Business Models and Technology Advances in Dual Interface and Multi Technology Cards ICMA – EXPO 2005 Miami, 16th – 19th October Presented by: Thies Janczek

Business Models and

Technology Advances in

Dual Interface and Multi Technology

Cards

ICMA – EXPO 2005

Miami, 16th – 19th October

Presented by: Thies Janczek

COCASO 2October, 17th 2005 ICMA Expo, Miami

Content

Introduction Business Cases for Dual Interface Cards

Banking Application ID Application

Technology Advances DIC Dual Interface Cards Multi Technology Cards

Driving factors Summary


Introduction

Smart cards are developing to increasing functionality

Increasing Employment of Dual Interface Cards Dedicated Contactless and Contact Usage

Integration of Electrical Functional Components Battery, Display, Solar Power Unit, Switch,

Sensors (e.g. Biometric) etc. Project driven Customizing, Non Standard Low Volume and High Costs

Increa

sing co

mple

xity


Dual Interface Card- Applications

Wireless Interface for Identification Access Low security ID Border control

Contact Interface for Security/Signature PKI for Transaction Data Exchange with High Rates/Volume High Security ID (e.g. Biometric)


Dual Interface CardsBanking Application

Contactless transactions (e.g. Paypass) in North America in project status EMV application in planning

Contact for EMV application Europe, Asia, EMEA, Africa Existing card reader infrastructure Open platforms for non-financial add-on‘s

Dual Interface Card projects in Asia



Mastercard and Visa provide Dual Interface Operating systems MChip and JCOP

Existing Card Reader Infrastructures Europe contact reader in business and

private environment North America currently building up

Contactless systems Interoperability



Multi Application of financial cards will ask for Dual functionality Non financial Add on’s (e.g. public

transport) Involved costs to be paid by

Scheme provider Customer

Interoperability in payment between Continents just for a minority of customer


Dual Interface CardsID Application

Contactless Interface for travel documents is defined by ICAO Passport with biometric data storage

projects in every country Current set up of border control

infrastructures Need for increased security



ID cards ID cards are employed in many countries

with increasing use Card size is merging to ID-001 In the EU Schengen area ID cards are

valid travel documents PKI infrastructures for governmental

applications (tax, registration etc. via internet) are installed on contact basis.



The ID card in the EU will merge to a Dual Interface ID-001 card.

For traveling identification with an ICAO conform contactless interface Including storage of biometric data

For secure authentification in a PKI infrastructure on a contact interface Including key generation and verification

for multiple applets


DIC Technology AdvancesBasics

Module – Contacts – Antenna Electrical Connection by

Anisotropic conductive adhesive (ACA) Isotropic conductive adhesive (ICA) Welding Technologies (TC bonding) Electro Magnetic Coupling


DIC Technology AdvancesBasics

Main target is on the card sideto get a reliable connection between the module/chip and the antenna


adhesive matrix connection particals

adhesive matrix

microconnections micro contacts

*Anisotropic Conductive Adhesive

DIC Technology Advances- ACA* Connection

Further technology development Optimization of the polymer matrix Optimization of the conductive filler

In testing at various cardmanufacturer


Epoxy silver filled has been replaced by flexible systems on silicone basis Flexible Bump (Mühlbauer, D) Polymer Spring (SPS, F)

Good reliability results due to permanent elastical pressure onto the contacts

Systems are in testing and qualification at card manufacturer

DIC Technology Advances- ICA* Connection


DIC Technology Advances- Welding Connection

BASIC CARD STRUCTUREAntenna

Wire embedded Hot melt

tape

Thermo Compression bonding window

M8.4 Module

Mag stripe (option)

Overlay

CA

RDIN

LA

Y

White or printed sheet


DIC Technology Advances- Welding Connection

Thermal Compression welding results in a very hard and strong connection.

Different technologies available Wire “pull out” on the finished card (China) Prelams with module connected (Smartrac)

available as blank white cards, prelaminated inlays (development), and unlaminated inlays (Q4/05)

Cards in testing and qualification at card manufacturer


DIC Technology Advances- Electro Magnetic Coupling

The contact between the module and a special trimmed ID1 antenna (booster) is a specific electromagnetic coupling.

NO contact between the devices. Highest reliability, material independent

(PVC, PC, PET etc.) Testing and qualification at card

manufacturer and passport producer


Technology AdvancesMulti Technology Cards

DISPLAY KEYPAD BATTERY RELOADABLE

BATTERY ANTENNA

SENSORS BIOMETRIC SENSOR SOLAR POWER UNIT DATA STORAGE COMPUTING


Multi Technology Cards- Development

ISO compliant sample cards are in development.

High development activity for certain components Driving factor are electronic devices (e.g.

PDA, Mobile, electronic paper)DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH -

DIODES - BATTERY - ANTENNA - SENSORS - AKKUMULATOR - SOLAR POWER UNIT -

DATA STORAGE - COMPUTING


Summary

Increased DIC demand lead to reliable Module/Antenna connections

Industrial High Volume DIC Production in 2006 High Potential for Lucrative Business Cases Products with Complex Electronic Circuits

have been proposed and are under further development

High R&D Activity lead to New Components and Technologies for Smart Cards


THANK YOU

FOR YOUR ATTENTION

Business Models and Technology Advances for DIC

More Information:COCASO – Thies Janczek – Moewenstrasse 5a – 24113 Molfsee – Germany

Phone: +49-(0)4347-703526 – Email : [email protected]


Documents

Business Models and Technology Advances in Dual Interface and Multi Technology Cards ICMA – EXPO 2005 Miami, 16th – 19th October Presented by: Thies Janczek