PowerPoint Presentation Evolving to Flexible, ... transparent carrier dynamic release layer...

July 2016© 2016 Uniqarta, Inc.

© 2016 Uniqarta, Inc.

Electronics Evolving to Flexible, Shaped Formats

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© 2016 Uniqarta, Inc.

Today’s ICs not Suitable forTomorrow’s Flexible Devices

Standard ICs are too thick to bend

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Thinned ICs are flexible

© 2016 Uniqarta, Inc.

Today’s Assembly Technology Can’t Handle Thin ICs

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Challenges

• Thinning/Handling

• Dicing

• Pick-up

• Cracking

• Accuracy

• Throughput

• Interconnections

© 2016 Uniqarta, Inc.

FlexChip™ Process Designed for Ultra-Thin ICs

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• Standard wafers

• Conventional tooling

• High throughput

• Extendable toultra-small ICs

patents pending

© 2016 Uniqarta, Inc.

On-Chip Handles Facilitate FlexChip Assembly

patents pending6

Thinned, Diced Wafer Handle Removal(pick-and-place or laser)

Die Placement

handle IC

ultra-thin IC

© 2016 Uniqarta, Inc.

Market Engagement and Support

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SBIR grants

Multiple funded projects

Commercial Collaborations

Co. #1 Flexible displays

Co. #2 Molded electronics

Co. #3 Wide-area sensors

Co. #4 Embedded materials