Virtual Pcb Fjelstad With Audio

An Alternative Method for An Alternative Method for Manufacturing Robust Manufacturing Robust Electronic Assemblies Electronic Assemblies

Without SolderWithout SolderJoseph Fjelstad

PresidentVerdant Electronics

Outline • Introduction• Background• The Occam Process • Benefits Analysis• Alternative Structures• Occam Roadmap• Summary and Conclusion

Introduction• Change is the defining element of evolution • In electronics most change has been voluntary to meet

customer needs and as well to control cost in order to make products more broadly available to benefit a broader base.

• Some change is mandated by legislation (e.g. RoHS) • The electronics industry is in the midst of trying to comply

with that mandate. • It has been neither easy nor 100% successful with many

questions and concerns still unaddressed. • In this environment a new approach has been conceived

and is rapidly heading into development.

• Electronics manufacturing presently comprises three basic manufacturing industries:

• Electronic component manufacturing industry – ICs, electronic modules, discrete devices, etc.

• Electronic interconnection manufacturing industry– PCBs, package substrates, sockets, connectors, cables, etc.)

• Electronic assembly industry– Soldering, testing, box build, etc.

• Vertically integrated companies of the past did it all.

Electronics Manufacturing Today

• Electronics have historically increased functionality of products while size, weight and cost have all decreased with each new generation of product

• The trend continues but it slope of the curve is flattening and becoming more asymptotic.

• Lead pitches are decreasing, this is impacting both design and manufacture of PCBs and assemblies

• Product life and reliability are also being impacted

• Supply chain is growing longer and less manageable

• Concerns over lead-free soldering are on the rise

Electronics Assembly Challenges

In the Recent News… • “RoHS remains a $30B problem”

– Design News July 31st 2007

• “EU ban increases worries over 'whiskers' “– San Jose Mercury News October 8th 2007

• “Peril: Tin ‘whiskers’ that ruin electronics”– Corvallis Gazette October 8th 2007

• “Lead Phase-out May Destroy Electronics”– LA Times October 9th 2007

• “'Tin whiskers' in electronics stoke anti-lead debate”– San Jose Mercury News October 15th 2007

The Value of Interconnections• Interconnection technologies have long

been undervalued but they are now gatekeepers of cost and performance

• Interconnection technologies are also often the limiting factor in product reliability

• Improved interconnection technologies are required to address future needs

Solder - Past and Present Issues• Tin-lead solder provided reliable electronic

interconnections, however lead-free solder is generating concerns in shock and vibration

• There are some intrinsic problems with solder but they are more easily addressed with tin-lead

• As lead contact pitch drops with every new component shrink, the problems with solder are becoming increasing apparent.

• Lead-free impact has been negative and expensive • Metals cost is rising (Tin has tripled since 2001)

The Occam Process

1. Position and bond various components on a temporary substrate or permanent carrier

2. Encapsulate the components in place

3. Remove from substrate, expose terminations.

4. Interconnect terminations by additive or semi-additive board fab methods or alternative direct interconnection methods.

Abbreviated Occam Concept

Sample Process

Sequence

Patents pending

CONVENTIONAL SMT ASSEMBLY

SCHEMATIC BOM

PWB DESIGN

ASSEMBLY DESIGN

SMT ASSEMBLY

PARTS ENGINEERING

PROCUREPARTS

SOLDER, PASTE, FLUX

INVENTORY, STORAGE

RELIABILITY ASSURANCE

PWB FAB, PROCURE

Storage & Inventory

VERDANT ELECTRONICS’ OCCAM PROCESS

THE OCCAM PROCESSSCHEMATIC

BOM

ASSEMBLY DESIGN

PARTS ENGINEERING

PROCUREPARTS

Storage &Inventory

CIRCUIT DESIGN

Supply Chain Compression

Components IC PackagesResistorsCapacitorsInductorsDiodes

Interconnections PCBsSocketsConnectorsCables

Assembly Stencil printingPick and placeReflowCleanBox build

Components IC PackagesResistorsCapacitorsInductorsDiodes

Verdant Assembly Pick and placeComponents & ConnectorsEncapsulateBuild up CircuitsBox build

The Occam Approach is Novel…but Not the Technologies

• Components are placed conventionally• Many suitable encapsulants available off the shelf

– Suitable CTE, low shrinkage, high thermal conductivity– Materials need not withstand soldering temperatures

• Vias can be made by laser or other methods– Photolithographic materials can work

• Additive fabrication process well established– All copper system should prevail– Plating to other finishes is unconventional (is it an issue?)

• Appropriate for all classes of products• Testing and rework... Philosophical questions?

– Use known good parts and robust processes– Repair is possible but there are issues

Benefits Analysis

• No PCB procurement• No PCB testing required• No spares required• No shelf life issues• No finish solderability concerns• No high temperature board warpage concerns• Low material use and near zero waste• All copper system possible• Edge card connections are still possible

Occam BenefitsNo PCB

• RoHS restricted material concerns eliminated• No solderability testing and finish concerns • Solder inspection required is not required • No high temperature damage to devices or PCB • Reduced energy use (no bakes, no reflow) • No post assembly cleaning concerns (e.g., SIR,

dendrites and fidelity at high frequency) • No solder shorts, opens or other solder related

assembly yield and reliability issues• Reduced steps and materials = reduced cost

Occam BenefitsNo Soldering

• No solderability or ROHS compliance checks• No component leads = No coplanarity issues• No thermal warping concerns• No MSL issues or popcorning concerns • Fewer component types needed (LGA & QFN)• Smaller component libraries possible (Pkgs) • Lower cost & higher yield on devices• No solder build up on tester/socket contacts • Improved routing for area array IC packages• Overlapping of components is possible

Occam Benefits Simpler Components

Overlapping Components

Patents pending

• Components can be placed closer together• Increased routing capability

Occam BenefitsCircuit Design Improvment

Alternative RoutingOffers Layer Reduction

QFP/QFN Routing Advantage

BGA Routing Advantage

Single Lead Pitch Potential

HDI - Price/Density ComparisonHDI - Price/Density Comparison

RCI: Rel price to 8LDEN: Ave pins/sq.inch

Source: Happy Holden

The Future of Electronics?

• Components can be placed closer together• Increased routing capability

Occam BenefitsCircuit Design Improvement

• “Dead” leads ignored for additional routing• Simpler and faster reconfiguration and ECOs• Improved design security with opaque encap• Integral heat spreader redefine placement rules• Completed assemblies can interconnected

Connecting Assemblies

Patents pending

Integral multi row edge connectors of various embodimentscan be directly interconnected to assembly as a component. Caps may be used to protect contact surfaces during assembly

Stackingand

InterconnectingOccam

ProcessedAssemblies

Patents pending

• Components can be placed closer together• Increased routing capability • Components can be placed closer together• Increased routing capability in less space • “Dead” leads ignored for additional routing• Simpler and faster reconfiguration and ECOs• Improved design security• Integral heat spreader redefine placement rules• Completed assemblies can interconnected• Adaptable to optoelectronics• Can be used for flexible circuits

Occam BenefitsCircuit Design Improvement

Occam Process for Flex Circuits

Tested and burned in com ponents are positioned fo r assem bly on a flexib le film


The com ponents are seal bonded on bottom and a t least partia lly encapsulated on filmThe com ponents are seal bonded on bottom and a t least partia lly encapsulated on filmO ptiona l support carrier can be used to facilita te processing, H ow ever com ponent s ide can be p la ted and sealed w ith m etal for ESD , EM I or heat spread ing if desired


H oles are drilled (e .g. U sing a laser) to access contacts on packages and com ponents


P lating and im aging processes create c ircu its and in terconnection to contacts. S tepsm ay be repeated to create additional c ircuit layers as needed


C over layer is applied to top final circu it layer to pro tect conductors


Carrier if used, is rem oved and the flex c ircu it can be bent into desired shape.

Patents Pending

EDA Support Emerging• Lack of integrated EDA tool flow creates gaps

between circuit design and manufacturing however, some EDA tool suppliers sense opportunity and are getting involved early

• Co-design of all elements needed for optimum system performance is easier with Occam– Electrical, mechanical and thermal analysis

• Signal integrity will increase in importance

• Verification and design accounting for multi-dimensional analysis for complex systems

Co-Design Compresses Time

IC Design Package Design PCB DesignIC Design Package Design PCB Design

Time to Market Reduction

• Simple structure with fewer elements• Lower temperature processing avoids thermal

damage caused by soldering • Components are fully encapsulated increasing

shock and vibration immunity• Hermetic structure possibilities with full metal

jacket protection • Total EMI protection possibilities• Integral heat spreader assemblies help to

extend life of IC devices

Occam Benefits Improved Reliability

• Testing is believed to be critical… but is it?• Testing implies defects are anticipated • Test finds faults of weak manufacturing

– Shorts and opens are accepted as facts of life– Lead-free assembly can damage components

• Stencil printing paste has physical limits• Simpler processes should yield higher • The ultimate test is assembly turn on• Can time and money for test be better spent?

What about Testing?

Cost Comparison

Model

Conventional SMT Line

Water Wash Machine$80K

Solder Paste Measurement Station $15K

Kitting, Feeder Setup

Solder Printer$75K

P&P Machine$200K

Reflow Oven$55K

Ionograph

$15K

X-ray$50K

Equipment with ~capital cost

Source: Richard Otte, Promex Industries

• Capital Cost 15+75+200+55+80 = $440K, 5yrs, 1 shift• Sq ft. 50 x 10 = 500@ $2.00/mo• Power, Kw 0.5+2+25+5 = 32.5 Kw @ $0.15/Kwh• Operators 1.5 persons @ $20/hr• Cost per hour = $80.72• Line will place 10,000 parts/hr• SAC305 costs 0.1 cent/part

or $10.00/hr @ 10,000 parts/hr.

Total Cost, ex-interconnect is:$90.72/hr

Conventional SMT Line Cost


Occam Process Line

Water Wash Machine

Solder Paste Measurement Station

Kitting, Feeder Setup

Solder Printer P&P Machine$200K

Reflow Oven

Encapsulant Dispenser $75K

Encapsulant Cure Station $5K

X-ray

Ionograph

Interconnect deposition $?


Occam Process Line Cost

• Capital Cost 200+75+5 = $280K• Sq ft. 20 x 10 = 200• Power, Kw 2+1+5 = 8 Kw• Operators 1.0 person• Cost per hour = $50.38• Line will place 10,000parts/hr• Encapsulant costs 2 cents/cc

or 0.4cents/cm2 @ 2 mm thickness or 0.1cents/pt. @4 parts/cc or $10.00/hr @ 10,000 pts/hr.

Total cost, ex-interconnect is:$60.38/hr, 33% less


Alternative Structures

Alternative Solderless Structures

programmed

Patents Pending

Occam and Direct Write Technology

Occam Process - Direct Write

Direct print technology can be used to create insulation and circu its d irectly onto contacts after m old ing and re leasing the assem bly from a tem porary carrier. A m echanical or chem ical m echanical process can be used prior to processing to clean leads

Ink jet printer

Patents Pending

Occam Roadmap

The Occam Process Roadmap

• Proof of concept• Test vehicle identification and reliability testing• Standards development – for design and performance• Simple products first (like early SMT) • Increase complexity with captured experience• Explore alternative solderless assembly methods• Engage Material & Equipment Suppliers with new

product and process opportunities • Suitable materials identified and characterized• Process qualification and technology transfer

SummaryCurrent assembly technology problems continue

1. Regulatory imperatives for lead-free electronics.• Very high process temperatures with lead-free solder.• Increased whisker risk from extensive use of tin plating.

2. Process challenges continue • Solder paste deposition process is highly variable.• Mixed finishes are a concern and supply chain challenge• Thermal damage to PCBs increasingly common

3. Never ending drive to reduce size and cost.• Increased density = Reduced pitch = Increased problems

4. Global sourcing and supply-chain expansion.• PWB fabrication largely moved or moving off-shore.• Components with tin-lead finish are disappearing • Limited support for new technology development by EMS

companies with sunk costs in existing equipment

A Shared Opportunity• No one company can change the entire

industry. It requires a shared effort

• Only those who appreciate the opportunity will respond early… the others will follow

• Early adopters will share the risks but also reap greater rewards. OEMs know this well.

• Change will happen… it always does.

• Question: Will the industry drive for change or wait to be legislated to change again.

The Learning CurveNew Technology

Cos

t

TimeSource BPASource BPA

Incumbent Technology

• Change is constant and inevitable • Simpler solutions are generally better• More can be done with less• Evolution generally favors those who

are prepared and willing to accept and adapt to change

Final Thoughts…

“Whatever you can do or dream you can, begin it. Boldness has genius, power and magic in it.

Begin it now.” ~Johann Goethe~

Thank You