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Why HB Automation’s
Reflow system
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Reflow soldering system
HS series reflow oven offers: • Totally meet the high
requirements of lead free process;
• PLC+PID control system for stable temperature accuracy and uniformity.
• Easy maintenance reduce downtime
• Multi options available includes dual lane,nitrogen system, center support system;
Reflow soldering system
TP series reflow oven offers • Powerful cooling performance with 3 up + 3 down cooling zone; • Updated heating technology for power saving • Longer heating length for lead free process • Excellent flux management system
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Reflow soldering system
Soldering theory
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Reflow soldering system
The two key purposes for soldering: 1. Electrical and power conduction 2. Durable solid mechanical connection strength
The temperature of the solder joints must be up to about 15 °C above the melting point of solder, and maintains a certain amount of time. At this time of the solder joints can send chemical reaction, and in between welding plate and components pins to form a kind of new chemical substances, which is known as the intermetallic compounds, persistently makes strong connection.
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Reflow soldering system
Lead free process puts forward a new challenges to reflow soldering oven system !
PWI comparison
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Reflow soldering system
The temperature ΔT caused by the different of the heat capacity of different components
The temperature difference is big between the big components and small components
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Reflow soldering system
Liquid phase
Liquid phase
solid phase
solid phase
Accepted PWI
Accepted PWI
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What is important in the lead free reflow soldering system?
Reflow soldering system
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Reflow soldering system
Ideal heat transfer
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In a reflow oven, the efficiency of the heat transfer has a primary effect on all aspects of quality. Productivity and running costs which directly influence profitability. Our heat transfer guarantee a minimum ΔT which translates into maximum profile flexibility.
Reflow soldering system
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The foundation of excellent heat transfer in the reflow is our in-depth understanding of convective heat generation ,transfer and management. Our heater generate the desired temperature faster than any other reflow heat source and respond in less than half a second to temperature change of less than 0.1°C thus maintaining the highest level of temperature repeatability. The heater modules in the oven are also unique in heating air on the intake, allowing it to be blended into a uniformly mixed air blanket.
Reflow soldering system
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Reflow soldering system
In a reflow oven, the thermal uniformity has a primary effect to determine if the reflow process can be easily and quickly put into production or not. With our latest design in the air chamber, it offers a combination of innovation and industry-proven technologies in an easy to-use, reliable and efficient reflow system. Our innovative approach to thermal transfer delivers highly efficient heat transfer throughout the entire process.
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Conveyor rail parallelism and stability
Reflow soldering system
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multi-gear and rack parallel protection Temperature region segmentation is
clear to avoid the interference between each zone as much as possible.
Reflow soldering system
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Reflow soldering system
Fully considering the different CTE of different material, the special structural design guarantee the stability of rail in life-use is without any deformation in the high temperature environment.
High quality Aluminum alloy with the special hardness surface treatment which is best for higher temperature in the lead free process !!!
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Reflow soldering system
No vibration design in the rail
Lead-free solder is no longer a eutectic alloy. At the 222 ° C to 217 ° C during the cooling process, the rail guide will not be allowed any vibration so that it can avoid to produce disturbance solder joints.
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Reflow soldering system
The center support system with a retractable thimble design which allows the bottom clearance of PCB 25mm
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Reflow soldering system
The central support ultra-light design with high strength mechanical properties and resistance to high temperature wear resistance, no heat shielding effect on PCB. The center support with a special parking design which allows the center support pins be hidden under the chain and also ensures a flexible selection for different requirements of different size PCB’s lead free process .
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Effective flux collection system and powerful cooling results
Reflow soldering system
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Reflow soldering system
Preheating, soldering and cooling zone multistage flux collection system.
The friendly design of our reflow oven not only lowers waste gas emissions, but it also enhances flux recovery to reduce build up a flux residue inside the oven. 1. High powerful flux management modular; 2. Easy to access for cleaning;
Preheating zone flux collection system
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Reflow soldering system
Full accessibility to cleaning the flux residue is accomplished through removable filters (front and back).
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Reflow soldering system
Innovative Cooling Technology • Air flow dynamics within cooling zones are efficiently controlled for a balanced environment and reduced exhaust temperatures. Air exhaust system in the cooling zone for the forced air cooling standard configuration significantly reduces the potential for flux dripping in the cooling area.
• Excellent separation between the heating and cooling areas produces tight control of TAL • Enhanced water chiller cooling design achieves maximum airflow balance and reduces nitrogen consumption by 20 to 25%.
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Heat preservation and hermetic in the oven
Reflow soldering system
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Reflow soldering system
The oven has the new patented design in heating temperature protection to prevent the thermal loss, especially in the position of motor temperature insulation and the back surface of the oven.
Heat preservation
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Reflow soldering system
High efficient Heat preservation
Lead free process requires the more higher temperature but the surface of the oven should not be hot.
Our surface temperature on the oven is only 5°C to 10°C above the factory environment temperature.
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Reflow soldering system
For a nitrogen reflow oven, if there is any smaller pinhole, it will cause to increase the nitrogen consumption!!!
Hermetic in the oven
Full hermetic + multi-level Heat preservation = below 500PPM, 20m³/h- 21m³/h nitrogen consumption.
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Reflow soldering system
Reliable electrical system
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Reflow soldering system
CE certificates supported
World -class Branded electrical parts: SIEMENS, GAVAZZI, Schneider, AB, Yamatake, NEMICON,SANYU
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Reflow soldering system
Thank you!
HB Automation Equipment Co.,Ltd Add.: Haobao industrial park,No.43,Xin Er Hong Road,Shajing,Shenzhen,China Tel.:+86-755-27272795;Fax.:+86-755-27271140 Email: tanglg@sz-hb.net Website: http://en.sz-hb.net/
• Agents spread: UK, Spain, Italy, Benelux, Poland, Lithuania, Hungary,Russia.
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