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The Chip Insider ® April 3, 2014 Equipment & Emerging Markets

Applied Materials ENDURA: Over 20 Years of Metallization Leadership

• Introduced in April 1990

• Aggressive Marketing around The World

• Endura is the Most Successful Platform

• Revenues exceed $20B

• Extension from PVD to CVD/ALD

• Complex Process Integrations

• Success Endures

Wildphotons: When I hear somebody…

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ENDURA Introduced in April 1990

• First staged vacuum architecture

• First ultra-high vacuum (10-9 torr)

production system

– Electromigration reduced by factor of nine

• Continuous vacuum between processes

– Five stage vacuum with high integrity

• Most complex platform to demonstrate

>90% uptime

– First platform to use magnetically coupled

vacuum robots

– Single central block of aluminum

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…and endorsed by Dr. Ohmi…


Aggressive Marketing around The World

4/3/2014 3


Sales Soared and Share went Vertical

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Applied Materials’ Endura Over 20 years of metallization leadership

• Undisputed leader across 3 decades

• Expansion of applications and films

• Original Endura specs included

integration of processes: – CVD, WCVD

– RTP

– Etch & Cleaning

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ENDURA is the most successful platform The longest running major platform

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Standard PVD

Collimation &

Long Throw

IMP

SIP & EnCoRe

RF PVD

1st Gen Ionized PVD 2nd Gen Ionized PVD 3rd Gen Ionized PVD


Endura’s brought in more than $20B

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Endura’s Extension from PVD to CVD/ALD

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Blanket PVD Films PVD for Film Coverage

20 Years of CVD/ALD


Over 100 Processes Drive the Revenues

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More Than PVD

Endura is driven by:

• Device performance and yield solutions

• Precision Materials Engineering leadership

Key technologies available:

• PVD

• CVD

– Thermal & Plasma Enhanced

• ALD

– Thermal & Plasma Enhanced

• Chemical Cleans

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Complex Process Integration Enables Challenging HVM applications

Flexibility:

• To meet demanding integration requirements – Results in both performance and cost benefits

System reliability:

• Enabled up to 7 integrated process steps – In high volume manufacturing for multiple nodes

Metal Gate:

• Integrated PVD, CVD, and ALD technologies that

have enabled the first generation of metal gate in

high volume production

• ALD deposition for conformal films

• RF PVD deposition for low damage high purity

PVD metal

• Integrated PVD or CVD wetting layers and

CVD/PVD Al Fill

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Endura Platform – Success Endures Continuous Refinement • Capability upgrades for manufacturing at 22nm node

and below

• Improvements for defect reduction and backside

metal contamination

– Minimum contact wafer transfer blades / electrostatic discharge

control

– Engineered lift pins and minimum contact points

– Electrostatic chuck and pedestal contact points

– High performance coatings on components

– Coordinate system and chamber moves with optimized motion

profiles

– Advanced slit door materials with specialized movements to

minimize defect creation

– Optimized gas flow patterns, specialized diffusers and pressure

equalization routines

• Defect performance at 40nm defect size

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Technology

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