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MEMS Activities in μSIC and MEMS PC
(μSIC と MEMSPC におけるMEMS 活動)
Masayoshi Esashi, Kentaro Totsu(江刺正喜、戸津健太郎)
Micro System Integration Center (μSIC), Tohoku Univ.(東北大学マイクロシステム融合研究開発センター(μSIC))
MEF2016 (2016/5/11)
MEMS Park Consortium (MEMSPC)
1
Future MEMS - Fusion with LSI -by M.Esashi and T.Ono (Morikita shuppan, 2016)
1. Heterogeneous integration (Fusion of MEMS and LSI)
2. Next generation mobile systems3. Sensor network and functional sensors4. Optical microsystems5. Biomedical microsystems6. Manufacturing and testing7. The way for improvement and effective
utilization (in Japanese)
Basics of MEMSBy M.Esashi (Morikita shuppan, 2009)
1. Introduction2. MEMS fabrication 3. MEMS elements 4. MEMS applications(in Japanese)
2
3
(a) Surface micromachining (b) Assembly of packaged MEMS (c) Transfer of MEMS on LSI(Limitation of MEMS process) and LSI (Limitation in interconnection) (no limitation)
Heterogeneous integration
4
ＤＭＤ chip fabricated by surface micromachining
(L.J.Hornbeck : Micromachining and
Microfabrication'95 (SPIE) (1995) 3)
Amorphous metal TiAl3 has been used for hinge since1992. Fatigue was solved by this ( >1×10 cycle).12
Life (hours)
5(Technical report in TI homepage)
6
7Heterogeneous integration by adhesive bonding
8
(a) Film transfer (b) Device transfer (via-last) (c) Device transfer (via-first)
Wafer level transfer
9
Conductive boron doped diamond (BDD) electrode array (20×20) on LSI for amperometric biosensor
(T.Hayasaka, S.Yoshida, K.Inoue, M.Nakano, T.Matsue, M.Esashi and S.Tanaka, J. of Microelectromechanical Systems, 24 (2015) 958-967)
10
Diamond formation on a carrier wafer
Fabrication process
11
Wide potential window
Screening of medicine for cancer cells
Diffusion of dropped histamine
Fabrication process of tunable SAW filter using the selective transfer12
(H.Hirano, T.Kimura, I.P.Koutsaroff, M.Kodato, K.Hashimoto, M.Esashi and S.Tanaka, J. of
Micromech. Microeng., 23 (2013) 025005)
Tunable SAW filter using ferroelectric varactor
13
14
(a) Film transfer (b) Device transfer (via-last) (c) Device transfer (via-first)
Wafer level transfer
15
PZT MEMS Switch on LSI
(Matsuo, Moriyama, Esashi, Tanaka, IEEE MEMS 2012, 1153-1156)
Displacement : 5μm / 10V
Tactile sensor network for robot (event driven type)
2.4mm
16
(M.Makihata, M.Muroyama, Y.Nakano, S.Tanaka, T.Nakayama (Toyota Motor), U.Yamaguchi, H.Yamada, Y.Nonomura(Toyota Central Research Lab.), H.Funabashi, Y.Hata and M.Esashi, Transducers2013, 2729)
Fabrication process of tactile sensor for network17
18
Tactile sensor network(Collaborators, Toyota,
Toyota Central Res. Lab.)
(M.Muroyama, M.Makihata, M.Esashi et al., Smart Systems Integration (SSI) 2014)
19
(S.Kobayashi & M.Esashi, Technical Digest of the 9th Sensor Symposium (1990) 137)
Common 2 wires tactile sensor array (polling type)
(1,000 Tr./chip in our lab., 1,000,000 (1M)Tr./chip in company, 10,000,000,000 (10B)Tr./chip now)
20
(a) Film transfer (b) Device transfer (via-last) (c) Device transfer (via-first)
Wafer level transfer
Multi SAW filters on LSI by selective transfer
(S. Tanaka, M. Yoshida, H. Hirano and M. Esashi, 2012 IEEE International UltrasonicsSymp. (2012) 1047) Characteristics of SAW filter and its phase noise 21
(T.Samoto, H.Hirano, T.Somekawa, K.Hikichi, M.Fujita, M.Esashi and S.Tanaka, Transducers2013, 171 (2013))
Selective transfer process using laser debonding
22
23
100×100 active
matrix nc-Si
emitter array
Concept of massive parallel electron beam exposure system using nc-Si emitter
Nano crystal (nc-) Si emitter
10 Tr. / wafer=10 times / 10 beams=10 times / 10 beams
12
8
6
4
6
410 beams
(M.Esashi, A.Kojima, N.Ikegami, H.Miyaguchi and N.Koshida, Microsystems & Nanoengi. , 1 (2015) 15029)
24Nano crystaline (nc) Si emitter
25Fabrication process of nc-Si emitter array with TSV
100×100 active matrix electron source LSI pad layout in 430 pin package26
27Driver circuit for 1 electron source
Q1 Q2
Q3 Q4 XRxEBdrv(to MEMS)
XRxHVpchg
RxE
na[
3]
RxE
na[
2]
RxE
na[
1]
RxE
na[
0]
D Q
ER
D Q
ER
D Q
ER
D Q
R
RxM
d[0
]R
xM
d[1
]
RxW
r
RxR
st
RxVL
RxEBoutG
RxVH
RxSRckout
RxSRdout
RxSRckin
RxSRdin
LT0
LT1
LT2
Md[1] Md[0] Wr
0 0 SR→LT0
0 1 SR→LT1
1 0 SR→LT2
SR
LT2 LT1
0 0 Ena0～HVpchg Electron Emission
0 1 Ena1～HVpchg Electron Emission
1 0 Ena2～HVpchg Electron Emission
1 1 Ena3～HVpchg Electron Emission
Rst = Vh → Reset SR/LT0-2 and level shifter
Level shifter5V → HV
Dis-i
Ena-iLvl Shft1.8→5V
Lvl Shft1.8→5V
(Open Drain)
Emission off ： SR = H、XRxEBdrv = H、RxEBoutG = Hi-Z
Emission on ： SR = L、XRxEBdrv = L、RxEBoutG = H
High VoltageTransistor
Low VoltageTransistor
5V
HVtransistorinverter
5Vtransistorinverter
1.8V
HVpchg
Ena
Out
XX
XO
XX
Q4Q2
Variable exposure time Emission off
OX
XX
OX
XX
OX
XX
Hi-Z
Hi-Z
Hi-Z Hi-Z
10
0%
90
%
80
%
70
%
XX
Hi-Z
TrOn/Off
Exposed patter on a resist using 1:1 projection system with 15×15 planer type nc-Sielectron source (Electron source pattern is superimposed in the right photograph)
28
1/100 and 1/1 exposure test set-up
29
Shared facility for industry to prototype MEMS devices (4 / 6 inch)
Hands-on-access fab. (Nishizawa memorial research center in Tohoku Univ.)
Contact person : Assoc. Prof. Kentaro Totsu totsu@mems.mech.tohoku.ac.jp
Companies which can not
prepare their own facility
dispatch their employees to
operate equipments by
themselves for development
and small volume production.
30
Nishizawa memorial
research center
Users of the Hands-on-access fab.
Users : 180 companies
70% of running cost
(1.7M$) is covered by
charge in 2015
Revenue and expenditure (FY2015)
Users fee126M(+8%)69% of the total revenue
MEXTNanotechnologyPlatform Project45M
Facilitymaintenance7M
Travel 1MProject, etc. 12M
Revenue Expenditurethe others 2M
Equipmentinstallation16M
Total : JPY 183 MUSD 1.7 M
Personnel55M
Air conditioningheating, lighting48M
Expendables24M
Equipmentmaintenance14M
Facility charge16M
31
Hands-on-access fab. users (~180 companies)
MiyagiKuramotoFurukawa NDKSmart SolarMGRIKENMems CoreAdvantestICR
TechnofineRicohAbelieveNakatani SangyoPacal Technologies Japan
MitsumaruPhotonic LatticeDexerialsIndustrial Technology Institute,
Miyagi Pref.Tohoku Institute of Technology
RS TechnologiesKami Electronic IndustryMaterial Concept
SonyAlps ElectricTohoku Univ.
IbaraikiRicoh Printing SystemsEUVL
JAEAJAXAtei solutions
FukushimaEMC SemiconductorMunekataAGC ElectronicsNihon Univ.
Maruwa QuartzFukushima SankenJSTFukushima Technology Centre
HokkaidoKyosemiFine Crystal
AkitaAkita Epson
YamagataChinoMitsumiYamagata Univ.Yamagata Research Institute Of Technology
Tsuruoka NTCAhiko Fine Tech
ChibaFurukawa ElectricTDKYoutec
Maruzen PetrochemicalSeiko Instruments
TokyoTakionInfinity Storage Media
BN TechnologyYuka IndustriesMD InnovationsNamiki Precision Jewel
Univ. of TokyoBEANS LaboratoryRionASETYokogawa ElectricNanox JapanOji Holdings
Konica MinoltaAdamantTokyo Metropolitan Univ.Fuji ElectricTokyo Univ. of Agriculture and Technology
KanagawaNTT-ATTokyo Polytechnic Univ.JVC Kenwood
Suss Micro TechM.T.CNLT TechnologiesKyodo International
NICTToshibaKeio Univ.Fujitsu Laboratories
ShizuokaHamamatsu PhotonicsMerckShizuoka Univ.Yazaki
AichiNGKNagoya Institute of Technology
CKDToyota Tsusho ElectronicsNagoya Univ.
NiigataInstitute of Niigata Pref.
Niigata Univ.
GunmaTaiyo YudenShin-Etsu
FukuokaKyusyu Univ.
HyogoSumitomo Precision ProductsYamamoto Electric WorksUniv. of Hyogo
OsakaSumitomo Electric Industry
PanasonicOsaka Univ.
ShigaRitsumeikanUniv.Toray Research CenterOmron
KyotoTecdiaKyocera
Kyoto Univ.
ToyamaHokuriku Electric Industry
IwateLightomFTC Corporation
Iwate Univ.Ricoh Optical
TochigiKeihin
KagawaAoi Electronics
SaitamaNippon SignalWacom
LintecRiken Keiki
KoreaSamsung
SingaporeInstitute of Microelectronics (IME)
Overseas
NaganoSeiko EpsonNagano KeikiShinsyu Univ.
AomoriAomori Pref. Industrial Technology Research Center
TottoriTottori Univ.
MieToho Engineering
YamaguchiTosoh SGM
YamanashiHOYA
32
Layout of the Hands-on access fab. for 4/6 inch wafer
Used for power
transistor
production until
2008
Succeeded
by Univ
Newly
Installed
Donated by
industry
Transferred
from 0ther
lab
Companies are allowed to sell MEMS devices produced in the fab.
33
FhG Germany – Sendai city partnership
signing ceremony in Munich (July15,2005)
FhG Germany – WPI-AIMR Tohoku Univ.
partnership signing ceremony in Sendai
(Nov. 8, 2011)
FhG Project center in WPI-AIMR, Tohoku
Univ. (April 1, 2012)
Collaboration with FhG
(Fraunhofer Institute) in
Germany
1st Fraunhofer Symposium in Sendai “Doing Worldwide Business via MEMS technology” (Oct.19, 2005)10st Fraunhofer Symposium in Sendai (Nov.26, 2015)
34
Signing ceremony (2012/6/11)
Strategic PartnerTohoku U Stanford U EPFL
Tohoku U
Stanford U“your lab and imec are very
complimentary” Rudy Lauwereins,
Vice-President of IMEC
35
2012/6/21 Seminar at IMEC 2013/11/8 Seminar in Sendai 2014/11/12 Seminar at IMEC
(IMEC M.Yoneyama 2012/6/12)
2015/11/12 Seminar in Sendai
Collaboration with IMEC
36
Sendai MEMS showroom (MEMS Park Consortium (MEMSPC))
Efficient way to access accumulated knowledge
is important for heterogeneous integrationCatalog
http://www.mu-sic.tohoku.ac.jp/showroom/index.html (Japanese)
http://www.mu-sic.tohoku.ac.jp/showroom_e/index.html (English)
37
Show room for new achievement (2016 -)
A0 OverviewA1 Electrical measurement : GalvanometerA2 Wired communication : Carbon microphoneA3 Wireless communication : Vacuum tube radioB1 Recording : Phonograph (Edison), Tape recorderB2 Computer (1) (Digital) : Mechanical computerB3 Computer (1) (Analog) : Calculation scaleC1 Vacuum tube : Various vacuum tubesC2 Transistor・IC : From vacuum tube to transistorC3 Haggerty’s forecast (1964)C4 Large size vacuum tube for transmitterC5 Vacuum tube during the 2nd world warC6 Mercury rectifier and thyratronD1 Optical instruments (1) Measurement D2 Optical instruments (2) Camera E1 Hobby (1) (Robot) : Mechanical doll, Aibo, ManoiE2 Hobby (2) (Car, Hericopter) : Micro flying robotE3 Automobile : Model T Ford、Model A Ford manualF1 Fountain penF2 Illumination and lighterF3 Measure gause : Balance, ThermometerF4 Clock : Motor clock, tuning-fork clockF5 Typewriter : Portable typewriterG Kiyota MagfacturingH Books on the history of technology、I Tohoku Univ. ,companies
Historical Museum of Technology(近代技術史博物館) http://www.mu-sic.tohoku.ac.jp/museumE/index.html (English) 38
Historical Museum of Technology (近代技術史博物館) 39
40
MEMS Seminar in Tokyo (Aug. 23-25, 2006) 280 attendees
MEMS Seminar in Sendai (Aug. 22-24, 2007) 75 attendees
MEMS Seminar in Fukuoka (Aug.20-22, 2008) 150 attendees
MEMS Seminar in Nagoya (Aug.4-6, 2009) 100 attendees
MEMS Seminar in Tsukuba (Aug.5-7, 2010) 211 attendees
MEMS Seminar in Kyoto (Aug.9-11, 2011) 175 attendees
MEMS Seminar in Tokyo (Aug.22-24, 2012) 226 attendees
MEMS Seminar in Tsukuba Univ.(Aug.7-9,2 013) 110 attendees
MEMS Seminar in Osaka (Aug.5-7, 2014) 140 attendees
MEMS Seminar in Toyohashi (Aug.5-7, 2015) 161 attendees
MEMS Seminar in Sendai (Aug.3-5, 2016)
Free MEMS seminar by MEMSPC
（http://www.memspc.jp）
41
MEMS Training Program in Sendai MEMS PCSince Apr.2007. Fee 1 million yen. Trainee participate with own subject. 16 companies participated.
Planning,design
Fabrication(4 inch process)
TestingPresentation,
report
10 ~ 20 d 30 ~ 60 d ~ 10 d 3 d
Lectures on Internet School
of Tohoku University
3 months
DesignEx. Capacitive 3-axis accelerometerTraining of Fabrication
MEMS core Co.Ltd.
(Contract development)
Advantest component Co.Ltd.
(Contract production)
Micro System Integration Center
(Tohoku Univ.) (Hands-on access fab.) Faculty of Eng. (Tohoku Univ.)
(Initial stage prototyping)
MEMS Park
Consortium
(MEMSPC)
42
Company
Open collaboration by MEMSPC in Sendai
43iCAN (International Contest of Application in
Nano / micro technologies)5th contest （iCAN‘14） in Sendai (July, 19-22, 2014)
Pro ROBO (Robot to protect the home safety) winnerFukushima pref. Koriyama-kita technical high school
TEMS （Talking Equipment from Manual Sign）iCAN’11 winner, Kyoto Univ.
44Anywhere SADOU, iCAN’15 winner, Tohoku Univ., Osaka Univ. Demonstration in CES (Consumer Electronics Show)
in Lasvegus (Jan. 7, 2016)
45Prof. Shuji Tanaka Assos.Prof. Masanori Muroyama Assis.Prof. Shinya Yoshida
(Hetero integration) (Tactile sensor network) (Diamond electrode array)
Acknowledgment to collaborators
Summary
Activities in μSIC
Heterogeneous integration by wafer level transfer
(Diamond electrode array on LSI, Tunable SAW filter, PZT MEMS switch on LSI,
Tactile sensor network, Multi SAW filters on LSI, Massive parallel EB exposure system)
Filter for EUV
Hands-on access fabrication facility
Activities in MEMSPC
International collaboration (Fhg.(Germany), IMEC (Bergium))
Sendai MEMS showroom and historical museum of technology
MEMS seminar and MEMS training program
Open collaboration in Sendai area
iCAN
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