SPH-7 Slurry - BAIKOWSKI · SPH-7 Slurry SPH-7 slurry was developed for polishing C-axis Sapphire....

SPH-7 Slurry

SPH-7 slurry was developed for polishing C-axis Sapphire. In order to meet the production volume increase and requirement of cost reduction, SPH-7 slurry achieves more than 3 times removal rate compared with colloidal silica under the same polishing condition such as pressure, plate rotation, pad, slurry flow etc. Baikowski is offering drastic improvement of productivity and reduce of polishing cost without additional investment.

Removal rate advantage

Grinding 600 grit

Polish 30 min

Polish 60 min

Polish 90 min

Colloidal silica RR 1.97µm/hour

SPH-7 RR 6.28µm/hour

Surface roughness

【Polishing condition】 Machine Pad Plate rotation Down force Slurry flow Work Slurry dilution

：φ15” single side ：SUBA 600 ：80 rpm ：400 g/cm2

：50 mｌ/min ：Sapphire C axis ：1 : 2

Packaging : ２０KG container,　４KG bottle

Ra : 0.168nm Baikowski Japan Co., Ltd. 6-17-13 Higashinarahino Narashino-city Chiba, 275-0001 Japan TEL 81(0)47 4738150 FAX 81(0)47 4738153 Sales1@baikowski.co.jp

Container Bottle

D50(µm） PH DilutionSPH-7 0.25 11-13 1:2

【Slurry formulation】