BYQ28EX

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Philips Semiconductors Product specificatio

Rectifier diodes BYQ28F, BYQ28EX seriesultrafast, rugged

FEATURES SYMBOL QUICK REFERENCE DATA

Low forward volt drop VR= 150 V/ 200 V Fast switching Soft recovery characteristic VF0.895 V Reverse surge capability High thermal cycling performance IO(AV)= 10 A Isolated mounting tab

IRRM= 0.2 A

trr25 ns

GENERAL DESCRIPTIONDual, ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode powesupplies.

The BYQ28F series is supplied in the SOT186 package.The BYQ28EX series is supplied in the SOT186A package.

PINNING SOT186 SOT186A

PIN DESCRIPTION

1 anode 1 (a)

2 cathode (k)

3 anode 2 (a)

tab isolated

LIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

BYQ28F / BYQ28EX -150 -200VRRM Peak repetitive reverse voltage - 150 200 VVRWM Crest working reverse voltage - 150 200 V

VR Continuous reverse voltage Ths148C - 150 200 VIO(AV) Average rectified output current square wave - 10 A

(both diodes conducting)1 = 0.5; Ths92 CIFRM Repetitive peak forward current t = 25 s; = 0.5; - 10 A

per diode Ths92 CIFSM Non-repetitive peak forward t = 10 ms - 50 A

current per diode t = 8.3 ms - 55 Asinusoidal; with reappliedVRWM(max)

IRRM Repetitive peak reverse current tp= 2 s; = 0.001 - 0.2 Aper diode

IRSM Non-repetitive peak reverse tp= 100 s - 0.2 Acurrent per diode

Tstg Storage temperature -40 150 C

Tj Operating junction temperature - 150 C

k

a1 a21 3

2

1 2 3

case

1 2 3

case

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ESD LIMITING VALUE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VC Electrostatic discharge Human body model; - 8 kVcapacitor voltage C = 250 pF; R = 1.5 k

ISOLATION LIMITING VALUE & CHARACTERISTICThs= 25 C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Visol Peak isolation voltage from SOT186 package; R.H. 65%; clean and - - 1500 Vall terminals to external dustfreeheatsink

Visol R.M.S. isolation voltage from SOT186A package; f = 50-60 Hz; - - 2500 Vall terminals to external sinusoidal waveform; R.H. 65%; cleanheatsink and dustfree

Cisol Capacitance from pin 2 to f = 1 MHz - 10 - pFexternal heatsink

THERMAL RESISTANCES


Rth j-hs Thermal resistance junction to with heatsink compound - - 5.7 K/W

heatsink without heatsink compound - - 6.7 K/WRth j-a Thermal resistance junction to in free air - 55 - K/Wambient

ELECTRICAL CHARACTERISTICScharacteristics are per diode at Tj= 25 C unless otherwise stated


VF Forward voltage IF= 5 A; Tj= 150C - 0.80 0.895 VIF= 5 A - 0.95 1.10 VIF= 10 A - 1.10 1.25 V

IR Reverse current VR= VRWM; Tj= 100 C - 0.1 0.2 mAVR= VRWM - 2 10 A

Qs Reverse recovery charge IF= 2 A; VR30 V; -dIF/dt = 20 A/s - 4 9 nC

trr1 Reverse recovery time IF= 1 A; VR30 V; - 15 25 ns-dIF/dt = 100 A/strr2 Reverse recovery time IF= 0.5 A to IR= 1 A; Irec= 0.25 A - 10 20 nsIrrm Peak reverse recovery current IF= 5 A; VR30 V; -dIF/dt = 50 A/s - 0.5 0.7 AVfr Forward recovery voltage IF= 1 A; dIF/dt = 10 A/s - 1 - V

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Fig.1. Definition of trr1, Qsand Irrm

Fig.2. Definition of Vfr

Fig.3. Circuit schematic for trr2

Fig.4. Definition of trr2

Fig.5. Maximum forward dissipation PF= f(IF(AV)) perdiode; square current waveform where

IF(AV)=IF(RMS)x D.

Fig.6. Maximum forward dissipation PF= f(IF(AV)) perdiode; sinusoidal current waveform where a = form

Qs

100%10%

time

dI

dt

F

IR

IF

Irrm

trr

I = 1AR

recI = 0.25A

0A

trr2

0.5A

IF

IR

time

time

V F

Vfr

V F

IF

0 1 2 3 4 5 6 7 80

1

2

3

4

5

6

7

8

D = 1.0

0.5

0.2

0.1

BYQ28

IF(AV) / A

PF / W Ths(max) / C

150

144.3

138.6

132.9

127.2

121.5

115.8

110.1

104.4

D =tptp

T

T

t

I

Vo = 0.748 V

Rs = 0.0293 Ohms

shunt

Current

to scope

D.U.T.

Voltage Pulse Source

R

0 1 2 3 4 5 60

1

2

3

4

5

6

a = 1.57

1.92.2

2.8

4

BYQ28

IF(AV) / A

PF / W Ths(max) / C

150

144.3

138.6

132.9

127.2

121.5

115.8Vo = 0.748 V

Rs = 0.0293 Ohms

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Fig.7. Maximum trrat Tj= 25 C; per diode

Fig.8. Maximum Irrmat Tj= 25 C; per diode

Fig.9. Typical and maximum forward characteristicIF= f(VF); parameter Tj

Fig.10. Maximum Qsat Tj= 25 C; per diode

Fig.11. Transient thermal impedance; per diode;Zth j-hs= f(tp).

1

10

trr / ns

1 10 100

1000

100

dIF/dt (A/us)

IF=1A

IF=5A

0.1

1.0

10

100Qs / nC

1.0 10 100-dIF/dt (A/us)

IF=5A

IF=2A

IF=1A

10

1

0.1

0.01

Irrm / A

1 10 100-dIF/dt (A/us)

IF=5A

IF=1A

1us 10us 100us 1ms 10ms 100ms 1s 10s0.001

0.01

0.1

1

10

BYQ28F/EXpulse width, tp (s)

Transient thermal impedance, Zth j-hs (K/W)

D =tptp

T

TP

t

D

0 1

15

10

5

0

0.5VF / V

1.5

IF / A

typ max

Tj=150C

Tj=25C

BYQ28

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MECHANICAL DATA

Dimensions in mm

Net Mass: 2 g

Fig.12. SOT186; The seating plane is electrically isolated from all terminals.

Notes1. Refer to mounting instructions for F-pack envelopes.2. Epoxy meets UL94 V0 at 1/8".

10.2max5.7max

3.23.0

0.90.5

4.4max

2.9 max

4.4

4.0

seating

plane

7.97.5

17max

0.55 max

1.3

13.5

min

2.54

5.08

0.90.7

1 2 3

M0.4

top view

3.5 max

not tinned4.4

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MECHANICAL DATA

Dimensions in mm

Net Mass: 2 g

Fig.13. SOT186A; The seating plane is electrically isolated from all terminals.

Notes1. Refer to mounting instructions for F-pack envelopes.2. Epoxy meets UL94 V0 at 1/8".

10.3max

3.23.0

4.6max

2.9 max

2.8

seating

plane

6.4

15.8max

0.6

2.5

2.54

5.08

1 2 3

3 max.not tinned

3

0.5

2.5

0.9

0.7

M0.4

15.8max.

19max.

13.5min.

Recesses (2x)

2.5

0.8 max. depth

1.0 (2x)

1.3

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DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above oneor more of the limiting values may cause permanent damage to the device. These are stress ratings only andoperation of the device at these or at any other conditions above those given in the Characteristics sections of

this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 1998

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of thecopyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to beaccurate and reliable and may be changed without notice. No liability will be accepted by the publisher for anyconsequence of its use. Publication thereof does not convey nor imply any license under patent or otherindustrial or intellectual property rights.

LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of theseproducts can be reasonably expected to result in personal injury. Philips customers using or selling these productsfor use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resultingfrom such improper use or sale.

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BYQ28EX