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EE&CSIE Nation al Taiwan Universi ty ARCHI ARCHI Lab Lab A Novel Dimensionally- Decomposed Router for On-Chip Communication in 3D Architectures Author: J. Kim, C. Nicopoulos (Dept. of CSE, PSU) Speaker: Po-Shan Huang ISCA’07

A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures. Author: J. Kim, C. Nicopoulos (Dept. of CSE, PSU) Speaker: Po-Shan Huang ISCA’07. Outline. Introduction Current 3D NoC Architecture Proposed DimDe Router Experimental Results Conclusion. Outline. - PowerPoint PPT Presentation

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Page 1: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

EE&CSIE

National

Taiwan

University

ARCHIARCHIARCHIARCHI LabLabLabLab

A Novel Dimensionally-Decomposed Router for On-Chip

Communication in 3D Architectures

Author: J. Kim, C. Nicopoulos (Dept. of CSE, PSU)Speaker: Po-Shan HuangISCA’07

Page 2: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

National

EE&CSIE

Taiwan

University

OutlineOutline

Introduction Current 3D NoC Architecture Proposed DimDe Router Experimental Results Conclusion

Page 3: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

National

EE&CSIE

Taiwan

University

OutlineOutline

Introduction Current 3D NoC Architecture Proposed DimDe Router Experimental Results Conclusion

Page 4: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

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EE&CSIE

Taiwan

University

IntroductionIntroduction

a new 3D NoC router architecture Partially-connected Dimensionally-Decomposed (Dim

De) Router

Characteristics True 3D crossbar structure Varying the number of vertical connections Segmented vertical links in the partially-connected cro

ssbar Hierarchical arbitration scheme for inter-strata transfe

rs Similar to the Row-Column (RoCo) Decoupled Router

nikc
Irrespective of the number of layersused in the implementation, the 3D crossbar allows a single-hop connection between any two layers
nikc
from one to four to emulate anything between a segmented bus and a full crossbar.
nikc
enable concurrent communication between the different layers of the 3D chip
nikc
reduces area and delay complexity
nikc
completely separates East-West and North-South intra-layertraffic through a pre-sorting operation at the input.
Page 5: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

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Face-to-Back bondingFace-to-Back bonding

Page 6: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

National

EE&CSIE

Taiwan

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OutlineOutline

Introduction Current 3D NoC Architecture Proposed DimDe Router Experimental Results Conclusion

Page 7: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

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Area and Power Comparisons of the Crossbar Switches

Area and Power Comparisons of the Crossbar Switches

Page 8: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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3D Symmetric NoC Architecture3D Symmetric NoC Architecture

7x7 crossbar

Page 9: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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3D NoC-Bus Hybrid Architecture3D NoC-Bus Hybrid Architecture

6x6 crossbar

Page 10: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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A True 3D NoC RouterA True 3D NoC Router

Page 11: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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A True 3D NoC Router (cont.)A True 3D NoC Router (cont.)

Page 12: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

National

EE&CSIE

Taiwan

University

OutlineOutline

Introduction Current 3D NoC Architecture Proposed DimDe Router Experimental Results Conclusion

Page 13: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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Taiwan

University

3D DimDe NoC Architecture3D DimDe NoC Architecture

Page 14: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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3D DimDe NoC Architecture3D DimDe NoC Architecture

Page 15: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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3D DimDe NoC Architecture3D DimDe NoC Architecture

Page 16: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

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EE&CSIE

Taiwan

University

OutlineOutline

Introduction Current 3D NoC Architecture Proposed DimDe Router Experimental Results Conclusion

Page 17: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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Simulation PlatformSimulation Platform

Server workloads TPC-C SAP

Memory traces SPLASH

Simulator Simics

The baseline configuration Solaris 9 Operating system eight UltraSPARC III cores

Page 18: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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Simulation Platform (cont.)Simulation Platform (cont.)

Energy Model Register-Transfer Level (RTL) Verilog Synopsys Design Compiler

TSMC 90 nm standard cell library

Page 19: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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Impact of the Number of Vertical Bundles on Performance

Impact of the Number of Vertical Bundles on Performance

Two vertical links instead of more

Page 20: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

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Simulation ResultSimulation Result

Latency and throughput improvements of over the other 3D architectures

Latency Throughput

Page 21: A Novel Dimensionally-Decomposed Router for On-Chip Communication in 3D Architectures

ARCHIARCHIARCHIARCHI LabLabLabLab

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ConclusionConclusion

Energy reduction within Slight performance overhead Small crossbar and simple design reduce about

26% in terms of EDP Within 5% overhead