Dilute Al–Mn alloys for superconductor device applications

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Nuclear Instruments and Methods in Physics Research A 520 (2004) 274–276

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303-497-304

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doi:10.1016

Dilute Al–Mn alloys for superconductor device applications

S.T. Ruggieroa,*, A. Williamsa, W.H. Rippardb, A.M. Clarkb, S.W. Deikerb,B.A. Youngc, L.R. Valeb, J.N. Ullomb

aDepartment of Physics, University of Notre Dame, Notre Dame, IN 46556, USAbNational Institute of Standards and Technology, Boulder, CO 80305, USA

c Department of Physics, Santa Clara University, Santa Clara, CA 95053, USA

Abstract

We discuss results on the superconducting and electron-transport properties of Mn-doped Al produced by sputter

deposition. The critical temperature of Al has been systematically reduced to below 50 mK by doping with 1000–

3000 ppm Mn. Values of the a parameter are in the range of 450–500, indicating sharp normal-to-superconductor

transitions. This material is thus of significant interest for both transition-edge sensors operating in the 100mK regime

and superconductor/insulator/superconductor and superconductor/insulator/normal devices, in the latter case where

appropriately doped Al–Mn replaces the normal metal.

r 2003 Elsevier B.V. All rights reserved.

PACS: 74.62.Dh; 73.40.Gk; 85.25.j

Keywords: Mn doped al; Transition-edge sensors; SIS devices

Transition-edge sensors (TES) require films withsuperconducting transition temperatures below1K. One approach to meeting this need is to useelemental superconductors, including W(Tc ¼ 80 mK) [1,2], Ti (Tc ¼ 370 mK) [3], and Ir(Tc ¼ 90–330 mK) [1,4–7]. Perhaps more widelyused are bi-layer systems such as Ti/Au [8,9], Mo/Cu [10], Mo/Au [11,12], and Ir/Au [13]. However,reproducibility has remained an issue with bothelemental and bilayer systems. Ion implantation ofW films with Co, Fe and Ni [14] has also beensuccessfully employed, although the reproduciblepreparation of W films with low critical tempera-tures is required.

onding author. Tel.: +1-303-497-4319; fax: +1-

2.

ddress: ruggiero@boulder.nist.gov (S.T. Ruggiero).

- see front matter r 2003 Elsevier B.V. All rights reserve

/j.nima.2003.11.236

Our work introduces a new approach toproducing films with superconducting transitiontemperatures in the 100 mK regime—with Al filmsdoped with Mn in the 1000—3000 ppm regime.The films were prepared by simple co-depositionfrom two sputter targets: one with a relatively high(3000 ppm) concentration of Mn and a secondtarget of pure Al. The sputter guns were tilted tointersect at a point equidistant from each gun,where substrates were placed. Sputtering rateswere B0.2 nm/s from each gun. Films wereprepared on oxidized, 3 in. diameter Si wafers,which could be rotated to produce films withuniform Mn doping. Systematic studies of filmuniformity have yet to be conducted.

Shown in Fig. 1 is Tc versus Mn concentration,the latter established with Rutherford backscatter-ing. Results for the low-temperature (4.0 K)

d.

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S.T. Ruggiero et al. / Nuclear Instruments and Methods in Physics Research A 520 (2004) 274–276 275

resistivity, rð0Þ; of the films (inset) can becompared with room-temperature resistivities forAu, Cu, and Mo of 2.04, 1.56 [15], and 5.7 mO cm[16], respectively (room-temperature to low-tem-perature resistance ratios for these materials aretypically 3–5), and rð0ÞB12 mO cm for Ti [17]. Thisimplies that for a given Tc; the conductivity ofdoped Al–Mn films are generally competitive withother systems for TES applications.

In our own investigations, we have seen thatferromagnetic materials such as Fe and Ni do notproduce a rapid depression of Tc in Al, and thatthe rate of Tc suppression with Mn doping is lowerthan typically observed with Abrikosov–Gor’kov[18] pair breaking with magnetic dopants. Thissuggests that Tc suppression in Al–Mn alloys is

0

0.2

0.4

0.6

0.8

1

0 1000 2000

0

1

2

3

4

0 1000 2000Mn conc. (ppm)T

c/T

co ρ(0)

(µΩ

cm

)

Mn Concentration (ppm)

Fig. 1. Reduced critical temperature versus Mn concentration

for Al–Mn thin films. Inset shows low-temperature (4.0K)

resistivity, rð0Þ; versus Mn concentration. Tco ¼ 1:17K.

1.4

1.2

1.0

0.8

0.6

0.40.2

0

0.460.450.440.430.420.410.40

∆T/Tc = 0.041Tc = 0.437 K

Al-Mn(1000 ppm Mn)

T(K)

Res

ista

nce

(arb

. uni

ts)

Fig. 3. Resistive transitions for Al–Mn films with transition tempe

rather the result of pair scattering from resonantmagnetic impurity sites in the context of theFriedel–Anderson model [19], as quantified bythe Kaiser theory [20].

Fig. 2 further illustrates the correlation of Tc

with transport properties. Shown is Tc versusresistance ratio, the ratio of the room temperatureto 4.0 K resistivity. Present are results for filmsmade at specific Mn concentrations and thoseproduced by a phase spread, where a substrate washeld fixed between pure Al and Al–Mn sputtertargets. The majority of the data is for films200 nm or greater in thickness.

The sharpness of transitions is a key parameterfor TES applications, quantified by a ¼dðln RÞ=dðln TÞ; where larger values represent

0

0.1

0.2

0.3

0.4

0.5

1 1.5 2 2.5

Uniform Dilutions

Phase Spread

Tc

(K)

resistance ratio

Fig. 2. Tc versus resistance ratio, defined as R273K/R4.0 K, of

Al–Mn thin films.

0.6

0.4

0.2

0

0.0960.0920.0880.084

∆T/Tc = 0.052Tc = 0.0898 K

Al-Mn(1500 ppm Mn)

T(K)

Res

ista

nce

(arb

. uni

ts)

ratures of 437 and 89.8mK. Arrows define transition region.

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S.T. Ruggiero et al. / Nuclear Instruments and Methods in Physics Research A 520 (2004) 274–276276

sharper transitions. Resistive transitions for Al–Mn films with critical temperatures of 437 and89.8 mK are shown in Fig. 3. They have a values of500 and 450, respectively, compared with reportedvalues for single and bi-layer systems ranging fromB90 to1000 [7–9,12].

Acknowledgements

The authors acknowledge useful discussionswith S. Nam. Work supported by the NationalInstitute of Standards and Technology, Depart-ment of Energy Grant DE FG02-88ER45373, andDARPA SpinS.

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