C350 Lead Free Soldering Machine

Product Features & Benefits

• Best in Class Lead Free• Compact & economy designed for PCB width Max. 350mm• Solder tank contains 158kg only

C350 Lead Free Soldering MachineC350 Wave Solder Key Features

• High-Quality Design and Construction To Meet Standards of Japanese Electronics Market

• Small Footprint - Approx. 2340 mm x 980 mm (92.1" x 38.5")• Single- or Dual-Wave Configurations for Through-Hole and Surface Mount

Assemblies• Seamless, Cast-Iron (150 kg cap.) Solder Pot with Corrosion-Resistant Coating and

Three-Year Warranty• Built-In Solder Pot Loading and Maintenance Platform with Locking Support

Mechanism• Heavy-Duty Pump Motor with Dial-Adjustable Wave Height Control; Low-Temp and

Overheat Alarms• Innovative Drum-Spray Fluxer for Superior Flux Application Consistency and Reduced

Operating Cost• Optical Sensors for On/Off Control of Fluxing and Wave Operations• Stainless-Steel Sheath-Type IR Preheater with PID Temperature Control Control• High-Temperature, Corrosion-Resistant, Finger-Type Conveyor with Width and

Angular Adjustment• Inlet Pin-Type Conveyor Standard. Optional Motorized, Chain-Driven, Pin-Type Inlet

Conveyor Available• Air Knife Option Distributes Flux Evenly While Preventing Flux from Entering Preheat

Area• Touch-Panel PLC Controller with Weekly Timer for Startup and Shutdown

More Information

Specially Coated 150 kg Solder Pot Includes Three Year Replacement WarrantyThe C350 includes a seamless, cast-iron solder pot with a specially formulated, corrosion resistant coating and is covered by a full three-year replacement warranty. In keeping with the C350's compact design, the solder pot, despite its ample 350 mm width, has a modest 150 kg capacity, reducing overall startup costs and contributing to its low cost of ownership. High-efficiency heaters, combined with the pot's small volume, considerably reduce startup time and consume much less energy, but more importantly reduce oxidation and dross formation. Another unique feature of the C350 system (like the C250) is that the solder pot and wave assembly easily slide out from the rear of the unit onto an extendable platform for easy loading and maintenance.

C350 Lead Free Soldering Machine

Single- or Dual-Wave Configurations to Suit Any Wave Soldering Application

The C350 is supplied as standard in a single-wave configuration for conventional through-hole assemblies, but for minimal additional cost can also be supplied as a dual-wave system for surface mount and mixed technology boards. Dual-wave technology often provides improved hole penetration and reduced bridging on difficult-to-solder boards of all technologies and therefore makes the dual-wave configuration very popular. If necessary, the chip wave in dual-wave systems can easily be deactivated through the installation of a nozzle cover plate included with this option. Wave height control is dial-adjustable to a maximum height setting of 10 mm (.39") and the wave pump motor, with on/off control activated by optical board sensors on the conveyor, is also protected by low temperature and overheat alarms.

Adjustable Fiber-Finger Conveyor and IR Preheater Allow Precise Lead-Free Profiling

The C350 Wave Soldering System includes a high-temperature, corrosion-resistant, fiber-finger conveyor system with variable speed up to 2 m/min (79"/min). Conveyor angle (3°-6°) and width are easily-adjustable to accommodate PCBs from 30 mm to 350 mm (1.2" to 10"). A chain-driven, pin-type inlet conveyor is included as standard and allows easy loading of assemblies and smooth transfer into the conveyor fingers. After flux application, a 600 mm IR preheater uses stainless-steel sheath-type heaters to raise PCBs and components to manufacturers' recommended temperatures for proper activation of VOC-Free and Lead-Free fluxes. The IR preheat zone is enclosed in a stainless steel internal housing, with a temperature resistant, dual-layer, glass hood, for increased thermal stability.

C350 Lead Free Soldering Machine

Innovative Drum-Spray Fluxing System Included As Standard Equipment

Our revolutionary Drum-Spray Fluxing Technology, included as standard equipment with C350 systems, combines the simplicity of a foam fluxer with the precision of a spray fluxing system. Its simple, innovative design is extremely easy to set up and maintain and is just one more example of a feature we've added to contribute to the C350's low cost of ownership. As shown in the diagram below, the Drum-Spray nozzle is positioned as close to the bottom of the PCB as possible and precisely applies flux in a thin vertical knife pattern across the full width of the board as it passes over the rotating drum. This method has been shown to provide more uniform application and less flux waste than systems that utilize small nozzles mounted to a reciprocating motor drive below the PCB. An adjustable mask is used to control the width of the spray pattern and optical sensors provide on/off control of the spray mechanism.

Video:https://youtu.be/uZbbTxEz9Yw

C350 Lead Free Soldering Machine

C350 Lead Free Soldering Machine

C350 Lead Free Soldering Machine

C350 Lead Free Soldering Machine