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A3000FC FLIP CHIP DIE BONDER
A High Precision and Flexible Solution for your
Flip Chip Applications
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A3000FC Features
High Precision +/- 25um Handle Small Die 0.2mm x 0.2mm Low
Bonding Force 30g min Rotary Bonding tool
Voice Coil bond force control
Gentle Pickup Synchronize Ejector
Performance Control System
PC Based Control system
Interactive menu driven control
User customizable menu
USB interface for data exchange
256 grey levels PR system
Geometric Features recognition
Die Alignment
Ink dot detection
Vision System
Large Bonding Area
Thin Substrate handling
PCB/Ceramic substrate
High Speed servo XY stage
Material Handling
Dual Servo Bond Head with linear encoder
2um resolution
No stick Z pickup linear bearing
Easy maintenance
Bond Head Options
Wafer mapping
Epoxy Stamping
Die Handling
Product that requires certain degree of customization is
available. Please consult ACCURATUS for such inquiries.
Trusted Technology. Creative Engineering
Handling of 8 Flex Frame Motorized wafer Theta
Adjustment
Waffle Pak and Foton Ring Handling Capability
Ejector system with multi stage programmable ejector height
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A3000FC Specifications
Die Size 8 x 8mil 400 x 400mil 0.2 x 0.2mm 10 x 10mm
Package PCB, Ceramic, Flex Circuit
Handling
Substrate Size
Length 10 (250mm) Width 4 (100mm) Thickness 0.002 0.25 (0.050
6.35mm)
Cycle Time 1.2 sec (Pick Flip and Place)
Wafer Stage
Wafer size Max 8 (200mm) XY Table Travel 9.5 x 9.5 (240mm x
240mm)
Bond Head
Bond force 30 300g Resolution 2um
Pattern Recognition System
PRS 256 Grey Level
Camera resolution 640pixel x 480pixel
Positional accuracy +/- pixel
System Accuracy
XY Placement +/- 25 um
Angle +/- 1 deg
Facilities Required
Voltage 110/220/230VAC (pre set at factory)
Frequency 50/60Hz (pre-set at factory)
Compressed air 80 PSI (Min)
Dimension & Weight
L x B x H 1200mm x 1000mm x 1650mm
Weight 900kg (Depend on configurations)
Pistos Solutions Pte Ltd
Block 996 Bendemeer Road. #04-01
Kallang Basin Industrial Estate.
Singapore 339944
EMAIL: [email protected]
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Trusted Technology. Creative Engineering
A3000FC FLIP CHIP DIE BONDER
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Efficient Machine Layout Wafer handling Assembly to go under
the Workholder. This allow shorter working stroke and higher
machine
through put
A3000FC FLIP CHIP DIE BONDER
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Pick Up Die from Wafer
A3000FC FLIP CHIP DIE BONDER
Die Flipping
Kiss and Part Precision Bond Force control using Voice Coil
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A3000FC FLIP CHIP DIE BONDER
Bottom Camera Assembly
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A3000FC FLIP CHIP DIE BONDER
Flexible dispensing of flux or epoxy.
Epoxy Stamping for critical control
Syringe Holder
Epoxy Pot
