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Zachary J. Davis, Senior Consultant, zjd@teknologisk.dk
Surface Acoustic Wave fabrication using nanoimprint
Zachary Davis, DTI Confidential
Center for Microtechnology & Surface Analysis
Surface Technology
Sensor Technology
Metrology
SERVICES AND PRODUCTS
Bottom Up
Micro and Nano Technology
Top Down
Zachary Davis, DTI Confidential
Surface Technology
Sensor Technology
Metrology
SERVICES AND PRODUCTS
Micro and Nano Technology Nanoimprint Lithography Physical Vapor Deposition Electron Beam Lithography Femtosecond Laser Excimer Laser CO2 Laser
SAW Sensors Wireless Systems Functional Coatings Antenna Design (cm-nm) System integration Lab-on-Chip
Molecular Imprinting Organic Synthesis Molecular Vapor Deposition Atomic Layer Deposition PE-CVD Inkjet dispense system
Focused Ion Beam Scanning Electron Microscopy QCM-D Gas Analysis Chamber TOF-SIMS XPS
Center for Microtechnology & Surface Analysis
MICRO / NANO FABRICATION SERVICE
DTI “owned” equipment at Danchip • J-FIL Nano Imprint Lithography (Pilot production/Low
volume production • Etchers (metal, DRIE, glass, polymer) • Ion beam milling/etching • Multi-Process Physical Vapor Deposition (unique) • Laser micromachining/wafer dicing • 2PP 3D-laser • New Electron Beam Lithography just intstalled Next-Generation JEOL E-beam: Top-three World-wide
1350 m2 class 1-1000 ISO 9001
JET AND FLASH NANOIMPRINT LITHOGRAPHY
Supplier Molecular Imprints
J-FIL (Jet and Flash Imprint Lithography)
The only lithographic method so far to be validated
for the 22 nm node by industrial user (Toshiba)
Room temparature nanoimprint by UV curing
Imprint resist (low voscosity monomers)
MonoMat
SilMat (~10% Si)
Other functional materials commercially
available
Template
In-house fabrication
Fused Silica block (65x65 mm2, 6 mm thick)
Zachary Davis, DTI Confidential
Imprio 55 Imprio 100 Imprio 300 (industry verified for 22 nm)
Imprio 1100 Imprio HD2200 Patterned media
Perfecta TR1100 Template replicator for Patterned media
NuTera HD7000 Patterned media
Zachary Davis, DTI Confidential
Zachary Davis, DTI Confidential
IMPRIO 100 SPECS
EBL J-FIL UV stepper
Resolution ~10 nm < 30nm 250 nm
Stitching < 50 nm < 350 nm 40 nm
Wafer size 100 mm 100-200mm 100-200 mm
Wafer flatness Simular 2 x CD Simular
Active area - 25 x 25 mm2 22 x 22 mm2
Capacity < 0.1 w/h 1-4 w/h (manual loading)*
100 w/h
Mask/template cost
- ~ $ 7k ~ $ 1-2k
* Throughput can be improved through installation of a automatic wafer loading system or through using the industrial imprio300 tool (our imprio100 is used for process development purposes)
Zachary Davis, DTI Confidential
1 - Cleaned Wafer
TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF
Zachary Davis, DTI Confidential
2 – Spin coat and bake adhesion/planarization/transfer-layer
TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF
Zachary Davis, DTI Confidential
3 – J-FIL imprint of Si containing resist
TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF
Zachary Davis, DTI Confidential
4 – Etch-back of imprint resist
TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF
Zachary Davis, DTI Confidential
5 – Dry develop to produce undercut
TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF
Zachary Davis, DTI Confidential
6 – PVD of metal
TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF
Zachary Davis, DTI Confidential
7 – Lift-off of all polymers and excess metal
TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF
Zachary Davis, DTI Confidential
FIB-SEM CROSS-SECTION BEFORE LIFT-OFF
5 nm Ti + 65 nm Al
Zachary Davis, DTI Confidential
Green is stamp protrusion and metal in final device
TYPICAL NIL TEMPLATE
200 nm lines
346 nm lines and spaces
346 nm lines and spaces
2.32 µm lines 1.25 µm spaces
Fabrication results
4” wafer with SAW resonators
SAW resonators on Langasite
1.5 mm Design: 346nm/346nm Template: 333.2/- Result: 355nm/335nm (+/-5nm) 5 nm Ti + 65 nm Al
500 µm
100 µm
Green is the stamp protrusion and in the end of the process the metal structures
Delay line devices
Design: 346nm/346nm Template: 333.2/- Result: 355nm/335nm (+/-5nm)
(5 nm Ti + 65 nm Al)
Metal IDTs on LiNb
100 nm lines (5 nm Ti + 65 nm Al) and spaces on LiNbO3
5 nm Ti / 40 nm Au on Si
Optical structures & lines
27
29
31
33
35
37
39
41
4.4010E+08 4.4015E+08 4.4020E+08 4.4025E+08 4.4030E+08 4.4035E+08
Ma
gn
itu
de
(arb
.)
Frequency (Hz)
Resonant curves of 5 SAW resonators on same wafer
3
20
23
26
43
Quartz resonator results
13 kHz
Q factor = 10000 with pure Al electrodes
AFM scan of 100nm thick Al IDT
In-house J-FIL templates
65mm2 Quartz block with 13mm x 13mm mesa area
Zachary Davis, DTI Confidential
30 nm lines
Zachary Davis, DTI Confidential
Zachary Davis, DTI Confidential
40 nm dots
PVD metallization optimization
Variation = 2.95 nm
Rotating plate with up to 12 wafers
Uniformity shield
Pocket with metal
Metal radiation
Cryofox with optimized shield
Variation = 2.95 nm Variation = 1.55 nm
Standard Shield Optimized Shield
GOAL = 0.5 nm
Metal lift-off of metal lines, CD > 30 nm Al Ti/Pt Ni AlCu (coming soon)
Small (<100 nm) and large (mm’s) features in same process
Metal thickness < 160 nm for 100 nm lines, (<1:1.5)
High uniformity batch metallization process to reduce fabrication tolerances
High fidelity + thickness variation control of IDTs result in low fabrication tolerances Various substrate materials:
Si ( > 95% yield) Quartz ( > 95% yield) Lithium Niobate ( > 95% yield) Langasite ( ~ 90% yield – surface polishing issues)
DTI can perform both J-FIL template fabrication & low /medium volume production
Template fabrication : ~ 4weeks ($7000 - $10000) Wafer throughput ~ 10-20 wafers /week (manual wafer loader)
DTI results with J-FIL
Thank You!
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