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Lowest cost per watt
High throughput up to 6,000 w/h Minimum running and maintenance costs 30% cost savings to market standard 50% less power consumption Lowest breakage rates for standard and thin wafers Bio-degradable insulation material (CE-certified, no additional safety measures required)
Innovative tool concept
Ceramic roller transport system for metal free and smooth cell transport Inline furnace with up to 8 lanes for multiple applications like diffusion, annealing and curing No yield loss in case of power shut down
Superior process results
No metal contamination Precise temperature control and excellent temperature uniformity Gas flow engineering via adjustable gas inlets and exhausts
CALiPSOFlexible Heat Treatment Furnace
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Steady state time between some minutes and hours (ill. 1) Low and high temperature applications (200°C – 1,000°C) (ill. 2) Individually closed loop controlled heating zones per module Up to 8-lane processing of 6 cells (other substrates of 4» to 40» possible) Heating length from 4.5 to 50 m Simple and safe process chamber access Innovative solution for easy maintainability Versatile gasflow engineering options Combination with various inline doper possible
EmitterDiffusion
Phosphor Glass (PSG)
Etching
Anti-Reflection Coating, Rear and Front Side
Passivation (Al2O3, SiNx)
LaserAblation
Screen Print
Contact Firing
MB-PERC process
Module B - Smallm x Process zone1,300mm
Module ALoading zone3,900 mm
Module C - Largen x Process zone5,000mm
Tem
pe
ratu
re [
°C]
Time [min]
4.7 m
7.0 m
14.1 m
28.2 m
35.2 m
Heating time [min]
4800
4000
3200
2400
1600
800
0
Th
rou
gh
pu
t [w
afe
r/h
]
Heating length as function of heating time and throughput
0 10 20 30 40 50 60 0 10 20 30 40 50 60
1200
1000
800
600
400
200
0
Curing Cell Tester& Sorter
Screen Printing
PECVD 2Front Side i/p
PECVD 1Back Side i/nTexturing
Heterojunction Technology process
PVDTCO Front/ Back Side
Back Contact
Module DUnloading zone3,900 mm
CALiPSO: Modular design
ill. 2ill. 1
1760
2361
1765 965
3900 4992 1248 3900
Technical data at a glance
Meyer Burger (Germany) AG, [email protected], www.meyerburger.com
Width ~ 2,360 mm
Height ~1,765 mm
Length Depending on application
Transport speed 0.1 – 10 m/min*
Process temperature up to 1,000 °C
Typical power consumption (@850 °C)
– for 15 m heating zone
– for 25 m heating zone35 kW50 kW
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to m
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/201
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Contact Firing
Cell Tester& Sorter
Anti-Reflection Coating,
Passivation
Screen Printing
EmitterDiffusion
Phosphor Glass (PSG)
Etching
Saw DamageEtching &Texturing
Standard c-Si process
EmitterDiffusion
Phosphor Glass (PSG)
Etching
Anti-Reflection Coating, Rear and Front Side Passivation
(Al2O3, SiNx)
LaserAblation
ScreenPrint
Contact Firing
MB-PERC process
Curing Cell Tester& Sorter
Screen Printing
PECVD 2Front Side i/p
PECVD 1Back Side i/nTexturing
Heterojunction Technology process
PVDTCO Front/ Back Side
Back Contact
Phosphorous Doping
* Depending on tool configuration