8
Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups Fuchuan Ding 1,2, a , Qingsong Chen 1,2,b , Shoulian Lai 1,2,c , Xiaoyan L 1,2,d 1 College of Chemistry and Materials Sciences, Fujian Normal University, Fuzhou 350007, P. R. China 2 Key Laboratory for Polymer Materials, Fujian Province, Fuzhou, 350007, P. R. China a [email protected], b [email protected], c [email protected], d [email protected] Keywords: Bismaleimide; DABPA; Reactive PEEK; Toughness Abstract. A reactive poly (ether ether ketone) PEEK with pendant propenyl groups was prepared by nucleophilic aromatic substitution of 4, 4’-Difluorobenzophenone (DFBP), diallylbisphenol A (DABPA) and bisphenyl A (BPA) as monomer. The prepared reactive PEEK with varying proportion was introduced to toughen bismaleimide (BMI) resin composing of 4,4'-bismaleimidodiphenyl methane (BMDM) and DABPA by melt technique without any solvent. The properties of the BMI resin as a function of the reactive PEEK concentration were evaluated. The presence of PEEK heightened the temperature of “ene” reaction for BMI and DABPA and slightly lowered the glass transition temperature (Tg) of the blends. The impact strength and fracture toughness were highest elevated from 9.0 KJ/m2 and 186 J/m2 to 15.2 KJ/m2 and 239 J/m2 by 10 phr PEEK, respectively. At the same time, the thermal stability was improved by increasing the proportion of the PEEK. Scanning electron microscopy (SEM) of fracture surface revealed that the blends have good interfacial adhesion. Introduction Due to the excellent bonding, physics-chemical, thermal, mechanical, dielectric, and aging characteristics, bismaleimide (BMI) resins are known to have high temperature performance and excellent processability. [ 1, 2] They are one of the most important high performance thermosetting engineering plastics that have found wide applications in both microelectronics and aerospace, such as in multilayer printed circuit boards, advanced composite for aerospace industries, and structural adhesives. [3,4] But like any other thermoset polymers, BMI resins undergo dramatic and irreversible physical changes during the cure process. As a result, the high crosslink density arised from polymerization (cure) reaction lead to BMI resins with inherent brittleness, thus limiting their use in some more demanding applications. [5,6] So modification for BMI resins to overcome brittleness is a very crucial and widely studied. Many works are done to reduce crosslink density or to increase the distance between crosslinks by the addition of reactive or inert component such as aromatic diamines, [ 7 ] diallyl bisphenol A, certain epoxies and carboxyl-terminate butadiene/acrylonitrile (CTBN) elastomers. [8,9] A two-component bismaleimide system (XU292), composed of BMDM and DABPA, has been developed by the Ciba Geigy Corporation to improve mechanical properties and processability. [ 10 ] During curing, DABPA copolymerizes with BMDM via an ene-type linear chain-extension reaction followed by the Diels-Alder reaction. The brittleness of the cured resin is improved, compared with the conventional bismaleimide resins. The toughness of these thermosetting resins has been increased by blending with functionalized thermoplastics. [11] But most modification might reduce the glass transition temperatures and the thermal stability of the cured BMI resins. Engineering thermoplastics are interesting materials as modifers for BMI resins from the viewpoint of the maintenance of mechanical and thermal properties for the matrix resins. [12,13] High performance thermoplastics with high glass transition temperatures and toughness, such as poly(ether imide), [14,15] poly(ether sulfone) (PES) , [16] and PEEK , [17] have been extensively used to toughen Advanced Materials Research Vols. 197-198 (2011) pp 1299-1305 Online available since 2011/Feb/21 at www.scientific.net © (2011) Trans Tech Publications, Switzerland doi:10.4028/www.scientific.net/AMR.197-198.1299 All rights reserved. No part of contents of this paper may be reproduced or transmitted in any form or by any means without the written permission of TTP, www.ttp.net. (ID: 134.148.29.34, University of Newcastle, Callaghan, Australia-17/03/14,04:57:45)

Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

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Page 1: Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive

Propenyl Groups

Fuchuan Ding1,2, a, Qingsong Chen1,2,b, Shoulian Lai1,2,c , Xiaoyan L1,2,d 1College of Chemistry and Materials Sciences, Fujian Normal University, Fuzhou 350007, P. R.

China

2Key Laboratory for Polymer Materials, Fujian Province, Fuzhou, 350007, P. R. China

[email protected],

[email protected],

[email protected],

[email protected]

Keywords: Bismaleimide; DABPA; Reactive PEEK; Toughness

Abstract. A reactive poly (ether ether ketone) PEEK with pendant propenyl groups was prepared by

nucleophilic aromatic substitution of 4, 4’-Difluorobenzophenone (DFBP), diallylbisphenol A

(DABPA) and bisphenyl A (BPA) as monomer. The prepared reactive PEEK with varying proportion

was introduced to toughen bismaleimide (BMI) resin composing of 4,4'-bismaleimidodiphenyl

methane (BMDM) and DABPA by melt technique without any solvent. The properties of the BMI

resin as a function of the reactive PEEK concentration were evaluated. The presence of PEEK

heightened the temperature of “ene” reaction for BMI and DABPA and slightly lowered the glass

transition temperature (Tg) of the blends. The impact strength and fracture toughness were highest

elevated from 9.0 KJ/m2 and 186 J/m2 to 15.2 KJ/m2 and 239 J/m2 by 10 phr PEEK, respectively. At

the same time, the thermal stability was improved by increasing the proportion of the PEEK. Scanning

electron microscopy (SEM) of fracture surface revealed that the blends have good interfacial

adhesion.

Introduction

Due to the excellent bonding, physics-chemical, thermal, mechanical, dielectric, and aging

characteristics, bismaleimide (BMI) resins are known to have high temperature performance and

excellent processability.[1,2] They are one of the most important high performance thermosetting

engineering plastics that have found wide applications in both microelectronics and aerospace, such

as in multilayer printed circuit boards, advanced composite for aerospace industries, and structural

adhesives.[3,4] But like any other thermoset polymers, BMI resins undergo dramatic and irreversible

physical changes during the cure process. As a result, the high crosslink density arised from

polymerization (cure) reaction lead to BMI resins with inherent brittleness, thus limiting their use in

some more demanding applications.[5,6] So modification for BMI resins to overcome brittleness is a

very crucial and widely studied. Many works are done to reduce crosslink density or to increase the

distance between crosslinks by the addition of reactive or inert component such as aromatic

diamines,[ 7 ]

diallyl bisphenol A, certain epoxies and carboxyl-terminate butadiene/acrylonitrile

(CTBN) elastomers.[8,9] A two-component bismaleimide system (XU292), composed of BMDM and

DABPA, has been developed by the Ciba Geigy Corporation to improve mechanical properties and

processability.[ 10 ]

During curing, DABPA copolymerizes with BMDM via an ene-type linear

chain-extension reaction followed by the Diels-Alder reaction. The brittleness of the cured resin is

improved, compared with the conventional bismaleimide resins. The toughness of these

thermosetting resins has been increased by blending with functionalized thermoplastics.[11] But most

modification might reduce the glass transition temperatures and the thermal stability of the cured BMI

resins.

Engineering thermoplastics are interesting materials as modifers for BMI resins from the

viewpoint of the maintenance of mechanical and thermal properties for the matrix resins.[12,13]

High

performance thermoplastics with high glass transition temperatures and toughness, such as poly(ether

imide),[14,15]

poly(ether sulfone) (PES) ,[16]

and PEEK , [17]

have been extensively used to toughen

Advanced Materials Research Vols. 197-198 (2011) pp 1299-1305Online available since 2011/Feb/21 at www.scientific.net© (2011) Trans Tech Publications, Switzerlanddoi:10.4028/www.scientific.net/AMR.197-198.1299

All rights reserved. No part of contents of this paper may be reproduced or transmitted in any form or by any means without the written permission of TTP,www.ttp.net. (ID: 134.148.29.34, University of Newcastle, Callaghan, Australia-17/03/14,04:57:45)

Page 2: Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

brittle BMI resins. But most these BMI resins have poor phase adhesion for their poor compatibility.

Therefore, many functionalized PEEK with groups that may react with BMI had been prepared to

modified BMI resins. An interesting finding was got that the functionalized PEEK would impressive

improve the fracture toughness but with no appreciable drop in grass transition temperature. [18]

In this work, a PEEK bearing reactive pendant propenyl groups statistically distributed along the

backbone is introduced to use as modifiers for bismaleimide resin. The phase adhesion can be

improved by the reaction of the propenyl groups with bismaleimide. The influence of the PEEK

amount on the toughness, glass temperature transition and morphology for PEEK/BIM matrix will be

studied.

Experimental

Materials. DFBP (99.8%) was bought from Changzhou Huashan Chemical Co. (Jiangsu China).

DABPA (99.2%) was purchased from Laiyu Chemical Co. (Laizhou Shandong China). Highly pure

BMDM was kindly provided by the Northwest Research Institute of Chemical Industry (Shanxi

China). Reagent-grade methanol, N,N’-dimethylacetamide (DAMc), bisphenol A (BPA), toluene,

methanol, chloroform and anhydrous potassium carbonate were obtained from commercial sources

and used without further purification.

Preparation of PEEK with pendant propenyl groups. The propenyl groups functionalized

PEEK was prepared by nucleophilic aromatic substitution of DFBP with the mixture of DABPA and

BPA in DMAc at about 25% solid content (w/w) and 25% excess of powdered potassium carbonate as

initiator (Scheme 1). The molar ratio of the DABPA and BPA was 1/1. The mixture was refluxed for

3 h at 140 to azoetrope off the formed water by toluene. After distilling off the excess toluene, the

temperature was slowly raised to 160 and maintained at this temperature for 6 h. Before cooling

down the reaction, additional DMAc was added to dilute the reaction solution. The result viscous

polymer solution was poured into the mixture of methanol/water (l:1 v/v) to precipitate out the

polymer. The precipitate was filtered off and washed with water. The recovered polymer was dried at

80 under vacuum. The yield was 96% and the inherent viscosity was 0.56g/dL.

C FF

O

C

CH3

CH3

OHHO

C

CH3

CH3

OO C

O

C

CH3

CH3

OO C

O

+ +

DMAc, Toluene, K 2CO31407 , 3h

C

CH3

CH3

OHHOn n 2n

n n

1607 , 6h

Scheme 1. Synthesis of the reactive PEEK.

Preparation of BMI/PPEK Blends. The blends containing 0 to 10 phr PEEK (Table1) were

prepared as follows: PEEK was dissolved in DABPA solvent at 160 . The clear yellow solution

was cooled down to 130 and the BMI powder was added. The mixture was stirred continuously

until a homogenous solution was got. The weight proportion of the DABPA and BMI was fixed at

100:75. The resulting clear blends were degassed under vacuum at 130 and poured into a

preheated mold. When the proportion of the PEEK exceed 10 phr, the viscosity of the mixture would

turn to too high to blend the composites uniformly. The curing cycle was 160 /2 h +190 /2 h +

1300 New and Advanced Materials

Page 3: Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

230 /4 h. After curing the oven was switched off and the plaques were allowed to cool slowly to

room temperature to avoid cracking.

Table1. Formulations of modified BMI blends.

Sample

BMDM/DABPA

(wight ration) PAEK (wt %)

S1 100/75 0

S2 100/75 2.5

S3 100/75 5

S4 100/75 7.5

S5 100/75 10

Characterizations

The thermal curing behavior and the glass transition temperatures (Tg’s) of the blends were

determined on a NETZSCH 200 PC DSC instrument at a heating rate of 10 /min under nitrogen

protection.

Thermal stability was analyzed using a Seiko TG analyzer (TGA/dynamic thermal analysis, model

SSC-5200) under a nitrogen atmosphere (200 ml/min) at temperature range of 70-600 . The

heating rate was 10 /min.

Inherent viscosity was determined for a solution of 0.5 g/dL in DMAc at 30 with a calibrated

Ubbelonhde viscometer.

The unnotched Izod impact strength of the samples was evaluated as per ASTM D-256-88 by

SANS (Shenzhen, China) impact strength measurement set (ZBC1400-2). As many as five test pieces

were used to generate the data points for the mechanical tests.

The fracture surfaces of the failed specimens from impact measurement were analyzed with a

JSM-7500F SEM. All specimens were sputter coated with a layer of gold before they were examined

by microscope.

Results and discussion

Synthesis of PEEK. The reactive functionalized PEEK with pendant propenyl groups was prepared

by nucleophilic aromatic substitution of DFBP with 1/1 molar ratio mixture of DABPA and BPA as

monomer . The 1H NMR spectrum of PEEK was shown in Figure 1. It could be found from the

1H

NMR data that the ally groups of DABPA were rearranged into propenyl groups by the potassium

carbonate as the base-catalyze in the reaction mixture [19]

. The typical propnyl group signals for the E

isomer appear at 1.71 ppm (methyl protons), 6.21 ppm and 6.50 ppm. The two smaller resonances at

5.75 ppm and 6.38 ppm belong to the double-bond protons of the Z stereoisomer of the propenyl

group. The peak intensity of the E and Z isomer indicates that the propenyl groups mostly state in the

stable Z situation. The double bond containing PEEK with 0.56g/dL inherent viscosity readily

obtained. The polymer is soluble in chlorinated solvents such as chloroform and dipolar solvents such

as NMP. Therefore, they could cast from solution to form flexible and transparent membranes. It

should be noted that some cross-linking reaction occurred during the polymerization when the

reaction temperature exceed 165

, resulting insoluble product. So the reaction temperature was

accurately controlled under 165 . There is a thermally cross-linking exothermic peak from

235~270 at the DSC trance of the polymer in Figure 2. This means that the prepared polymer

could be easily cured by thermal.

Advanced Materials Research Vols. 197-198 1301

Page 4: Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

Figure 1. 1H NMR spectrum of the prepared PEEK.

150 200 250 300 350

Temprerature,oC

Exo

Endo

Figure 2. The DSC trance of the thermal cross-linking reaction for the prepared polymer.

Preparation of BMI/PEEK Blends. The prepared PEEK with propenyl groups is easily soluble in

the DABPA at high temperature about 170 without any solvent by melt process. Because the

cross-linking reaction for the propenyl groups of the PEEK and the ally groups of the DABPA would

not occur under this temperature, so this technique is optional, environmental and saving. The BMI

would cured with the propenyl groups of the PEEK and the ally groups of the DABPA at high

temperature, so it was added to the DABPA and PEEK solution below the 130 .

Curing behavior of Blends. The curing behavior is important to comprehend the cure reaction.

Hence, dynamic DSC measurements were carried out to track the curing behavior for the BMI blends

containing 0 and 10 phr PEEK at 10 K/min, respectively. The DSC curves of the blends were shown

in Figure 3. Obviously, there were two exothermic peaks on the DSC curves in the range of 100–300

. The first exothermic peak in the range of 100-190 was attributed to the “ene” reaction of the

BMI and DABPA monomers to form “ene” adduct. And the principal cure reactions occur in the

range of 200–300 via the –C=C– double bonds, such as Wagner-Jauregg reaction, Diels-Alder

reaction, thermal rearrangement, and thermal cross-linking, to form a three-dimension networks.

Comparing the curve S1 and S5, it was found that the top exothermic peak of the first peak for the

1302 New and Advanced Materials

Page 5: Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

curve S5 (165 ) was 10 higher than that of curve S1 (155 ). It indicated that the presence of

PEEK heightened the temperature of “ene” reaction for BMI and DABPA. The DSC curves of the

cured BMI blends were showed in Figure 4. The added PEEK decreased the cross-linking density, so

the Tgs of the blends decreased from 272 to 245 with increasing reactive PEEK from 0 phr to

10 phr. The thermal stability of the cured blends was also characterized by TGA. Figure 5 shows the

TGA profiles of cured blends containing the modifier PEEK from 0 phr to 10 phr labeled as S1, S2, S3,

S4 and S5. It could be seen that all samples show similar decomposition trend, but the difference was

that the decomposition rate decreased with the PEEK content increasing. This means that the PEEK

has good contribution to the thermal stability of the blends.

100 150 200 250 300 350

Temperature, oC

S1

S5Exo

Endo

Figure 3. The DSC trances of the thermal curing behavior for the BMI blends.

100 150 200 250 300 350

Temperature, oC

Exo

Endo

S1

S2

S3

S4

S5

Figure 4. The Tgs of the BMI blends.

Advanced Materials Research Vols. 197-198 1303

Page 6: Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

100 200 300 400 500 60020

30

40

50

60

70

80

90

100

Weight remaining,oC

Temperature, oC

S1

S2

S3

S4

S5

Figure 5. The TGA curves of the BMI blends.

Morphology and Toughening Mechanism. The final phase structures and toughness mechanism

can be obtained from the fracture morphology. Therefore, the impact fracture surfaces without further

treatment were directly investigated by SEM. Mechanical properties are important properties of a

matrix for advanced composites, especially those used as structural materials. The impact strength

and fracture toughness (GIC) of the BMI blends were listed in Table2. The impact strength and

fracture were significantly improved by the reactive PEEK. The toughening mechanism could be

reflected from the morphology of the failure surface. It can be seen that the fracture surface of S1

sample is smooth and crack propagation uninterrupted (Figure 6a), suggesting a brittle fracture. There

are microcracks and ridge patterns on the fracture surface of S5 sample (Figure 6b). The crack

deflection and bifurcation at the crack tip region absorbed more energy for propagation of the crack.

In this case, the crack was split into some branches and initiated more ductile microcracks, resulting in

increased surface area of the cracks, thereby increasing the toughness. There are very little PEEK

particles separated out from the BMI phase with curing reaction developing, but no obvious separated

phase structure could be found. This is due to the adequate interfacial adhesion between the PEEK

and BMI resin resulted from cross-linking reaction of pendant propenyl groups with BMI.

Table2. Impact strength of the blends

Property S1 S2 S3 S4 S5

Impact strength (KJ/m2) 9.0 12.3 13.5 14.6 15.2

GIC (J/m2) 186 207 221 231 239

Figure 6. SEM micrographs of fracture surface for cured BMI blends.

1304 New and Advanced Materials

Page 7: Bismaleimide (BMI) Resin Modified by PEEK Bearing Pendant Reactive Propenyl Groups

Conclusions

In this study, a reactive PEEK with pendant propenyl groups was prepared by nucleophilic aromatic

substitution of DFBP, DABPA and BPA as monomer. The prepared reactive PEEK was introduced to

toughen BMI resin with varying proportion. When the PEEK reached 10 phr, the impact strength and

fracture toughness were elevated from 9.0 KJ/m2

and 186 J/m2 to 15.2 KJ/m

2 and 239 J/m

2,

respectively. The PEEK improved the thermal stability of the blends. Due to the adequate interfacial

adhesion between the PEEK and BMI resin, there is no obvious separated phase structure could be

found on the failure surface.

Acknowledgements

The authors acknowledge the support of natural science foundation of Fujian province of China (No.

2009J05024).

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