2008-04-00 Microchip Product Footprint Reference

8/6/2019 2008-04-00 Microchip Product Footprint Reference

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PackagingSpecification


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DS00049AS-page ii 2008 Microchip Technology Inc.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE . Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyers risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,dsPIC, K EE LOQ , KEE LOQ logo, MPLAB, PIC, PICmicro,PICSTART, PRO MATE, rfPIC and SmartShunt are registeredtrademarks of Microchip Technology Incorporated in theU.S.A. and other countries.

FilterLab, Linear Active Thermis tor, MXDEV, MXLAB,SEEVAL, SmartSensor and The Embedded Control SolutionsCompany are registered trademarks of Microchip TechnologyIncorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,ECONOMONITOR, FanSense, In-Circuit SerialProgramming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLABCertified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,PICDEM.net, PICtail, PIC 32 logo, PowerCal, PowerInfo,PowerMate, PowerTool, REAL ICE, r fLAB, Select Mode, TotalEndurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporatedin the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

2008, Microchip Technology Incorporated, Printed in theU.S.A., All Rights Reserved.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in theintended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips DataSheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does notmean that we are guaranteeing the product as unbreakable.

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwideheadquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in Californiaand India. The Companys quality system processes and proceduresare for its PIC MCUs and dsPIC DSCs, K EE LOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the designand manufacture of development systems is ISO 9001:2000 certified.


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2007 Microchip Technology Inc. DS00049AR-page iii

MPackaging Index

CERAMIC SIDE-BRAZED DUAL IN-LINE FAMILY

8-Lead Ceramic Side Brazed Dual In-Line with Window (JW) .300" Body ............................................... 114-Lead Ceramic Side Brazed Dual In-Line with Window (JW) .300" Body ............................................. 228-Lead Ceramic Side Brazed Dual In-Line with Window (JW) .300" Body ............................................. 3

CERAMIC DUAL IN-LINE (CERDIP) FAMILY

8-Lead Ceramic Dual In-Line (JA) .300" Body [CERDIP] ......................................................................... 58-Lead Ceramic Dual In-Line with Window (JW) .300" Body [CERDIP] ................................................... 614-Lead Ceramic Dual In-Line (JD) .300" Body [CERDIP] ....................................................................... 714-Lead Ceramic Dual In-Line with Window (JW) .300" Body [CERDIP] ................................................. 816-Lead Ceramic Dual In-Line (JE) .300" Body [CERDIP] ....................................................................... 918-Lead Ceramic Dual In-Line with Window (JW) .300" Body [CERDIP] ............................................... 1020-Lead Ceramic Dual In-Line with Window (JW) .300" Body [CERDIP] ............................................... 11

24-Lead Ceramic Dual In-Line (JG) .600" Body [CERDIP] ..................................................................... 1228-Lead Ceramic Dual In-Line (JN) .600" Body [CERDIP] ..................................................................... 1328-Lead Ceramic Dual In-Line with Window (JW) .300" Body [CERDIP] ............................................... 1428-Lead Ceramic Dual In-Line with Window (JW) .600" Body [CERDIP] ............................................... 1540-Lead Ceramic Dual In-Line (JK) .600" Body [CERDIP] ..................................................................... 1640-Lead Ceramic Dual In-Line with Window (JW) .600" Body [CERDIP] ............................................... 17

CERAMIC CHIP CARRIER (CERQUAD) FAMILY

68-Lead Ceramic Leaded (CL) Chip Carrier with Window Square [CERQUAD] .................................... 1984-Lead Ceramic Leaded (CL) Chip Carrier with Window Square [CERQUAD] .................................... 20

SMALL-OUTLINE TRANSISTOR FAMILY

3-Lead Plastic Transistor Outline (TO) [TO-92] ......................................................................................... 213-Lead Plastic Transistor Outline (ZB) [TO-92].......................................................................................... 223-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]................................................................ 235-Lead Plastic Small Outline Transistor Header (MT) [SOT-89] ................................................................ 243-Lead Plastic Transistor Outline (AB) [TO-220] ....................................................................................... 255-Lead Plastic Transistor Outline (AT) [TO-220]........................................................................................ 265-Lead Plastic Thin Small Outline Transistor (OS) [TSOT]........................................................................ 273-Lead Plastic Small Outline Transistor (TT) [SOT-23] ............................................................................. 283-Lead Plastic Small Outline Transistor (NB) [SOT-23]............................................................................. 293-Lead Plastic Small Outline Transistor (CB) [SOT-23A] .......................................................................... 303-Lead Plastic Small Outline Transistor (DB) [SOT-223] ........................................................................... 323-Lead Plastic Small Outline Transistor (DB) [SOT-223](Land Pattern or Package Footprint).......................................................................................................... 335-Lead Plastic Small Outline Transistor (DC) [SOT-223]........................................................................... 345-Lead Plastic Small Outline Transistor (DC) [SOT-223](Land Pattern or Package Footprint).......................................................................................................... 354-Lead Plastic Small Outline Transistor (RC) [SOT-143]........................................................................... 364-Lead Plastic Small Outline Transistor (RC) [SOT-143](Land Pattern or Package Footprint).......................................................................................................... 375-Lead Plastic Small Outline Transistor (OT) [SOT-23]............................................................................. 385-Lead Plastic Small Outline Transistor (CT) [SOT-23] ............................................................................. 396-Lead Plastic Small Outline Transistor (CH) [SOT-23]............................................................................. 40


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MPackaging Index

SMALL-OUTLINE TRANSISTOR FAMILY (CONTINUED)

6-Lead Plastic Small Outline Transistor (OT) [SOT-23] .............................................................................413-Lead Plastic Small Outline Transistor (LB) [SC70]........ ............ ............ ........... ............ ............. .............. 425-Lead Plastic Small Outline Transistor (LT) [SC70].. ............ ............ ............ ............. ............ ............ ....... 43Leadless Wedge Module Plastic Small Outline Transistor (WM) [SOT-385]........ .............. .............. .......... 44

DOUBLE DECA-WATT PACKAGE (DDPAK) FAMILY

3-Lead Plastic (EB) [DDPAK]..................................................................................................................... 455-Lead Plastic (ET) [DDPAK] ..................................................................................................................... 467-Lead Plastic (EK) [DDPAK]..................................................................................................................... 47

PLASTIC DUAL IN-LINE (PDIP) FAMILY

8-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP] ..............................................................................498-Lead Plastic Dual In-Line (PA) 300 mil Body [PDIP] ............. ............. ............ ............. ............. ............ 5014-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP] ............................................................................5114-Lead Plastic Dual In-Line (PD) 300 mil Body [PDIP]............ ............ ............. ............ ............. ............ 5216-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP] ............................................................................5316-Lead Plastic Dual In-Line (PE) 300 mil Body [PDIP] .......................................................................... 5418-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP] ............................................................................5520-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP] ............................................................................5624-Lead Plastic Dual In-Line (P) 600 mil Body [PDIP] ............................................................................5724-Lead Plastic Dual In-Line (PG) 600 mil Body [PDIP]......... ............. ............. ............ ............. .............. 5824-Lead Skinny Plastic Dual In-Line (SP) 300 mil Body [SPDIP] ........... ............. ............. ............. .......... 5924-Lead Skinny Plastic Dual In-Line (PF) 300 mil Body [SPDIP]........... ............. ............. ............. .......... 6028-Lead Skinny Plastic Dual In-Line (SP) 300 mil Body [SPDIP] ........... ............. ............. ............. .......... 6128-Lead Skinny Plastic Dual In-Line (PJ) 300 mil Body [SPDIP] ............................................................ 6228-Lead Plastic Dual In-Line (P) 600 mil Body [PDIP] ............................................................................6328-Lead Plastic Dual In-Line (PI) 600 mil Body [PDIP] ...........................................................................6440-Lead Plastic Dual In-Line (P) 600 mil Body [PDIP] ............................................................................6540-Lead Plastic Dual In-Line (PL) 600 mil Body [PDIP] .......................................................................... 6664-Lead Shrink Plastic Dual In-Line (SP) 750 mil Body [PDIP] ............ ............. ............ ............. ............. 67

PLASTIC LEADED CHIP CARRIER (PLCC) FAMILY

20-Lead Plastic Leaded Chip Carrier (L) Square [PLCC]............. ............. ............. ............. ............. ....... 6928-Lead Plastic Leaded Chip Carrier (L) Square [PLCC]............. ............. ............. ............. ............. ....... 7028-Lead Plastic Leaded Chip Carrier (LI) Square [PLCC]............. ............ ............. ............. ............. ....... 7132-Lead Plastic Leaded Chip Carrier (L) Rectangle [PLCC] ...................................................................7244-Lead Plastic Leaded Chip Carrier (L) Square [PLCC]............. ............. ............. ............. ............. ....... 7344-Lead Plastic Leaded Chip Carrier (LW) Square [PLCC] ....................................................................7468-Lead Plastic Leaded Chip Carrier (L) Square [PLCC]............. ............. ............. ............. ............. ....... 7568-Lead Plastic Leaded Chip Carrier (LS) Square [PLCC] .....................................................................7684-Lead Plastic Leaded Chip Carrier (L) Square [PLCC]............. ............. ............. ............. ............. ....... 77


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MPackaging Index

PLASTIC SMALL-OUTLINE (SOIC/SOIJ) FAMILY

8-Lead Plastic Small Outline (SN) Narrow, 3.90 mm Body [SOIC]......................................................... 788-Lead Plastic Small Outline (SN) Narrow, 3.90 mm Body [SOIC](Land Pattern or Package Footprint).......................................................................................................... 798-Lead Plastic Small Outline (OA) Narrow, 3.90 mm Body [SOIC]......................................................... 808-Lead Plastic Small Outline (OA) Narrow, 3.90 mm Body [SOIC]......................................................... 8114-Lead Plastic Small Outline (SL) Narrow, 3.90 mm Body [SOIC] ....................................................... 8214-Lead Plastic Small Outline (OD) Narrow, 3.90 mm Body [SOIC] ...................................................... 8316-Lead Plastic Small Outline (SL) Narrow, 3.90 mm Body [SOIC] ....................................................... 848-Lead Plastic Small Outline (SM) Medium, 5.28 mm Body [SOIJ] ........................................................ 858-Lead Plastic Small Outline (SM) Medium, 5.28 mm Body [SOIJ](Land Pattern or Package Footprint).......................................................................................................... 8616-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body [SOIC] .......................................................... 8716-Lead Plastic Small Outline (OE) Wide, 7.50 mm Body [SOIC] .......................................................... 8818-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body [SOIC] .......................................................... 8920-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body [SOIC] .......................................................... 9024-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body [SOIC] .......................................................... 9124-Lead Plastic Small Outline (PF) Wide, 7.50 mm Body [SOIC]........................................................... 9228-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body [SOIC] .......................................................... 9328-Lead Plastic Small Outline (OI) Wide, 7.50 mm Body [SOIC] ........................................................... 94

PLASTIC QUAD FLATPACK AND PLASTIC DUAL FLATPACK (DFN) FAMILY

6-Lead Plastic Dual Flat, No Lead Package (MA) 2x2x0.9 mm Body [DFN] .......................................... 956-Lead Plastic Dual Flat, No Lead Package (ME) 2x3x0.9 mm Body [DFN] .......................................... 966-Lead Plastic Dual Flat, No Lead Package (MH) 3x3x0.9 mm Body [DFN] .......................................... 978-Lead Plastic Dual Flat, No Lead Package (MC) 2x3x0.9 mm Body [DFN] .......................................... 988-Lead Plastic Dual Flat, No Lead Package (MC) 2x3x0.9 mm Body [DFN](Land Pattern or Package Footprint).......................................................................................................... 998-Lead Plastic Dual Flat, No Lead Package (MF) 6x5 mm Body [DFN-S]PUNCH SINGULATED ........................................................................................................................... 1008-Lead Plastic Dual Flat, No Lead Package (MF) 3x3x0.9 mm Body [DFN] ........................................ 1028-Lead Plastic Dual Flat, No Lead Package (MF) 3x3x0.9 mm Body [DFN](Land Pattern or Package Footprint)........................................................................................................ 1038-Lead Plastic Dual Flat, No Lead Package (MD) 4x4x0.9 mm Body [DFN] ........................................ 1048-Lead Plastic Dual Flat, No Lead Package (MD) 4x4x0.9 mm Body [DFN](Land Pattern or Package Footprint)........................................................................................................ 1058-Lead Plastic Dual Flat, No Lead Package (MF) 6x5 mm Body [DFN-S].......... ............ ............ .......... 1068-Lead Plastic Dual Flat, No Lead Package (MN) 2x3x0.75 mm Body [TDFN]............. ............. .......... 1088-Lead Plastic Dual Flat, No Lead Package (MN) 2x3x0.75 mm Body [TDFN](Land Pattern or Package Footprint)........................................................................................................ 1098-Lead Plastic Dual Flat, No Lead Package (MU) 2x3x0.5 mm Body [UDFN] ..................................... 1108-Lead Plastic Dual Flat, No Lead Package (MU) 2x3x0.5 mm Body [UDFN](Land Pattern or Package Footprint)........................................................................................................ 11110-Lead Plastic Dual Flat, No Lead Package (MF) 3x3x0.9 mm Body [DFN] ...................................... 11210-Lead Plastic Dual Flat, No Lead Package (MF) 3x3x0.9 mm Body [DFN](Land Pattern or Package Footprint)........................................................................................................ 11316-Lead Plastic Quad Flat, No Lead Package (ML) 4x4x0.9 mm Body [QFN] ..................................... 114


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MPackaging Index

PLASTIC QUAD FLATPACK (QFN) AND PLASTIC DUAL FLATPACK (DFN) FAMILY (CONTINUED)

20-Lead Plastic Quad Flat, No Lead Package (ML) 4x4x0.9 mm Body [QFN]......... ............. ............ .... 11528-Lead Plastic Quad Flat, No Lead Package (ML) 6x6 mm Body [QFN]with 0.55 mm Contact Length................................................................................................................... 11628-Lead Plastic Quad Flat, No Lead Package (ML) 6x6 mm Body [QFN]with 0.55 mm Contact Length (Land Pattern or Package Footprint) ........................................................ 11728-Lead Plastic Quad Flat, No Lead Package (MM) 6x6x0.9 mm Body [QFN-S]with 0.40 mm Contact Length................................................................................................................... 11828-Lead Plastic Quad Flat, No Lead Package (MM) 6x6x0.9 mm Body [QFN-S]with 0.40 mm Contact Length (Land Pattern or Package Footprint) ........................................................ 11940-Lead Plastic Quad Flat, No Lead Package (MM) 6x6x0.9 mm Body [QFN]with 0.40 mm Contact Length................................................................................................................... 12044-Lead Plastic Quad Flat, No Lead Package (ML) 8x8 mm Body [QFN] ............................................12244-Lead Plastic Quad Flat, No Lead Package (ML) 8x8 mm Body [QFN](Land Pattern or Package Footprint) ........................................................................................................123

PLASTIC MICRO SMALL-OUTLINE (MSOP) FAMILY

8-Lead Plastic Micro Small Outline Package (MS) [MSOP] ..................................................................... 1258-Lead Plastic Micro Small Outline Package (UA) [MSOP]................... ............. ............. ............. ............ 12610-Lead Plastic Micro Small Outline Package (MS) [MSOP] ................................................................... 12710-Lead Plastic Micro Small Outline Package (UN) [MSOP] ................................................................... 128

PLASTIC SHRINK SMALL-OUTLINE (SSOP) FAMILY

16-Lead Plastic Shrink Small Outline Narrow Body (QR) .150" Body [QSOP]............. ............. ............ 12920-Lead Plastic Shrink Small Outline (SS) 5.30 mm Body [SSOP]...... ............. ............ ............. .......... 13024-Lead Plastic Shrink Small Outline (SS) 5.30 mm Body [SSOP]............ ............. ............. ............ ..... 13128-Lead Plastic Shrink Small Outline (SS) 5.30 mm Body [SSOP]............ ............. ............. ............ ..... 132

PLASTIC THIN SHRINK SMALL-OUTLINE (TSSOP) FAMILY

8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body [TSSOP]........... ............. ............. ............ 13314-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body [TSSOP].......... ............. ............. ........... 13420-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body [TSSOP].......... ............. ............. ........... 135

PLASTIC THIN SMALL-OUTLINE (TSOP) AND VERY SMALL OUTLINE (VSOP) FAMILY

28-Lead Plastic Thin Small Outline (TS) 8x20 mm [TSOP].......... ............. ............. ............. ............. ..... 13628-Lead Plastic Very Small Outline (VS) 8x13.4 mm Body [VSOP]............. ............. ............. ............. .. 137

PLASTIC LOW-PROFILE QUAD FLATPACK (LQFP) FAMILY

32-Lead Plastic Low-Profile Quad Flatpack (PL) 7x7x1.4 mm Body, 2.0 mm [LQFP] ............. ............. 139


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MPackaging Index

PLASTIC METRIC-QUAD FLATPACK (MQFP) FAMILY

44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 3.20 mm [MQFP] ............................. 14044-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 3.20 mm [MQFP](Land Pattern or Package Footprint)........................................................................................................ 14144-Lead Plastic Metric Quad Flatpack (KW) 10x10x2 mm Body, 3.20 mm [MQFP]........ .............. ....... 14264-Lead Plastic Metric Quad Flatpack (BU) 14x14x2.7 mm Body, 3.20 mm [MQFP] .......................... 14464-Lead Plastic Metric Quad Flatpack (BU) 14x14x2.7 mm Body, 3.20 mm [MQFP](Land Pattern or Package Footprint)........................................................................................................ 145

PLASTIC THIN-QUAD FLATPACK (TQFP) FAMILY

32-Lead Plastic Thin Quad Flatpack (PT) 7x7x1.0 mm Body, 2.00 mm [TQFP] .................................. 14644-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 2.00 mm [TQFP] ................................. 14844-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)........................................................................................................ 14964-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 2.00 mm [TQFP] ................................. 15064-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 2.00 mm [TQFP](Land Pattern or Package Footprint)........................................................................................................ 15164-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 2.00 mm [TQFP] ................................. 15264-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 2.00 mm [TQFP](Land Pattern or Package Footprint)........................................................................................................ 15380-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 2.00 mm [TQFP] ................................. 15480-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 2.00 mm [TQFP](Land Pattern or Package Footprint)........................................................................................................ 15580-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 2.00 mm [TQFP] ................................. 15680-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 2.00 mm [TQFP](Land Pattern or Package Footprint)........................................................................................................ 157100-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 2.00 mm [TQFP] ............................... 158100-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 2.00 mm [TQFP](Land Pattern or Package Footprint)........................................................................................................ 159100-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 2.00 mm [TQFP] ............................... 160100-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 2.00 mm [TQFP](Land Pattern or Package Footprint)........................................................................................................ 161


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MPackaging Index


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MPackaging Diagrams and Parameters

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28-Lead Ceramic Dual In-Line with Window (JW) .300" Body [CERDIP]

Notes:1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. Significant Characteristic.3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging

Units INCHESDimension Limits MIN NOM MAX

Number of Pins N 28Pitch e .100 BSCTop to Seating Plane A .200Ceramic Package Height A2 .140 .175Standoff A1 .015 Shoulder to Shoulder Width E .308 .325Ceramic Package Width E1 .280 .288 .296Overall Length D 1.442 1.450 1.470Tip to Seating Plane L .125 .200Lead Thickness c .008 .014Upper Lead Width b1 .045 .065Lower Lead Width b .015 .023Overall Row Spacing E2 .325 .410Window Width W1 .130 .140 .150Window Length W2 .290 .300 .310

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Documents

2008-04-00 Microchip Product Footprint Reference