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Automated Transient Thermal Analysis with ANSYS Icepak and Simplorer Using EKM
Eric LinLalit Chaudhari
© 2011 ANSYS, Inc. August 25, 20111
Shantanu BhideVamsi Krishna Yaddanapudi
Overview
• Power Map Introduction• Need for Chip-co Design Automation• ANSYS solutions for Steady and Transient state• Use Case Description for Transient state
– Setup in IcepakS t i Si l– Setup in Simplorer
– Collaborative simulation using EKM
• Observations/Benefits• Observations/Benefits
© 2011 ANSYS, Inc. August 25, 20112
Introduction to Power map
Power map is a table of powerPower map is a table of power values associated with respective locations on a chip
Assumption of uniform power for silicon is a past approximationp pp
Current silicon needs demand non-uniform poweruniform power
© 2011 ANSYS, Inc. August 25, 20113
Icepak
Computational Fluid Dynamics (CFD) code
Multi mode heat transfer effectsMulti‐mode heat transfer effects
– Conduction
– Convection SystemBoard
– Radiation
Steady‐state and transient Package
System
Single or multiple fluids
Volumetric resistances and sources for
– Velocity and Energy
Joule Heating in tracers and conductors
C l t i
ICEPAK
© 2011 ANSYS, Inc. August 25, 20114
Complex geometries– Round, Angled, Curved shapes require no approximations
Simplorer
© 2011 ANSYS, Inc. August 25, 20115
Engineering Knowledge Manager (EKM)
File Repository Automate Processes
PROCESS MANAGEMENTDATA MANAGEMENTFile Repository
Meta-Data Extraction Advanced Search
Data Mining
Automate ProcessesManage Workflows
Design SystemsE-mail NotificationData Mining
Report GenerationE mail Notification Track Progress
ComputeFile & web
end user
Compute server
File & webservers
Enterprise AccessW b E bl d
Application PortalJob Submission
© 2011 ANSYS, Inc. August 25, 20116
Web Enabled
ACCESS MANAGEMENTJob Submission
Current Thermal Management Process
Silicon Designer Cooling roadmap
Closure?
Temperaturemap
Thermal SoftwareEDA S ft Thermal SoftwareEDA SoftwareIterative Process
Power mapLonger Design Cycles
© 2011 ANSYS, Inc. August 25, 20117Thermal Engineer
p
Collaborative Chip Design Solution
• Single click quick solution to Design Engineers for thermal evaluation of chip designsthermal evaluation of chip designs
• EKM based collaborative approach for steady and transient simulationsSteady State– Steady State• Icepak for pre-characterization• Linear superposition computation for steady state
– Transient• RC network generation for transient problems• Icepak and Simplorer based computation for transientIcepak and Simplorer based computation for transient
results– It is assumed that the system is linear for both steady and
transient simulations
© 2011 ANSYS, Inc. August 25, 20118
Steady State Solution
Power mapThermal/Mechanical Engineer Library of custom applications
deployed in ANSYS EKM
Chi D i
Passive Heat sink Cooling(FPGA & ASICS)
Active Heat sink Cooling(GPUs and CPUs ) Chip Design
Automatic Characterization Macro in Icepak
Chip Designer
Liquid Cooling(High End GPUs & Supercomputer CPUs)
software
© 2011 ANSYS, Inc. August 25, 20119
Transient Solution
Excitation DataThermal/Mechanical Engineer Library of custom applications
deployed in ANSYS EKM
Chi D i
Passive Heat sink Cooling(FPGA & ASICS)
Active Heat sink Cooling(GPUs and CPUs ) Simplorer
Icepak + Simplorer to generate RC network
Chip Designer
Liquid Cooling(High End GPUs & Supercomputer CPUs)
p
© 2011 ANSYS, Inc. August 25, 201110
Use CaseCompact package model is
considered for the analysis
Component DetailsQFP PackageTO Package
Component Details• 6 Dual Inline Packages• 6 PBGA Packages• 2 PQFP Packages• TO Packages with Heat
spreaders• PCB
Boundary Conditions• Opening with 1m/s velocity• Opening with 1m/s velocity• 4 PBGA packages with 1W
power each Dual Inline Package PBGA Package
© 2011 ANSYS, Inc. August 25, 201111
g(1W power each)
Work Flow
• Icepak– Identify the transient thermal elements in Icepaky p– Generate transient responses and simplorer input file
• Simplorer– Generate RC network in Simplorer
• EKM– Transfer RC networks to shared EKM repository– Using a template, run Simplorer to generate transient
Thermal results
© 2011 ANSYS, Inc. August 25, 201112
Work Flow
Power input profile
ANSYS Icepak ANSYS Simplorer
Template schematic
pCompute Step response matrix
pEquivalent model computation based on step response matrix Output:
Temperature response IC floor plan
Vs time
ANSYS EKMC ll b ti E i tCollaborative Environment
© 2011 ANSYS, Inc. August 25, 201113
Icepak setup
• Use Icepak parametric capability to generatecapability to generate transient responses for SimplorerE h f th PBGA• Each of the PBGA package is powered and simulation is performed for 50 secondsfor 50 seconds
• p1, p2, p3 and p4 is power associated with PBGA packages in the model
• Turn on “Write Simplorer Files” option in Icepak
© 2011 ANSYS, Inc. August 25, 201114
Files option in Icepak
Icepak Output Files for Simplorer
Icepak run generatesTemperature Response
• Transient temperature response
• Simplorer input file
Simplorer Input File
© 2011 ANSYS, Inc. August 25, 201115
Setup in Simplorer
• Simplorer Circuit: Add Icepack Component• Simplorer Circuit: Add Icepack Component..
• Specify the .simpinfo file provided from Icepak, select Equivalent circuit model, select Non-Conservative. Click Generate to create the thermal model
© 2011 ANSYS, Inc. August 25, 201116
model.
• Specify the excitation profile files as the input to the thermal model
Execute the analysis from EKM
© 2011 ANSYS, Inc. August 25, 201117
Thermal Results in EKM
© 2011 ANSYS, Inc. August 25, 201118
Benefits
• Icepak offers customized thermal management capability for Electronics simulation
• Unique connection with Simplorer for generating thermal modelsFully Automated solution• Fully Automated solution
• Shorter Design cycles, quicker turn around timeD i d Th l E i ( ) ll b t f• Design and Thermal Engineer(s) can collaborate for what-if studies
• Past simulations and RC network data is stored centrallyPast simulations and RC network data is stored centrally as a library and is accessible remotely
• Previous simulations can be re-used effectively
© 2011 ANSYS, Inc. August 25, 201119
• Audit/Traceability for regulatory compliance
Thank You
Questions?
© 2011 ANSYS, Inc. August 25, 201120
