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Mobile Phone LG C1100 Service Manual
Citation preview
Serv
ice M
an
ual
Mo
del : C
1100
Service ManualC1100
P/N : MMBD0034301 Date : June, 2004 / Issue 1.0
- 1 -
1. INTRODUCTION ................................ 21.1 Purpose ............................................... 21.2 Regulatory Information ........................ 21.3 Abbreviations ....................................... 4
2. PERFORMANCE ................................. 62.1 H/W Features ...................................... 62.2 Technical Specification ........................ 7
3. TECHNICAL BRIEF ......................... 113.1 Transceiver ....................................... 113.2 Power Amplifier Module .................... 163.3 13MHz Clock ..................................... 173.4 Power Supplies for RF Circuits ......... 173.5 Digital Main Processor ...................... 183.6 Analog Main & Power Management
Processor ........................................... 233.7 Memory ............................................. 333.8 Display and Interface ......................... 343.9 Keypad Switches and Scanning......... 353.10 Microphone........................................ 363.11 Main Receiver .................................. 373.12 Headset Jack Interface ..................... 383.13 Speaker & MIDI IC ........................... 393.14 Key Back-light Illumination ............... 403.15 LCD Back-light Illumination .............. 413.16 MOTOR ............................................ 42
4. TROUBLE SHOOTING ................... 434.1 RX Trouble ........................................ 434.2 TX Trouble ......................................... 514.3 Power On Trouble ............................. 594.4 Charging Trouble ............................... 614.5 LCD Trouble. ..................................... 634.6 Receiver Trouble ............................... 654.7 Speaker Trouble ................................ 674.8 Mic Trouble ........................................ 694.9 Vibrator Trouble ................................. 714.10 Key Backlight LED Trouble .............. 734.11 Folder on/off Trouble ........................ 744.12 SIM Detect Trouble .......................... 764.13 Earphone Trouble ............................. 774.14 Indicator LED Trouble ...................... 804.15 RTC Trouble ..................................... 81
5. DISASSEMBLY INSTRUCTION ... 825.1 Disassembly ...................................... 82
6. DOWNLOAD AND CALIBRATION ............................. 906.1 Download .......................................... 906.2 Calibration ......................................... 97
7. BLOCK DIAGRAM ......................... 100
8. CIRCUIT DIAGRAM ....................... 101
9. PCB LAYOUT ..................................... 9511.1 TOP ................................................. 9511.2 BOTTOM ......................................... 96
10. ENGINEERING MODE ................ 10710.1 BB Test .......................................... 10710.2 RF Test .......................................... 10810.3 MF Mode ....................................... 10810.4 Trace optiont ................................. 11010.5 Call timer ....................................... 11010.6 Fact. Reset .................................... 11010.7 S/W version ................................... 110
11. STAND ALONE TEST.................. 11111.1 Introduction .................................... 11111.2 Setting Method .............................. 11111.3 HW Test : Software for Standalone
Test Setup ..................................... 112
12. AUTO CALIBRATION .................. 11412.1 Overview ....................................... 11412.2 Requirements ................................ 11412.3 Equipment Setup............................ 11412.4 AGC ............................................... 11612.5 APC ............................................... 11612.6 ADC ............................................... 11612.7 Setting ........................................... 11612.8 How to do calibration ..................... 116
13. EXPLODED VIEW &REPLACEMENT PART LIST ............................................................. 117
13.1 Exploded View ............................... 11713.2 Replacement Parts ........................ 11913.3 Accessory ...................................... 126
Table Of Contents
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1. INTRODUCTION
1.1 PurposeThis manual provides the information necessary to repair, calibration, description and downloadthe features of this model.
1.2 Regulatory Information
A. SecurityToll fraud, the unauthorized use of telecommunications system by an unauthorized part (forexample, persons other than your company’s employees, agents, subcontractors, or personworking on your company’s behalf) can result in substantial additional charges for yourtelecommunications services. System users are responsible for the security of own system.There are may be risks of toll fraud associated with your telecommunications system. Systemusers are responsible for programming and configuring the equipment to prevent unauthorizeduse. The manufacturer does not warrant that this product is immune from the above case but willprevent unauthorized use of common-carrier telecommunication service of facilities accessedthrough or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of HarmIf a telephone company determines that the equipment provided to customer is faulty andpossibly causing harm or interruption in service to the telephone network, it should disconnecttelephone service until repair can be done. A telephone company may temporarily disconnectservice as long as repair is not done.
C. Changes in ServiceA local telephone company may make changes in its communications facilities or procedure. Ifthese changes could reasonably be expected to affect the use of the this phone or compatibilitywith the network, the telephone company is required to give advanced written notice to the user,allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance LimitationsMaintenance limitations on this model must be performed only by the manufacturer or itsauthorized agent. The user may not make any changes and/or repairs expect as specificallynoted in this manual. Therefore, note that unauthorized alternations or repair may affect theregulatory status of the system and may void any remaining warranty.
E. Notice of Radiated EmissionsThis model complies with rules regarding radiation and radio frequency emission as defined bylocal regulatory agencies. In accordance with these agencies, you may be required to provideinformation such as the following to the end user.
1. INTRODUCTION
- 3 -
F. PicturesThe pictures in this manual are for illustrative purposes only; your actual hardware may lookslightly different.
G. Interference and AttenuationPhone may interfere with sensitive laboratory equipment, medical equipment, etc. Interferencefrom unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTIONBoards, which contain Electrostatic Sensitive Device (ESD), are indicated by thesign. Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange systemboards.
When repairs are made to a system board, they should spread the floor with anti-static matwhich is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION
1. INTRODUCTION
- 4 -
1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Rate
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
1. INTRODUCTION
- 5 -
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
- 6 -
2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Li-ion, 760 mAh
Standard Battery Cell Size: 33.8(W) x 49.7(H) x 4.6(T) [mm]
Weight: 30.00g
Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current
is below 4mA.
Talk time Up to 3 hours (GSM TX Level 7)
Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time Approx. Under 3 hours
RX Sensitivity GSM, EGSM: –105dBm, DCS: –105dBm
TX output powerGSM, EGSM: 33dBm (Level 5), DCS: 30dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V only
Display Main LCD: 128 x 128 pixel 65K Color STN
Hard icons. Key Pad;
Status Indicator0 ~ 9, #, *, Up/Down/Left/Right Navigation Key, Menu Key, Clear Key, Send Key, END/PWR KeySoft Key (Left/Right)
ANT External
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recording No
C-Mike Yes
Receiver Yes
Travel Adapter Yes
MIDI 16 Poly
Options Hands-free kit, CLA, Data Kit
2. PERFORMANCE
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2. PERFORMANCE
2.2 Technical Specification
Item Description Specification
GSM
TX: 890 + n x 0.2 MHzRX: 935 + n x 0.2 MHz (n=1~124)
EGSM1 Frequency Band TX: 890 + (n-1024) x 0.2 MHz
RX: 935 + (n-1024) x 0.2 MHz (n=975~1024)
DCSTX: 1710 + (n-512) x 0.2 MHzRX: 1805 + (n-512) x 0.2 MHz (n=512~885)
2 Phase ErrorRMS < 5 degreesPeak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 –30
250 –33
400 –60
600~ <1,200 –60
1,200~ <1,800 –60
1,800~ <3,000 –63
3,000~ <6,000 –65
5 Output RF Spectrum 6,000 –71
(due to modulation)DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 –30
250 –33
400 –60
600~ <1,200 –60
1,200~ <1,800 –60
1,800~ <3,000 –65
3,000~ <6,000 –65
6,000 –73
GSM, EGSM
Offset from Carrier (kHz). Max. dBm
400 –19
600 –21
1,200 –21
6 Output RF Spectrum 1,800 –24(due to switching
DCStransient)
Offset from Carrier (kHz). Max. dBm
400 –22
600 –24
1,200 –24
1,800 –27
7 Spurious Emissions Conduction,Emission Status
2. PERFORMANCE
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2. PERFORMANCE
Item Description Specification
GSM, EGSM
8 Bit Error RateBER (Class II) < 2.439% @–102 dBm
DCS
BER (Class II) < 2.439% @–100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 –12 –
200 0 –
300 0 –12
11 Sending Response 1,000 0 –6
2,000 4 –6
3,000 4 –6
3,400 4 –9
4,000 0 –
12 RLR 2 3 dB
Frequency (Hz) Max. (dB) Min. (dB)
100 –12 –
200 0 –
300 2 –7
500 –5
13 Receiving Response 1,000 0 –5
3,000 2 –5
3,400 2 –10
4,000 2
* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
–35 17.5
–30 22.5
16 Distortion–20 30.7
–10 33.3
0 33.7
7 31.7
10 25.5
17 Side tone Distortion Three stage distortion < 10%
18System frequency
≤ 2.5 ppm(13 MHz) tolerance
19 32.768KHz tolerance ≤ 30 ppm
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Item Description Specification
At least 80 dB under below conditions:20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm.
21 Charge CurrentCC Charge : < 500 mATrickle Charge : < 60 mA
Antenna Bar Number Power
5 –85 dBm ~
4 –90 dBm ~ –86 dBm
22 Antenna Display 3 –95 dBm ~ –91 dBm
2 –100 dBm ~ –96 dBm
1 –105 dBm ~ –101 dBm
0 ~ –105 dBm
Battery Bar Number Voltage
0 ~ 3.62V
23 Battery Indicator 1 3.62 ~ 3.73V
2 3.73 ~ 3.82V
3 3.82V ~
24 Low Voltage Warning3.5 0.03V (Standby)
3.62 0.03V (Call)
25 Forced shut down 3.35 0.03VVoltage
1 Li-ion Battery
26 Battery TypeStandard Voltage = 3.7VBattery full charge voltage = 4.2VCapacity : 950mAh
Switching-mode charger27 Travel Charger Input : 100 ~ 240V, 50/60 Hz
Output : 5.2V, 600 mA
2. PERFORMANCE
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3. TECHNICAL BRIEF
3.1 Transceiver (SI4205-BM, U301)The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part.
The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellularhandsets and wireless data modems. The integrated solution eliminates the IF SAW filter,external low noise amplifier (LNAs) for three bands, transmit and RF voltage controlled oscillator(VCO modules, and other discrete components found in conventional designs.
Figure 3-1. RECEIVER FUNCTIONAL BLOCK DIAGRAM
AN
TE
NN
A S
WIT
SH
TCXO
3. TECHNICAL BRIEF
(1) Receiver PartThe Aero I transceiver uses a low-IF receiver architecture which allows for the on chipintegration of the channel selection filters, eliminating the external RF image reject filters and theIF SAW filter required in conventional superheterodyne architectures.
A. RF front endRF front end consists of Antenna Switch(FL400), two SAW Filters(FL401, FL402) and dualband LNAs integrated in transceiver (U401).
The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed intothe antenna or Mobile switch.
The Antenna Switch(FL400) is used to control the Rx and Tx paths. And, the input signalsVC1 and VC2 of a FL400 are directly connected to baseband controller to switch either Tx orRx path on.
The logic and current is given below Table 3-1.
Table 3-1. The Logic and current
Three differential-input LNAs are integrated in SI4205. The GSM input supports the GSM 850(869-849 MHz) or E-GSM 900 (925-960MHz) bands. The DCS input supports the DCS 1800(1805-1880 MHz) band. The PCS input supports the PCS 1900 (1930-1990 MHz) band.
The LNA inputs are matched to the 150Ω balanced output SAW filters through external LCmatching networks. The LNA gain is controlled with the LNAG[1:0] and LNAC[1:0] bits inregister 05h (Figure 3-2).
VC1 VC2 Current
DCS TX 0V 2.5 ~ 3.0V 10.0 mA max
GSM TX 2.5 ~ 3.0V 0V 10.0 mA max
GSM/DCS RX 0V 0V < 0.1 mA
- 12 -
3. TECHNICAL BRIEF
- 13 -
3. TECHNICAL BRIEF
Figure 3-2. SI4205 RECEIVER PART
B. Intermediate frequency (IF) and DemodulationA quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediatefrequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency isbetween 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900modes. The mixer output is amplified with an analog programmable gain amplifier (PGA),which is controlled with the AGAIN[2:0] bits in register 05h (Figure3-2). The quadrature IFsignal is digitized with high resolution A/D converters (ADCs).
The ADC output is downconverted to baseband with a digital 100KHz quadrature LO signal.Digital decimation and IIR filters perform channel selection to remove blocking and referenceinterference signals. The selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1).The low selectivity filter has a flatter group channelization filter is in the baseband chip. Afterchannel selection, the digital output is scaled with a digital PGA, which is controlled with theDGAIN [5:0] bits in register 05h.
The amplified digital output signal go through with DACs that drive a differential analog signalonto the RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADC inputbaseband ICs. No special processing is required in the baseband for offset compensation orextended dynamic range.
Compared to a direct-conversion architecture, the low-IF architecture has a much greaterdegree of immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing,2nd order distortion of blockers, and device 1/f noise.
- 14 -
(2) Transmitter PartThe transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-lockedloop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for theGSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800(1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
Figure 3-3. SI4205 TRANSMITTER PART
A. IF ModulatorThe baseband converter(BBC) within the GSM chipset generates I and Q baseband signalsfor the Transmit vector modulator. The modulator provides more than 40dBc of carrier andunwanted sideband rejection and produces a GMSK modulated signal. The basebandsoftware is able to cancel out differential DC offsets in the I/Q baseband signals caused byimperfections in the D/A converters.
The Tx-Modulator implements a quadrature modulator. A quadrature mixer upconverts thedifferential in-phase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals with the IFLO togenerate a SSB IF signal that is filtered and used as the reference input to the OPLL.
The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2 togenerate the quadrature LO signals for the quadrature modulator, resulting in an IF between383 and 448 MHz. For the E-GSM 900 band, two different IFLO frequencies are required forspur management. Therefore, the IF PLL must be programmed per channel in the E-GSM900 band.
B. OPLLThe OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integratedTXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and itsoutput is divided by 2 for the GSM 850 and E-GSM 900 bands. The RFLO frequency isgenerated between 1272 and 1483 MHz. To allow a single VCO to be used for the RFLO,high-side injection is used for the GSM 850 and E-GSM 900 bands, and low-side injection isused for the DCS 1800 and PCS 1900 bands. The I and Q signals are automatically swappedwhen switching bands. Additionally, the SWAP bit in register 03h can be used to manuallyexchange the I and Q signals. Low-pass filters before the OPLL phase detector reduce theharmonic content of the quadrature modulator and feedback mixer outputs. The cutofffrequency of the filters is programmable with the FIF[3:0] bits in register 04h (Figure 3-3), andshould be set to the recommended settings detailed in the register description.
3. TECHNICAL BRIEF
÷ 2 BBG[1:0]
FIF[3:0]
TXBAND[1:0]
PDIBPDRB
SWAPTXIP
TXIN
I
Q
TXQP
TXQN
÷ 1,2
REG
RFOG
RFOD
REG
- 15 -
3. TECHNICAL BRIEF
(3) Frequency Synthesizer
Figure 3-4. SI4205 FREQUENCY SYNTHESIZER PART
The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators,loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses twomultiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used fortransmit mode. The IF PLL is used only during transmit mode. All VCO tuning inductors arealso integrated. The IF and RF output frequencies are set by programming the N-Dividerregisters, N RF1, N RF2 and NIF. Programming the N-Divider register for either RF1 or RF2automatically selects the proper VCO. The output frequency of each PLL is as follows:
The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a13 or 26 MHz reference frequency. For receive mode, the RF1 PLL phase detector updaterate ( ) should be programmed = 100 kHz for DCS 1800 or PCS 1900 bands, and = 200kHz for GSM 850 and E-GSM 900 bands. For transmit mode, the RF2 and IF PLL phasedetector update rates are always =200 kHz.
3.2 Power Amplifier Module (RF3133, U302)The RF3133 is a high-power, high-efficiency power amplifier module with integrated powercontrol. The device is self-contained with 50Ω input and output terminals. The power controlfunction is also incorporated, eliminating the need for directional couplers, detector diodes,power control ASICs and other power control circuitry; this allows the module to be drivendirectly from the DAC output.
The device is designed for use as the final RF amplifier in GSM 850, E-GSM 900, DCS and PCShandheld digital cellular equipment and other applications in the 824-849 MHz, 880-915 MHz,1710-1785 MHz, and 1850-1910 MHz bands.
On-board power control provides over 37 dB of control range with an analog voltage input(TX_RAMP); and, power down with a logic “low” for standby operation (TX_ENABLE).
External control (BAND_SELECT) is used to select the GSM or DCS band with a logic high orlow. A logic low enables the GSM band whereas a logic high enables the DCS band.
Figure 3-5. FUNCTIONAL BLOCK DIAGRAM OF RF3133
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1DSC/PCS IN
2
3
4
5
6
7
BAND SELECT
TX ENABLE
VBATT
VREG
VRAMP
GSM IN
DSC/PCS OUT
VC
C2
VC
C2
VCC OUT
GSM OUT
11
8
12
10
9
3. TECHNICAL BRIEF
- 17 -
3. TECHNICAL BRIEF
3.3 13MHz Clock (VCTCXO, X301)The 13 MHz clock(X301) consists of a TCXO(Temperature Compensated Crystal Oscillator)which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base bandchipset (U102, AD6537B), digital base band chipset (U101, AD6525), and MIDI (U401) chipset.
Figure 3-6. VCTCXO CIRCUIT DIAGRAM
3.4 Power Supplies for RF Circuits (RF LDO, U303)Two regulators are used for RF circuits. One is MIC5255 (U303), and the other is one port ofAD6537B (U102).
MIC5255 (U303) supplies power to transceiver (SI4205, U301).
One port of AD6537B supplies power to VCTCXO (X301).
Main power (VBAT) from battery is used for PAM (RF3133, U302) because PAM requires highpower.
Table 3-2. RF POWER SUPPLIERS
Figure 3-7. RF LDO CIRCUIT DIAGRAM
AD6535_AFCDAC
1608
VVCXO
2.2uC371
4VCC
15K
R317X301
13MHz
GND2
OUT3
C3721000p
AFC
Supplier Voltage Powers Enabled signal
U303 (VRF) 2.85V U301, U302 CLKON
U102 (VVCX0) 2.75V X301
Battery (VBAT) 3.4~4.2V U302,U303
10uC361
VRF
10u
C362
0.01u
C3633
GND21
IN5
OUT
U303MIC5255-2.85BM5
4BYP EN
R317 0
VBAT
CLKON
- 18 -
3.5 Digital Main Processor (AD6525, U101)
3. TECHNICAL BRIEF
AD6525 GSM-PROCESSOR
KEYPADCOL[4:0]KEYPADROW[4:0]
KEYPADMatrix JTAG
UniversalSystem
Connector(USC)
PowerSub-system
32kHz
AD6537B
DRV-OUT AGC
13MHz
VCO
Synthesizer
LAN-IN
RADIO(AD6523/AD6524)
ControlSerialPort
RX/TXI/Q
SerialPort
VOICEDATASerialPort
BacklightService light
FLASH16 bit
SRAM8 or 16 bit(optional)
AccessoryDevices
e.g.BATTERY
SIM
PA SupplyEnable
VDDIOVDDCORE
GNDIOGNDCORE
ASDOASFSASDI
VSDOVSDIVSFS
BSDOBSOFS
BSDIBSIFS
CLKOUT_GATECLKOUT
VBCRESETGeneric Serial Port E
OSCIN
OSCOUT
JTAGENTCK, TMSTDI, TDO
PWRONVDDRTC
RESET
JTAGE, HSL, GPIOUSCTX/RX/CLK
Generic Serial port AGeneric Serial port BGeneric Serial port D
BACKLIGHT0BACKLIGHT1
ROMCSADD[23:0]DATA[15:0]
RDWRHWR/UBSLWR/LBS
ASDIASDFSASDO
VSDIVSDOVSFS
MCLK oeMCLKRESET
RAMPRF TimingI/Q InterinceVOICE 1/F &Buzzer
AFC
MODE
JTAG
BSDIBSIFSBSDOBSOFS
DISPLAYCSLCDCTL
ROMCS
Generic Serial Port C
GPCS0GPCS1Generic Serial Port D-AGeneric Serial Port D-B
CLKINCLKON
Micro SM™RF Interface
SIM Serial Interface
GPIO[ ] / IR Q
DISPLAY(parallel or
serial)
USC
Figure 3-8. SYSTEM INTERCONECTION OF AD6525 EXTERNAL INTERFACE
- 19 -
3. TECHNICAL BRIEF
• AD6525 is an ADI designed processor.
• AD6525 consists of
1. BUS arbitration Subsystem• EBUS, RBUS, PBUS, SBUS, DMABUS, IOBUS
2. DSP Subsystem• ADI DSP, Viterbi coprocessor, Ciphering unit, Cache memory/controller system
3. MCU Subsystem• ARM7TDMI, boot ROM, Clock generation and access control module
4. Peripheral Subsystem• MMI group Keyboard, Display, Backlight, RTC, GPIO interface
• House Keeping group Watchdog Timer, Interrupt controller, General Timer
• GSM system group
• Direct Memory Access group Between PBUS,RBUS, and EBUS
- 20 -
3. TECHNICAL BRIEF
3.5.1 Interconnection with external devices
A. RTC Block InterfaceCountered by external X-TAL
The X-TAL oscillates 32.768KHz
B. LCD module interfaceThe LCD module is controlled by DBB chipset, AD6525.
When LCD operate, the AD6525 controls the LCD module through LCD_CS, LCD_RESET,ADD01, WR, DATA[00-15]. LCD_ID, LCD_RESET
Table 3-3. LCD module interface
C. RF InterfaceThe AD6525 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, CLKON , PA_EN,S_EN, S_DATA, S_CLK, RF_PWR_DWN
Table 3-4. RF CONTROL SIGNALS DISCRIPTION
Signals Description
LCD_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
LCD_RESET This pin resets LCD module.
This pin determines whether the data to LCD module are display dataADD1(RS) or control data. ADD1 can select 16 bit parallel bus. ADD1 is also
used to address flash memory.
WR Write control. The phone do not read data from LCD chip.
DATAParallel data lines. Color LCD driver chip uses the 16-bit datainterface.
2V8_VMEM 3V voltage is supplied to white colored LED driver for backlighting.
LCD_BACKLIGHT Control signal of white LED driver IC.
DATA[00-15] Parallel data lines, Sub LCD driver chip uses the 8-bit data in reface.
GPO Signal Name Description
17 PA_BAND PAM Band Select
9 ANT_SW1 Antenna Switch Band Select
11 ANT_SW2 Antenna Switch Band Select
- CLKON RF LDO Enable/Disable
16 PA_EN PAM Enable/Disable
19 S_EN PLL Enable/Disable
20 S_DATA Serial Data to PLL
21 S_CLK Clock to PLL
4 RF_PWER_DWN Powerdown Input
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3. TECHNICAL BRIEF
D. SIM InterfaceThe AD6525 check status periodically in call mode if SIM card is inserted or not, but theAD6525 don't check in deep sleep mode.
Interface by SIM_DATA, SIMCLK, SIM_RST(GPIO_23)
Table 3-5. SIM CONTROL SIGNALS DISCRIPTION
Figure 3-9. SIM CIRCUIT
E. Key InterfaceInclude 5 column and 5 row. The AD6525 detect key press by interrupt.
F. ADP3537B InterruptThere are two interrupts, EOC and CHRDET
EOC: End of Charge. AD6525 makes charging operation stop when high signal is inputted.
CHRDET: This pin is activated when the charger is inserted.
Description
SIM_DATAThis pin receives and sends data to SIM card. This model supportonly 3.0 volt interface SIM card.
SIMCLK Clock 3.25MHz frequency.
SIM_RST(GPIO_23) Reset SIM block
C116
1000p
VSIM
C1170.1u
220n
C115
CLK3
4GND1
GND278
GND39
GND4GND5
106
IORST
2VCC
15
VPP
J101
GCA261-6S
VA165
AV
L14
K02
200
VSIM
SIM_DATA
AD6525
- 22 -
3.5.2 AD6525 Architecture
Figure 3-10. AD6525 INTERNAL ARCHITECTURE
The internal architecture of AD6525 is shown in Figure 3-10. AD6525 regroups three mainsubsystems connected together through a dynamic and flexible communication bys network.It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory,Baseband converter functions, and terminal functions like MMI, SIM and Universal SystemConnector (USC).
The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing,channel equalization and channel codec functions. The code used to implement suchfunctions can be stored in external Flash Memory and dynamically downloaded on demandinto the DSP’s program RAM and Instruction Cache.
The microcontroller subsystem supports all the GSM terminal software, including the layer 1,2 and 3 of the GSM protocol stack, the MMI, and applications software such as dataservices, test and maintenance. It is tightly associated with on-chip system SRAM and alsoincludes boot ROM memory with a small dedicated routine to facilitate the initialization of theexternal Flash Memory via code download using the on-chip serial interface to the externalFlash Memory interface.
The peripheral subsystem is composed of system peripherals such as interrupt controller,real time clock, watch dog timer, power management and a timing and control module. Italso includes peripheral interfaces to the terminal functions: keyboard, battery supervision,radio and display. Both the DSP and the MCU can access the peripheral subsystem via theperipheral bus (PBUS).
For program and data storage, both the MCU subsystem and the DSP subsystem canaccess the on chip system SRAM and external memory such Flash Memory. The access tothe SRAM module is made through the RAM Bus (RBUS) under the control of the busarbitration logic. Similarly, access to the Flash Memory is through the parallel External Bus(EBUS).
3. TECHNICAL BRIEF
AD6525
AD6537BDSP
SRAM FLASH
MMIUSC
MUCPeripheral
RF-Control
Subsystem
SubsystemSubsystem(ARM7TDMI®)
DMA and BUSARBITRARION
Serial Link
DSP BUS
RBUS
EBUSPBUS
SBUS
- 23 -
3. TECHNICAL BRIEF
3.6 Analog Main & Power Management Processor (AD6537B, U102)
Figure 3-11. AD6537B FUNCTIONAL BLOCK DIAGRAM
AD6525orAD6526
- 24 -
• AD6537B is an ADI designed processor.
• AD6537B consists of
1. BB Transmit section• This section generates in-phase and quadrature BB modulated GMSK signals.
• Digital GMSK modulator, 10-bit DACs, Reconstruction Filter
2. BB Receive section• 2 identical ADC channels that process BB in-phase and quadrature input signals.
3. Auxiliary section• 2 auxiliary DASs •AFC DAC, IDAC, AUX ADC
• AUX ADC : 6 channels 10 bitsAFC DAC : 13 bitsIDAC : 10 bits
4. Voiceband section• Receive audio signal from MIC.
Send audio signal to Speaker
• It interconnect with external device like main microphone, main receiver, ear-microphone and Hands-free kit.
5. Power Management section• 8 LDOs Block in the AD6537B. VCORE, VMEM, VEXT, VSIM, VRTC, VABB, VMIC,
VVCXO
• Battery Charging Block
3. TECHNICAL BRIEF
- 25 -
3. TECHNICAL BRIEF
3.6.1 Baseband transmit section 1. The AD6537B Baseband Transmit Section is designed to support GMSK for both single-
slot and multi-slot application.
2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bitDACs and a matched pair of reconstruction filter
Figure 3-12. AD6537B BASEBAND TRANSMIT SECTION
3.6.2 Baseband receive section 1. This section consists of two identical ADC channels that process baseband in-phase(I)
and quadrature(Q) input signals.
2. Each channel consists of a coarse switched capacitor Anti-Alias filter, followed by a low-pass digital filter
Figure 3-13. AD6537B BASEBAND RECEIVE SECTION
3. TECHNICAL BRIEF
- 26 -
3.6.3 Auxiliary Section1. This section includes an Automatic Frequency Control (AFC) DAC, voltage reference
buffers, an Auxiliary ADC, and light controllers.
2. This section also contains AUX ADC and Voltage Reference
• AFC DAC: 13 bits
• IDAC: 10 bits
• The Auxiliary ADC provides :
Two differential inputs for temperature sensing.
- A differential input for the battery charger current sensor
- A single-ended input for battery voltage measurement
- A single-ended input for battery type identification
- Two single-ended inputs for microphone and hookswitch detection, one for each of twoanalog
Audio input channels
- Two general purpose external inputs
- REF, REFOUT, REFCHG
- REFADC and REFADC/2, and AGND1 inputs for offset and gain measurement
Figure 3-14. AD6537B AUXILIARY SECTION
CSFS
CSDI
CSDO
AD6537B
ControlSerialPort
AFCDAC
VoltageReference
REFTXCM
AuxADC
AFCDAC
REFBB
REFOUT
REF
REFCHG
TEMP1
TEMP2
AUXADC1
AUXADC2
AIN1P
AIN2P
BATTYPE
ISENSE
VBATSENSE
LIGHT1
LIGHT2
LIGHT3
LightControllers
3. TECHNICAL BRIEF
- 27 -
3.6.4 Audio Section1. Receive audio signal from microphone. C1100 use differential configuration.
2. Send audio signal to speaker. C1100 use differential configuration.
3. This section provides an audio codec with a digital-to-analog converter and an analog-to-digital converter, a ring tone volume controller, a microphone interface, and multipleanalog input and output channels.
4. It interconnect with external device like main microphone, main receiver, and headset jackthrough the AIN1N, AIN1P, AIN2N, AIN2P, AIN3N, AIN3P, AOUT1P, AOUT1N, AOUT2P,AOUT2N, AOUT3P, and AOUT3N port.
• AIN1P, AIN1N : Main microphone positive/negative terminal
• AOUT2P, AOUT2N : Main Speaker positive/negative terminal
• AIN2P, AIN2N : Ear-Mic microphone positive/negative terminal
• AOUT1P, AOUT1N : Ear-Mic speaker positive/negative terminal
Figure 3-15. AD6537B AUDIO SECTION
GPI
CSFS
CSDI
CSDO
ASFS
ASDI
ASDO
AD6537B
ControlSerialPort
Ring ToneVolume Controller
AudioSerialPort
Filter/SRC
Filter/SRC
DAC
ADC
PGA
PGA
PGA
AIN3P
AIN3N
8Ω
32Ω
32Ω
SPWR
AOUT2P
AOUT2N
AOUT1N
AOUT3N
AOUT3P
AOUT1P
SGND
AIN1P
AIN1N
AIN2P
AIN2N
AnalogSwitch
AnalogSwitch
Analog Adder
Microphone Interface
Gain Pre-Amp
3. TECHNICAL BRIEF
- 28 -
3.6.5 Power Management
Figure 3-16. AD6537B POWER MANAGEMENT SECTION
1. Power up sequence logic1. The AD6537B controls power on sequence
2. Power on sequencez
- If a battery is inserted, the battery powers the 8 LDOs.
- Then if PWRONKEY is detected, the LDOs output turn on.
- REFOUT is also enabled
- Reset is generated and send to the AD6525
3. TECHNICAL BRIEF
- 29 -
Figure 3-17. AD6537B POWER MODE LOGIC
2. LDO Block1. There are 8LDOs in the AD6537B.
- VCORE : supplies Digital Baseband Processor core and AD6537 digital core(1.8V, 80mA)
- VMEM : supplies external memory and the interface to the external memory onthe digital baseband processor (1.8V or 2.8V, 150mA)
- VEXT : supplies Radio digital interface and high voltage interface (2.8V,170mA)
- VSIM : supplies the SIM interface circuitry on the digital processor and SIMcard (1.8V or 2.85V, 20mA)
- VRTC : supplies the Real-Time Clock module (1.8 V, 200 µA)
- VABB : supplies the analog portions of the AD6537
- VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)
- VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
AD6537B
THERMThermalShutdown
DDLO
UVLO
CHGDET
VBAT
KEYON
DBBON
VRTC
VEXT
VCXDEN
POWERMODE
Enable
Mode
Enable
Mode
Enable
Mode
Enable
Mode
Enable
Digital coreLDO Regulator
Memory InterfaceLDO Regulator
External InterfaceLDO Regulator
SIM InterfaceLDO Regulator
VCXOLDO Regulator
VCORE Comparator
VMEM Comparator
VEXT Comparator
VCORE
VMEM
VEXT
VCORECP
VMEMCP
VEXTCP
low: VCORE < 1.5Vhigh: VCORE > 1.5V
high: VMEM > 2.5V or 1.5Vlow: VMEM < 2.5V or 1.5V
high: VEXT > 2.5V low: VEXT < 2.5V
VCORE
VMEM
VEXT
VSM
VVCXO
VSMEnControl Bit
3. TECHNICAL BRIEF
- 30 -
Table 3-6. AD6537B LDO DESCRIPTION
3. Battery Charging Block1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries.
Charger initialization, trickle charging, and Li-Ion charging control are implemented inhardware.
2. Charging Process
- Check charger is inserted or not
- If AD6537B detects that Charger is inserted, the CC-CV charging starts.
- Exception: When battery voltage is lower than 3.2V, the precharge(low current chargemode) starts firstly.
- And the battery voltage reach to 3.2V the CC-CV charging starts.
3. Pins used for charging
- CHG_DET: Interrupt to AD6525 when charger is plugged.
- CHG_EN: Control signal from AD6525 to charge Li+ battery
- EOC: Interrupt to AD6525 when battery is fully charged
- GATEIN: Control signal from AD6525 to charge NiMH battery. But, not used.
- MVBAT: Battery voltage divider. Divide ratio is 1:2.3 and it is sensed in AD6521AUX_ADC
4. TA (Travel Adaptor)
- Input voltage: AC 85V ~ 260V, 50~60Hz
- Output voltage: DC 5.2V ( ±0.2 V )
- Output current: Max 850mA ( ±50mA )
5. Battery
- Li-polymer & Li-ion battery (Max 4.2V, Nom 4.0V)
- Standard battery: Capacity - 770mAh, Advanced Li-ion
Description
VSIM 2.85V(is provided to SIM card)
VCORE 1.8V(is provided to the AD6525 & AD6537B’s digital core)
VRTC 1.8V(is provided to the RTC and Backup Battery)
VMIC 2.55V(is provided to the AD6525 I/O and used as microphone bias)
VTCXO 2.75V(is provided to VCTCXO)
VMEM 2.8V(is provided to Flash)
VEXT 2.8V(is provided to LCD)
3. TECHNICAL BRIEF
- 31 -
Figure 3-18. AD6537B BATTERY CHARGING BLOCK
Figure 3-19. C1100 AUDIO CIRCUIT
AD6537B
ControlSerialPort
CSFS
CSDI
CSDO
ChargeTimer
TroubleCharge
Chg.DAC
VCHG
GATEDRIVE
ISENSE
VBATSENSE
VBATx
BATTYPE
REFOHGRTRIF
RSENSE
AGND1
VCHARGER
RGATE
3-TerminalBattery Pack
RTEMP
thermistorINT InterruptLogic
AuxADC
CLOSE TO EARJACK
CLOSE TO MIC
CLOSE TO
HEADSET JACK
AD6537
0R124
2.2KR134
TC153
10u
R128
100C163
39p
1KR126
C179
39p
OB4-15L42-C33L
MIC101
12
C12339p
39p
C196
R156 100K
SP115
VEXT
R150
100
39p
C1651MR144
100pC171
1u
C157
C178
39p
C177
39p
100R148
100
R132
0.1uC124
C152
39p
VA153
AV
L5M
02-2
00
VEXT
R158 NA
VMEM
VA151
AV
L5M
02-2
00
C168
18p
39K
R153
C139 4.7u
SG
ND
1T
8
SG
ND
2R
8
SPWR1R10
SPWR2T10
NC_R12R12
N15
LG
ND
LIGHT1L16M15
LIGHT2LIGHT3
M16
B10AUXADC1AUXADC2
A9
DG
ND
M2
AIN1NR16
AIN1PP16R15
AIN2N
P15AIN2P
R13AIN3LAIN3R
R14
K15AOUT1NAOUT1P
J15
T9AOUT2N1
R9AOUT2N2
R11AOUT2P1
T11AOUT2P2AOUT3N
K16J16
AOUT3P
AG
ND
1
C193
VMEM
46N
O
2VCC
39p
U105
MAX4599EXT-T5C
OM
GND3
1IN
NC
VA152
AV
L5M
02-2
00
U104
MAX9075EXK-T
2GND
1OUT
VCC
5
3 VIN+
VIN-4
R159
1K
AV
L5M
02-2
00
VA154
C154
39p
4.7
R141
C188
0.1u
1MR145
VBAT
C155
39p39p
C153
39p
C161
10u
TC151
NA
R154R137 1K
4.7K
R130
R149
NA
2.2KR127
VMIC
VMEM
39p
C156
C160
0.1u
330KR147
R138
2.2K
C167
39p
J102
1
2
34
5
C170100p
C151 0.1u
C162
39p
R181 4.7
SP114
VMIC
HOOK_DET
VMIC_ON
JACK_DET
HOOK_DET
RLEDGLED
RECP
SPKN
SPKP
RECN
3. TECHNICAL BRIEF
- 32 -
Figure 3-20. MAIN RECEIVER CIRCUIT
Figure 3-21. CHARGING CIRCUIT
In order to reduce time for trickle charging, additional circuit (Pre-charge circuit) was included.This circuit has supplied a 50mA current into the battery additionally.
So call it, it reduce trickle charging time
Closed to Analog SW
47p
C412C411
47p
R407
0
0
R409
4.7
R414
100KR415
C40747p
39pC409
NA
VMEM
R405
R406
NA
47pC410
1V+
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
2NO1
10NO2
MAX4684EUBU402
4.7
R416
47pC406
SPK_REC_N
SPK_REC_P
SPKN
SPKP
RECP
RECN
SPK_RCV_SEL
1%
Current Sense
CLOSE TO BATTERY PACK
D6
G4 5S
TPCF8102
D11D22D33 D4 6
D5 7
8
Q103
VCHARGE VBAT
0.1u
C14049.9R162
0
R163
100KR1651.5K
R157
1KR164
NAR155
6
3
1
4
Q104
UMX1NTN
2 5
VBAT
330R108
D101
CUS02
0.2R107
VCHARGE
10u
C187
RED_LEDPRE_CHARGE
3. TECHNICAL BRIEF
- 33 -
3.7 Memory (TH50VPF5783AASB, U201)
Block Diagram
Figure 3-22. MEMORY BLOCK DIAGRAM
• 128Mbit flash memory + 32Mbit PSRAM
• 16 bit parallel data bus
• ADD01 ~ ADD22.
• 2 Chip enables for Flash memory select.
• RF Calibration data, Audio parameters and battery calibration data etc are stored in Flashmemory area.
Vccf Vss
DQ0~DQ15(DQ0~DQ7)
Vccps
A0~A20
A-1 A0~A21
A-1 A0~A21
WP/ACC
RY/BYf
BYTE
WEOE
CE1ps
CE2psUBLB
RESETCEf1CEf2
Vss
128 MbitsFLASH Memory
328 MbitsPSEUDO SRAM
DQ0~DQ15
DQ0~DQ15
- 34 -
3.8 Display and InterfaceTable 3-7. LCD module discription
C1100 Main LCD supports one 65,536 color LCD module.
There are the control signals : LCD_CS (This acts as the chip select enable for the LCD Driver),WR, ADD01(RS) and LCD_RESET. DATA[00:15] pins to send data for displaying graphical textonto the LCD.
Figure 3-23. LCD INTERFACE CIRCUIT
3. TECHNICAL BRIEF
Main LCD Display Format 128 X RGB X 128 dots
Main LCD Backlight White LED Backlight
LCD BACKLIGHT LED
C255
22p
C219
22p
39pC262
C242
22p22p
C276
820R204
456789
20212223242526272829
3
30313233341
1011121314151617 18
19
2
CN201
EN_SET9
11GND
10IN
2OUT
U203
AAT3123ITP-20-T1
4C1+
C1-3
C2+1
12C2-D1
8
D27
D36
D45
22p
C225C215
22p 22p
C224C221
22p
R210 820
22p
C240
22p
C227
C258
1uF
VBAT
C220
VRTC
22p 22p
C243C212
22p
C223
22p
C244
22p
C233
22p
VA207
AV
L14
K02
200
C214
22p 22p
C222C216
22p
R213 820
C237
22p
C274
22p
C247
22p22p
C235
22p
C239 C248
22p
C257
22p
R214 820
C2601uF
820
R212
R202
820
22p
C241
22p
C246
C261
VEXT
1uF
22p
C238
820R205
820R209820R211
C278
22p
330R219
820R203
C271
18p
C217
VBAT
22p
FB1
22p
C213
22p
1uF
C254
C259
22p
C231
22p
C245
C272
18p
C275
22p 22p
C256
R218 330
C236
22p22p
C218
820R201
22p
C211 C234
22p
R206 820R207 820
820R216
C226
22p
820R208
C232
22p22p
C277
R215 820
SPK_REC_NSPK_REC_P
LCD_RESET
LCD_CSMOTOR
DATA05
DATA07DATA06
DATA04DATA03DATA02DATA01DATA00
ADD01
LCD_DIM
DATA10DATA09DATA08
DATA11DATA12
DATA15
DATA13DATA14
WR
LCD_ID
- 35 -
3. TECHNICAL BRIEF
3.9 Keypad Switches and ScanningThe key switches are metal domes, which make contact between two concentric pads on thekeypad layer of the PCB when pressed. There are 24 switches (SW1-SW2,KB2~KB22),connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power switch(KB101), which is connected independently. Functions, the row and column lines of the keypadare connected to ports of AD6525. The columns are outputs, while the rows are inputs and havepull-up resistors built in.
When a key is pressed, the corresponding row and column are connected together, causing therow input to go low and generate an interrupt. The columns/rows are then scanned by AD6525to identify the pressed key.
Figure 3-24. C1100 KEYPAD CIRCUIT
6
3MENU
RIGHT
2
0
SELECT
*
98
UP
LEFT
CONFIRMDOWN
SEND7
CLR
1
4
#
DOWN
5UP
SP205
SP235
KB19SP230
SP234
123
45
SW1
KB10
KB2SP209
KB16
SP201
KB17
VA201
AV
L5M
02-2
00
SP228KB15
KB5
KB11
KB12
680
R243
SP211
SP207
KB8
KB14
SP206
KB20
SP208
SP227 SP226KB3KB7
SP231
SW2
123
45
KB18
AV
L5M
02-2
00
SP233
VA202
SP229
KB6
KB9
680
R242
KB21
SP212 SP210
SP232
SP213
SP204
KB22
KB4
KB13
KEY_ROW0
KEY_COL2
KEY_ROW1
KEY_COL0
KEY_ROW4
KEY_COL1
KEY_COL3KEY_COL4
KEY_ROW2
KEY_ROW3
PWR KEY
0.01u
C144
KEYON (AD6537B)R161
1K KB101
3.10 MicrophoneThe microphone is placed to the front cover and contacted to main PCB. The audio signal ispassed to AIN1P and AIN1N pins of AD6537B. The voltage supply VMIC is output fromAD6537B, and is a bias voltage for the AIN1P. The AIN1P and AIN1N signals are then A/Dconverted by the Voiceband ADC part of AD6537B. The digitized speech is then passed to theDSP section of AD6525 for processing (coding, interleaving etc.).
Figure 3-25. MICROPHONE
- 36 -
3. TECHNICAL BRIEF
AIN1P
AIN1N
1k
2.2k39p
10u
100
39p
100 0.1u39p
39p 39p
2.2k39p 39p
Main Mic
AD6537B
VMIC
- 37 -
3. TECHNICAL BRIEF
3.11 Main ReceiverThe Receiver is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain iscontrolled by the PGA in an AD6537B.
The Receiver is placed in the folder cover and contacted to LCD MODULE
Figure 3-26. MAIN RECEIVER
- 38 -
3.12 Headset Jack InterfaceThis phone chooses a 3-pole type ear-mic jack which has three electrodes such as Receiver+, Mic+, and GND. This type usually supports only single-ended configuration in the audiopath. But most of phones use the common interface.
Figure 3-27. HANDS-FREE & HEADSET JACK INTERFACE
3. TECHNICAL BRIEF
AIN2NAIN2P
AIN3LAIN3R
AD6537B
CLOSE TO EARJACK
HEADSET JACKTC153
10u
C179
39p
C12339p
39p
C196
R156 100K
SP115
VEXT
R150
100
39p
C1651MR144
100pC171
C178
39p
C177
39p
100R148
0.1uC124
C152
39p
VA153
AV
L5M
02-2
00
VEXT
R158 NA
VMEM
C168
18p
39K
R153
VMEM
46N
O
2VCC
U105
MAX4599EXT-T5C
OM
GND3
1IN
NC
U104
MAX9075EXK-T
2GND
1OUT
VCC
5
3 VIN+
VIN-4
R159
1K
AV
L5M
02-2
00
VA1544.7
R1411MR145
39p
C153
NA
R154R137 1K
4.7K
R130
VMIC
VMEM
330KR147
R138
2.2K
C167
39p
J102
1
2
34
5
C170100p
C151 0.1u
R181 4.7
SP114
HOOK_DET
VMIC_ON
JACK_DET
- 39 -
3. TECHNICAL BRIEF
3.13 Speaker & MIDI ICC1100 don’t use buzzer. but uses the loud speaker and Melody IC which makes the robustjoyful melody sounds.
• Melody IC control2GPIO are assigned to control melody IC. Melody data is transferred to melody IC.
Figure 3-28. SPEAKER & MIDI IC
This phone have a melody IC of Yamaha, YMU759B is a synthesis LSI for portabletelephone that is capable of playing high quality music by utilizing FM synthesizer andADPCM decoder. This chipset is equipped with Yamaha's original FM synthesizer, withwhich the device is capable of simultaneously generating up to 16 voices with differenttones, that is 16 polys. YMU759B includes a speaker amplifier low ripple whose maximumoutput is 550mW at SPVDD = 3.6V.
Closed to Analog SW
(16 Poly MIDI)
C403 0.1u
47p
VMEM
R403
10K
C412C411
47p
C404
R407
0.01u
0
0
R409
28_WR
4.7
R414
HPOUT_L10
HPOUT_R11
5IFSEL
6 PLLC
32 SDOUT
SPOUT117
SPOUT218
SPVDD 15
16SPVSS
VDD7
VREF9
8 VSS
_CS29
_IRQ3
31_RD
4_RST
30A0
1CLK1
D027
D126
D225
D324
D42322
D521
D620
D7
12EQ1
EQ2 13
14EQ3
EXT1 219EXT2
YMU759B U4010R401
100p
C405
0
R404
R408 3.3K
100KR415
10K
R412
C40747p
39K
R402
VBAT
39pC409
NA
VMEM
R405
R406
NA
47pC410
1V+
150KR417
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
2NO1
10NO2
MAX4684EUBU402
4.7
R416
R410 047pC406
1000p
R413
0
C402 0.1u
C401
0.1u
SPK_REC_N
SPK_REC_PC408
13MHZ_MIDIMIDI_RESET
ADD00RD
MIDI_CS
WRMIDI_INT
DATA08DATA09DATA10DATA11DATA12DATA13DATA14DATA15
SPKN
SPKP
RECP
RECN
SPK_RCV_SEL
- 40 -
3.14 Key Back-light IlluminationIn key back-light illumination, there are 10 blue LEDs on main PCB keypad side , which aredriven by LIGHT3 line from AD6537B.
Figure 3-29. KEY BACK-LIGHT ILLUMINTION
3. TECHNICAL BRIEF
LD118LD111
SP109 SP110
LD115
47R116
LD119
R11347
LD116
SP108
R1174747
R11247
R118 R11947
SP102
LD114LD113
SP105SP104
LD117
SP106
47R115
LD112
47R114
LD120
SP107
R11147 47
R120
SP103 SP111
VBAT
AD6537B
LIGHT1
LIGHT2
LIGHT3
RLED
GLED
RED LED
GREEN LED
NAR264
5
6
3
1
4
Q201
UMX1NTN
2
10K
R225
0R263
R262
0
0
R261
R226 47K
R229 47K47K
R227
RLED
GLED
RED_LEDIND_LEDG
- 41 -
3. TECHNICAL BRIEF
3.15 LCD Back-light IlluminationIn LCD Back-light illumination, there is an charge pump driver in main PCB, which is controlledby LCD_DIM line from AD6525.
Figure 3-30. MAIN LCD BACKLIGHT ILLUMINATION
LCD BACKLIGHT LED
39pC262
EN_SET9
11GND
10IN
2OUT
U203
AAT3123ITP-20-T1
4C1+
C1-3
C2+1
12C2-D1
8
D27
D36
D45
C258
1uF
VA207
AV
L14
K02
200
C2601uF
C2611uF
C271
18p
VBAT
FB1
1uFC259
C272
18p
LCD_DIM IND_LEDG
LCD MODULE
3.16 MOTORThe Vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator isdriven from VIBRATOR (GPIO_0) of AD6525.
Figure 3-31. MOTOR
- 42 -
3. TECHNICAL BRIEF
20R223
1SS352D201
47KR224
VBAT
R230 220
R234100K
VBAT
VA204
AV
L14
K02
200
23
64
1
5
Q202
EMZ2 C2734.7u
1.5KR233
MOTOR
VIBRATOR
- 43 -
4. TROUBLE SHOOTING
4.1 RX Trouble
RX Check Area
HP8922 : Test mode62 CH, 7 level setting (TCH)
62 CH, -60dBm setting (BCCH)Spectrum analyzer settingOscilloscope setting
START
1.CheckRegulator Circuit
2.CheckVCTCXO Circuit
3.CheckControl Signal
4.CheckAnt SW &Mobile SW
5. CheckSaw Filter
Circuit
6. CheckRX IQ
Redownload SW, CAL
4. Trouble Shooting
1
2
6
5
3
4Test Point
Checking FlowFigure 4-1.
4. Trouble Shooting
- 44 -
(1) Checking Regulator Circuit
Test Points
Circuit Diagram
Checking Flow
Figure 4-2.
U303. 3
U303. 5
Pin 3. High ?
Yes
Changing the BoardRF 2.85V O.K?
Yes
No
Replace U303Regulator Circuit is OKSee next Page to checkVCTCXO
NoCheck Pin 5.
10uC361
VRF
10u
C362
0.01u
C3633
GND21
IN5
OUT
U303MIC5255-2.85BM5
4BYP EN
R317 0
VBAT
CLKON
4. Trouble Shooting
- 45 -
(2) Checking VCTCXO Circuit
Test Points Checking Flow
Waveform
Circuit Diagram
Figure 4-3.
No
Yes
No
Yes
Check Pin 3.Refer to Graph 2-1
Check Pin 4.Refer to Graph 2-2
13 MHzO.K?
2.75V OK?
Check U101, PMIC
VCTCXO Circuit is OKSee next Page to checkANT SW & Mobile SW
Changing X301
(1608)
AD6535_AFCDAC
C373100p
1000pC372
R314
C3712.2u
100
X301
2GND
3OUT
VCC4
13MHz
VVCXO
R315
15KAFC
X301. 4 X301. 3
4. Trouble Shooting
- 46 -
(3) Checking PLL Control Signal
Test Points
Waveform
Checking Flow
Figure 4-4.
S_DATA
S_CLK
S_EN
RF_PWR_DWN
Check RF_PWR_DWN. Level is High?
Yes
Control Signal is OKSee next Page to checkANT SW & Mobile SW
No
Check TP Check if there isAny Major DifferenceRefer to Graph 3-13-2
Similar?
Yes
No
Download the SW
Download the SW
4. Trouble Shooting
- 47 -
(4) Checking Ant SW & Mobile SW
Test Points
Circuit Diagram Waveform
Figure 4-5.
GPO_9
GPO_11
22pC321
C383 27p
0.5pC322
C385 10p
10pC382
C325NA
33nH
L305
C384 3.3p
KMS-507 SW301AN
TG
1
G2
RF
14GND7
VC
1
11
VC
2
2SHS-C090DR
FL3018ANT
1DCS_RX
DCS_TX3
EGSM_RX10
EGSM_TX5
GND14
GND26
GND37
GND49
GND512
GND613
33nH
L306
27p
C387
ANT_SW1
ANT_SW2
SW301. RF
FL301. 1
FL301. 10
L306 (VC1)
L305 (VC2)
SW301. ANT
4. Trouble Shooting
- 48 -
Checking Flow
Check L305, L306Check whether Ant SWSet as RX modeRefer to Table 4-1
Check SW301 Pin ANT,RFwith RF Cable connected. Open
Yes
Yes
Yes
Yes
Changing SW301
Check SW301 Pin ANT,RFwith No RF Cable Connected
For these 2 test case,No Call connection is needed
No
Changing SW301No
Changing the Board.No
Changing FL301NoCheck RF Level of
FL301.2 (for GSM) &FL301.11(for DCS)
Ant SW & Mobile SW is OKSee next Page to checkRx IQ Signal
For this RF Level test case,RX Stand alone Mode is neededrefer to chapter 11
Short
VC1 : LowVC2 : Low
Pin10 : ~ -62dBmPin 1 : ~ -63dBm
Table 4-1.
ANT SW VC1 VC2
DCS TX 0 1
EGSM TX 1 0
EGSM,DCS RX 0 0
4. Trouble Shooting
- 49 -
(5) Checking SAW Filter Circuit
Test Points
Checking Flow
Circuit Diagram
Figure 4-6.
FL302
B7820
G1
2
G2
5
IN1 O1
3
O2
4
C353
1p
C352
1p
7.5nHL304
27nHL303
C354
1p
1p
C351
G1
2
G2
5
IN1
3O1
O2
4
FL303
B7821
27p
C387
Check RF Level ofSaw Filter InputFor GSM : FL302.1
Check RF Level ofSaw Filter OutputFor GSM : FL302.3For DCS : FL303.3
FL303.1 : ~ -61dBm
FL302.3 : ~ -64dBmFL303.3 : ~ -65dBm
Saw Filter is OKSee next Page to checkRx IQ Signal
Yes
Yes Yes
No
Check the parts arewell SolderedFor GSM : C387
No No
Check the parts are well SolderedFor GSM : L303,C351For DCS : L304, C353
ChangingC387for GSM
ChangingC387for GSM
For the test,RX Stand alone Mode isneeded. Refer to chapter 11
ChangingL303, C351 for GSML304, C353 for DCS
ChangingFL302 for GSMFL303 for DCS
FL303FL302
- 50 -
4. Trouble Shooting
(6) Checking RX IQ
Test Points
Waveform
Checking Flow
Circuit Diagram
Yes
NoCheck C342, C343.Check if there isAny Major Difference• Refer to Graph 4-4
Similar? Replace U301
Redownload the SoftwareAnd calibrate
39p
39p
C343
C342
QP
QN
IP
IN
Figure 4-7.
Graph 4-4.
C342C343
- 51 -
4.2 TX Trouble
4. Trouble Shooting
START
1. CheckRegulator Circuit
2. CheckVCTCXO Circuit
3. CheckControl Signal
HP8922 : Test mode 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH)
Spectrum analyzer settingOscilloscope setting
4. CheckTX IQ
5. CheckPAM Control Signal
6. Check Ant SW &Mobile SW
Redownload SW, CAL
Test Points
Checking Flow
Figure 4-8.
6
1
2
3
5
4
- 52 -
(1) Checking Regulator Circuit
Figure 4-9.
4. Trouble Shooting
10uC361
VRF
10u
C362
0.01u
C3633
GND21
IN5
OUT
U303MIC5255-2.85BM5
4BYP EN
R317 0
VBAT
CLKON
No No
Yes Yes
RF 2.85VO.K? Pin 3. High ? Changing the Board
Regulator Circuit is OK.See next Page to checkVCTCXO
Replace U303
Check Pin 5 .
Test Points
Circuit Diagram
Checking Flow
U303. 3
U303. 5
- 53 -
4. Trouble Shooting
(2) Checking VCTCXO Circuit
Yes
Yes
Check Pin 3.• Refer to Graph 2-11
13 MHzO.K?
2.75V OK?
Check U101,PMIC
No
No
Changing X301
VCTCXO Circuit is OKSee next Page to checkANT SW & Mobile SW
(1608)
AD6535_AFCDAC
C373100p
1000pC372
R314
C3712.2u
100
X301
2GND
3OUT
VCC4
13MHz
VVCXO
R315
15KAFC
Figure 4-10.
Test Points Checking Flow
Waveform
Circuit Diagram
X301. 4 X301. 3
(3) Checking PLL Control Signal
- 54 -
4. Trouble Shooting
No
No
Yes
Yes
Check RF_PWR_DWN.
Similar?
Control Signal is OK.See next Page to checkANT SW & Mobile SW
Level is High? Download the SW
Download the SW
Figure 4-11.
Test Points
Checking Flow
Waveform
S_DATA
S_CLK
S_EN
RF_PWR_DWN
- 55 -
4. Trouble Shooting
(4) Checking Ant SW & Mobile SW
Graph 4-7.(a) Graph 4-7.(b)
Figure 4-12.
GPO_9
GPO_11
22pC321
C383 27p
0.5pC322
C385 10p
10pC382
C325NA
33nH
L305
C384 3.3p
KMS-507 SW301AN
TG
1
G2
RF
14GND7
VC
1
11
VC
2
2SHS-C090DR
FL3018ANT
1DCS_RX
DCS_TX3
EGSM_RX10
EGSM_TX5
GND14
GND26
GND37
GND49
GND512
GND613
33nH
L306
27p
C387
ANT_SW1
ANT_SW2
Test Points
Waveform
Circuit Diagram
SW301. RF
FL301. 1L306 (VC1)
L305 (VC2)
SW301. ANT
FL301. 10
- 56 -
(5) Checking Ant SW & Mobile SW
4. Trouble Shooting
Yes
Yes
Yes
Yes
For the test,TX Stand alone Mode is needed. Refer tochapter 11 (PL=7 for GSM, PL=2 for DCS)
Check L305, L306Check whether Ant SWSet as TX mode• Refer to Graph 4-7(a),4-7(b)• Refer to Table 4-2
Check RF Level ofFL301 Pin 5 (for GSM) & Pin 3(for DCS)
Check SW301.ANT, RF withRF Cable connected.
Check SW301.ANT,RFwith RF Cable disconnected
Check VC1, VC2 Changing board
Go to 4.3.5 Checking PAMcontrol signal
Changing SW301
Changing SW301
Pin5 : ~29.5dBmPin 3 : ~26.5dBm
Open
Short
END
No
No
No
No
Checking Flow
Table 4-2.
ANT SW VC1 VC2
DCS TX 0 1
EGSM TX 1 0
EGSM,DCS RX 0 0
- 57 -
4. Trouble Shooting
(6) Checking PAM Control Signal
Go to Next Step
Similar?
Yes
NoDownload S/W
Graph 4-8.
Figure 4-13.
Test Points
Waveform
Checking Flow
TX_RAMP (R301)
PA_EN (R302)
Check TX_RAMP and PA_ENCheck if there is Any Major Difference or not Refer to Graph 5-11
- 58 -
(7) Checking TX IQ
Figure 4-14.
Graph 4-9.
C399
22n 22p
C386
39p
39p
C343
C342
TXIN5
TXIP4
TXQN7
TXQP6
32V
DD
2
RXIN32
RXIP
1RXQN
GN
D4
31
QP
QN
IP
IN
4. Trouble Shooting
Test Points
Waveform
Circuit Diagram
C342C343
4. Trouble Shooting
- 59 -
4.3 Power On Trouble
Figure 4-15. AD6537B POWER MANAGEMENT SECTION
For AD6535 & 6537B
VBAT
VSIM
C133
10u
VMIC
C147
22p
VBAT
VCORE VMEM
VBAT
VEXT
10u
C146
A4
VE
XT
1B
4V
EX
T2
T3
VM
EM
1V
ME
M2
T2
VM
ICN
16
T7VRTC
VS
IMT
6D
16V
VC
XO
H16
VA
BB
VB
AT
1N
2
C15
VB
AT
1-1
P2
VB
AT
2
VB
AT
2-1
G15
VB
AT
2-2
H15
R2
VB
AT
3
VB
AT
3-1
A3
VB
AT
3-2
B3
R5
VB
AT
4V
BA
T5
R4
B8VBATSENSE
VBAT_NETT4
P1
VC
OR
E1
N1
VC
OR
E2
R6
NC
_R6
C149
39p
VVCXO
R101NA
C148
47n
47n
C132
10u
C13510u
C131
C137C136
10u10u
VRTC
R104
NA
C195
0.1u
0
R103
10u
C134
AD6537B
Circuit Diagram Test Points&
4. Trouble Shooting
- 60 -
No
No
No
No
NoNo
Yes
Yes
Yes
Yes
Yes
START
Check Battery Voltage> 3.35V ?
Push power-on key and check the level change of
U102 KEYON
Check the voltage ofthe following port at U102
VOORE=1.8V ?VMEM = 1.8 or 2.8V ?
VEXT=2.8V ? VRTC=1.8V ?VSIM=2.85V ? VMIC=2.5V ?VVCXO=2.75V ?
Logic level at KEYON of U102= HIGH?
Does it work properly?
THE PHONE WILLPOWER ON.
Charge or Change Battery and try again.
Check the contact of power-key or dome switch.
Replace U102
Redownload software & try again.
Yes
Yes
Does it work properly?
The power-on procedure is completed.The problem may be elsewhere.
Replace the main board.
Checking Flow
- 61 -
4. Trouble Shooting
4.4 Charging Trouble
Figure 4-16.
1%
Current Sense
CLOSE TO BATTERY PACK
D6
G4 5S
TPCF8102
D11D22D33 D4 6
D5 7
8
Q103
VBAT
330R108
D101
CUS02
VCHGISENSE
GATEDRIVE
0.2R107
VCHARGE
10u
C187
Test Points
Circuit Diagram
D101 Q103
R107
- 62 -
4. Trouble Shooting
Voltage at VCHG of U102 = 5.2V?
R107, Q103, D101 well-soldered?
Voltage across D101 = ~0.3V
Voltage acrossR107 is ~100mV.
~0.7< Voltage(Q103) < ~1.3V
Is the battery charged ?
The charging adaptor(TA) is out of order.Change the charging adaptor.
Resolder R102, U102, D101.
Replace D101.
Replace R107.
Replace Q103.
The battery may have the problem.Change the battery and try again.
CHARGING WILLOPERATE PROPERLY.
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
START
SETTING : Connect the battery and the charging adaptor(TA) to the phone
Checking Flow
- 63 -
4. Trouble Shooting
4.5 LCD Trouble.
Figure 4-17.(a) Figure 4-17.(b)
Figure 4-17.(c)
Checking Flow
Connection Check
CN201
If the FPCB has aproblem,the control signals forLCD cannot betransmitted properly.
- 64 -
4. Trouble Shooting
START
Is the connection of LCDmodule with LCD connector on
PCB OK?
Check the soldering of CN201
Check the soldering ofConnector at LCD module.
Check the soldering of CRC filter
Does LCD work properly?
LCD WILL WORKPROPERLY.
The FPCB which connects the mainboard and LCD module
has a problem. Replace the FPCB.
Change the FPCB and try again.
At LCD module
FPCB Check
Reassemble LCD module with LCD connector.
Resolder CN201.
Resolder connector.
Resolder CRC filter.
Replace LCD module.
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
Checking Flow
- 65 -
4. Trouble Shooting
4.6 Receiver Trouble
AD6537B
AOUT1P
AOUT1N
MIDI
Closed to Analog SW
47p
C412C411
47p
R407
0
0
R409
4.7
R414
100KR415
C40747p
39pC409
NA
VMEM
R405
R406
NA
47pC410
1V+
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
2NO1
10NO2
MAX4684EUBU402
4.7
R416
47pC406
SPK_REC_N
SPK_REC_P
SPKN
SPKP
RECP
RECN
SPK_RCV_SEL
Receiver path
SPK path
Figure 4-18.
Test Points
Circuit Diagram
U401
vibratorSpeaker
Receiver
U402
R414C411
C412R416
Solderingcheck
4. Trouble Shooting
- 66 -
Checking Flow
Waveform
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
START
Check the signal level of RCVP & RCVN at R414, R416. Are
these voltage is about 1.2V?
Check the signal level at R415. Is it almost 0?
Check the soldering R414 & R416
Re-soldering R414, R416
Check the soldering of U402
Replace the Main board. ABB is out of order.
Re-soldering U402
Replace the dual mode speakerCheck the contact state of dual mode speaker.
The dual mode speaker will work properly.
Replace U402
No
No
No
No
No
Yes
Yes
Yes
Yes
Graph 4-10.
4. Trouble Shooting
- 67 -
4.7 Speaker Trouble
Test Points
Circuit Diagram
Figure 4-19.
Closed to Analog SW
(16 Poly MIDI)
C403 0.1u
47p
VMEM
R403
10K
C412C411
47p
C404
R407
0.01u
0
0
R409
28_WR
4.7
R414
HPOUT_L10
HPOUT_R11
5IFSEL
6 PLLC
32 SDOUT
SPOUT117
SPOUT218
SPVDD 15
16SPVSS
VDD7
VREF9
8 VSS
_CS29
_IRQ3
31_RD
4_RST
30A0
1CLK1
D027
D126
D225
D324
D42322
D521
D620
D7
12EQ1
EQ2 13
14EQ3
EXT1 219EXT2
YMU759B U4010R401
100p
C405
0
R404
R408 3.3K
100KR415
10K
R412
C40747p
39K
R402
VBAT
39pC409
NA
VMEM
R405
R406
NA
47pC410
1V+
150KR417
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
2NO1
10NO2
MAX4684EUBU402
4.7
R416
R410 047pC406
1000p
R413
0
C402 0.1u
C401
0.1u
SPK_REC_N
SPK_REC_PC408
13MHZ_MIDIMIDI_RESET
ADD00RD
MIDI_CS
WRMIDI_INT
DATA08DATA09DATA10DATA11DATA12DATA13DATA14DATA15
SPKN
SPKP
RECP
RECN
SPK_RCV_SEL
CN201U401
vibratorSpeaker
Solderingcheck
C410C404
R420
R404
C405
Speaker path
receiver path
These five componentsmake up the amplifier andthe filter stage of melody.
[C404 R402 C405 R404 R417]
Analog switch for select audiopath or midi path.
To the speaker at LCDmodule via CN201.
C417
4. Trouble Shooting
- 68 -
Checking Flow
SETTING : Connect PIF to the phone, and Power on. Enter the engineering mode, and set"Melody on" at Buzzer of BB test menu.
START
Voltage across C408= 3.3 V?
Check the soldering of R410
Check the soldering of U402
Check the signal level of R407, R409
The voltage of R415 is ~2.8V
Speaker Working!!
Re-soldering R410
Replace U102( ABB LDO)
Replace U401
Replace U402
Replace speaker
Re-soldering U402
Check the state of contact of dual mode speaker
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
4. Trouble Shooting
- 69 -
4.8 Mic Trouble
Test Points
Circuit Diagram
CLOSE TO MIC
2.2KR134
R128
100C163
39p
1KR126
OB4-15L42-C33L
MIC101
12
100
R132
VA151
AV
L5M
02-2
00
C19339p
VA152
AV
L5M
02-2
00
39p
C161
10u
TC1512.2KR127
C160
0.1u
C162
39p
VMIC
Figure 4-20.
Solderingcheck
MIC101
R127 R126
C193
R128
R132C160
The signal flow of themicrophone to ABB
- 70 -
4. Trouble Shooting
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
Figure 4-20.
Checking Flow
START
Voltage across C193= 2.5VDC?
Voltage VMIC of U102 = 2.5VDC?
Resolder R126 & R127.
Replace U102.
Replace the microphone, MIC101.
Resolder C160, R128, R132.
Replace Main board.
MIC Bias Voltage
MIC WILL WORK.
Check the soldering of R110,C160,
R128, R132.
Check the signal levelat each side of MIC101. Is it a
few tens mVAC?
Yes
Yes
Yes
No
No
No
No
- 71 -
4. Trouble Shooting
4.9 Vibrator Trouble
20R223
1SS352D201
47KR224
VBAT
R230 220
R234100K
VBAT
VA204
AV
L14
K02
200
23
64
1
5
Q202
EMZ2 C2734.7u
1.5KR233
MOTOR
VIBRATOR
Figure 4-21.(a) Figure 4-21.(b)
Test Points
Circuit Diagram
Vibratorblock Soldering Check
in LCD Module
VibratorQ202
L
H
When the vibrator works, thesignal at this point goes H
When the vibrator works, thecurrent flow in this direction.
Current path
From the vibrator at LCDmodule via CN201.
- 72 -
4. Trouble Shooting
START
Is the voltage at pin6 of Q202
near VBAT?
Check the soldering of R223.
Replace Q202.
Resolder R223.
Resolder CN201.
Resolder vibrator.
Check the soldering of R223
Check the soldering of CN301
Check the soldering of vibrator at
LCD module
Replace Vibrator.
VIBRATOR WILLWORK PROPERLY.
Yes
Yes
Yes
Yes
Yes
No
No
No
No
NoResolder R223.
Checking Flow
SETTING : After Initialize Agilent 8960, Test in EGSM, Connect PIF to the phone, and Poweron. Enter The engineering mode, and set ’Vibrator on’ at Vibration of BB testmenu.
- 73 -
4. Trouble Shooting
4.10 Key Backlight LED Trouble
LD118LD111
SP109 SP110
LD115
47R116
LD119
R11347
LD116
SP108
R1174747
R11247
R118 R11947
SP102
LD114LD113
SP105SP104
LD117
SP106
47R115
LD112
47R114
LD120
SP107
R11147 47
R120
SP103 SP111
VBAT
START
Check the U102.
Check the soldering of each R or replace LEDs not working.
BACKLIGHT WILLWORK PROPERLY.
Is the voltage level VBAT3.6-4.2V?
Are all LEDs LD111~LD120t
working?
No
No
Yes
Yes
Test Points
Checking Flow
Circuit Diagram
Figure 4-22.
ToLIGHT3port ofABB
Light3
- 74 -
4.11 Folder on/off Trouble
FOLDER SWITCH
C11110p
R142 51K
VEXT
C112
0.1u GND13
4GND2
NC12
NC25
OUTPUT1
PGND7
6VDD
A3212EEH U103
4. Trouble Shooting
Figure 4-23.
Test Points
Circuit Diagram
U103
C111 R142 C112
The voltage at this pointgoes from 2.8V to 0 V
when the folder is closed.
This component operatewhen a magnet get closehere.
AD6525
- 75 -
4. Trouble Shooting
START
Check the magnet in the folder side.
Place the magnet properly.
Resolder U103.
Resolder R142 & U103.
Replace U103.
Replace U102.
Voltage at Pin 6 of U103 = 2.8V ?
Open Folder.Voltage at Pin 1 of U103
= 2.8V ?
Does it work properly?
FOLDER WILL WORKPROPERLY.
Close Folder orget close any magnet to U103.
Voltage at Pin 1 of U103= 0V ?
Voltage VEXT1 of U102= 2.8V?
No
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Redownload software or change the main board.
Checking Flow
- 76 -
4.12 SIM Detect Trouble
C116
1000p
VSIM
C1170.1u
220n
C115
CLK3
4GND1
GND278
GND39
GND4GND5
106
IORST
2VCC
15
VPP
J101
GCA261-6S
VA165
AV
L14
K02
200
VSIM
SIM_DATA
START
Resolder J101. Replace J101.
Does the SIM supports 3V?
Change the SIM. Our Phone supports 3V SIM only.
Voltage at Pin 1 of J101 = 2.85V?
Check the soldering condition
of J101.
Voltage VSIM of U102.= 2.85V?
Check the contact betweenJ101 and SIM
card.
Change theSIM and try again.
Does it work properly?
Resolder J101.
Replace J101.
SIM will be DETECTED.
The SIM is malfunctioned. Change the SIM.
Change the main board.
Does it work properly after redownloading SW?
Yes
Yes
Yes
Yes
Yes
No
No
No
No No
No No
4. Trouble Shooting
Test Points
Checking Flow
Circuit Diagram
Figure 4-24.
PIN1
DBB
SETTING : Insert SIM into J101, connect PIF to the Phone, and Power on.
- 77 -
4. Trouble Shooting
4.13 Earphone Trouble
CLOSE TO EARJACK
HEADSET JACKTC153
10u
C179
39p
C12339p
R156 100K
SP11539p
C165
100R148
0.1uC124
VA153
AV
L5M
02-2
00
R158 NA
VMEM
C168
18p
39K
R153
VMEM
46N
O
2VCC
U105
MAX4599EXT-T5C
OM
GND3
1IN
NC
R159
1K
AV
L5M
02-2
00
VA1544.7
R141
NA
R154R137 1K
VMIC
VMEM
R138
2.2K
C167
39p
J102
1
2
34
5
R181 4.7
SP114
HOOK_DET
VMIC_ON
Test Points
Circuit Diagram
J102
R181 C167 R154 R159R153R156
R158C123
AIN2P
AIN2N
AOUT3P
JACK_DET(DBB)
The direction of the audiosignal from the ear-mic
The direction of the audiosignal to the ear-receiver
VMEM VMIC SWITCHINGWhen Jack is activated
Figure 4-25.(a) Figure 4-25.(b)
- 78 -
START
Insert the earphone to the phone.
Set the audio part of the testequipment to echo mode.
Does the audioprofile of the phone change to
the earphone mode?
Can you hear your vioce fromthe earphone?
EARPHONE WILLWORK PROPERLY.
Change Earphone.
Can you hear your voice fromthe earphone?
Can you hear the sound from
voltage at C139=~1.2V
Check soldering C139,R141,J102
Replace main board
Re-solder C139,R141,J102
Download S/W
Earphone receiving pathproblem
Earphone sending pathproblem
Change the earphone and try again.
Set the audio part of the testequipment to PRBS or continuous wave mode.
Earphone detect problem
Audio path problem
4 3
3
2
1
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
4. Trouble Shooting
Checking Flow
Earphone receiving path problem
- 79 -
4. Trouble Shooting
4
3
Yes
Yes
Yes
Yes
Yes
No
No
No
No
Earphone sending path problem
Voltage at A point= 1.5~1.9 VDC ?
Is the signal level across C166&7a few tens
or hundreds VAC ?
Does it work well? Redownload software.
Does it work well? Change the main board.
Resolder C166&7.
Resolder R181.
ResolderR153, R159.
Voltage at R150= 2.8V ?
Voltage at Pin1 of U104 = 2.8V ?
Resolder R150.
Resolder R145, R147, R144
Earphone detect problem
Voltage at Pin 3 of U104> Voltage at Pin 4
of U104?
Resolder or replace U104.
5
5
1
4
Yes
Yes
Yes
No
No No
Earphone detect problem
Earphone sending path problem
4.14 Indicator LED Trouble
- 80 -
4. Trouble Shooting
Test Points
Circuit Diagram
Checking Flow
CN201
21 22
RLED
GR225
10KR223 17K
UMX1NTN
4
5
6 12
3
0
0
R261
GREEN LED
R263
RED LED
GLED
RED_LED
Q201R264 NA
R262
0
R226 47K
R22747K
VBAT of U102 is 3.6~4.2V?
Are both LEDs notworking?
BACKLIGHT WILLWORK PROPERLY.
Replace Q201, and try again.
Check the VBAT of U102.
Check the soldering or replace LEDs not working.
No
No
Yes
Yes
START
Figure 4-26.
R226 R227 R264 R262
Q201
R225 R229
- 81 -
5. DISASSEMBLY INSTRUCTION
4.15 RTC Trouble
Test Points
Circuit Diagram
Checking Flow
START
Is the voltage level at R123about 1.8V?
Replace X101 and try again.
Check the soldering of R123.
BACKLIGHT WILLWORK PROPERLY.
Yes
Yes
No
X101
R123
3
2
X1U1
4
132.768KHz
MC_146
R12310M
DBB
OSCOUT
OSCIN
Figure 4-27.
- 82 -
5. DISASSEMBLY INSTRUCTION
5.1 Disassembly1. Remove the Battery and Screws as shown below.
Figure 5-1.
Figure 5-2.
5. DISASSEMBLY INSTRUCTION
- 83 -
5. DISASSEMBLY INSTRUCTION
Figure 5-3.
- 84 -
Figure 5-4.
5. DISASSEMBLY INSTRUCTION
- 85 -
5. DISASSEMBLY INSTRUCTION
Figure 5-5.
Figure 5-6.
- 86 -
5. DISASSEMBLY INSTRUCTION
Figure 5-7.
Figure 5-8.
3
1
12
- 87 -
Figure 5-9.
5. DISASSEMBLY INSTRUCTION
5. DISASSEMBLY INSTRUCTION
- 88 -
Figure 5-10.
Figure 5-11.
5. DISASSEMBLY INSTRUCTION
- 89 -
Figure 5-12.
32
1
- 90 -
6. DOWNLOAD AND CALIBRATION
6.1 Download
A. Download SetupFigure 6-1 describes Download setup.
Figure 6-1. Download Setup
6. DOWNLOAD AND CALIBRATION
UART
- 91 -
B. Download Procedure1. Access Flash loader program in PC and select Erase. (Don’t check OWCD)
2. Press Start and Wait until Erase is completed.
6. DOWNLOAD AND CALIBRATION
1. Select Erase
2. Check
3. Don’t CheckOWCD
1. PressStart and
Wait
- 92 -
3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Waituntil Erase is completed again.
4. Press Write to start Download and press Key to choose software (AlchemyData.mot)
1. Change Addressand Size
3. Press Start andWait
2. Don’t CheckOWCD
1. Press
2. Press
6. DOWNLOAD AND CALIBRATION
- 93 -
5. Choose software
6. Wait until converting from MOT to BIF is completed (Don’t check OWCD)
1. Select File
2. Press Open
2. Wait until completion 1. Don’t Check OWCD
6. DOWNLOAD AND CALIBRATION
- 94 -
7. Press Start and Power on the phone using JIG remote Power on (Switch 1)
8. Wait until Sending Block is completed
6. DOWNLOAD AND CALIBRATION
- 95 -
9. Press Write to start Download and press Key to choose software (CodeData.mot)
10. Choose software
6. DOWNLOAD AND CALIBRATION
- 96 -
11. Wait until Sending Block is completed
1. Wait UntilSending Blockis completed
6. DOWNLOAD AND CALIBRATION
- 97 -
6.2 Calibration
A. Equipment List
Table 6-1. Calibration Equipment List
B. Equipment Setup
Figure 6-2.
6. DOWNLOAD AND CALIBRATION
Equipment for Calibration Type/Model Brand
Wireless Communication Test Set HP-8960 Agilent
RS-232 Cable and Test JIG LG
RF Cable LG
Power Supply HP-66311B Agilent
GPIB interface card HP-GPIB Agilent
Calibration & Final test software LG
Test SIM Card
PC (for Software Installation) Pentium II class above 300MHz
- 98 -
Figure 6-3. The top view of Test JIG
C. Test Jig Operation
Table 6-2. Jig Power
Table 6-3. Jig DIP Switch
Table 6-4. LED Description
6. DOWNLOAD AND CALIBRATION
LED Number Name Description
LED 1 Power Power is provided for Test Jig.
LED 2 TA Indicate charging state of the phone battery
LED 3 UART Indicate data transfer state through the UART port
LED 4 MON Indicate data transfer state through the MON port
Power Source Description
Power Supply usually 4.0V
Travel Adaptor Use TA, name is TA-20G (24pin)
Switch Number Name Description
Switch 1 ADI-REMOTE In ON state, phone is awaked. It is used ADI chipset.
Switch 2 TI-REMOTE In ON state, phone is awaked. It is used TI chipset.
Switch 3 VBAT Power is provided for phone from battery
Switch 4 PS Power is provided for phone from Power supply
- 99 -
1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MONport of TEST JIG, in general)
2. Set the Power Supply 4.0V
3. Set the 3 rd , 4 th of DIP SW ON state always
4. Press the Phone power key, if the Remote ON is used, 1 st ON state
D. Procedure1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MON
port of TEST JIG, in general)
2. Power ON PC then enter into Windows 98 (Remark : Windows 2000 system could befeasible)
3. Run AUTOCAL.exe, the AUTOCAL application window will be appeared.
6. DOWNLOAD AND CALIBRATION
- 100 -
7. BLOCK DIAGRAM
7. BLOCK DIAGRAM
Speaker &Receiver Motor
LCD Panel128X128
Indicate LED(2 Color)
Connector RTCBackupBattery
Board to BoardConnector
Ear JackLCDConnectorRF
ABB
(AD6537B)
Charging
SIMConnector Flash
Memory
DBB
(AD6525)
YNU763MIDI
Battery IO Connector
- 101 -
8. CIRCUIT DIAGRAM
Sign & Name
1
02/25
CLOSE TO EARJACK
A
Approved
3
JTAG PORT
DRAWING
D
1 2
CHO B.K.
PWR KEY
LG Electronics Inc.
CLOSE TO MIC
7
KIM S. K.
Designer
TP
6
Iss.
C
54
CLOSE TO
Sheet/Sheets
KIM Y. T.
NO.
5
2
1%
D
LGIC(42)-A-5505-10:01
B
C
B
Name
B
Current Sense
NAME2400
Notice No.
10
Data Set Ready
02/25
HEADSET JACK
2004E
8
MODEL
3
GUIDE HOLE
A
AD6537
CLOSE TO BATTERY PACK
02/252004
Athena, Typhoon, Audio
REV. 1.0
1/4C1100 (GB-1E)
DRAWING
Section
A
Date
Date
9
For AD6535 & 6537B
PARK S.J.
4
LG Electronics Inc.
FOLDER SWITCH
Checked
0R124
LD118
R105 NA
C111
VBAT
10p
TDI
TDO_0
TDO_1
TMS
VBAT
_F_WE
2.2KR134
JTAG1
GND
JTAGEN
RPWON
TCK
LD111
R142 51K
TC153
10u
VCORE
R128
100
200KR122
C163
D6
G4 5S
39p
TPCF8102
D11D22D33 D4 6
D5 7
8
C116
Q103
1KR126
1000p
C179
39p
OB4-15L42-C33L
MIC101
12
SP109
1u
C181
SP110
VCHARGE VBAT
0.1u
C14049.9R162
0
R163
100KR1651.5K
R157
1KR164
NAR155
VSIM
TP110TP112
LD115
47R116
6
3
1
4
VSIM
Q104
UMX1NTN
2 5
100p
C191
C133
C12339p
10u
0.01u
C199
C144
C182
NA
0.1u
22p
C106
39p
C196
VMIC
R156 100K
39p
C186
C147
22p
SP115
LD119
C183 22p
VBAT
R11347
LD116
SP108
VBAT
VEXT
R150
100
39p
C165
VCORE
VREF
1MR144
100pC171
1u
C157
C178
39p
VS
SR
TC
D3
P14WE
VSIM
R102 100K
VC
C3
K14
C8
VC
C4
A2
VD
DR
TC
VE
XT
1B
14
VE
XT
2B
10C
6V
EX
T3
VE
XT
4D
5
L2
VM
EM
1N
5V
ME
M2
N9
VM
EM
3V
ME
M4
N13
E3
VP
EG
1
VSDIG3H3
VSDOH2
VSFS
VS
IML
9
PWRONB2
RAMCSM14
M11RD
N14RESET
M13ROMCS
SIMCLKK12J13
SIMDATAOP
C14USC0USC1
D12
USC2A14A13
USC3USC4
E11C12
USC5USC6
B13
H1
VC
C1
VC
C2
P7
GPO_9H11
N12HWR
JTAGENK11
KEYPADCOL0C4E4
KEYPADCOL1KEYPADCOL2
B4A4
KEYPADCOL3KEYPADCOL4
C3
KEYPADROW0A6F4
KEYPADROW1KEYPADROW2
D4B5
KEYPADROW3KEYPADROW4
A5
LWRP13
OSCINA3B3
OSCOUT
GPO_16E13G11
GPO_17GPO_18
E12
GPO_19D14
G13GPO_2
D13GPO_20GPO_21
F11
GPO_22A7C5
GPO_23
E1GPO_24
GPO_3G12H12
GPO_4
GPO_5A1C1
GPO_6
GPO_7F14F13
GPO_8
GPIO_21J11
J14GPIO_22GPIO_23
L10K13
GPIO_24
GPIO_3C11
GPIO_32L14
GPIO_4D9
B11GPIO_5
A11GPIO_6
C10GPIO_7
D8GPIO_8GPIO_9
A10
GPO_0B1C2
GPO_1
F12GPO_10GPO_11
E14
GPCS0M12L13
GPCS1
GPIO_0D11D10
GPIO_1
GPIO_10C9C7
GPIO_11B9
GPIO_12GPIO_13
A9B8
GPIO_14GPIO_15
A8
GPIO_16D6B7
GPIO_17
GPIO_18H14H13
GPIO_19
GPIO_2B12
J12GPIO_20
DATA6P8N8
DATA7DATA8
M8P9
DATA9
M5DISPLAYCS
J1G
ND
1
D7
GN
D10
GN
D11
B6
GN
D2
K1
P3
GN
D3
GN
D4
L6
GN
D5
L8
GN
D6
P12
GN
D7
L11
C13
GN
D8
A12
GN
D9
CLKINL12
G14CLKON
CLKOUTD1D2
CLKOUT_GATE
N6DATA0DATA1
P6
M9DATA10DATA11
P10N10
DATA12DATA13
M10
DATA14P11
DATA15N11
DATA2M6N7
DATA3DATA4
M7L7
DATA5
ADD21M4P5
ADD22
J4ADD3ADD4
K3K2
ADD5ADD6
K4
ADD7L4L1
ADD8ADD9
L3
ASDIE2
ASDOF1
ASFSF2
BSDIG2
F3BSDO
G1BSIFS
BSOFSG4
ADD0H4J3
ADD1
L5ADD10
M1ADD11ADD12
M2N1
ADD13ADD14
P1N2
ADD15ADD16
P2
ADD17N3M3
ADD18ADD19
P4
ADD2J2
N4ADD20
TP118
AD6525ACA-REEL
U101
C177
39p
VMEM
330R108
100R148
100
R132
0.1uC124
VBAT
R11747
R146
VEXT
20K
C152
39p
VA153
AV
L5M
02-2
00
47R112
VEXT
47R118
100KR151
R158 NA
VMEM
C1170.1u
VA151
AV
L5M
02-2
00
D101
CUS02
C168
18p
VEXT
TP106
R11947
SP102
39K
R153
10u
C146
A2VCXOEN
A4
VE
XT
1B
4V
EX
T2
T3
VM
EM
1V
ME
M2
T2
R3VMEMSEL
VM
ICN
16
T7VRTC
VS
IMT
6D
16V
VC
XO
C139 4.7u
H16
VA
BB
VB
AT
1N
2
C15
VB
AT
1-1
P2
VB
AT
2
VB
AT
2-1
G15
VB
AT
2-2
H15
R2
VB
AT
3
VB
AT
3-1
A3
VB
AT
3-2
B3
R5
VB
AT
4V
BA
T5
R4
B8VBATSENSE
VBAT_NETT4
VCHGA5
P1
VC
OR
E1
N1
VC
OR
E2
A10REFBB
REFCHGD15
REFOUTB11
T1RESET
RXONK1
SG
ND
1T
8
SG
ND
2R
8
SPWR1R10
SPWR2T10
B2TCK
TDIA1
TDOC1
TEMP1B9A8
TEMP2
TMSB1
K2TXON
B5NC_B5
B7NC_B7
NC_C16C16
NC_E15E15E16
NC_E16
F16NC_F16
G16NC_G16
NC_R1R1
NC_R12R12
R6
NC
_R6
T12NC_T12
NC_T15T15
B12PA
QNA14A15
QP
B15REF
T5GND_NET1
GND_NET2F15
C2GPI
A13IN
INTD1
A12IP
ISENSEA7
KEYONT14T13
KEYOUT
N15
LG
ND
LIGHT1L16M15
LIGHT2LIGHT3
M16
L1MCLK
J2MCLKEN
A16NC_A16
D2ASDO
F2ASFS
ASMJ1 B10
AUXADC1AUXADC2
A9
B6BATTYPE
G2BSDI
E2BSDOBSIFS
F1
BSOFSG1
H2CSDICSDO
H1
CSFSL2
R7DBBON
DG
ND
M2
A6GATEDRIVE
AG
ND
4T
16
AIN1NR16
AIN1PP16R15
AIN2N
P15AIN2P
R13AIN3LAIN3R
R14
K15AOUT1NAOUT1P
J15
T9AOUT2N1
R9AOUT2N2
R11AOUT2P1
T11AOUT2P2AOUT3N
K16J16
AOUT3P
ASDIE1
AG
ND
031
L12 M
5A
GN
D03
2A
GN
D03
3M
6M
7A
GN
D03
4A
GN
D03
5M
10M
11A
GN
D03
6A
GN
D03
7M
12
AGND04E7
E10AGND05AGND06
E11E12
AGND07AGND08
F5F6
AGND09
AG
ND
1B
16A
GN
D2
A11
L15
AG
ND
3
G10
AG
ND
017
AG
ND
018
G11
G12
AG
ND
019
AGND02E5
AG
ND
020
K5
K6
AG
ND
021
K7
AG
ND
022
AG
ND
023
K10
K11
AG
ND
024
AG
ND
025
K12 L5
AG
ND
026
AG
ND
027
L6
L7
AG
ND
028
AG
ND
029
L10
E6AGND03
L11
AG
ND
030
M1ABBRESET
AFCDACB14
B13AGND01
AGND010F7
F10AGND011AGND012
F11F12
AGND013AGND014
G5G6
AGND015AGND016
G7
C193
VMEM
U102
AD6537B
46N
O
2VCC
39p
U105
MAX4599EXT-T5C
OM
GND3
1IN
NC
VA152
AV
L5M
02-2
00
U104
MAX9075EXK-T
2GND
1OUT
VCC
5
3 VIN+
VIN-4
VEXT
C112
VEXT
0.1u
VBAT
R159
1K
C149
39p
R12110K
AV
L5M
02-2
00
VVCXO
VA154
R109NA
C105
22pR101
NA
C154
39p
R161
1K
4.7
R141
C104
0.1u
C188
0.1u
C101
1uF
C102
0.1u
1MR145
0.2R107
C107
0.1u
VBAT
VSIM
LD114
C148
C155
39p
47n
39p
C153
47n
220n
C115
C132
39p
VCHARGE
C161
10u
TC151
NA
R154R137 1K
10u
C135
1uF
LD113
C103
SP105
4.7K
R130
CLK3
4GND1
GND278
GND39
GND4GND5
106
IORST
2VCC
15
VPP
J101
GCA261-6S
C143
1uF
R149
NA
NAC138
R106NA
10u
C131
2.2KR127
NAR152
VCOREVMEM
SP104
VMIC
VMEM
39p
C156
C160
0.1u
330KR147
VRTC
C185
0.068u
LD117
C137
SP106
C136
10u10u
R138
2.2K
TP104
VRTC
GND13
4GND2
NC12
NC25
OUTPUT1
PGND7
6VDD
A3212EEH U103
VA165
AV
L14
K02
200
1
2
KB101
D104 KDS121E
3
C167
39p
TP108
47R115
R104
NA
1uC184
TP114TP115
J102
1
2
34
5
LD112
47R114
C192
100p
LD120
C195
SP107
0.1u
10MR123
0
R103
47n
C108
10u
C187
X101
MC-146
32.768KHz12
3 4
TP105
R11147
C170100p
10u
C134
VSIM
C151
TP101
0.1u
C162
39p
100R125
47R120
SP103
R181 4.7
SP114
VMIC
SP111
VBAT
TP116TP117
HOOK_DET
RED_LEDPRE_CHARGE
SIM_DATA
VMIC_ON
JACK_DET
MIDI_SEL
MIDI_SEL
HOOK_DET
RLEDGLED
WR
ROM_CS2
MIDI_INT
SPK_RCV_SEL
MIDI_RESET
MIDI_CS
ADD00
RECP
SPKN
SPKP
JACK_DET
CLKON
VBACKUP_SEL
TDO_0
TMS TX_RAMP
LCD_ID
VIBRATOR
TCK
TDI
TDO_0
TDO_1TMS
VBAT
LCD_DIM
ABB_INT
CLKON
TDO_1
VBACKUP_SEL
BAT_TEMP
PWR_ONPWR_HOLD
JTAGEN
PWR_ON
AFC
IND_LEDG
QPQN
INIP
RDUBSLBS
ROM_CS1
JTAGEN
VMIC_ON
RECN
KEY_ROW0
PWR_ON
RAM_CSRD
S_CLKS_DATA
PWR_HOLD
S_EN
ANT_SW2
TDI
LCD_CS
PRE_CHARGE
PA_BANDPA_EN
DSR
RF_TEMP
TCK
RESET
ADD21
ADD02
RESET
KEY_ROW4KEY_ROW3KEY_ROW2KEY_ROW1KEY_ROW0
KEY_COL4KEY_COL3KEY_COL2KEY_COL1KEY_COL0
SIM_DATA
ANT_SW1
RF_PWR_DWN
ADD04ADD05ADD06ADD07ADD08ADD09ADD10ADD11ADD12ADD13ADD14ADD15ADD16ADD17ADD18ADD19ADD20
DATA14
DATA03DATA04DATA05DATA06DATA07DATA08DATA09
DATA00
DATA15
DATA01DATA02
13MHZ
RAM_CS
WR
ADD01
ADD22
ADD03
MON_RX
MON_TX
USC0USC1USC2USC3USC4USC5USC6
LCD_RESET
ABB_INT
DATA10DATA11DATA12DATA13
8. CIRCUIT DIAGRAM
- 102 -
NA
6
Type
1
R256
2
3
TX
MENU
5
KIM S. K.
RIGHT
2
CTS
0
RTS
SELECT
4
*
0
Date
C
9
USC2D
NA
NA
-
NAME
DRAWING
10
8
MODEL
UP
LEFT
(128M / 32M)
UART
3
CONFIRM
Date
D
R258 B
4 9
47
0
UART
I/O CONNECTOR
A
USC5
47
R249
DOWN
Name
LG Electronics Inc.
Data Set Ready
-
CHO B.K.
RI(Ring Indicator)
Type
RX
SEND
47
JIG_PWR_ON
1
CLOCK
DAI
RXDUSC1
NA
LG Electronics Inc.
02/25
Iss.
47
NA
R257
USC0
RED LED
TXD
A
6
C
R244
LGIC(42)-A-5505-10:01
USC6
PARK S. J.
Section
R250
DAI
-
7
GREEN LED
R248
Sheet/Sheets
8
Sign & Name
02/25
2
64/32
Checked
RESET
CLR
1
0
Terminal Ground
R246
NO.
KIM Y. T.
USC4
DRAWING
47
NA
B
NA
200402/25 C1100 (GB-1E)
2/4
REV. 1.0
Memory, Key, I/O, LCD Interface
B
2004
NA
128/32
2004
Notice No.
-4
#
DOWN
Designer
5
R253
5
PIN
NA
Approved
A
7
E
UP
LCD BACKLIGHT LED
3
NA
C255
22p
SP205
R265
1K
C219
22p
NAR264
39pC262
C242
22p
SP235
22p
C276
820R204
456789
20212223242526272829
3
30313233341
1011121314151617 18
19
2
NAR248
CN201
EN_SET9
11GND
10IN
2OUT
U203
AAT3123ITP-20-T1
4C1+
C1-3
C2+1
12C2-D1
8
D27
D36
D45
22p
C225C215
22p 22p
KB19
C224
SP230
SP234
R235
123
45
100KSW1
47R249
R245 47
VMEM
VBAT
KB10
C221
22p
R210 820
10K
R221
20R223
KB2
R237100K
R251 47
22p
C240
22p
C227
3456789
SP209
1516171819
2
2021222324
25
26 2728
29CN202
1
1011121314
C258
KB16
1uF
VBAT
C220
VRTC
SP201
22p
R240100K
5
6
3
1
4
NAR257
Q201
UMX1NTN
2
22p
1SS352
C243
D201
47R255
3p
C251
C212
22p
KB17
VA201
AV
L5M
02-2
00
SP228
C223
22p
C244
22p
C233
KB15
22p
VA207
AV
L14
K02
200
C214
22p 22p
C222
47R250
SP224
C216
22p
R213 820
C237
22p
C274
22p
C247
22p
KB5
22p
KB11
C235
22p
C239
KB12
C252
39p
C248
22p
CN2031
680
R243
SP211
C257
SP207
22p
10K
R225
100KR239
100KR236
KB8
47R254
R214
KB14
820
C260
SP206
1uF
820
R212
R202
820
KB20
22p
47R246
C241
47K
22p
C246
R224
0R263
R262
0
VBAT
0
R261
C261
VEXT
1uF
SP208
SP227
22p
C238
SP226
820R205
R226 47K
KB3KB7
820
VMEM
R209
0R258
R230 220
820
VSS1G3
_BYTEH9
J2_CE1PS
_CEF1H2F5
_CEF2
_LBC4
H3_OE
D5_RESET
_UBD4
_WEC6
C5_WP_ACC
R211
NC13L10
NC14M1
NC15M10
NC2B1
NC3B10
NC4C1
NC5F1F6
NC6F9
NC7F10
NC8G1
NC9
RY_BYE5
VCCF1J5G5
VCCF2VCCPS
J6
VSS0J9
DQ15H8
DQ2K4H5
DQ3H6
DQ4K7
DQ5G7
DQ6J8
DQ7K3
DQ8DQ9
H4
K6DU1DU2
G8
NC0A1
NC1A10
NC10G6
G10NC11
L1NC12
A21E9
D2A3
F3A4
E3A5A6
D3
A7C3
A8C7
A9E7
D6CE2PS
DQ0J3
DQ1G4
DQ10J4
DQ11K5J7
DQ12H7
DQ13DQ14
K8
G2A0
F2A1
A10F7
A11C8D8
A12A13
E8
A14F8D9
A15G9
A16F4
A17E4
A18D7
A19
A2E2
E6A20
SP231
TH50VPF5783AASB
U201
C278
39pC267
22p
SW2
123
45
R234
KB18
100K
330
VBAT
AV
L5M
02-2
00R219
SP233
VA202
0R256
820R203
C271
18p
VA203
AVL14K02200
C217
10p
C269
VBAT
22p
VCHARGE
10K
R232
FB1
22p
C213
22p
SP229
1uF
C254
C259
47R247
KB6
VMEM
KB9
680
R242
AVL14K02200
VA206
VA204
AV
L14
K02
200
22p
C231
NAR253
23
64
1
5
Q202
EMZ2
22p
C245
20p
C268
KB21
VA205
AV
L5M
02-2
00
C272
18p
C275
47
22p
1uF
R238
C299
C290
1uF
C298
1uF
22p
C256
R218 330
C236
22p22p
C218
820
SP203
R201
22p
C211 C234
SP212
22p
SP210
R244 NA
0.1u
C203
R241 47
22p
C201
R206 820
1uF
C202
R207 820
820R216
SP232
C226
22p
C2734.7u
820R208
47R252
1.5KR233
C232
22p
SP213
SP204
KB22
R229 47K
KB4
22p
C277
47KR227
KB13
R215 820
KEY_ROW0
KEY_COL2
KEY_ROW1
BAT_TEMP
ROM_CS2ROM_CS1
SPK_REC_NSPK_REC_P
PWR_ON
RLED
GLED
MOTOR
LCD_RESET
LCD_CSMOTOR
ADD06ADD05ADD04
ADD22ADD21
ADD03
ADD20ADD19ADD18ADD17ADD16ADD15ADD14ADD13ADD12ADD11
ADD02ADD01
USC1
USC3
VIBRATOR
WRRD
ADD10ADD09ADD08ADD07
DATA05
DATA07DATA06
DATA04DATA03DATA02DATA01DATA00
ADD01
LBS
RAM_CS
RESET
UBS
KEY_COL0
DSR
USC0
LCD_DIM
KEY_ROW4
DATA00DATA01DATA02DATA03DATA04DATA05DATA06DATA07DATA08DATA09DATA10DATA11DATA12DATA13DATA14DATA15
USC6
MON_TX
RED_LED
KEY_COL1
KEY_COL3KEY_COL4
KEY_ROW2
KEY_ROW3
DATA10DATA09DATA08
DATA11DATA12
DATA15
DATA13DATA14
WR
IND_LEDG
MON_RXUSC2
USC5
USC4
LCD_ID
8. CIRCUIT DIAGRAM
- 103 -
Date
A
B
(1608)
5
Checked
6
Iss. Name
2004
3
GPO_9
NAME
RX
B
D
CHO B.K.
C
E2004
L
GPO_11
DCS_TX
9
C
GPO_19
02/25
GPO_20
4
LG Electronics Inc.4
A
Approved
ANT_SW1
2
02/25RF BOARD TEMPERATURE
DRAWING
LG Electronics Inc.
1
DRAWING
B
Section
L
GPO_17
GPO_16
LGIC(42)-A-5505-10:01
Sign & Name
KIM S. C.
32 5
200402/25 C1100 (GB-1E)
3/4
REV. 1.0
RF(AERO1)
8
GPO_4
1
SEO D. H.
10
GSM_TX
NO.
H
L
GPO_21
7
D
MODEL
AD6535_PA
H
ANT_SW2
Date
L
A
Sheet/Sheets
Designer
AD6535_AFCDAC
Notice No.
33u
RF_PWR_DWN
C301
L3024.7nH
1.2nHL308
R310 0
10uC361
0.5p
C331
FL302
B7820
G1
2
G2
5
IN1 O1
3
O2
4
VRF
150R311
C312
10p
C373100p
6p
C345
C399
22n
22p
VRF
C316
C321
C353
27p
1p
1000pC372
S_CLK
10u
C362
C383
S_EN
27p
0.022uC341
C326
R304
2p
100
0.5pC322
0.01u
C363
22p
C386
C352
1p
C385 10p
L301
8.2nH
10pC382
R306130
R314
C3712.2u
100
21
7GSM_IN
GSM_OUT9
TX_ENABLE 3
VBATT 4
8VCC1
VCC212
10VCC_OUT
6VRAMP
5VREG
BAND_SELECT
DCS_IN 1
11DCS_OUT
GN
D1
13
22G
ND
10
GN
D11
2324G
ND
1225
GN
D13
GN
D14
26
GN
D2
1415G
ND
3
GN
D4
16G
ND
51718
GN
D6
GN
D7
19
GN
D8
20
GN
D9
U302RF3133
2
7.5nHL304
33p
ANT1
C311
130R307
R312150
0.5p
C323
R301 15K
C35622p
VRF
3GND
21
IN5
OUT10KR316
U303MIC5255-2.85BM5
4BYP EN
27nHL303
R319
S_DATA
39p
39p
C343
C389
C342
47p
36
R309
C354
X301
2GND
3OUT
VCC4
1p
C317
27p
13MHz
C325NA
1000pC355
22nH
L307
C350
39p
33nH
L305
R305
47
C344
C384 3.3p
C375
VREF
10p
100p
R317 0
KMS-507 SW301AN
TG
1
G2
RF
1p
VVCXO
C351
14GND7
VC
1
11
VC
2
2
R315
15K
SHS-C090DR
FL3018ANT
1DCS_RX
DCS_TX3
EGSM_RX10
EGSM_TX5
GND14
GND26
GND37
GND49
GND512
GND613
G1
2
G2
5
IN1
3O1
O2
4
VRF
FL303
B7821
33nH
L306
27p
C387
VBAT
R302 100
SC
LK
13S
DI
14
SD
O11
TXIN5
TXIP4
TXQN7
TXQP6
9V
DD
1
32V
DD
2
XE
N26
XIN
8
XO
UT
2710
_PD
N
12_S
EN
33GND5GND6
3435
GND7GND8
36
RFIDN19
RFIDP18
RFIGN21
RFIGP20
RFIPN17
RFIPP16
22R
FO
D23
RF
OG
RXIN32
RXIP
1RXQN
28R
XQ
P
SI4205
U301
DIA
G1
24 25D
IAG
2
GND115
GN
D2
29 30G
ND
3G
ND
431
22p
VRF
VBAT
C302
QP
13MHZ
PA_EN
QN
S_EN
S_CLK
RF_PWR_DWN
CLKON
PA_BAND
13MHZ_MIDI
ANT_SW1
ANT_SW2
IP
IN
TX_RAMP
AFC
S_DATA
RF_TEMP
8. CIRCUIT DIAGRAM
- 104 -
8. CIRCUIT DIAGRAM
0
Type
Date
1
KIM S.K.
DRAWING
16Poly
YMU759B YMU762
7
B
C
2 3
D
E
8
2004 DRAWING
MODEL
9
KIM Y. T.02/25
102
02/25
53 4 6
PARK S.J.
A A
CHO B.K.
Iss.
2004
Closed to Analog SW
Notice No.
Sheet/Sheets
5
B
1
NAME
C
NO.
A
U401
R403 NA
R412 10K
02/252004
MIDI
REV. 1.0
4/4C1100 (GB-1E)
Part
D
Designer
(16 Poly MIDI)
B
4
10K
40Ploy
Sign & Name
Date Name
Section
LG Electronics Inc.
LGIC(42)-A-5505-10:01 LG Electronics Inc.
Checked
Approved
C403 0.1u
47p
VMEM
R403
10K
C412C411
47p
C404
R407
0.01u
0
0
R409
28_WR
4.7
R414
HPOUT_L10
HPOUT_R11
5IFSEL
6 PLLC
32 SDOUT
SPOUT117
SPOUT218
SPVDD 15
16SPVSS
VDD7
VREF9
8 VSS
_CS29
_IRQ3
31_RD
4_RST
30A0
1CLK1
D027
D126
D225
D324
D42322
D521
D620
D7
12EQ1
EQ2 13
14EQ3
EXT1 219EXT2
YMU759B U4010R401
100p
C405
0
R404
R408 3.3K
100KR415
10K
R412
C40747p
39K
R402
VBAT
39pC409
NA
VMEM
R405
R406
NA
47pC410
1V+
150KR417
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
2NO1
10NO2
MAX4684EUBU402
4.7
R416
R410 047pC406
1000p
R413
0
C402 0.1u
C401
0.1u
SPK_REC_N
SPK_REC_PC408
13MHZ_MIDIMIDI_RESET
ADD00RD
MIDI_CS
WRMIDI_INT
DATA08DATA09DATA10DATA11DATA12DATA13DATA14DATA15
SPKN
SPKP
RECP
RECN
SPK_RCV_SEL
- 105 -
9. PCB LAYOUT
9. PCB LAYOUT
- 106 -
9. PCB LAYOUT
- 107 -
10. ENGINEERING MODE
A. About Engineering ModeEngineering mode is designed to allow a service man/engineer to view and test the basicfunctions provided by a handset.
B. Access CodesThe key sequence for switching the engineering mode on is 2945#*#. Pressing END willswitch back to non-engineering mode operation.
C. Key OperationUse Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing‘back’ key will switch back to the original test menu.
D. Engineering Mode Menu Tree
10. ENGINEERING MODE
Engineering
Mode
BB Test RF Test MF ModeTrace
option Call Timer Fact. Reset
S/W
Version
LED
LCD
Backlight
Buzzer
Vibrator
ADC
Battery
Audio
¡ DAI
SAR TestAll Auto Test
Backlight
Buzzer
VibratorLCD
Key padMicSpkTest
All Calls
Reset
UART On
UART OffLED
- 108 -
10.1 BB Test [MENU 1]Baseband Test
10.1.1 LCD• Contrast value : This menu is to test Main LCD contrast.
- Contrast Value [10-50] : Change this value by up and down key.
• Sub LCD Contrast : This menu is to test Sub LCD contrast.
- Contrast Value [0-50] : Change this value by up and down key.
10.1.2 Backlight [1-2]This menu is to test the LCD Backlight and Keypad Backlight.
• Backlight On : LCD Backlight and Keypad Backlight light on at the same time.
• Backlight Off : LCD Backlight and Keypad Backlight light off at the same time.
• Backlight value : This controls brightness of Backlight. When entering into the menu,the present backlight-value in the phone is displayed. Use Left / Rightkey to adjust the level of brightness. The value of the brightness set atlast will be saved in the NVRAM.
10.1.3 Buzzer This menu is to test the melody sound.
• Melody on : Melody sound is played through the speaker.
• Melody off : Melody sound is off.
10.1.4 VibratorThis menu is to test the vibration mode.
• Vibrator On : Vibration mode is on.
• Vibrator Off : Vibration mode is off.
10.1.5 ADC (Analog to Digital Converter)This displays the value of each ADC.
• MVBAT ADC (Main Voltage Battery ADC)
• AUX ADC (Auxiliary ADC)
• TEMPER ADC (Temperature ADC)
10.1.6 BATTERY• Bat Cal :
This displays the value of Battery Calibration. The following menus are displayed in order; BAT_LEV_4V, BAT_LEV_3_LIMIT,BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT,SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT
• TEMP Cal :
This displays the value of Temperature Calibration.The following menus are displayed in order; TEMP_HIGH_LIMIT,TEMP_HIGH_RECHARGE_LMT, TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT
10. ENGINEERING MODE
- 109 -
10.1.7 AudioThis is a menu for setting the control register of Voiceband Baseband Codec chip. Although the actual value can be written over, it returns to default value after switching off andon the phone.
• VbControl1 : VbControl1 bit Register Value Setting
• VbControl2 : VbControl2 bit Register Value Setting
• VbControl3 : VbControl3 bit Register Value Setting
• VbControl4 : VbControl4 bit Register Value Setting
• VbControl5 : VbControl5 bit Register Value Setting
• VbControl6 : VbControl6 bit Register Value Setting
10.1.8 DAI (Digital Audio Interface)This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustictesting.
• DAI AUDIO : DAI audio mode
• DAI UPLINK : Speech encoder test
• DAI DOWNLINK : Speech decoder test
• DAI OFF : DAI mode off
10.2 RF Test [MENU 2]Radio Frequency Test
10.2.1 SAR testThis menu is to test the Specific Absorption Rate.
• SAR Test On : Phone continuously process TX only. Call-setup equipment is notrequired.
• SAR Test Off : TX process off
10.3 MF Mode [MENU 3]This manufacturing mode is designed to do the baseband test automatically. Selecting this menuwill process the test automatically, and phone displays the previous menu after completing thetest.
10.3.1 All auto testLCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker,
10.3.2 LEDLCD Backlight and LED Backlight are on for about 1.5 seconds at the same time, then off.
10.3.3 BacklightThis menu is to test the volume of Melody. It rings in the following sequence. Volume 1,Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.
10.3.4 BuzzerVibrator is on for about 1.5 seconds.
10. ENGINEERING MODE
- 110 -
10.3.5 VibratorMain LCD screen resolution tests horizontally and vertically one by one and fills the screen.
10.3.6 LCDWhen a pop-up message shows ‘Press Any Key’, you may press any keys including sidekeys, but not [Soft2 Key]. If the key is working properly, name of the key is displayed on thescreen. Test will be completed in 15 seconds automatically.
10.3.7 Key padSub LCD screen resolution tests horizontally one by one and fills the screen.
10.3.8 MicSpkTestThe sound from MIC is recorded for about 3 seconds, then it is replayed on the speakerautomatically
10.4 Trace option [MENU 4]This is NOT a necessary menu to be used by neither engineers nor users.
10.5 Call timer [MENU 5]This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
• All calls : This displays total conversation time. User cannot reset this value.
• Reset settings : This resets total conversation time to this, [00:00:00].
• DAI DOWNLINK : Speech decoder test
• DAI OFF : DAI mode off
10.6 Fact. Reset [MENU 6]This Factory Reset menu is to format data block in the flash memory and this procedure set upthe default value in data block.
Attention
- Fact. Reset (i.e. Factory Reset) should be only used during the Manufacturing process.
- Servicemen should NOT progress this menu, otherwise some of valuable data such as Settingvalue, RF Calibration data, etc. cannot be restored again.
10.7 S/W versionThis displays software version stored in the phone.
10. ENGINEERING MODE
- 111 -
11. STAND ALONE TEST
11.1 IntroductionThis manual explains how to examine the status of RX and TX of the model.
A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.
B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.
11.2 Setting Method
A. COM port
a. Move your mouse on the “Connect” button, then click the right button of the mouse andselect “Com setting”.
b. In the “Dialog Menu”, select the values as explained below.
- Port : select a correct COM port
- Baudrate : 38400
- Leave the rest as default values
B. Tx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Selecting APC
a. Select either Power level or Scaling Factor.
b. Power level
- Input appropriate value GSM (between 5~19) or DCS (between 0~15)
c. Scaling Factor
- A ‘Ramp Factor’ appears on the screen.
- You may adjust the shape of the Ramp or directly input the values.
C. Rx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Gain Control Index (0~ 26) and RSSI level
- See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 inGain Control Index.
- Normal phone should indicate the value of RSSI close to -16dBm.
11. STAND ALONE TEST
- 112 -
11.3 HW Test : Software for Standalone Test Setupa. Select a COM port
b. Set the values in Tx or Rx
c. Select band and channel
d. After setting them all above, press connect button.
e. Press the start button
Figure 11-1. HW test program
11. STAND ALONE TEST
- 113 -
Figure 11-1. HW test program
Figure 11-1. HW test program
11. STAND ALONE TEST
- 114 -
12. AUTO CALIBRATION
12.1 OverviewAutocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and BatteryCalibration with Agilent 8960(GSM call setting instrument) and TektronixPS2521G(Programmable power supply).Autocal generate calibration data by communicating with phone and measuring equipmentthen write it into calibration data block of flash memory in GSM phone.
12.2. Requirements- PC or Notebook installed with Microsoft Windows 98/ME/2000/XP
- Auto Calibration program(Autocal.exe)
- GSM Phone
- LGE PIF JIG, Serial Cable, Data Cable
- Agilent 8960(Call Setting Instrument)
- Tektronix PS2521G(Programmable Power Supply)
12.3 Equipment Setup- File(F) Clear View : Clear Calibration Status window texts
- File(F) Save View : Save Calibration Status window texts
- File(F) Save Setting : Save Current Calibration settings to setting file(*.cal)
- File(F) Load Setting : Load saved Calibration setting
- File(F) Make BIN ALL : Make binary file after calibration finished
- File(F) Make BIN BAT.Cal only : Make binary file of battery cal data only after calibrationfinished
- File(F) Make & Write BIN : Make binary file after calibration finished then download itto the Flash Memory
- View(V) Tools : Enable or disable Tool bar
- View(V) Status : Enable or disable status bar
- Connection(C) Connect : Connect the phone with PC. This procedure checkswhether the PC is connected “ag8960 ” or not. After that itperforms sync. procedure with phone. If the sync.procedure is successful state column on status barchanged to SETUP, else you should disconnect phone andtry again from the beginning and also check the wholeconnection. All measurement is performed at state SETUP.
- Connection(C) Port Setting : Show COM port setting dialog and Baudrate you canchange,etc.
- GPIB(G) Connect : Connect the Ag8960 GPIB card with PC.
12. AUTO CALIBRATION
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Figure 12-1. Equipment Setup
Screen Cable loss : Enter the RF cable loss GSM and DCS
Screen GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIBaddress
Screen ADC Channel : Default ADC Calibration Channel
Screen Auto Calibration Item : Default Calibration Settings about Tx, Rx, ADC and writeBIN file
12. AUTO CALIBRATION
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12.4 AGCThis procedure is for Rx calibration.In this procedure, We can get RSSI correction value. Set band EGSM and press Start buttonthe result window will show correction values per every power level and gain code and thesame measure is performed per every frequency.
12.5 APCThis procedure is for Tx calibration.In this procedure you can get proper scale factor value and measured power level.
12.6 ADCThis procedure is for battery calibration.You can get main Battery Config Table and temperature Config Table
12.7 SettingCheck com port and cable loss. Select automatic calibration item. If you uncheck one itemcalibration will stop from the unchecked item. This is useful when you want to process only oneitem.
12.8 How to do calibrationA. Connect cable between phone and serial port of PC.
B. Connect Ag8960 equipment and Power Supply and phone.
C. Set correct port and baud rate.
D. Press Start button. AutoCal process all calibration procedure
i. AGC EGSM
ii. AGC DCS
iii. APC EGSM
iv. APC DCS
v. ADC
E. After finished all measurement. The state is return to SETUP.
F. The Cal file will be generated and then the calibration data will be written into phone andthen will be reset.
12. AUTO CALIBRATION
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13. EXPLODED VIEW & REPLACEMENT PART LIST
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW
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Note.
13. EXPLODED VIEW & REPLACEMENT PART LIST
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Level Location No. Description Part Number Specification Color Remark1 GSM(FOLDER) TGFF0033001 Silver2 APEY00 PHONE APEY0131001 C1100 ORUSV Silver3 ACGG00 COVER ASSY,FOLDER ACGG0037701 C1100 ORUSV Silver4 ACGH00 COVER ASSY, FOLDER(LOWER) ACGH0020701 C1100 ORUSV Main Window Tape 0.1t Dark Gray5 MCJH00 COVER,FOLDER(LOWER) MCJH0016501 C1300 CGRSV Dark Gray 75 MFBC00 FILTER,SPEAKER MFBC0008101 C1300 CGRSV ELLIPSE 0.1t Black 65 MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver 105 MPBF00 PAD,FLEXIBLE PCB MPBF0005601 C1300 CGRSV 26 X 5 X 3.5 t Black 95 MPBG00 PAD,LCD MPBG0021101 C1300 CGRSV 35.6 X 39.3 X 0.7 t Black 85 MTAD00 TAPE,WINDOW MTAD0022201 C1300 CGRSV 0.1 t 54 ACGJ00 COVER ASSY, FOLDER(UPPER) ACGJ0029801 C1100 ORUSV Silver5 MCJJ00 COVER,FOLDER(UPPER) MCJJ0022501 C1100 ORUSV Silver 205 MDAM00 DECO,WINDOW(SUB) MDAM0005001 C1100 ORUSV 0.2t Silver 245 MGAD00 GASKET,SHIELD FORM MGAD0049601 C1300 CGRSV 4 x 8 x 1.5 t Gold 175 MGAD01 GASKET,SHIELD FORM MGAD0049901 C1300 CGRSV 5.2 X 5.2 X 1.8 t Gold 185 MICA00 INSERT,FRONT MICA0001201 LG-G510,511,512 common use, DIA = 1.7mm+2.3t5 MPBZ00 PAD MPBZ0042501 C1300 CGRSV 1.0 t Black 195 MSAZ00 SHEET MSAZ0013401 C1200 TMDBD, Dx=11.3, Dy=7.3, t<0.2mm White 215 MTAA00 TAPE,DECO MTAA0047201 C1100 ORUSV 0.2t 235 MTAB00 TAPE,PROTECTION MTAB0042401 C1300 CGRSV Upper Protection 38 X 68 X 0.07t 265 MTAE00 TAPE,WINDOW(SUB) MTAE0014901 C1100 ORUSV 0.16t 224 ACGK00 COVER ASSY,FRONT ACGK0032501 C1100 ORUSV Silver5 MBHY00 BUMPER MBHY0008401 C1300 CGRSV 4.4 X 1.9 Silver 485 MBHY01 BUMPER MBHY0008501 C1300 CGRSV 4.4 X 1.9, 5.2 PI for MIKE Silver 475 MBJL00 BUTTON,SIDE MBJL0011601 C1300 CGRSV Chrome Plating Silver 445 MCJK00 COVER,FRONT MCJK0023101 C1100 ORUSV Silver 465 MICA00 INSERT,FRONT MICA0006001 G7030,M1.4 x L2.5, Outside Diameter 2.0 Yellow5 MPBZ00 PAD MPBZ0050701 C1300 CGRSV 2.0 X 2.0 X 0.5t Black5 MSGY00 STOPPER MSGY0004901 C1300 CGRSV 8.9 X 2.6 Silver 495 MTAZ00 TAPE MTAZ0036001 C1300 CGRSV 20 X 4 X 0.05t Blue4 AWAB00 WINDOW ASSY,LCD AWAB0009701 C1100 ONLY LG LOGO Silver 45 BFAA00 FILM,INMOLD BFAA0015901 C1100 EUASV Main Window Inmold Film Silver5 MWAC00 WINDOW,LCD MWAC0036601 C1100 ORUSV 1.0t Silver4 GMZZ00 SCREW MACHINE GMZZ0009402 C1300 CGRSV 1.4 mm, 3.0 mm, Head DIA 2.7, 1.2t, STAR Silver4 MCCH00 CAP,SCREW MCCH0021501 C1300 CGRSV 3.1PI Dark Gray 24 MHFD00 HINGE,FOLDER MHFD0005901 Pi5.8, 5Kgf, CAN Type, Prexco(Head R1.0), Click Hinge Deep Silver 414 MIDZ00 INSULATOR MIDZ0041401 C1300 CGRSV 9 X 5.5 X 0.05t Blue 154 MLAC00 LABEL,BARCODE MLAC0003401 EZ LOOKS(user for mechanical)4 MTAB00 TAPE,PROTECTION MTAB0042601 C1300 CGRSV Main Window Protection 41 X 65 X 0.15t 14 MWAD00 WINDOW,LED MWAD0003501 C1100 ORUSV 0.8t Cyber Mirror 253 ACGM00 COVER ASSY,REAR ACGM0029801 C1100 ORUSV Silver4 MCCC00 CAP,EARPHONE JACK MCCC0013501 C1300 CGRSV 6.2PI Silver 324 MCIA00 CONTACT,ANTENNA MCIA0010901 C1300 CGRSV 4.75pi X 3.85h Gold 314 MCJN00 COVER,REAR MCJN0019801 C1100 ORUSV CE0700 carved Silver 334 MGAD00 GASKET,SHIELD FORM MGAD0045801 C1300 CGRSV 11 X 2.8 X 0.4t Gold 354 MGAD01 GASKET,SHIELD FORM MGAD0049001 C1300 CGRSV 6.5 X 2.8 X 0.35t Gold 364 MGAD02 GASKET,SHIELD FORM MGAD0049301 C1100 ORUSV 9 X 2.5 X 0.45t Gold 374 MLEA00 LOCKER,BATTERY MLEA0015201 C1300 CGRSV Silver 304 MPBH00 PAD,MIKE MPBH0007501 C1300 CGRSV 3.2 PI 1.0t Black 344 MSDC00 SPRING,LOCKER MSDC0001901 diameter 5X1.6 294 SNGF00 ANTENNA,GSM,FIXED SNGF0003701 3.0 ,-2 dBd,SILVER ,GSM+DCN,C1100+C1200 283 ADCA00 DOME ASSY,METAL ADCA0017101 C1300 CGRSV D-Dimple 4.9 or 5.0 PI White 403 AKAZ00 KEYPAD ASSY AKAZ0004502 C1100 ORUSV menu EMI Applied Silver 423 GMZZ00 SCREW MACHINE GMZZ0009402 C1300 CGRSV 1.4 mm, 3.0 mm, Head DIA 2.7, 1.2t, STAR Silver 33 MCCF00 CAP,MOBILE SWITCH MCCF0013401 C1300 CGRSV 3 PI, 5.2 PI Silver 273 MLAK00 LABEL,MODEL MLAK0006901
13.2 Replacement Parts<Mechanic component>
Note: This Chapter is used for reference, Part order isordered by SBOM standard on GCSC
13. EXPLODED VIEW & REPLACEMENT PART LIST
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Level Location No. Description Part Number Specification Color Remark4 SACY00 PCB ASSY,FLEXIBLE SACY0017002 145 SACA00 PCB ASSY, FLEXIBLE,AUTO SACA00008016 C1 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP6 C2 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP6 CN1 CONNECTOR,BOARD TO BOARD ENBY0013401 34 PIN,0.4 mm,STRAIGHT ,Au ,B to B G54006 CN2 CONNECTOR,BOARD TO BOARD ENBY0018701 41 PIN,0.3 mm,ETC ,AU ,6 LD1 DIODE,LED,CHIP EDLH0003401 RED, GREEN ,ETC ,R/TP ,SIZE 1315 , GSM DUAL LED6 R1 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP6 R2 RES,CHIP ERHY0000172 68 ohm,1/16W ,F ,1005 ,R/TP6 R3 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP6 R4 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP6 SPCY00 PCB,FLEXIBLE SPCY0032001 POLYI ,45 mm,DOUBLE ,4 SBCL00 BATTERY,CELL,LITHIUM SBCL0001303 2 V,1 mAh,COIN ,SOLDER TYPE BACKUP BATTERY 134 SJMY00 VIBRATOR,MOTOR SJMY0002802 3 V,0.08 A,12*15 ,G5300 VIBRATOR (0.5t PAD) 124 SUSY00 SPEAKER SUSY0006207 ASSY ,8 ohm,92 dB,17 mm,5T 114 SVLY00 LCD SVLY0018801 163 SAFY00 PCB ASSY,MAIN SAFY0097701 C1100 EUASV 384 MLAB LABEL,A/S MLAB0000601 HUMIDITY STICKER4 MLAC00 LABEL,BARCODE MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware))4 SAFA00 PCB ASSY,MAIN,AUTO SAFA0034201 C1100 ORUSV5 C101 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C102 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C103 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C104 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C105 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C106 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C107 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C108 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP5 C111 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C112 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C115 CAP,CERAMIC,CHIP ECCH0001811 220000 pF,10V ,Z ,Y5V ,HD ,1005 ,R/TP5 C116 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C117 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C123 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C124 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C131 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C132 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP5 C133 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C134 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C135 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C136 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C137 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C139 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP5 C140 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C143 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP5 C144 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP5 C146 CAP,TANTAL,CHIP,MAKER ECTZ0002601 10 uF,10V ,M ,STD ,2125 ,R/TP5 C147 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C148 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP5 C149 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C151 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP5 C152 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C153 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C154 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C155 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C156 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C157 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP5 C160 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C161 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C162 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C163 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C165 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C167 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C168 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP5 C170 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C171 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C177 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C178 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
<Main component>
13. EXPLODED VIEW & REPLACEMENT PART LIST
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Level Location No. Description Part Number Specification Color Remark5 C179 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C181 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP5 C182 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP5 C183 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C184 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP5 C185 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP5 C186 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C187 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP5 C188 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C191 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C192 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C193 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C195 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP5 C196 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C201 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C202 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C203 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C211 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C212 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C213 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C214 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C215 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C216 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C217 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C218 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C219 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C220 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C221 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C222 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C223 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C224 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C225 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C226 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C227 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C231 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C232 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C233 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C234 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C235 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C236 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C237 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C238 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C239 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C240 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C241 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C242 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C243 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C244 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C245 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C246 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C247 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C248 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C251 CAP,CERAMIC,CHIP ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP5 C252 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C254 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C255 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C256 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C257 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C258 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C259 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C260 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C261 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C262 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C267 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C268 CAP,CERAMIC,CHIP ECCH0000114 20 pF,50V,J,NP0,TC,1005,R/TP5 C269 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C271 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP5 C272 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP
13. EXPLODED VIEW & REPLACEMENT PART LIST
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Level Location No. Description Part Number Specification Color Remark5 C273 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP5 C274 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C275 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C276 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C277 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C278 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C290 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C298 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C299 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C301 CAP,TANTAL,CHIP,MAKER ECTZ0000318 33 uF,10V ,M ,L_ESR ,ETC ,R/TP5 C302 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C311 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP5 C312 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C316 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C317 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C321 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C322 CAP,CERAMIC,CHIP ECCH0000101 0.5 pF,50V,C,NP0,TC,1005,R/TP5 C323 CAP,CERAMIC,CHIP ECCH0000101 0.5 pF,50V,C,NP0,TC,1005,R/TP5 C326 CAP,CERAMIC,CHIP ECCH0000176 2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP5 C331 CAP,CERAMIC,CHIP ECCH0000101 0.5 pF,50V,C,NP0,TC,1005,R/TP5 C341 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP5 C342 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C343 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C344 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C345 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP5 C350 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C351 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C352 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C353 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C354 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C355 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C356 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C361 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP5 C362 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP5 C363 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP5 C371 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP5 C372 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C373 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C375 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C382 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C383 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C384 CAP,CERAMIC,CHIP ECCH0000171 3.3 pF,16V ,J ,NP0 ,TC ,1005 ,R/TP5 C385 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C386 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C387 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C389 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C399 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP5 C401 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C402 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C403 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C404 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP5 C405 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C406 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C407 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C408 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C409 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C410 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C411 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C412 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 CN201 CONNECTOR,BOARD TO BOARD ENBY0013402 34 PIN,0.4 mm,STRAIGHT ,Au ,B to B G54005 CN202 CONNECTOR,I/O ENRY0002202 24 PIN,0.5 mm,ETC ,AU ,OFFSET TYPE5 D101 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t)5 D104 DIODE,SWITCHING EDSY0005701 EMT3 ,80 V,4 A,R/TP ,5 D201 DIODE,SWITCHING EDSY0012301 1-1E1A ,85 V,1 A,R/TP ,P=200mW, IFM=200mA5 FB1 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead5 FL301 FILTER,SEPERATOR SFAY0003702 900 ,1800 ,1.3 dB,1.5 dB,30 dB,25 dB,4532 ,Antenna switch5 FL302 FILTER,SAW SFSY0021301 942.5 MHz,2.0*1.4*0.68 ,SMD ,5 FL303 FILTER,SAW SFSY0021302 1842.5 MHz,2.0*1.4*0.68 ,SMD ,
13. EXPLODED VIEW & REPLACEMENT PART LIST
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Level Location No. Description Part Number Specification Color Remark5 J101 CONN,SOCKET ENSY0007607 6 PIN,ETC ,BRIDGE NON PROTECTOR TYPE ,2.54 mm,3.0T5 J102 CONN,JACK/PLUG, EARPHONE ENJE0002301 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD5 L301 INDUCTOR,CHIP ELCH0001004 8.2 nH,J,1005,R/TP5 L302 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP ,5 L303 INDUCTOR,CHIP ELCH0002715 27 nH,G ,1608 ,R/TP ,coil inductor5 L304 INDUCTOR,CHIP ELCH0002714 7.5 nH,G ,1608 ,R/TP ,coil inductor5 L305 INDUCTOR,CHIP ELCH0005006 33 nH,J ,1005 ,R/TP ,5 L306 INDUCTOR,CHIP ELCH0005006 33 nH,J ,1005 ,R/TP ,5 L307 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,CDMA5 L308 INDUCTOR,CHIP ELCH0001009 1.2 nH,S ,1005 ,R/TP ,5 LD111 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD112 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD113 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD114 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD115 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD116 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD117 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD118 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD119 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD120 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 MTCA00 TERMINAL,GROUND MTCA0001501 C1300 CGRSV 4.7 X 1.8 X 1.3 (0.3t) Sn Plating Silver5 Q103 TR,FET,P-CHANNEL EQFP0004201 2.9*1.9*0.8(t) ,0.7 W,20 V,-6.0 A,R/TP ,NDC652P upgrade(substitution) item5 Q104 TR,BJT,ARRAY EQBA0000406 SC-70 ,0.2 W,R/TP ,CDMA,Common use5 Q201 TR,BJT,ARRAY EQBA0000406 SC-70 ,0.2 W,R/TP ,CDMA,Common use5 Q202 TR,BJT,ARRAY EQBA0002701 EMT6 ,150 mW,R/TP ,NPN, PNP, 150 mA5 R102 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R103 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R107 RES,CHIP ERHY0001102 0.2 ohm,1/4W ,F ,2012 ,R/TP5 R108 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP5 R111 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R112 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R113 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R114 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R115 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R116 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R117 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R118 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R119 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R120 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R121 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP5 R122 RES,CHIP ERHY0000286 200K ohm,1/16W,J,1005,R/TP5 R123 RES,CHIP ERHY0000512 10M ohm,1/16W,J,1608,R/TP5 R124 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R125 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R126 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R127 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP5 R128 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R130 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP5 R132 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R134 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP5 R137 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R138 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP5 R141 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R142 RES,CHIP ERHY0000274 51K ohm,1/16W,J,1005,R/TP5 R144 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP5 R145 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP5 R146 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP5 R147 RES,CHIP ERHY0000291 330K ohm,1/16W,J,1005,R/TP5 R148 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R150 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R151 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R153 RES,CHIP ERHY0000271 39K ohm,1/16W,J,1005,R/TP5 R156 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R157 RES,CHIP ERHY0000116 1.5K ohm,1/16W,F,1005,R/TP5 R159 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R161 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R162 RES,CHIP ERHY0004101 49.9 ohm,1/10W ,F ,1608 ,R/TP5 R163 RES,CHIP ERHY0000401 0 ohm,1/16W,J,1608,R/TP
13. EXPLODED VIEW & REPLACEMENT PART LIST
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Level Location No. Description Part Number Specification Color Remark5 R164 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R165 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R181 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R201 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R202 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R203 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R204 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R205 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R206 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R207 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R208 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R209 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R210 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R211 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R212 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R213 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R214 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R215 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R216 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R218 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP5 R219 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP5 R221 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R223 RES,CHIP ERHY0000207 20 ohm,1/16W,J,1005,R/TP5 R224 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R225 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R226 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R227 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R229 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R230 RES,CHIP ERHY0000226 220 ohm,1/16W,J,1005,R/TP5 R232 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R233 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP5 R234 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R235 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R236 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R237 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R238 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R239 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R240 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R241 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R242 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP5 R243 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP5 R245 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R246 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R247 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R249 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R250 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R251 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R252 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R254 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R255 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R256 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R258 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R261 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R262 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R263 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R265 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R301 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP5 R302 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R304 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R305 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R306 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP5 R307 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP5 R309 RES,CHIP ERHY0006603 36 ohm,1/16W ,J ,1005 ,R/TP5 R310 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R311 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP5 R312 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP5 R314 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R315 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP
13. EXPLODED VIEW & REPLACEMENT PART LIST
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Level Location No. Description Part Number Specification Color Remark5 R316 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP5 R317 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R319 THERMISTOR SETY0001201 NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES5 R401 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R402 RES,CHIP ERHY0000271 39K ohm,1/16W,J,1005,R/TP5 R403 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R404 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R407 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R408 RES,CHIP ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP5 R409 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R410 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R412 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R413 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R414 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R415 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R416 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R417 RES,CHIP ERHY0000284 150K ohm,1/16W,J,1005,R/TP5 SPFY00 PCB,MAIN SPFY0072101 FR-4 ,1.00 mm,BUILD-UP 8 ,5 SW1 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W5 SW2 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W5 SW301 CONN,RF SWITCH ENWY0003001 STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T5 TC151 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 TC153 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 U101 IC EUSY0157001 LFBGA ,160 PIN,R/TP ,DIGITAL BASEBAND PROCESSOR5 U102 IC EUSY0169301 148-TERMINAL BGA ,148 PIN,R/TP ,GSM ANALOG BASEBAND / TYPHOON B5 U103 IC EUSY0129502 LEADLESS CHIP ,6 PIN,R/TP ,HALL-EFFECT SWITCH IC / 2.0*3.0*0.85 U104 IC EUSY0077701 SC70-5 ,5 PIN,R/TP ,5 U105 IC EUSY0077301 SC70-6/SOT23-6 ,6 PIN,R/TP ,5 U201 IC EUSY0145401 P-FBGA73 ,73 PIN,R/TP ,128M FLASH 32M PSRAM / BOTTOM BOOT / CE 2 PCS5 U203 IC EUSY0178201 TSOPJW-12 ,12 PIN,R/TP ,CHARGE PUMP FOR WHITE LED / MAX - 6 LEDS5 U301 IC EUSY0161301 8x8 LGA ,28 PIN,R/TP ,5 U302 PAM SMPY0004001 35 dBm,55 %,2 A,-50 dBc,25 dB,10.0 * 7.0 * 1.4 ,SMD ,5 U303 IC EUSY0118602 SOT-23-5 ,5 PIN,R/TP ,150mA LOW NOISE uCAP CMOS LDO5 U401 IC EUSY0098501 32-PIN QFN ,32 PIN,R/TP ,MA-2 / UP TO 16 VOICES / FM SYNTHESIZER5 U402 IC EUSY0119001 10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOG SWITCHES5 VA151 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA152 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA153 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA154 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA165 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA201 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA202 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA203 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA204 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA205 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA206 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA207 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 X101 X-TAL EXXY0015601 .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 ,5 X301 VCTCXO EXSK0000801 13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 ,3 SUMY00 MICROPHONE SUMY0003803 PIN ,42 dB,4*1.5 ,FPCB 392 MHBY00 HANDSTRAP MHBY0001101 Neck Strap 380mm Gray
13. EXPLODED VIEW & REPLACEMENT PART LIST
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13.3 Accessory
Level Location No. Description Part Number Specification Color Remark2 SBPL00 BATTERY PACK,LI-ION SBPL0072128 3.7 V,760 mAh,1 CELL,PRISMATIC ,C1100 BATTERY(SV) Silver2 SGEY00 EAR PHONE/EAR MIKE SET SGEY0003203 G4050 G4010 For USA ,3 POLE Design change2 SSAD00 ADAPTOR,AC-DC SSAD0007835 FREE ,50 Hz,5.2 V,800 mA,CE,CB ,UK(IO.24P)
Note: This Chapter is used for reference, Part order isordered by SBOM standard on GCSC
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