ALPHA® POWERBOND® SOLDER PREFORMS FOR AUTOMOTIVE & POWER SEMICONDUCTOR APPLICATIONS

ALPHA® PowerBond® is particularly suited for large area and high-CTE mismatch interfaces (baseplate and heat sink)

Baseplate

Heat Sink

DBC

Ambient

Clip Attach

Die Attach

Baseplate Attach

Heat Sink Attach

Conduction

Die

ALPHA® PowerBond® Solder Preforms are based on a family of lead-free, high-reliability alloys with antimony (Sb) content ranging from 5-10%. Antimony addition results in increased strength, thermal fatigue resistance and higher liquidus temperatures, compared to traditional tin/silver/copper based lead-free systems.

In addition, ALPHA® PowerBond® Solder Preforms comply with applicable environmental standards, including RoHS for use in products requiring lead-free materials. They are manufactured with 99.99% purity (4N alloy) ensuring highest performance. The preforms can be customized with ALPHA® TrueHeight® Preforms technology (for bond-line thickness and tilt control) and pre-coated with ALPHA® AccuFlux™ series for difficult-to-solder surfaces.

Key Attributes• Lead-Free

• High Creep Resistance with High Tensile Strength

• Improved Thermal Conductivity (over standard high-Pb and SnSb alloys)

• Improved Wetting (compared to standard SnSb alloys)

APPLICATIONS

Global Headquarters300 Atrium Drive Somerset, NJ 08873 USATel: +1-814-946-1611

European HeadquartersUnit 2, Genesis Business Park Albert Drive, Woking, Surrey, GU21 5RWUKTel: +44 (0) 1483 758400

Asia/Pacific8/F, Paul Y. Centre, 51 Hung To RoadKwun Tong, KowloonHong KongTel: 852-3190-3100

AlphaAssembly.com

For more information about ALPHA® PowerBond® Preforms, please contact your Alpha Representative.

©2018 AlphaIssued 08/18SM1477

MLF 100 VOIDS SUMMARY CHART

ALPHA® POWERBOND® SOLDER PREFORMS FOR AUTOMOTIVE & POWER SEMICONDUCTOR APPLICATIONS

ALPHA® PowerBond® 2110 Preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for the power semiconductor devices operating at high junction temperatures (150-175°C). The alloy composition has been particularly tailored to enable easy wetting and low voiding.

ALPHA® PowerBond® 2100 Preforms provide highest creep resistance and tensile strength for high operating temperature applications. Alloy material properties result in superior thermal fatigue performance than traditional SAC and SnAg alloys.

ALPHA® PowerBond® 2050 Preforms expand upon industry standard Sn95Sb5 alloy to provide improved wetting characteristics. The superior soldering characteristics combined with good thermal conductivity make it a viable option for heat sink applications.

a

bc

DIMENSION (mm) MIN (mm) MAX (mm)

a ±0.05mm 1.50 58.0

b ±0.05mm 1.50 58.0

c ±10% 0.10 0.50

Both tape and reel and waffle pack packaging available

Preform Sizes and Packaging