1 Jay Chen 　 2014/10/23

集成电路设备发展的考量与思索

陈捷 Jay Chen东电电子 ( 上海 ) 有限公司 总裁

2014 北京微电子国际研讨会

2 Jay Chen 　 2014/10/23

3 New waves expanding Semiconductor market

Social Networking, Big Data

ＣExpanding applications

Automotive, Environment, EHS care, Education

Increasing semiconductor content ratio Emerging countries

Geographical expansion

Semiconductor market trend

3 Jay Chen 　 2014/10/23

Electronics

IP & Fabless

IDM, Foundry & OSAT

WFE

Wafer Fab Equipment

未来蓝图离不开全球 IC产业链的持续贡献Hierarchy of The Semiconductor Industry

IDM: Integrated Device Manufacturer OSAT:Outsource Assembly and Test

US$1,493B

SemiconductorUS$316B

US$27B

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Device Technology Drive Equipment Development

Mo

re Mo

ore

Functional Diversification

CM

OS

Sca

ling

New MaterialNew Structure

Advanced Packaging(3DI / WLP)

3DI

Strained Si

High-k Metal Gate

Cu/ULK

FinFET

Patterning

ArF

ArF-Immersion

EUV

Source :TEL based on ITRS

DP/MP

Carbon Tr. / CNT

SiGe / III-V

NIL, EBDW

Flip-Chip2.5D

Wire-Bonding

Si Photonics

Homogeneous

450mm

DSA

More than Moore

Heterogeneous

Diversified technology development is ongoing

Tech Trend

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Cluster Tool

New Platform

Platform Trend

Single WaferBatch

Wafer Size Single Wafer

6 inch

8 inch

12 inch

12 inch18 inch

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450mm Motivation

Ref. Nikon, 2013

Ref. TEL, 2012

450mm is a cost project (with Big Development)

Platform Trend

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Wafer Demand Forecast

19861988

19901992

19941996

19982000

20022004

20062008

20102012

20142016

20182020

20222024

0

2000

4000

6000

8000

10000

12000

14000

16000

<150mm200mm300mm450mm

M S

q In

/ye

ar

Source: IC knowledge Strategic Industry Model(1200), SPE Marketing

450mm transition will come around 2020

Platform Trend

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South AmericaSouth East AsiaMiddle East Asia

Africa

BRICsEast Europe

North AmericaWest Europe

East Asia

ConsumerConsumer0.8B people

1.5Bpeople

4Bpeople

Service in ChinaSales in ChinaManufacture in ChinaR&D in ChinaHead office in China

BusinessTrendRegional expansion and New Targets of Electronic Equipment markets

9 Jay Chen 　 2014/10/23

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Y2002 Y2012

Top 6Front-endEquipmentCompanies

Top 6Front-endEquipmentCompanies

Others

Others

50%

75%

The Industry Consolidates- Equipment8”

0.18μm~0.13μm12”

28nm~20nm108 companies 69 companies

Source: SEMI, 2014

BusinessTrend

10 Jay Chen 　 2014/10/23

68%81%

86%

The Industry Consolidates- Capital Spending

Source: IC Insights, Jan 2014

Y2014(F) Capital Spending Leaders’ Shares of Total WWSemiconductor Industry Spending ($63.4B)

Top 5 = 68%

Top 10 = 81%

Top 15 = 86%

92%

Y2005 ShareTop 5 = 40%Top 10 = 55%Top 15 = 67%Top 25 = 82%

Top 25 = 92%

BusinessTrend

11 Jay Chen 　 2014/10/23

The Industry Consolidates- IDMsTOP 5 IDMs in Y2001:32.6%

Share of worldwide installed capacity(without discretes)

TOP 5 IDMs in Y2013:52.0%

Share of worldwide installed capacity(without discretes)

Total Revenue: $154B Total Revenue: $315B

16%

4%4%4%

4%67%

Intel

Toshiba

ST Microelectronics

Samsung

Texas Instr

Rest of IDMs

20%

15%

6%6%5%

48%

Intel

Samsung

Micro

Hynix

Toshiba

Rest of IDMs

Source: Gartner, IHS, 2014

16%

4%4%4%

4%67%

Intel

Toshiba

ST Microelectronics

Samsung

Texas Instr

Rest of IDMs

BusinessTrend

12 Jay Chen 　 2014/10/23

Plasma Etch System/ TactrasTM VigusTM

Key initiative : Saving energy consumption of chiller, pump and heater

Thermal Processing System/ TELINDY PLUSTM

Key initiative: Ensuring the use of proper amount of nitrogen

Coater/Developers/ CLEAN TRACKTM LITHIUS ProTM V-i Key initiative: Reducing the amount of exhaust of rotating cup modules and saving energy in temperature/humidity control

Single Wafer Plasma Treatment System/ Triase+TM SPAi Key initiative: Eliminating temperature control unit by using plant- sourced cooling water directly

Elec.

Elec.

N2

EXH

Source : TEL Taiwan EHS Seminar, 2014

Energy Saving Activities in 300mm Equipment

Green Trend

13 Jay Chen 　 2014/10/23

Single Wafer Cleaning System/ CELLESTATM- i Key initiative: Ensuring the use of proper amount of nitrogen

Gas Chemical Etch System/ Certas WINGTM

Key initiative: Improving productivity with two-wafer

Auto Wet Station/ EXPEDIUSTM- i Key initiative: Reducing pure water consumption in standby mode

Wafer Prober/ Precio nanoTM

Key initiative: Reducing the amount of dry air supply with dew point monitoring

Elec.

Water

Air

N2

Source : TEL Taiwan EHS Seminar, 2014

Energy Saving Activities in 300mm Equipment

Green Trend

14 Jay Chen 　 2014/10/23

Energy Saving in Taiwa Factory

The size of 54 American football fields

Green Trend

15 Jay Chen 　 2014/10/23

Energy Saving in Taiwa Factory

Emergency Power Supply

Water Storage Facility

Emergency Stock

Base Isolation System

Green Trend

16 Jay Chen 　 2014/10/23

Energy Saving in Taiwa Factory

Green Trend

17 Jay Chen 　 2014/10/23

2007 2008 2009 2010 2011 2012 2013 2014

Fiscal Year

100

70

50

80

90

60

Base Target

40

50% Reduction 30% Reduction

Middle Target

Achieved

Energy Saving form Corporate Perspective

Source: SEMICON China 2014

Green Trend

18 Jay Chen 　 2014/10/23

Eco-Industry: WFE Supplier and IC Maker

~ Old Days

End Product (Electronics)

IC Design

IC Manufacturing

IC Development

Device Integration

Failure Analysis

Module Process

Process Development

Maintenance

Hardware Production

Current ~

End Product (Electronics)

IC Design

IC Manufacturing

IC Development

Device Integration

Failure Analysis

Module Process

Process Development

Tool Maintenance

Hardware ProductionWFE

Supplier

ICMaker

WFE Supplier

ICMaker

Overlap Region : Collaboration Area

WFE supplier’s duty is increasing, call for collaboration

Partnership Trend

19 Jay Chen 　 2014/10/23

TEL Worldwide R&D Sites

imec (Belgium)

Japan

SEMATECH (US)

CEA-Leti (France)

Albany NanoTech (US)

TEL R&D base

Consortium

Leading-edge ProcessDevelopment CenterTechnology Development CenterTEL Technology Center, Sendai

TEL Technology Center, America

Tohoku University(Japan)

G450C

Preparing for the future technology : w/w collaboration

Partnership Trend

20 Jay Chen 　 2014/10/23

Biz Model Transition : Vertical Integration to Horizontal Specialization

Source: T. Higashi, IME 2014

Partnership Trend

21 Jay Chen 　 2014/10/23

◆集成电路市场三大发展方向 -社交网络普及，设备高性能化，消费区域扩大◆集成电路产业五大变化趋势 -技术趋势：后摩尔定律时代的多元发展 -平台趋势： 450/Single Wafer/Cluster Tool

-商务趋势：中国时代，产业集聚 -绿色趋势：生产环节，使用环节 -平台趋势：合作共生，协同发展

考量与思索

天时地利人和中国正扮演世界 IC 业界的主角

22 Jay Chen 　 2014/10/23

谢谢聆听