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PRESENTATION
WIRE BONDINGGroup 2: Tống Văn Khoa
Cao Văn Phước Trần Phúc Thành
Why Wire Bonding? Enable an IC to be electrically
interconnected to the package, and to allow that IC to be handled, tested and “burnt-in”
Such “qualified” IC used in electronic product.
Interconnected to other ICs, passives, flat panel displays, keyboards, sensors, connectors, antennas, switches, etc.
PRIMARY purpose – enable ICs to be interconnected with rest of the system.
Primary functions of IC assembly:(1) To provide signal and power distribution of
the packaged IC to the system.(2) To provide mechanical support to fragile IC(3) To provide environmental protection of the
IC
Another way to bonding: Tape automated bonding (TAB)Flip chip
IntroductionUsed in interconnecting the Die to various substrates… The most popular interconnection methodWire bonding is a SOLID phase welding process
where the two metallic materials, a thin wire and the metallization on Pad surface are brought into intimate contact under a combination of heat, pressure, and/or ultrasonic energy…..
Types of Wire BondingWire bonding is made using two types of
tools:A Wedge- Called Wedge bondingB: Capillary- Called ball bondingVery inexpensive- A penny per pin
Bonding Tools
Ball BondingProcess Steps
Capillary loaded with Au wireEFO wand generates a spark to melt the Au
wire at the tipApply pressure and ultrasonic energy, heat to
form ball bond at bond pad on chip sideBonding on substrate padLoop formationPackage bond pad formation by stitch bondingWire break-off to finish process
Wedge Bonding
Al Is More Suitable For Wedge Bonding
Process StepsWedge tool loaded
with wireApply pressure
and ultrasonic energy to form wedge
Bonding on substrate pad
Loop formationPackage bond pad
formationWire break-off to
finish process
Features of Wire Bonding MethodHigh speed( Bonding time 40ms: 2-4 wires/
sec)EconomicalStrong bondLarger Bonding pad (0,2mm gold wire:
0,5*0,5 mm pad)Ultrasonic can be used
(Dis)advantagesThe advantages of wirebonding:
Highly flexible chip-to-package interconnection process
Low defect rates or high yield interconnection processing
Easily programmed High reliability interconnection structure Very large industry infrastructure supporting the
technologyRapid advances in equipment, tools, and material
technologyThe disadvantages of wirebonding:
Slower interconnection rates due to point-to-point processing of each wirebond
Long chip-to-package interconnection lengths, degrading electrical performance
Larger footprint required for chip to package interconnection
SummaryFunction of Wire BondingTypes of Wire Bonding
Ball BondingWedge Bonding
Advantages and Disadvantages
ReferencesWikipedia
http://en.wikipedia.org/wiki/Wire_bondinghttp://en.wikipedia.org/wiki/Ball_bonding
Youtubehttp://r1---sn-o097zuel.c.youtube.com/videoplay
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THANK YOU FOR LISTENING !
Nano- Electronic Materials Group-HUST
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