST
23©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
FOWLP - MATERIALS MARKET FORECAST
24©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
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OUR 2017 REPORTS PLANNING (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
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− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
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35©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
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− Status of Power Electronics Industry 2017
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− Power GaN 2017: Materials, Devices, and Applications
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017
o DISPLAYS
− Microdisplays and MicroLEDs 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− QD for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Emerging Display Technologies 2017**
o LED
− UV LEDs 2017 - Technology, Manufacturing and Application Trends
− Agricultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs 2017 - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− CSP LED Module 2017
− LED Packaging 2017
PATENT ANALYSIS by Knowmade
− 3D Monolithic Memory: Patent Landscape Analysis
− Microfluidic Diagnostic: Patent Landscape Analysis
− GaN Technology: Top-100 IP profiles**
− Uncooled Infrared Imaging: Patent Landscape Analysis**
− MEMS Microphone: Patent Landscape Analysis**
− MEMS Microphone: Knowles' Patent Portfolio Analysis**
− MicroLEDs: Patent Landscape Analysis**
− Microbolometer: Patents used in products**
− Micropumps: Patent Landscape Analysis**
− Flexible batteries: Patent Landscape Analysis**
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
** To be confirmed
36©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
37©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape 2016 report
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
38©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
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39©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample
CONTACT INFORMATION
Follow us on
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
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• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
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