16-Channel, Constant-Current LED Driver datasheet … · TLC59281 SBVS139B –JANUARY 2010–REVISED JANUARY 2011 This integrated circuit can be damaged by ESD. Texas Instruments

¼

¼

¼

SIN

SCLK

LAT

BLANK

SOUT

GND

VCC

TLC59281

IC1

OUT0 OUT15

VCC

¼ ¼

VLED VLED

¼

¼

SIN

SCLK

LAT

BLANK

RIREF

IREF

SOUT

ICn

OUT0 OUT15

DATA

SCLK

BLANK

ERROR

READ

¼

VLED VLED

RIREF

IREF

Controller

GND

VCC

VCC

3

LAT

TLC59281

www.ti.com SBVS139B –JANUARY 2010–REVISED JANUARY 2011

16-Channel, Constant-Current LED DriverCheck for Samples: TLC59281

1FEATURES APPLICATIONS• LED Video Displays

2• 16 Channels, Constant-Current Sink Outputwith On/Off Control • Message Boards

• Illumination• 35-mA Capability (Constant-Current Sink)• 10-ns High-Speed Constant-Current Switching

DESCRIPTIONTransient TimeThe TLC59281 is a 16-channel, constant-current sink• Low On-Time ErrorLED driver. Each channel can be turned on/off by• LED Power-Supply Voltage up to 17 Vwriting serial data to an internal register. The

• VCC = 3.0 V to 5.5 V constant-current value of all 16 channels is set by a• Constant-Current Accuracy: single external resistor.

– Channel-to-Channel = ±1%– Device-to-Device = ±1%

• CMOS Logic Level I/O• 35-MHz Data Transfer Rate• 20-ns BLANK Pulse Width• Operating Temperature: –40°C to +85°C

Typical Application Circuit (Multiple Daisy-Chained TLC59281s)

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. © 2010–2011, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.

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TLC59281

SBVS139B –JANUARY 2010–REVISED JANUARY 2011 www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION (1)

PRODUCT PACKAGE-LEAD ORDERING NUMBER TRANSPORT MEDIA, QUANTITY

TLC59281DBQR Tape and Reel, 2500TLC59281 SSOP-24/QSOP-24

TLC59281DBQ Tube, 50

TLC59281RGER Tape and Reel, 3000TLC59281 QFN-24

TLC59281RGE Tape and Reel, 250

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit thedevice product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS (1) (2)

Over operating free-air temperature range, unless otherwise noted.

PARAMETER TLC59281 UNIT

VCC Supply voltage: VCC –0.3 to +6.0 V

IOUT Output current (dc) OUT0 to OUT15 40 mA

VIN Input voltage range SIN, SCLK, LAT, BLANK, IREF –0.3 to VCC + 0.3 V

SOUT –0.3 to VCC + 0.3 VVOUT Output voltage range

OUT0 to OUT15 –0.3 to +18 V

TJ(MAX) Operating junction temperature +150 °CTSTG Storage temperature range –55 to +150 °C

Human body model (HBM) 2 kVESD rating

Charged device model (CDM) 500 V

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods maydegrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyondthose specified is not supported.

(2) All voltage values are with respect to network ground terminal.

DISSIPATION RATINGSOPERATING FACTOR TA < +25°C TA = +70°C TA = +85°C

PACKAGE ABOVE TA = +25°C POWER RATING POWER RATING POWER RATING

SSOP-24/QSOP-24 14.3 mW/°C 1782 mW 1140 mW 927 mW

QFN-24 (1) 24.8 mW/°C 3106 mW 1988 mW 1615 mW

(1) The package thermal impedance is calculated in accordance with JESD51-5.

2 Submit Documentation Feedback © 2010–2011, Texas Instruments Incorporated

Product Folder Link(s): TLC59281


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http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SBVS139BB&partnum=TLC59281


TLC59281


RECOMMENDED OPERATING CONDITIONSAt TA= –40°C to +85°C, unless otherwise noted.

TLC59281

PARAMETER TEST CONDITIONS MIN NOM MAX UNIT

DC Characteristics: VCC = 3 V to 5.5 V

VCC Supply voltage 3.0 5.5 V

VO Voltage applied to output OUT0 to OUT15 17 V

VIH High-level input voltage 0.7 × VCC VCC V

VIL Low-level input voltage GND 0.3 × VCC V

IOH High-level output current SOUT –1 mA

IOL Low-level output current SOUT 1 mA

IOLC Constant output sink current OUT0 to OUT15 2 35 mA

TA Operating free-air temperature range –40 +85 °CTJ Operating junction temperature range –40 +125 °CAC Characteristics: VCC = 3 V to 5.5 V

fCLK (SCLK) Data shift clock frequency SCLK 35 MHz

TWH0 SCLK 10 ns

TWL0 SCLK 10 ns

TWH1 Pulse duration LAT 20 ns

TWH2 BLANK 20 ns

TWL2 BLANK 20 ns

TSU0 SIN–SCLK↑ 4 nsSetup time

TSU1 LAT↑–SCLK↑ 100 ns

TH0 SIN–SCLK↑ 3 nsHold time

TH1 LAT↑–SCLK↑ 10 ns

© 2010–2011, Texas Instruments Incorporated Submit Documentation Feedback 3



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D (%) = - 1IOUTn

(I + I + ... + I + I )OUT0 OUT1 OUT15OUT14

16

´ 100

D (%) =Ideal Output Current

- (Ideal Output Current)(I + I + ... I + I )OUT0 OUT1 OUT14 OUT15

16´ 100

I = 42 ´OUT(IDEAL)

1.20

RIREF

100

(I at V = 3.0 V)OUTn CC

(I at V = 5.5 V) (I at V = 3.0 V)OUTn CC OUTn CC-

5.5 V 3 V-

D (%/V) = ´

100

3 V 1 V-

´

(I at V = 1 V)OUTn OUTn

(I at V = 3 V) (I at V = 1 V)-OUTn OUTn OUTn OUTnD (%/V) =

.

TLC59281


ELECTRICAL CHARACTERISTICSAt VCC = 3.0 V to 5.5 V and TA = –40°C to +85°C. Typical values at VCC = 3.3 V and TA = +25°C, unless otherwise noted.

TLC59281

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOH High-level output voltage IOH = –1 mA at SOUT VCC – 0.4 VCC V

VOL Low-level output voltage IOL = 1 mA at SOUT 0 0.4 V

IIN Input current VIN = VCC or GND at SIN, SCLK, LAT, and BLANK –1 1 mA

SIN/SCLK/LAT = low, BLANK = high, VOUTn = 1 V,ICC1 1 2 mARIREF = 27 kΩ

SIN/SCLK/LAT = low, BLANK = high, VOUTn = 1 V,ICC2 4.5 8 mARIREF = 3 kΩSupply current (VCC)

SIN/SCLK/LAT/BLANK = low, VOUTn = 1 V,ICC3 7 18 mARIREF = 3 kΩ

SIN/SCLK/LAT/BLANK = low, VOUTn = 1 V,ICC4 16 40 mARIREF = 1.5 kΩ

All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩIOLC Constant output current 31 34 37 mA(see Figure 6), at OUT0 to OUT15

All OUTn for constant-current driver, all outputs offIOLKG Output leakage current BLANK = high, VOUTn = VOUTfix = 17 V, RIREF = 1.5 kΩ 0.1 mA

(see Figure 6), at OUT0 to OUT15

Constant-current error All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩΔIOLC ±1 ±3 %(channel-to-channel) (1) at OUT0 to OUT15

Constant-current error All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩΔIOLC1 ±1 ±6 %(device-to-device) (2) at OUT0 to OUT15

All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩΔIOLC2 Line regulation (3) ±0.5 ±1 %/Vat OUT0 to OUT15

All OUTn = ON, VOUTn = 1 V to 3V, VOUTfix = 1 V,ΔIOLC3 Load regulation (4) ±1 ±3 %/VRIREF = 1.5 kΩ, at OUT0 to OUT15

VIREF Reference voltage output RIREF = 1.5 kΩ 1.16 1.20 1.24 V

(1) The deviation of each output from the average of OUT0–OUT15 constant-current. Deviation is calculated by the formula:

(2) The deviation of the OUT0–OUT15 constant-current average from the ideal constant-current value.Deviation is calculated by the following formula:

Ideal current is calculated by the formula:

(3) Line regulation is calculated by this equation:

(4) Load regulation is calculated by the equation:




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VCC

VCC

SCLK

SIN

LAT

BLANK

IREF

GND

GND

16

MSB

MSB

0 15

LSB

SOUT

OUT0 OUT1 OUT14 OUT15

16-Channel Constant-Current Sink Driver

TI Reserved

Data

On/Off Control Shift Register

(1 Bit x 16 Channels)

16

0 15

LSB

On/Off Control Data Latch

(1 Bit x 16 Channels)

¼

16

TLC59281


SWITCHING CHARACTERISTICSAt VCC = 3.0 V to 5.5 V, TA = –40°C to +85°C, CL = 15 pF, RL = 130 Ω, RIREF = 1.5 kΩ, and VLED = 5.5 V. Typical values atVCC = 3.3 V and TA = +25°C, unless otherwise noted.

TLC59281

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

tR0 SOUT (see Figure 5) 5 15 nsRise time

tR1 OUTn (see Figure 4) 10 30 ns

tF0 SOUT (see Figure 5) 5 15 nsFall time

tF1 OUTn (see Figure 4) 10 30 ns

tD0 SCLK↑ to SOUT 8 20 ns

LAT↑ or BLANK↓ to OUTn sink current ontD1 12 30 nsPropagation delay time (see Figure 10)

LAT↑ or BLANK↑ to OUTn sink current offtD2 12 30 ns(see Figure 10)

On/off latch data = all '1', 20 ns BLANK low leveltON_ERR Output on-time error (1) –8 +8 nsone-shot pulse input (see Figure 4)

(1) Output on-time error (tON_ERR) is calculated by the formula: tON_ERR (ns) = tOUT_ON – BLANK low level one-shot pulse width (TWL2).tOUT_ON indicates the actual on-time of the constant-current driver.

FUNCTIONAL BLOCK DIAGRAM




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LAT

OUT0

OUT1

OUT2

OUT3

OUT4

BLANK

OUT15

OUT14

OUT13

OUT12

OUT11

1

2

3

4

5

6

18

17

16

15

14

13

Thermal Pad

(Bottom Side)

TLC59281

SC

LK

24

OU

T5

7

SIN

23

OU

T6

8

GN

D22

OU

T7

9

VC

C21

OU

T8

10

IRE

F20

OU

T9

11

SO

UT

19

OU

T10

12

GND

SIN

SCLK

LAT

OUT0

OUT1

OUT2

OUT3

OUT4

OUT5

OUT6

OUT7

VCC

IREF

SOUT

BLANK

OUT15

OUT14

OUT13

OUT12

OUT11

OUT10

OUT9

OUT8

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

TLC59281

TLC59281


DEVICE INFORMATION

SSOP-24/QSOP-24 QFN-24DBQ PACKAGE RGE PACKAGE

(TOP VIEW) (TOP VIEW)

NOTE: Thermal pad is not connected to GND internally. The thermal pad must be connected to GND via the PCB pattern.




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TLC59281


TERMINAL FUNCTIONSTERMINAL

NAME DBQ RGE I/O DESCRIPTION

Serial data input for driver on/off control. When SIN = high level, data '1' are written into LSBSIN 2 23 I of the on/off control shift register at the rising edge of SCLK.

Serial data shift clock. Schmitt buffer input. All data in the on/off control shift register areSCLK 3 24 I shifted toward the MSB by 1-bit synchronization of SCLK. A rising edge on SCLK is allowed

100 ns after a rising edge of LAT.

Edge triggered latch. The data in the on/off control data shift register are transferred to theon/off control data latch at this rising edge. At the same time, the data in the on/off control shift

LAT 4 1 I register are replaced with TI reserved data for production test. LAT must be toggled only onceafter the shift data are updated to avoid the on/off control latch data being replaced with TIreserved data in the shift register. The reserved data is not a fixed number.

Blank, all outputs. When BLANK = high level, all constant-current outputs (OUT0–OUT15) areBLANK 21 18 I forced off. When BLANK = low level, all constant-current outputs are controlled by the on/off

control data in the data latch.

Constant-current value setting, OUT0–OUT15 sink constant-current is set to desired value byIREF 23 20 I/O connection to an external resistor between IREF and GND.

Serial data output. This output is connected to the MSB of the on/off data shift register. SOUTSOUT 22 19 O data changes at the rising edge of SCLK.

Constant-current output. Each output can be tied together with others to increase theOUT0 5 2 O constant-current. Different voltages can be applied to each output.

OUT1 6 3 O Constant-current output















VCC 24 21 — Power-supply voltage

GND 1 22 — Power ground




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VCC

INPUT

GND

VCC

SOUT

GND

OUTn

GND

VCC

VCC

GND

IREF OUTn

RIREF

RL

CL

(1)VLED

VCC

VCC

GND

SOUT

CL

(1)

¼¼

VCC

RIREF

VOUTFIX

VOUTn

OUT0VCC

OUTn

OUT15GND

IREF

TLC59281


PARAMETER MEASUREMENT INFORMATION

PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS

Figure 1. SIN, SCLK, LAT, BLANK Figure 2. SOUT

Figure 3. OUT0 Through OUT15

TEST CIRCUITS

(1) CL includes measurement probe and jig capacitance.(1) CL includes measurement probe and jig capacitance.

Figure 4. Rise Time and Fall Time Test Circuit forFigure 5. Rise Time and Fall Time Test Circuit forOUTn

SOUT

Figure 6. Constant-Current Test Circuit for OUTn




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T , T, T , T , T :WH0 WH1WL0 WH2 WL2

INPUT(1)

CLOCK

INPUT(1)

DATA/CONTROL

INPUT(1)

T , T , T , T :SU0 SU1 H0 H1

TSU TH

VCC

VCC

GND

VCC

GND

GND

50%

50%

50%

TWH TWL

t , t , t , t , t , t , t :R0 R1 F0 F1 D0 D1 D2

INPUT(1) 50%

50%

90%

10%

OUTPUT

tD

t or tR F

V or VOL OUTn

V or VOH OUTn

GND

VCC

TLC59281


TIMING DIAGRAMS

(1) Input pulse rise and fall time is 1 ns to 3 ns.

Figure 7. Input Timing

(1) Input pulse rise and fall time is 1 ns to 3 ns.

Figure 8. Output Timing




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tD0

SIN

OUTn(1)

OUTn(2)

OUTn(3)

OUTn(4)

ON

OFF

LAT

On/Off Control

Latch Data (Internal)

SOUT

SCLK

Shift Register

LSB Data (Internal)

ON

BLANK

ON

OFFOFF

ON

ON

OFFON

ON

OFFOFF

OFF

ON

OFF

tWH2

TWH0

TH1

TWH1

13 14 15 161 2 3 4 5 1 2 3 4 5 6

TSU0

TH0

TWL0

t /tR0 F0

tD2tD1

tWL2

tOUTON

Shift Register

LSB+1 Data (Internal)

Shift Register

MSB Data (Internal)

Shift Register

MSB-1 Data (Internal)

DATA

0A

DATA

0A

DATA

15BDATA

14B

DATA

13BDATA

12B

DATA

3BDATA

2B

DATA

1B

DATA

15C

DATA

14C

DATA

13C

DATA

12C

DATA

11CRSV 0A

DATA

0B

DATA

1A

DATA

15BDATA

14B

DATA

13BDATA

4B

DATA

3BDATA

2BRSV DATA DATA DATA DATARSV 1A

DATA

14A

DATA

15BRSV RSV RSV RSV RSVRSV 14A

DATA

15ARSV RSV RSV RSV RSVRSV 15A

DATA

15B

DATA

15ARSV RSV RSV RSV RSVRSV 15A

DATA

15B

DATA

15BDATA

14B

DATA

13BDATA

12B

DATA

11B

DATA

3BDATA

2B

DATA

1B

DATA

0B

DATA

15C

DATA

14C

DATA

13C

DATA

12C

DATA

11C

DATA

10C

Previous On/Off Latch Data Latest On/Off Latch Data

TSU1

tD1 tD2

tD1

tR1

tF1

¼ ¼ ¼

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV RSV

RSV RSVRSVRSVRSV RSV

DATA

1B

DATA

14B

TLC59281


(1) On/off latched data are '1'.(2) On/off latched data are changed from '1' to '0' at the second LAT signal.

(3) On/off latched data are changed from '0' to '1' at the second LAT signal.

(4) On/off latched data are '0'.

Figure 9. Timing Diagram




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100000

10000

10000 5 10 15 20 35

Output Current (mA)

Refe

rence R

esis

tor

()

W

25

1440

5040

33602520

1680

25200

10080

30

2016

4000

3000

2000

1000

0

-40 -20 0 20 40 60 80

Free-Air Temperature ( C)°

Po

we

r D

issip

atio

n R

ate

(m

W)

100

TLC59281DBQ

TLC59281RGE

40

35

30

25

20

15

10

5

00 0.5 1.0 1.5 2.0 2.5 3.0

Output Voltage (V)

Ou

tpu

t C

urr

en

t (m

A)

T = +25 C°AI = 35 mAO

I = 30 mAO

I = 20 mAO

I = 10 mAO

I = 5 mAOI = 2 mAO

40

39

38

37

36

35

34

33

32

31

300 0.5 1.0 1.5 2.0 2.5 3.0

Output Voltage (V)

Ou

tpu

t C

urr

en

t (m

A)

I = 30 mAO

T = 40- °CA

T = +25 C°A

T = +85 C°A

4

3

2

1

0

1

2

3

4

-

-

-

-

-40 -20 0 20 40 60 80 100

Ambient Temperature ( C)°

DI

(%)

OL

C

I = 35 mAO

V = 5 VCC

V = 3.3 VCC

4

3

2

1

0

1

2

3

4

-

-

-

-

0 10 20 30 40

Output Current (mA)

DI

(%)

OLC

T = +25 C°A

V = 5 VCC

V = 3.3 VCC

TLC59281


TYPICAL CHARACTERISTICSAt VCC = 3.3 V and TA = +25°C, unless otherwise noted.

REFERENCE RESISTOR POWER DISSIPATION RATEvs OUTPUT CURRENT vs FREE-AIR TEMPERATURE

Figure 10. Figure 11.

OUTPUT CURRENT vs OUTPUT CURRENT vsOUTPUT VOLTAGE OUTPUT VOLTAGE


ΔIOLC vs AMBIENT TEMPERATURE ΔIOLC vs OUTPUT CURRENT





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Time (12.5 ns/div)

CH1 (2 V/div)

CH2 (2 V/div)

CH3 (2 V/div)

CH3-OUT15

(BLANK = 20 ns)

C 2-OUT0

(BLANK = 20 ns)

H

CH1-BLANK

(20 ns)

I = 35 mA

T = +25 C

R = 130

C = 15 pF

VLED = 5.5 V

°

W

OLC

A

L

L

TLC59281


TYPICAL CHARACTERISTICS (continued)At VCC = 3.3 V and TA = +25°C, unless otherwise noted.

CONSTANT-CURRENT OUTPUTVOLTAGE WAVEFORM

Figure 16.




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R (k ) =WIREF

V (V)IREF

I (mA)OLC

´ 42

TLC59281


DETAILED DESCRIPTION

SETTING FOR THE CONSTANT SINK CURRENT VALUE

The constant-current values are determined by an external resistor (RIREF) placed between IREF and GND. Theresistor (RIREF) value is calculated by Equation 1.

Where:VIREF = the internal reference voltage on the IREF pin (typically 1.20 V) (1)

IOLC must be set in the range of 2 mA to 35 mA. The constant sink current characteristic for the external resistorvalue is shown in Figure 10. Table 1 describes the constant-current output versus external resistor value.

Table 1. Constant-Current Output versus External Resistor Value

IOLCMax (mA, Typical) RIREF (kΩ)

35 1.44

30 1.68

25 2.02

20 2.52

15 3.36

10 5.04

5 10.1

2 25.2

CONSTANT-CURRENT DRIVER ON/OFF CONTROL

When BLANK is low, the corresponding output is turned on if the data in the on/off control data latch are '1' andremains off if the data are '0'. When BLANK is high, all outputs are forced off. This control is shown in Table 2.

Table 2. On/Off Control Data Truth Table

ON/OFF CONTROL LATCH DATA CONSTANT-CURRENT OUTPUT STATUS

0 Off

1 On

When the IC is initially powered on, the data in the on/off control shift register and data latch are not set to therespective default value. Therefore, the on/off control data must be written to the data latch before turning theconstant-current output on. BLANK should be at a high level when powered on because the constant-currentmay be turned on as a result of random data in the on/off control latch.

The on/off data corresponding to any unconnected OUTn outputs should be set to ‘0’ before turning on theremaining outputs. Otherwise, the supply current (ICC) increases while the LEDs are on.




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¼

On/Off Control Shift Register (1 Bit 16 Channels)´

On/Off Control Data Latch (1 Bit 16 Channels)´ 16 Bits

To Constant Current Driver Control Block

¼SOUT

13 12 3 2

LSB

On/Off Data

for

OUT3

On/Off Data

for

OUT2

On/Off Data

for

OUT13

On/Off Data

for

OUT12

SIN

SCLK

¼

13 12 3 2

LSB

LAT

15 14

On/Off Data

for

OUT15

On/Off Data

for

OUT14

15 14

1 0

On/Off Data

for

OUT1

On/Off Data

for

OUT0

1 0

MSB

MSB

On/Off Data

for

OUT13

On/Off Data

for

OUT12

On/Off Data

for

OUT15

On/Off Data

for

OUT14

11

11

4

4

On/Off Data

for

OUT3

On/Off Data

for

OUT2

On/Off Data

for

OUT1

On/Off Data

for

OUT0

TLC59281


REGISTER CONFIGURATION

The TLC59281 has an on/off control data shift register and data latch. Both the on/off control shift register andlatch are 16 bits long and are used to turn the constant-current drivers on and off. Figure 17 shows the shiftregister and latch configuration. The data at the SIN pin are shifted in to the LSB of the shift register at the risingedge of the SCLK pin; SOUT data change at the rising edge of SCLK. The timing diagram for data writing isshown in Figure 18. The driver on/off is controlled by the data in the on/off control data latch.

The on/off data are latched into the data latch by a rising edge of LAT after the data are written into the on/offcontrol shift register by SIN and SCLK. At the same time, the data in the on/off control shift register are replacedwith TI reserved data for production test. Therefore, LAT must be input only once after the on/off data update toavoid the on/off control data latch being replaced with TI reserved data in the shift register. When the IC initiallypowers on, the data in the on/off control shift register and latch are not set to the default values; on/off controldata must be written to the on/off control data latch before turning the constant-current output on. BLANK shouldbe high when the IC is powered on because the constant-current may be turned on at that time as a result ofrandom values in the on/off data latch. All constant-current outputs are forced off when BLANK is high.

Figure 17. On/Off Control Shift Register and Latch Configuration




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Previous On/Off Latch Data

SIN

OUTn(1)

ON ON

ON

ON

OFF

OFF

OFF OFF

OFF

OFF

OFF

LAT

On/Off Control

Latch Data (Internal)

SOUT

OUTn(2)

Latest On/Off Latch Data

SCLK

1 2 3 4 5 1 2 3 4 5 613 14 15 16

Shift Register

LSB Data (Internal)

BLANK

ON

OFF

ON

OFFOUTn(3)

ON

OFFOUTn(4)

Shift Register

LSB+1 Data (Internal)

Shift Register

MSB Data(Internal)

Shift Register

MSB 1 Data(Internal)-

¼ ¼ ¼

DATA

0A

DATA

0A

DATA

15BDATA

14B

DATA

13BDATA

12B

DATA

3BDATA

2B

DATA

1B

DATA

0B

DATA

15B

DATA

15C

DATA

14C

DATA

13C

DATA

12C

DATA

11CRSV 0A

DATA

1A

DATA

15BDATA

14B

DATA

13BDATA

4B

DATA

3BDATA

2B

DATA

15C

DATA

14C

DATA

13C

DATA

12CRSV 1A

DATA

14A

DATA

15BRSV 14A

DATA

1ARSV 15A

DATA

15B

DATA

1ARSV 15A

DATA

15BDATA

14B

DATA

13BDATA

12B

DATA

11B

DATA

3BDATA

2B

DATA

1B

DATA

0B

DATA

15C

DATA

14C

DATA

13C

DATA

12C

DATA

11C

DATA

10C

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV RSV RSV RSV RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

RSV

DATA

1B

DATA

14B

TLC59281


(1) On/off latched data are '1'.(2) On/off latched data are changed from '1' to '0' at the second LAT signal.

(3) On/off latched data are changed from '0' to '1' at the second LAT signal.

(4) On/off latched data are '0'.

Figure 18. On/Off Control Operation

LAYOUT CONSIDERATIONS

The output current transient time in the TLC59281 is very fast. In addition, all outputs turn on or off at the sametime to minimize the output on-time error. This high current demand can cause GND to shift in the entire system,and lead to false triggering of signals. To overcome this issue, design all GND lines to be as wide and short aspossible in order to reduce parasitic inductance and resistance.




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TLC59281


REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (September 2010) to Revision B Page

• Added Layout Considerations section ................................................................................................................................ 15

Changes from Original (January 2010) to Revision A Page

• Changed SO-24 to SSOP-24/QSOP-24 in Package/Ordering Information table ................................................................. 2

• Changed SO-24 to SSOP-24/QSOP-24 in Dissipation Ratings table .................................................................................. 2

• Changed SO-24 to SSOP-24/QSOP-24 in DBQ pinout ....................................................................................................... 6




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PACKAGE OPTION ADDENDUM

www.ti.com 15-Apr-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

TLC59281DBQ ACTIVE SSOP DBQ 24 50 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC59281

TLC59281DBQR ACTIVE SSOP DBQ 24 2500 Green (RoHS& no Sb/Br)


TLC59281RGER ACTIVE VQFN RGE 24 3000 Green (RoHS& no Sb/Br)


TLC59281RGET ACTIVE VQFN RGE 24 250 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR TLC59281

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

http://www.ti.com/product/TLC59281?CMP=conv-poasamples#samplebuy




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PACKAGE OPTION ADDENDUM

www.ti.com 15-Apr-2017

Addendum-Page 2

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

TLC59281RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2

TLC59281RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 26-Mar-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TLC59281RGER VQFN RGE 24 3000 367.0 367.0 35.0

TLC59281RGET VQFN RGE 24 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 26-Mar-2013

Pack Materials-Page 2

GENERIC PACKAGE VIEW

Images above are just a representation of the package family, actual package may vary.Refer to the product data sheet for package details.

RGE 24 VQFN - 1 mm max heightPLASTIC QUAD FLATPACK - NO LEAD

4204104/H

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PACKAGE OUTLINE

www.ti.com

4224376 / A 07/2018

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK- NO LEAD

RGE0024C

A

0.08 C

0.1 C A B

0.05 C

B

SYMM

SYMM

4.1

3.9

4.1

3.9

PIN 1 INDEX AREA

1 MAX

0.05

0.00

SEATING PLANE

C

2X 2.5

2.1±0.1

2X

2.5

20X 0.5

1

6

7

12

13

18

19

24

24X

0.30

0.18

24X

0.50

0.30

(0.2) TYP

PIN 1 ID

(OPTIONAL)

25

AutoCAD SHX Text

AutoCAD SHX Text

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments

literature number SLUA271 (www.ti.com/lit/slua271).5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

EXAMPLE BOARD LAYOUT

4224376 / A 07/2018

www.ti.com


RGE0024C


SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE: 20X

2X

(0.8)

2X(0.8)

(3.8)

( 2.1)

1

6

7 12

13

18

1924

25

24X (0.6)

24X (0.24)

20X (0.5)

(R0.05)

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

METAL

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(Ø0.2) VIA

TYP

(3.8)

www.ti.com/lit/slua271

AutoCAD SHX Text

AutoCAD SHX Text

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations..

EXAMPLE STENCIL DESIGN

4224376 / A 07/2018

www.ti.com


RGE0024C


SYMM

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

80% PRINTED COVERAGE BY AREA

SCALE: 20X

(3.8)

(0.57)

TYP

(0.57)

TYP

4X ( 0.94)

1

6

712

13

18

1924

24X (0.24)

24X (0.58)

20X (0.5)

(R0.05) TYP

METAL

TYP

25

(0.19)

AutoCAD SHX Text

AutoCAD SHX Text

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Documents

16-Channel, Constant-Current LED Driver datasheet … · TLC59281 SBVS139B –JANUARY 2010–REVISED JANUARY 2011 This integrated circuit can be damaged by ESD. Texas Instruments