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COVALENT COMPOUNDS

C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

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Page 1: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

COVALENT COMPOUNDS

Page 2: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

COVALENT COMPOUNDS1. Usually soft and squishy

2. Not soluble in water

3. Does not conduct electricity

4. Low melting points

5. Low boiling points

Page 3: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

TWO TYPES OF BONDS Ionic: Electrons are transferred

Covalent: Electrons are shared Non-polar covalent: equally shared

Polar Covalent: unevenly shared

Page 4: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

NAMING COVALENT COMPOUNDS

Page 5: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

NAMING COMPOUNDS

Nonmetal – Nonmetal

USE PREFIXES!

1. Change the ending of the second word to -ide

2. No mono on the first word

3. Drop any double vowels

Page 6: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

COVALENT PREFIXESNumber of Atoms Prefix

1 Mono-2 Di-3 Tri-4 Tetra-5 Penta-6 Hexa-7 Hepta-8 Octa-9 Nona-

10 Deca-

Page 7: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

THE PREFIX TELLS YOU HOW MANY ATOMS YOU

HAVE!NO CRISS CROSS!!!!

Page 8: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

EXAMPLES

1. CO

2. CO2

3. SO2

4. SO3

5. N2H4

6. N2O3

1. Carbon Monoxide

2. Carbon Dioxide

3. Sulfur Dioxide

4. Sulfur Trioxide

5. Dinitrogen Tetrahydride

6. Dinitrogen Trioxide

Page 9: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

EXAMPLES

1. disilicon hexafluoride

2. tricarbon octachloride

3. phosphorus pentabromide

4. nitrogen monoxide

5. selenium difluoride

6. dihydrogen monoxide

1. Si2F6

2. C2Cl8

3. PBr5

4. NO

5. SeF2

6. H2O

Page 10: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

EMPIRICAL AND MOLECULAR FORMULAS

Page 11: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Define Empirical Formula:A chemical formula that gives the simplest whole-number ratio of the elements in the formula.

Which of the following is an empirical formula? CO2 C2O4

Fe2Cl6 FeCl3

Page 12: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Define Molecular Formula:A chemical formula that gives the actual number of the elements in the molecular compound. For the following molecular formulas, write the empirical formula:

Molecular: Empirical: C2H4 C6H12O6

C9H21O6N3

Page 13: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

LEWIS STRUCTURES

Page 14: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

F F

LEWIS STRUCTURES FOR COMPOUNDS The pair of dots between two symbols

represents the shared pair. How many shared pairs does each fluorine have

below?

An unshared pair, also called a lone pair, is a pair of electrons that is not involved in bonding and that belongs exclusively to one atom.

Page 15: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

F F

LEWIS STRUCTURES

The shared pair of electrons is often replaced by a long dash.

Each dash represents TWO electrons

Page 16: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

F F+

7e- 7e-

F F

8e- 8e-

F F

F F

Lewis structure of F2

lone pairslone pairs

lone pairslone pairs

single covalent bond

single covalent bond

WHY SHOULD TWO ATOMS SHARE ELECTRONS?

To get a valence of 8 electrons!

Page 17: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

HC

HCH

H

MULTIPLE COVALENT BONDS double bond:

covalent bond in which two pairs of electrons are shared between two atoms

shown by two side-by-side pairs of dots or by two parallel dashes

Page 18: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

MULTIPLE COVALENT BONDS triple bond:

covalent bond in which three pairs of electrons are shared between two atoms

shown by three side-by-side pairs of dots or by three parallel dashes

Page 19: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

STEPS FOR DRAWING LEWIS STRUCTURES1. Draw the Lewis Dot diagram for each individual

atom

2. Count up the number of valence electrons

3. Connect the atoms together to pair up the electrons (put atoms that can make the most connections in the center)

4. Once all electrons are paired, recount electrons to double check total valence

Page 20: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

PRACTICE

Draw the Lewis Structure for HBr

1. H Br2. 1 + 7 = 8

3. H — Br

4. 2 + 6 = 8

Page 21: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

BOND POLARITY

Page 22: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Which element is the most electronegative?

H F

Fluorine- Has 7 valence e- and wants 8

ability of an atom to attract electrons

REVIEW:WHAT IS ELECTRONEGATIVITY?

Page 23: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

H F FH

electron richregion

electron poorregion

e- riche- poor

d+ d-

POLAR BOND :

covalent bond with greater electron density around one of the two atoms

Page 24: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

1

2

3 4 5 6 7 8 9 10 11 12

13 14 15 16 17

18

Page 25: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

NonpolarCovalentshare e-

Polar Covalentpartial transfer of e-

Ionictransfer e-

Increasing difference in electronegativity

Electronegativity Difference Bond Type

0 to 0.3 Nonpolar Covalent

0.4 to 1.6 Polar Covalent

1.7 Ionic

WHAT TYPE OF BOND IS IT?

Page 26: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Classify the following bonds as ionic, polar covalent,or covalent:

Cs – 0.7 Cl – 3.0 3.0 – 0.7 = 2.3 Ionic

H – 2.1 S – 2.5 2.5 – 2.1 = 0.4 Polar Covalent

Cl – 3.0 N – 3.0 3.0 – 3.0 = 0 Nonpolar Covalent

Cs to Cl

H to S

Cl to N

Page 27: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

INTERMOLECULAR FORCES

Page 28: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Intermolecular forces: attractive forces between molecules.

Intramolecular forces: attractive forces within a molecule (the bonds)

intramolecular forces are much stronger than intermolecular forces

Intramolecular Forces

Intramolecular Forces

Intermolecular Forces

Page 29: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

DIPOLES

What is a dipole?

A polar molecule

Uneven sharing of electrons so there is a separation of charge

Page 30: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

DIPOLE-DIPOLE FORCES

Attraction between two polar molecules

— + — +

Page 31: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

HYDROGEN BONDING

Special type of Dipole – Dipole

Attraction between:Hydrogen and Nitrogen/Oxygen/Fluorine

Page 32: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

DIPOLE – INDUCED DIPOLE Attraction between one polar and one

nonpolar molecule

— +

— + — +

Electrons shift toward

positive end of dipole

Page 33: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

LONDON DISPERSION FORCES Attraction between two nonpolar molecules

— + — +

Electrons become

uneven and form a dipole

Page 34: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

STRENGTH OF IMF

Hydrogen Bond

Dipole – Dipole

Dipole – Induced Dipole

London Dispersion Forces

strongest

weakest

Page 35: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

WHAT DOES IMF EFFECT? Viscosity

Surface Tension

Cohesion/Adhesion

Boiling Point

Page 36: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Stronger IMF Higher Viscosity

VISCOSITY

Measures a fluid’s resistance to flow

Page 37: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Stronger IMF Higher Surface Tension

SURFACE TENSION

result of an imbalance of forces at the surface of a liquid.

Page 38: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points
Page 39: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

Adhesion

Cohesion

ADHESION AND COHESION Cohesion:

intermolecular attraction between like molecules Adhesion:

intermolecular attraction between unlike molecules

Page 40: C OVALENT C OMPOUNDS. 1. Usually soft and squishy 2. Not soluble in water 3. Does not conduct electricity 4. Low melting points 5. Low boiling points

BOILING POINT

Point at which liquid particles escape the surface of the liquid into the gas phase

Stronger IMF Higher Boiling Point