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Interference Assisted Lithography (IAL): A Way to Contain the Lithography Costs for the 32nm and 22nm Half-Pitch Device Generations. Rudi Hendel; David Markle; John S. Petersen; Andrew Barada; Periodic Structures, Inc. Zhilong Rao Applied Materials, Inc. Presentation Overview. - PowerPoint PPT Presentation
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Interference Assisted Lithography (IAL): Interference Assisted Lithography (IAL): A Way to Contain the Lithography Costs for the A Way to Contain the Lithography Costs for the 32nm and 22nm Half-Pitch Device Generations 32nm and 22nm Half-Pitch Device Generations
Rudi Hendel; David Markle; Rudi Hendel; David Markle; John S. Petersen; Andrew Barada;John S. Petersen; Andrew Barada;
Periodic Structures, Inc. Periodic Structures, Inc. Zhilong RaoZhilong Rao
Applied Materials, Inc. Applied Materials, Inc.
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Presentation OverviewPresentation OverviewSemiconductor Manufacturing Costs:Semiconductor Manufacturing Costs:A quick calibrationA quick calibrationCost Model OverviewCost Model OverviewBasics and AssumptionsBasics and AssumptionsInterference Assisted LithographyInterference Assisted LithographyAn introduction into the ConceptAn introduction into the ConceptProcess and Lithography-related cost factors Process and Lithography-related cost factors and their impactand their impactResults and DiscussionResults and DiscussionConclusions Conclusions
22
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
0
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““Lithography is a Bargain!*”Lithography is a Bargain!*”* Paul Arnold, ASML at the VLSI Litho Panel 2008 (November 18, 2008)
450mm projections
33
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Still – Time for Reality Check: Still – Time for Reality Check: (Comparing the price-tag for a Fab with….)(Comparing the price-tag for a Fab with….)
$1B
$3B
$5B
Megafab:$6B to $10B
44
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Should the size of Fab Price Tags Should the size of Fab Price Tags be a concern?be a concern?
Bob Johnson (Gartner DQ) at ISS 2009
YesYes
55
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
The basis of our Cost Model:The basis of our Cost Model:
Process Cost (Resist, Develop, BARC, Metrology, Inspection, etc.
Allocation of Mask Cost
Tool component – Depreciation and Tool Maintenance
Model by “Screenivasan et al.” as quoted by Frank Goodwin, November 7, 2005 – Trends in the Cost of Photolithography
66
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Cost of LithographyCost of LithographyDirect Impact CostsDirect Impact Costs
I̶ Cost and Complexity of Cost and Complexity of the Patterning Processthe Patterning Process
I̶ Cost of additional Tools Cost of additional Tools required (ex.: S.I.T.)required (ex.: S.I.T.)
I̶ Cost of Mask(s)Cost of Mask(s)I̶ Depreciation Cost and Depreciation Cost and
Maintenance Expense of Maintenance Expense of the Exposure Toolthe Exposure Tool
Tool Price to CustomerTool Price to CustomerEffective ThroughputEffective ThroughputScheduled & unscheduled Scheduled & unscheduled MaintenanceMaintenance
Indirect Impact CostsIndirect Impact Costs(Factors of high importance (Factors of high importance to a customer on which the to a customer on which the Choice of Lithography has a Choice of Lithography has a critical impact)critical impact)
I̶ Cost of DesignCost of DesignI̶ Time to Design Time to Design
ImplementationImplementationI̶ Risk of First Silicon FailRisk of First Silicon Fail
77
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Per Yan Borodovsky; Semicon West; July 15, 2009
88
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
How to reduce cost? Start with the ToolHow to reduce cost? Start with the Tool
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Or:Trade off general purpose capabilitywith acceptable restrictionsleading to cost savings
Either:Simplify the pattern, reducing Pixel Transfer Rate which leads to lower capital cost
99
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Effective Means to segment (and reduce) Effective Means to segment (and reduce) Information Content contained in a pattern:Information Content contained in a pattern:
Interference Assisted LithographyInterference Assisted Lithography It separates high frequency component It separates high frequency component
of the image (dense line-spaces) of the image (dense line-spaces) from the design content (line-ends)from the design content (line-ends)
Simplified Imaging Rules allow lower tool cost Simplified Imaging Rules allow lower tool cost without sacrificing minimum resolutionwithout sacrificing minimum resolution
Several technology approaches are available Several technology approaches are available Ultimate Selection will accommodate Ultimate Selection will accommodate
key requirements in both, logic and memory.key requirements in both, logic and memory.
1010
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
What is Interference Assisted Lithography?What is Interference Assisted Lithography?I.A.L. is a two-exposure process:I.A.L. is a two-exposure process: Exposure One – Fixed Pitch Pattern (a grating)Exposure One – Fixed Pitch Pattern (a grating) Exposure Two – a Block-Mask, Exposure Two – a Block-Mask,
determining where the lines defined in the determining where the lines defined in the first exposure end and startfirst exposure end and start
=+
1111
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
The I.A.L. Technology Principle The I.A.L. Technology Principle has been demonstratedhas been demonstrated
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Source: MIT Lincoln Lab (2005)
M. Fritze, T. M. Bloomstein, B. Tyrrell, T. H. Fedynyshyn, N. N. Efremow, D. E. Hardy, S. Cann, D. Lennon, S. Spector and M. Rothschild, “Hybrid Optical Maskless Lithography: Scaling Beyond the 45nm Node”, J. Vac, Sci. and Tech. B 23(6) (2005), pp. 2743–2748.
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Benefits of Interference-based Benefits of Interference-based Exposure ToolsExposure Tools
Cost benefitsCost benefits Simplified Optics and thus lower Tool CostSimplified Optics and thus lower Tool Cost OL requirements for IAL are relaxed compared to OL requirements for IAL are relaxed compared to
OL requirements for traditional Double PatterningOL requirements for traditional Double Patterning Significant savings in Cost of MasksSignificant savings in Cost of Masks
IAL requires 1 critical mask,IAL requires 1 critical mask,Double Patterning requires 2 + Double Patterning requires 2 +
Technical BenefitsTechnical Benefits Wider process windowWider process window Increased Contrast/DOFIncreased Contrast/DOF
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October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
22nm Technology Node Lithography Cost Comparison Traditional DP vs. IAL DP
$-
$50
$100
$150
$200
$250
$300
$350
$400
$450
$500
Traditional DP IAL DP
Lit
ho
Co
st o
f al
l DP
Lay
ers
Mask
Resist
Maintenance
DepreciationThe reduced Cost of Masksgives IAL DP a30% cost benefit compared to Traditional DP(Independent ofMask Usage)
Double Patterning: – Double Patterning: – Comparing Traditional D.P. vs. I.A.L. D.P.Comparing Traditional D.P. vs. I.A.L. D.P.
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October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Total Litho Cost by Node:Total Litho Cost by Node:
Assignment ofAssignment of Mask LevelsMask Levels
Node and Minimum CD 45 32 22 16Minimum Pitch 130 90 64 45EUVL Levels 0 0 2 11193i-DP Levels or 193-IAL Levels 0 10 9 8193i-SE Levels 7 10 21 21193d-SE Levels 19 17 8 0248-SE Levels 7 0 4 4I-line Levels 7 7 6 6
Total number of Levels in Node 40 44 50 50
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October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Cost of Lithography - Traditional DP Process
$-
$500
$1,000
$1,500
$2,000
$2,500
45 32 22 16
Technology Node
Co
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f L
ith
og
rap
hy
per
Waf
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Mask Cost (at 10,000 wafers per mask)
Resist Cost
Maintenance Cost
Depreciation (at 70% of catalog throughput)
Lithography Cost per Wafer - IAL based DP Process
$-
$500
$1,000
$1,500
$2,000
$2,500
45 32 22 16
Technology Node
Waf
er C
ost
($)
Mask Cost (at 10,000 wafers per mask)
Resist Cost
Maintenance Cost
Depreciation (at 70% of catalog throughput)
Traditional Double PatterningI.A.L. Double Patterning
Total projected Lithography CostTotal projected Lithography Cost Traditional D.P. vs. I.A.L. D.P.Traditional D.P. vs. I.A.L. D.P.
Co
st o
f L
ith
og
rap
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per
Waf
er
1616
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Cost of Lithography - Traditional DP Process
$-
$500
$1,000
$1,500
$2,000
$2,500
45 32 22 16
Technology Node
Co
st o
f L
ith
og
rap
hy
per
Waf
er
Mask Cost (at 10,000 wafers per mask)
Resist Cost
Maintenance Cost
Depreciation (at 70% of catalog throughput)
Lithography Cost per Wafer - IAL based DP Process
$-
$500
$1,000
$1,500
$2,000
$2,500
45 32 22 16
Technology Node
Waf
er C
ost
($)
Mask Cost (at 10,000 wafers per mask)
Resist Cost
Maintenance Cost
Depreciation (at 70% of catalog throughput)
Traditional Double PatterningI.A.L. Double Patterning
Co
st o
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ith
og
rap
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the
No
de
Only I.A.L. DP for Critical Layers
EUVL replaced by IAL
$-
$500
$1,000
$1,500
$2,000
$2,500
45 32 22 16
Technology Node
Co
st o
f L
ith
og
rap
hy
for
No
de
Mask Cost (at 10,000 wafers per mask)
Resist Cost
Maintenance Cost
Depreciation (at 70% of catalog throughput)
Total projected Lithography Cost Total projected Lithography Cost Hypothetical Case of replacing all EUV Layers with IALHypothetical Case of replacing all EUV Layers with IAL
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October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Additional Benefits Possible with I.A.L.Additional Benefits Possible with I.A.L.(System Architecture Dependent)(System Architecture Dependent)
Reduced Capital Cost benefits all Lot SizesReduced Capital Cost benefits all Lot Sizes
In the case of a reduced Exposure Field In the case of a reduced Exposure Field (Not all applications require large Exposure Fields)(Not all applications require large Exposure Fields) Further Mask Cost ReductionFurther Mask Cost Reduction
Minimizing write/inspection costsMinimizing write/inspection costs
Particularly benefitting small lot sizes, Particularly benefitting small lot sizes, which are highly sensitive to Mask Cost which are highly sensitive to Mask Cost
Reduced Systems Cost Reduced Systems Cost (Stepper architecture allows systems simplifications)(Stepper architecture allows systems simplifications)
Additional efficiency particularly for small devices Additional efficiency particularly for small devices (somewhat counterintuitive) (somewhat counterintuitive)
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October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Mask Cost vs Field Size
$0
$10,000
$20,000
$30,000
$40,000
$50,000
$60,000
0 200 400 600 800 1,000
Patterned Area (mm2)
Mask C
ost
Mask Cost vs. Mask Patterned AreaMask Cost vs. Mask Patterned Area
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October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Cost of Lithography Step Comparison (Traditional Scanner vs. I.A.L. Stepper)
$1
$10
$100
$1,000
$10,000
1 10 100 1,000 10,000
Mask Utilization (Wafers per Mask)
Co
st
per
Lit
ho
gra
ph
y S
tep
(U
SD
)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Lit
ho
gra
ph
y C
ost
Red
uct
ion
(%
)
I.A.L. Stepper 10x20
Traditional Scanner 30x20
Cost Reduction (Stepper vs.Scanner)
Cost of Lithography Comparison – Cost of Lithography Comparison – Traditional Scanner vs. I.A.L. StepperTraditional Scanner vs. I.A.L. Stepper
2020
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
I.A.L. LimitationsI.A.L. Limitations
High Regularity requires Design Restrictions High Regularity requires Design Restrictions I.A.L. Restrictions are similar to I.A.L. Restrictions are similar to
Sidewall Image Transfer (S.I.T.) Restrictions Sidewall Image Transfer (S.I.T.) Restrictions Yet, S.I.T. is considered as one viable option Yet, S.I.T. is considered as one viable option for extending resolution. for extending resolution.
Designs compatible with S.I.T. are expected Designs compatible with S.I.T. are expected to be compatible with I.A.L..to be compatible with I.A.L..
Adopting such restrictions early and transitioning to Adopting such restrictions early and transitioning to regularity in one single step promises regularity in one single step promises significant cost benefits. significant cost benefits.
2121
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
In Summary – Cost Benefits of I.A.L.:In Summary – Cost Benefits of I.A.L.:Direct:Direct:Significant reduction of Mask CostSignificant reduction of Mask Cost Comparable layers (vs. traditional DP) Comparable layers (vs. traditional DP)
Containment of Litho Cost IncreasesContainment of Litho Cost Increases If applied to all Critical Levels in the process flowIf applied to all Critical Levels in the process flow
Additional Benefits are possible:Additional Benefits are possible: Reduced Die Size, Small Lot-size, Reduced Die Size, Small Lot-size,
(leading to smaller Exposure Fields)(leading to smaller Exposure Fields) Enhanced Maskless Lithography EconomicsEnhanced Maskless Lithography Economics
Reduced Image (Pixel) Density for Block Mask Reduced Image (Pixel) Density for Block Mask Enables competitive MLL Throughput (prototyping)Enables competitive MLL Throughput (prototyping)
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October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Indirect:Indirect:
I.A.L. can become a Technology Enabler for I.A.L. can become a Technology Enabler for a market segment currently underserved:a market segment currently underserved: Opening Access to Leading Edge Geometries Opening Access to Leading Edge Geometries
for low/medium mask usage applications for low/medium mask usage applications (ASIC/ASSP) by:(ASIC/ASSP) by:
Reduced Mask Costs (and Capital Cost)Reduced Mask Costs (and Capital Cost)
Simplified DR complexitySimplified DR complexity
Reduced time to Design CompletionReduced time to Design Completion
Reduced risk to first time successReduced risk to first time success
In Summary – Cost Benefits of I.A.L.:In Summary – Cost Benefits of I.A.L.:
2323
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
AcknowledgementsAcknowledgements
Al Bergendahl, Bergendahl EnterprisesAl Bergendahl, Bergendahl Enterprises
Marc Levenson Marc Levenson
Mark Pinto, Applied MaterialsMark Pinto, Applied Materials
Hans Stork, Applied MaterialsHans Stork, Applied Materials
Bill Tobey, ACT ConsultingBill Tobey, ACT Consulting
2424
October 23. 2009October 23. 2009Periodic Structures, Inc. Periodic Structures, Inc.
Lithography Extensions Conference, PragueLithography Extensions Conference, Prague
Thank you!Thank you!
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