3M Electrically Conductive Transfer Tapes

8/13/2019 3M Electrically Conductive Transfer Tapes

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3MElectrically ConductiveAdhesive Transfer Tapes

Eliminates mechanical fasteners Saves space

Speeds assembly

Acrylic Conductive Adhesive Tapesare RoHS-compliant

Slim down with single componentshielding, grounding & bonding from 3M

MoreFeaturesPackages

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The continuing trend toward designing

electronic devices with smaller enclosures,denser circuits and higher speeds has mademanaging electromagnetic/radio frequencyinterference (EMI/RFI) and electrostaticdischarge (ESD) a growing challenge forelectronics manufacturers.

3M can help you meet that challenge,with a variety of advanced shielding andgrounding solutions designed to help youspeed assembly timereduce weightsave spacecontrol costsand give youmore design exibility. Let 3M help youget connected!

Easy-to-use shielding, groundingand bonding technology for todaysthinner electronics3MElectrically Conductive Adhesive Transfer Tapes are designed to help you save time in

electronics assembly operations from attaching EMI shields and gaskets to grounding andbonding exible circuits and PCBs while improving the performanceand reliability of your nished products.

These long-lasting adhesive transfer tapes caneliminate the need for screws and mechanicalfasteners while allowing the use of lighter,more compact fabric and layered foilshielding materials.

And, unlike other electricallyconductive adhesives that can bemessy and difcult to handle, 3Mdelivers advanced adhesive and

conductive properties in an easy-to-use, pressure-sensitive tape that canbe hand or machine applied and diecut to virtually any shape!

In the unique construction of 3MXYZAxis tapes, conductive bers extend abovethe adhesive, ensuring a solid electrical

connection between substrates. Wipingaction creates good electrical contact;spring-loaded tension maintains contact.Plus, the reinforcement provided by thebers adds excellent handling characteristics.

GetStay

Connected

Connected

3MElectrically Conductive Adhesive Transfer Tapes

4 ways to a better connection with 3MElectrically Conductive Adhesive Transfer Tapes

1. Improved Adhesion Good initial tack, plus lasting adhesion provides long-term performance.

2. Easy Handling Unlike carbon-loaded, semi-liquid adhesives, 3M tape-deliveredadhesives stay where you put them, without leaving messy residues behind. Plus,the built-in conductive bers help reinforce the tape, for excellent handlingcharacteristics. Well-suited for die cutting and automated application.

3. Low Electrical Resistance/Good Conductivity for increased shielding effectiveness. Solidelectrical connection is ensured by means of conductive bers extending above the adhesiveor a matrix of conductive particles.

4. RoHs Compliant/REACH Compliant/Halogen Compliant 3M Electrically ConductiveAdhesive Transfer Tapes comply with the European Unions Restriction of HazardousSubstances (RoHs) initiative and with European REACH regulations. They also comply withcurrent 2009 industry initiatives for Halogen content values.

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Contact Resistance (R ohms)

between a Copper foil test

panel and a 2nd Sheet of aCopper foil test panel using

the 3M ECATT

Contact Resistance (R ohms)between a Gold Flexible Test

Strip and a Gold Pad PCB panel

using the 3M ECATT

Product

PictorialDesign

Thickness(m)

Z

orXYZ

Conductivity(Based

on3MTestMethod)

ConductiveFiller

Type Adhesive Type

Features,

Advantages, and Benefits

Copper foil bonded to a Copper

Foil using the 3M ECATT / 3M

2-point Resistance Test Method

/ 645mm2Overlap Contact Area

/ 1 Hr RT Dwell . See note 1.

Gold flex bonded to SS using the

ECATT. Best results relate to a lowe

contact R potential on SS. Contact R

can vary with SS type tested as the

oxide layer thickness on a SS type

affects the final R results. See note 1

9703 50 Z SilverLow OutgassingAcrylic ECATT

Z- Axis, Low Outgassing < 0.2 < 0.2

9705 50 Z SilverStandard

Acrylic ECATTZ-Axis, Standard outgassing version of 9703. < 0.2 < 0.2

9706 50 Z SilverHigh AdhesionAcrylic ECATT

High Adhesion version of the 9705 < 0.2 < 0.3

9707 9707 50 XYZ SilverHigh AdhesionAcrylic ECATT

High Adhesion, Bond Line Gap/SlitEMI Shielding for High Frequency,

Low contact R to SS< 0.2 < 0.3

9709 50 XYZ SilverStandard

Acrylic ECATTStandard Adhesion, Bond Line Gap/Slit

EMI Shielding for High Frequency< 0.2 < 0.3

9709S 50 XYZ SilverStandard

Acrylic ECATT

Standard Adhesion, Bond Line Gap/SlitEMI Shielding for High Frequency,

Low contact R to SS< 0.2 < 0.2

9709SL 50 XYZ SilverStandard

Acrylic ECATTPremium low liner release version of 9709S < 0.2 < 0.2

7810 150 XYZ NickelHigh AdhesionAcrylic ECATT

Thicker ECATT for gap lling. < 1.5 < 10.0

7805 150 XYZ SilverStandard

Acrylic ECATT

Thicker ECATT for gap lling. < 1.0 < 0.2

7850 150 XYZ CarbonHigh AdhesionAcrylic ECATT

Higher Thermal Conductivity & ThickerECATT for gap lling.

< 1.0 < 10.0

7772 66 XYZNickle &

Alum DCMedium Adhesion

Acrylic D/CDouble Coated Aluminum foil < 0.5 < 2.0

9712 125 XYZ CarbonStandard Acrylic

ECATTNon-woven conductive scrim & Standard acrylic

adhesive.< 1.5 < 15.0

9713 89 XYZ Nickel/CStandard

Acrylic ECATTLower R non-woven conductive scrim vs. 9712

& Standard acrylic adhesive.< 0.4 < 7.5

9719 100 XYZ Nickel /C Silicone ECATTLow surface energy silicone adhesive, Highertemperature resistance, Lower R non-woven

conductive scrim vs. 9712.< 1.0 < 20.0

9720 35 XYZ Nickel/CuHigh AdhesionAcrylic ECATT

Lower R non-woven conductive scrim vs. 9713,Thinner scrim design & Medium adhesion.

< 0.2 < 0.5

9723 60

XYZNickel/Cu

High Adhesion

Acrylic ECATT

Lower R non-woven conductive scrim vs.

9713, Thinner scrim design & High adhesion.< 0.2 < 0.4

9725 50 XYZ Nickel/CuMedium AdhesionAcrylic ECATT

Lower R non-woven conductive scrimvs. 9713 & High adhesion.

< 0.2 < 0.5

9732 100 XYZ Nickel/CuMedium AdhesionAcrylic ECATT

Lower R non-woven conductive scrim vs. 9713,Thicker scrim design & High adhesion.

< 0.2 < 2.5

9760 50 XYZ Nickel/CuHigh / Low Adhesion

Double sided reworkableAcrylic ECATT

Easier rework as greater Face Side to Back Sideadhesion delta. Easier rework version of 9725.

High and Low adhesion sides.< 0.2 < 0.8

9780 200 XYZ Nickel/CuHigh / Low Adhesion

Double sided reworkableAcrylic ECATT

Easier rework as greater Face Side to Back Sideadhesion delta. Easier rework and thicker version

of the 9732. High and Low adhesion sides.< 0.5 < 5.0

ECATT Basic Comparative Reference Table: Based on the suggested ECATT Selection Process, the end user should identify 2-4 ECATT products to testin an application to determine tness for use. As each application is unique, it is difcult to identify the Optimum ECATT product without testing the ECATTproducts in an end use assembly design. The ECATT Selection Process of Good-Better-Best ranks products as they might perform in a nominal application.As each ECATT may employ different conductive particles, scrim or non-woven, thickness variations, acrylic adhesive type, etc. they will perform differentlybased on end use application and so the need for the end users own comparative testing. The following technical information and data should be considered

representative or typical and should not be used for specication purposes.

Note 1: Test & performance results will vary based on items such as, but are not limited to : Contact area, Assembly method, Testing conditions, Normal variations in product performance from one mfg. lot to a different mfg.

lot of material-along with the normal variations found in a material within a mfg. lot (such as thickness, available conductive material in an actual sample tested, variations in conductive ller materials and uniformity of

conductive materials dispersed within a lot of material, variations in adhesives, etc.), Test methods, Environmental aging, Exact test surface material type utilized, etc. The Copper to Copper & Gold Flex to PCB testi

also should be noted for the differences related to the Contact area difference in the Test Methods (645 mm2vs. 6 mm2) as this does impact the test results. Testing of ECATT materials and the noted test substrates

does not imply that the ECATT is suitable for an end use application of similar materials. End user is responsible to determine if an ECATT and substrate combination is t for use in their intended end use application.

3MElectrically Conductive Adhesive Transfer Tapes (ECATT)Features, Advantages, Benefits

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3MElectrically Conductive Adhesive Transfer Tape (ECATT) Selection Process:Selection of Grounding, EMI Shielding and attachment ECATTsconsists of determining several application requirements: For example, an ECATT general selection process could take into consideration itemssuch as, but not limited to: 1) Determine contact R target, 2) Dene contact surface type, 3) Adhesion level desired - from High-Medium-StandardAdhesion, and High/Low adhesion sided ECATTs, 4) Bond line thickness, 5) Z or XYZ conductive type ECATT, 6) Operating temperature range andenvironmental conditions, 7) EMI Shielding in bond line Gap/Slit for high frequencies, 8) Determine contact area for ECATT used for R and adhesion

of surfaces, 9) Assembly Pressure, temperature and time limits 10) After assembly bond line stresses and need for added mechanical support.

Contact Resistance(R ohms) between a Gold Flexible

Test Strip and a SS panel using

the 3M ECATT

Bond Line EMIShielding (Bond Line

Gap/Slit EMI

Shielding Potential)

Potential to improve contact R

of a Flex to a PCB grounding locationsvia improved surface conformability

and XYZ conductive potential with an

ECATT product type vs. a genericZ-axis only conductive PSA

Adhesion to

SS type substrate/3MTM/24hr RT dwell

Ease of Reworkbased on a

standard setof substrates

Thermal Conductivity

(W/mK) or an effectiveThermal Resistance (C/W)

for a given thickness vs a

generic Z-Axis only PSA

Product

Gold flex bonded to SS using the ECATT.

Best results relate to a lower contact

R potential on SS. Contact R can vary

with SS type tested as the oxide layer

thickness on a SS type affects the

final R results. See note 1.

Best = High dB

EMI Shielding in

Bond Line Gap/Slit

Contact R between

a Flex and a PCBPeel Strength

ECATT design

can effect rework

based on acrylic

adhesive type &

conductive filler type.

Effective Thermal

resistance and Thermal

Conductivity vs a genericZ-Axis only PSA.

9703 Best Good Good Better Good

9705 Best Good Good Better Good

9706 Best Good Best Good Good

9707 Best Best Best Best Good Best

9709 Good Best Best Good Better Best

9709S Best Best Best Good Better Best

9709SL Best Best Best Good Better Best

7810 Better Better Good Best Good Better

7805 Good Better Good Best Better Better

7850 Good Good Good Best Good Best

7772 Better Good Good Good Good Good

9712 Good Good Good Better Good Good


9719 Good Good Good Better Good Good


9723 Better Good Better Best Good Good

9725 Best Better Better Better Good Good

9732 Best Better Better Best Good Good

9760 Best Better Better Good Best Good

9780 Better Better Good Good Best Good

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As frequency increases, is the bond line gap leading to stray EMI?Cross talk, spurious EMI, signal degradation, noise

Problem Solution

Higher frequencies require optimized

grounding and Faraday Cage design

Inherent bond line thickness

EMI Shielding using 3M ECATT

MetalThickness

Gap

Size

orSlitLength

60dB EMI Shielding

0.1mHz 50mHz 10Hz

60db

3500 m

35 m

1000mHZ

(1GHz)

10000mHZ

(10GHz)

Poor "through tape" EMI Shielding leadsto lower EMI SE at High Frequencies.

At High Frequencies, the effect of "throughthe tape thickness" EMI gaps or EMI slits isto allow EMI leakage. If the effective EMIgap/slit does not = "0", EMI energy at highfrequency can pass through a "standardconductive adhesive tape material" via thegap related to the adhesive thickness. The"Tape Bond Line Gap/Slit leakage effect"leads to poor EMI Shielding, cross-talk,degraded Signal-to-Noise ratio, etc.

Standard electricallyconductive tape leadsto EMI leakage through

bond line tape thickness.

3MElectricallyConductive Adhesive

Transfer Tape (ECATT )9709SL

Grounding Surface (R OK) Grounding Surface (Lower Contact R)

Flex Circuit (FPC)Flex Circuit (FPC)

.

,

.

3M ECATT with inherent EMI shielding atthe bond line provides signicantly reducedcrosstalk, stray EMI, noise in circuit, antennaeeffects, FPC susceptibility and

spurious emissions.

3MElectricallyConductiveAdhesive TransferTape 9709SL usedfor FPC groundingand EMI Shielding

Flex PrintedCircuit

Flex3MTape 9709SL

Grounding SurfaceSubstrate Layer

Flexible EMI shieldattached with 3M ECATT(9709SL, 9705, 9706,9713) to exible circuit

Stainless steel stiffener andEMI shield attached with3M ECATT (9709SL, 9706,9713) to exible circuit

EMC and Electrically Conductive Adhesives:3M Conductive Adhesive Transfer Tapes

Is Grounding Bias degrading your antennae?

Problem Solution

Electrical Bias Degrades Performance Effectively Ground Device

GroundingNot Effective

Antenna

Signal Data Flex

+2.0 V

+0.0 V Ground

Internal Device Bias

i l l

i l l

No Device Bias

Antenna

Signal Data Flex

+0.0 V

+0.0 V Ground

Assembly optimizedfor grounding using3M ECATT

If device is not well grounded, thebias voltage in the device acts as atransmitter of a signal that the signal lineex, antennae ex, etc. pick up, leading topoor performance.

Device is well grounded so the biasvoltage in the device is baseline and noRF signal is emitted.

The 3MElectrically Conductive Adhesive Transfer Tapes (ECATT) are designed to providefor different contact resistance based on the substrate types. The contact resistance value(ohms) will lead to different performance aspects of the nal assembly and device.

Assembly contact resistance can effect:

Assembly electrical bias or EMI Shielding Performance as ECATT grounds the EMI shield

Bias can generate antennae or RF signal affects that can lead to lower performanceof device

Lower R can allow for improved EMI shielding of a design. 3M ECATT 9709S-9707 hasinherent bond line EMI shielding in addition to excellent grounding for improved highfrequency performance.

3MElectrically

Conductive AdhesiveTransfer Tapes

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Kapton and Teon are registered trademarks ofDuPont. 3M is trademark of 3M Company.Used under license by 3M subsidiaries and afliates.

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Please recycle. Printed in USA.Issued: 8/09 3M 2009.All rights reserved. 6873HB60-5002-0051-8

Electronics Markets Materials Division3M Center, Building 225-3S-06St. Paul, MN 55144-1000www.3M.com/electronics1-800-251-8634

Important Notice:Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liabilityassociated with such use. Please consult the 3M product technical data sheet and Material Safety Data Sheet before use.

Warranty; Limited Remedy; Limited Liability:3Ms product warranty is stated in its Product Literature available upon request. 3M MAKES NO OTHER WARRANT IESINCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHA NTABILITY OR FITN ESS FOR A PARTICULAR PURPOSE. If this product is defective withinthe warranty period stated above, your exclusive remedy shall be, at 3Ms option, to replace or repair the 3M product or refund the purchase price of the 3M product.Except where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless ofthe legal theory asserted.

Product Adhesive Type Contact Resistance Thermal Impedence7373 Epoxy/acrylate 1.0 m, 3M Test Method 0.5C-in2/W

PCB Ground Plane Bonding Film3MGrounded Heat Sink Bonding Film 7373 is an anisotropic electrically-conductive thermoset adhesivelm, ideal for bonding and grounding high frequency printed circuit boards, such as cellular base stationampliers, to heat sinks and heat spreaders. Eliminates the need for mechanical fasteners! This product isnot halogen-compliant.

3MAluminum Foil and Copper Foil Tapes for EMI Shielding and Heat Spreading

Product Backing Adhesive

300PL 1.9 mil aluminum foil Acrylic Non-Conductive

508SN 1.4 mil Copper backing Acrylic Non-Conductive

Specialty Products useful for EMI Shielding,Heat Spreading & Grounded Heat Sink Bonding

3MTransparent Electrically Conductive/EMI Shielding Film 8880-S3/S7

3M Transparent EMI Film

Product Thickness3M OCA

Adhesive TypeEMI Shielding*

Film SurfaceResistance*

Transmission%*

8880-S3 3 mil (75 m) none 22-26 dB 8-12 ohms

Documents

3M Electrically Conductive Transfer Tapes