Embed Size (px)
Citation preview
AltiumLive 2017:ANNUAL PCBDESIGN SUMMIT
PresenterHieu Duong
San Diego, CAOctober 3rd-4th, 2017
The Four Pillars of PCB Design forCreating a Successful IoT Product
The Four Pillars of PCB Design for Creating a Successful IoT Product
R O L E S :
• Electrical Engineer
• Head of Dialexa’s Hardware Department
R E S P O N S I B I L I T I E S :
• Hardware Research
• Technology Evaluation
• Product Architecture
• PCB Design
• Certification & Production Planning
About Myself
About Dialexa
Dialexa is the technology research, design, & creation firm, where we design and create custom hardware and
software products and platforms.
w w w. d i a l exa . c o m
The Four Pillars of PCB Design For Creating a Successful IoT Product
Connectivity
1
Time to Market
Form Factor
Cost
2
3
4
IoT Devices on the Market
• Nest Cam
• Ecobee4 Thermostat
• Philips Hue
• Fitbit Smart Watch
• Ring Smart Video Doorbell
Form Factor Challenges for IoT Devices
• Lightweight
• Miniaturized
• Ergonomic
• Ruggedized
AMBER ALERT GPS CHILD TRACKER
Best Practices: MCAD & ECAD Collaboration
• Become best friends with your Mechanical Engineers
• Verify potential mechanical interferences
• Ensure enough structural support
• Perform thermal/airflow simulations
• Leverage built-in collaboration tools
Multiple Board Designs
• Reduce horizontal footprint
• Utilize rigid-flex designs
• Conformal antennas
Additional Resources
1 . T H E F U T U R E O F E L E C T R O M E C H A N I C A L D E S I G N :
• Machine Design
• http://www.machinedesign.com/archive/future-electromechanical-design
2 . T H E R E A L C O S T O F FA I L E D D E S I G N C O L L A B O R AT I O N :
• EDN Network
• http://www.edn.com/electronics-blogs/all-aboard-/4439959/The-real-costs-of-failed-design-
collaboration
Connectivity
Time to Market
Form Factor
Cost
1
3
4
2
The Four Pillars of PCB Design For Creating a Successful IoT Product
Connectivity Challenges
• Technologies
• Power Consumption
• Compatibility
• Certifications
Types of IoT Connectivity
http://postscapes2.webhook.org/internet-of-things-technologies
Best Practices: Common Layout Practices
• Power analysis
• PCB stack-up
• Grounding
• Stitching vias
• Antenna de-tuning
Certifications
• FCC, CE, IC
• Intentional/Unintentional Radiators
• Multiple radios
• Others: PTCRB, WEEE, etc.
Additional Resources
1 . 5 C H A L L E N G E S O F I N T E R N E T O F T H I N G S C O N N E C T I V I T Y:
• PubNub
• https://www.pubnub.com/blog/2014-06-17-5-challenges-of-internet-of-things-connectivity/
2 . T H E 4 S TA G E S O F A N I OT A R C H I T E C T U R E :
• TechBeacon
• https://techbeacon.com/4-stages-iot-architecture
Connectivity
Time to Market
Form Factor
Cost
1
2
4
3
The Four Pillars of PCB Design For Creating a Successful IoT Product
Cost Challenges
• Research & Development
• MSRP
• Production NRE
• Certifications
Hardware Cost Break-Down
• Research & Development: 9 – 24 months
• MSRP: $50 - $200
• Production NRE: $30k - $70k
• Certifications: $20k - $50k
Best Practices: Test Early and Often
TIME INTO DEVELOPMENT
$
MISTAKES
• Late mistakes are costly
• Pick the right architecture & technologies
• Reduce the design feedback loops
Design for Manufacturing & Assembly
• Engage with Contract Manufacturer as early as
you can
• Reduce the number of components
• Use standard components & common parts
among product lines
• Relax design tolerance
• Utilize plastics for structural support
Design for Certifications
• Start the certification process early
• Use pre-cert modules
• Design & re-used own modules
• 20cm rules for co-located antennas
• Perform multiple certifications at the
same time
Additional Resources
1 . C H O O S I N G T H E B E S T H A R D WA R E F O R YO U R N E X T I OT P R OJ E C T:
• IBM
• https://www.ibm.com/developerworks/library/iot-lp101-best-hardware-devices-iot-
project/index.html
2 . H OW M U C H D O E S I T C O S T TO B U I L D I OT S O LU T I O N :
• R-Style Lab
• http://r-stylelab.com/company/blog/iot/internet-of-things-how-much-does-it-cost-to-build-
iot-solution
Connectivity
Time to Market
Form Factor
Cost
1
2
3
4
The Four Pillars of PCB Design For Creating a Successful IoT Product
Why Improving Time to Market?
• Improved operational efficiency
• Efficient resource management
• Better market position
• Increased revenues
Time-to-Market Challenges
• Everyone wants to be the first to
markets
• Few weeks delay can affect
market share significantly
• Rapid-changing markets and
technologies
Best Practices: Avoid Mistakes
• Avoid unwanted design cycle due to mistakes
• Spending more time on planning
• Engage with vendors and test agencies early
• Know the market
Design for Rapid Prototyping
• Future-proof designs
• Modular designs and re-usability
• Re-used own certified modules
• Leverage existing IoT platforms
Additional Resources
1 . T H E I N T E R N E T O F T H I N G S : S I Z I N G U P T H E O P P O R T U N I T Y:
• McKinsey
• http://www.mckinsey.com/industries/semiconductors/our-insights/the-internet-of-things-
sizing-up-the-opportunity
2 . I M P R OV I N G T I M E TO M A R K E T:
• Arena
• https://www.arenasolutions.com/resources/articles/time-to-market/
Key Take-Aways
• Pick the right technologies• MCAD & ECAD Collaboration• DFMA• Plan early for certifications &
manufacturing• Leverage existing platforms and
modules• Mistakes = time + cost
Slideshare link:
https://www.slideshare.net/DialexaLLC
S TAY I N TO U C H
Dialexa.com@Dialex
a
m
