6’’ and Below: Small Dimension Wafer Market Trends 2020

© 2020

From Technologies to Markets

Sample

6’’ and Below: Small Dimension Wafer Market Trends 2020

Market and Technology

Report 2020

Sil’tronix Silicon Technologies© - Polishing process - 2020

2

METRICS

6’’ and Below: Small Dimension Wafer Market Trends 2020 | Sample | www.yole.fr | ©2020

2” Wafer

50 mm

3” Wafer

76 mm

4” Wafer

100 mm

5” Wafer

130 mm

6” Wafer

150 mm

8” Wafer

200 mm

12” Wafer

300 mm

Diameter

1” Wafer ➔ 25,4 mm

AREAS OF FOCUS

Diameters are usually expressed in millimeter (mm) or inch (“).

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REPORT OBJECTIVES

Assess the wafer market up to 6 inch for More than Moore (MtM) devices

• Provide a detailed analysis and wafer forecast for each MtM application segment

• Submit a wafer-starts analysis and metrics by MtM application segment, and split by wafer size and by wafer material (2019 – 2025)

Describe the key drivers of using small wafer size as well as the ones that will shape the small wafer market’s future

• Key technology choices and technology dynamics

• What are the challenges related to higher performances and process implementation?

• Emerging technologies, roadmaps and process availability

Ecosystem and positioning of key players

• Who are the players? What are the relationships inside this ecosystem?

• What is the time to market?

• What are the potential consumer applications?

This report aims to give the entire wafer starts market up to 6 inch for More than Moore devices

1)

2)

3)


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REPORT METHODOLOGY

Market

Volume (in Munits)

ASP (in $)

Revenue (in $M)

Yole’s market forecast model is based on the matching of several sources:

Information

Aggregation

Preexisting

information


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TABLE OF CONTENTS

Part 1/2

• Glossary 04

• Definition 05

• Metrics 06

• Report objectives 07

• Scope of the report 08

• Methodology & definitions 12

• About the authors 13

• Companies cited in this report 14

• Why this report? 15

• Three-page summary 16

• Executive summary 20

• Market trends 43

o Semiconductor devices at one glance

o Semiconductor devices categories

o Applications vs diameters

o Applications vs materials

o Applications vs diameters & materials

o Wafer price trends

o ASP of epi-ready wafers

o Wafer pricing analysis

o Wafer reclaim

o Wafer diameter trends

o Wafer diameter evolution

o Major Si manufacturers

o Major gallium arsenide manufacturers

o Major silicon carbide manufacturers

o Major gallium nitride manufacturers

o Major LT/LN manufacturers

o Major indium phosphide manufacturers

o Major sapphire manufacturers

o Wafer diameter drivers

o Wafer diameter drivers

o Limitations for diameter evolution

o Overcoming limitations

o Conclusion

• Technology trends 77

o Freestanding substrates used by semiconductor industry

o Substrate types and their applications

o Key drivers for small size applications

o From devices to wafer materials

o RF components

o Power components

o Laser diodes

o LEDs

o MEMS & sensors

o From devices to wafer materials


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TABLE OF CONTENTS

Part 2/2

o Growth methods

o Bulk single-crystal growth

o Growth Techniques

o Benchmarking

o Growth methods

o Physical properties

• Business model & supply chain 101

o Business model

o Supply chain

o Producers and distributors

o Reclaim wafers

o Merger & acquisitions, partnerships, licensing

o Fabs & equipment : 1’’ – 6’’ processable

o Fabs

o Equipment

o Focus on China

o Focus on Russia

• Market forecasts 134

o Overall wafer forecast

o By diameter

o By application

o By wafer material

o Observations and analysis

• Conclusions 161

• Outlook 165

• Yole Développement presentation 170


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Biographies & contacts

ABOUT THE AUTHORS

Gaël GIUSTI, Market & Technology Analyst, Equipment and Materials Manufacturing

Gaël Giusti, PhD. Is a Technology & Market Analyst specialized in Semiconductor Manufacturing as well as Equipment & Materials at Yole Développement (Yole). As part of the Semiconductor & Software division at Yole, his expertise is focused on thin film growth and related applications, equipment, materials and manufacturing processes. Gaël is daily involved in the production of technology & market reports and custom consulting projects. Prior to Yole, he served as a R&D engineer at Sil'Tronix Silicon Technologies for 5 years. Gaël was in charge of upscaling a CVD process to develop epitaxial AlN thin film on sapphire for RF applications. He also worked on transparent conducting thin films for optoelectronics applications as a post-doctoral researcher at LMGP (Grenoble, France).

Gaël holds a master’s degree from ENSICAEN (Caen, France) as well as a PhD in Materials Science from the University of Birmingham (UK).

Contact: [email protected]

Vishnu KUMARESAN, Market & Technology Analyst, Equipment and Materials Manufacturing

Vishnu Kumaresan, PhD., is a Technology & Market analyst in the Semiconductor Manufacturing Team of Yole Développement, France. He focuses on thesemiconductor manufacturing domain, covering both equipment and material segments. His scope includes mainstream microelectronic applications as well asMore-than-Moore applications. Having lived and worked in 4 countries, he has more than 11 years of experience in the electronics industry, coveringsemiconductor, display, and software technologies. Prior to joining Yole, he worked as an epitaxy engineer in an advanced startup in the micro LED display industryand has previously gained corporate experience at IMEC, CNRS, Saint-Gobain and Infosys.

Vishnu obtained his PhD in Material Physics & Chemistry from Pierre and Marie Curie University, France, and master’s in Microelectronics from National Universityof Singapore and Technical University of Munich, Germany.

Contact: [email protected]


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II-VI Advanced Materials, Applied Materials, Atecom Technology, ATREG, Ceramic Forum, CMK, Cree-Wolfspeed, Crystaland, Cyberstar, ELMA, Freiberger, Global Wafers, Harbin Aurora, III-V Reclaim, Iljin Display, Infineon, InPact, Monocrystal,

Okmetic, Optim Wafer Services, Power Advanced Materials, PSI, Pure Wafer, ROHM -SiCrystal, Saint-Gobain LUMILOG, Shin-Etsu, Showa Denko, Siltronic, Sil'Tronix ST, Si-Mat, SK Siltron, SOITEC, ST Microelectronics, SUMCO, Sumitomo , TDG, University

Wafer, Vital Materials, Wafer Export, Wafer World and many more.

COMPANIES CITED IN THIS REPORT


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SCOPE OF THE REPORT (1/3)

Glass and quartz materials, templates, SOI, logic and memory applications will not be discussed in this report.

GaAs

SiC

Bulk GaN

InP

LT / LN

1) Applications for MtM

POWER

RFMEMS

LED

PHOTONICS

2) Substrate types used for MtM

3) Wafer diameters

2’’ and below

3’’

4’’5’’

6’’

Sapphire

Silicon

LT/LN: Lithium Niobate/Lithium Tantalate


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Prime-wafers

Semiconductor substrate

growth

Semiconductor material ingot

Wafering

Polishing

Epitaxy growth process

(MOCVD, CVD, MBE)

Epiwafer

Raw wafer /

Prime wafers

(With no epitaxy)

Chips: dies-on-wafer

End-product

Testing

Back-end assembly

Front-end waferLitho, deposition, etching, metallization…

Epi-ready wafer

Tooling/Slicing

Fab level

Raw materials

Scope of the report


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Reclaim Wafers

Prime-Wafers

Chips

(dies-on-wafer)

Front-end processing(litho, deposition, etching,

etc.,)

Packaging

End-products

Sort / Characterize Strip Lap

PolishCleanInspection

Wafer Reclaim ServicesTest / Qualification line


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KEY DRIVERS FOR SMALL DIMENSION WAFERS

The main driver for smalldimension wafers can besummarized in two words: « good enough ».

Low fabrication Price of small wafer size

For small industrial players and/or volumes as well as research institutes, it can be very expensive to scale-up tools

Technological crystal growth limitations make scaling-up the diameter very costly

Yield vs ROI “Good enough” : no pressure to scale-up

Process yields can drastically go down as wafer diameter increases

Small die size can justify staying on small wafer size if volumes is not expected to pick up

Less stringent specifications

Key drivers for using

small wafer size


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SEMICONDUCTOR DEVICES CATEGORIES

More Moore

Moore-Than-Moore Devices

PHOTONICS

Laser

EELS VCSELS

PIC

LED

MiniLEDs MicroLEDs IR UV

Visible

ROY Green Blue

RF

Filter PAAntennaswitch

POWER

SiC

Transistors Diodes

GaN

HEMTs

MEMS

Sensors ActuatorsMicro -fluidics

More device

Silicon

Substrate

More functionality

Silicon, GaAs, GaN, InP, SiC, Sapphire, LT/LN, SOI, POI, etc.,


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TOTAL ANNUAL SMALL DIMENSION (≤ 6’’) MARKET IN REVENUES: 2019 – 2025 FORECASTS

Total small dimension wafers-starts (breakdown by material for semiconductor devices)

InP

Si

GaAs

CAGR2019-2025: +1.8%

$1.8BCAGR: -3.3%

$5.4B2025

$0.7BCAGR: +19.5%

$0.2BCAGR: +14.4%

$0.5B

CAGR: +3.9%

$0.4BCAGR: +8%

$1.7B

CAGR:+1.1%

$2.2B$0.1B

$4.8B2019

$0.3B$0.2B

$0.4B$1.6B

SiC

Sapphire

LT/LN


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TOTAL SMALL DIMENSION MARKET (≤ 6’’) - BREAKDOWN BY DIAMETER FORECAST

CAGR: -5.3%COVID-19 impact


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TOTAL LARGE DIMENSION MARKET (≥ 8’’) - BREAKDOWN BY DIAMETER FORECAST

In units, 2019-2025 Logic & memory excluded

CAGR: 5.5 %


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NEW AND REFURBISHED EQUIPMENT VENDORS

USA

Italy

France

UK

Germany

Netherlands

China

Japan

South Korea

Singapore

Ireland

New equipment vendors Refurbished equipment vendors


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WAFER DIAMETER EVOLUTION

By material


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ASP OF EPI-READY WAFERS

Price trend with respect to wafer diameter


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SLIDE EXTRACTS

Forecasts: By diameter, material and application


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MORE SLIDE EXTRACTS

Supply chain focus: Wafer producers, equipment and fabs


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Contact our

Sales Team

for more

information

22

Contact our

Sales Team

for more

information

Status of the MEMS Industry 2020

Epitaxy Growth Equipment for More Than Moore Devices Technology and

Market Trends 2020

Thinning Equipment Technology and Market Trends for Semiconductor

Devices

Status of the Power Electronics Industry 2019

Compound Semiconductor Quarterly Market Monitor

YOLE GROUP OF COMPANIES RELATED REPORTS & MONITORS

Yole Développement


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https://www.i-micronews.com/products/thinning-equipment-technology-and-market-trends-for-semiconductor-devices/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/status-of-the-mems-industry-2020/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/status-of-the-mems-industry-2020/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/thinning-equipment-technology-and-market-trends-for-semiconductor-devices/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/compound-semiconductor-service-compound-monitor/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/compound-semiconductor-service-compound-monitor/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_SmallWafer_Sept2020

23About Yole Développement | www.yole.fr | ©2020

CONTACTS

FINANCIAL SERVICES

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+1 208 850 3914

CUSTOM PROJECT SERVICES

› Jérome Azémar, Yole Développement -

[email protected] - +33 6 27 68 69 33

› Julie Coulon, System Plus Consulting -

[email protected] - +33 2 72 17 89 85

GENERAL

› Camille Veyrier, Marketing & Communication

[email protected] - +33 472 83 01 01

› Sandrine Leroy, Public Relations

[email protected] - +33 4 72 83 01 89

› General inquiries: [email protected] - +33 4 72 83 01 80

Western US & Canada

Steve Laferriere - [email protected]

+ 1 310 600 8267

Eastern US & Canada

Chris Youman - [email protected]

+1 919 607 9839

Europe and RoW

Lizzie Levenez - [email protected]

+49 15 123 544 182

Benelux, UK & Spain

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+49 69 96 21 76 78

India and RoA

Takashi Onozawa - [email protected]

+81 80 4371 4887

Greater China

Mavis Wang - [email protected]

+886 979 336 809 +86 136 6156 6824

Korea

Peter Ok - [email protected]

+82 10 4089 0233

Japan

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+81 34 4059 204

Japan and Singapore

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+81 80 3577 3042

Japan

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6’’ and Below: Small Dimension Wafer Market Trends 2020