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CCTC MFG Capabilities & CCTC MFG Capabilities & Technology Roadmap Technology Roadmap 2010 2010
SIZE
Maximum Processed finish board size 22 X 16inch
Average Processed finish board size 8 X 6inch
Board Size Tolerance ±0.004inch
Maximum Panel Size 24 X 24inch
Minimum Panel Size 14 X 10inch
THICKNESS
Maximum Processed Thickness .250inch
Average Processed Thickness .062inch
Board Thickness Tolerance +/-10%
Warp / Bow and Twist - Inch per Inch ≤0.5%
LAYER CONSTRUCTION
Maximum Processed Layer Count 28
Average Processed Layer Count 8
Minimum Dielectric Thickness (not including Microvia layers) .002inch
Minimum Core Thickness 0.004inch
Layer to Layer Registration .003inch
Dielectric Tolerance Layer to Layer ±10%
CCTC Manufacturing Capabilities
ASPECT RATIO
Maximum Aspect Ratio - Plated Through Holes 10: 1
Maximum Aspect Ratio - Microvia Holes 1: 1
Minimum Drill Size - Mechanically Drilled holes prior to plating .008inch
Minimum Mechanically Drilled Hole size Preferred .010inch
Smallest Finished PTH .006inch
Smallest Finished PTH - Tolerance ±.002inch
Nominal Finished PTH .023inch
Nominal Finished PTH - Tolerance ±.003inch
HOLE SIZE TOLERANCE
PTH Standard ±.003inch
PTH Compliant Pin ±.002inch
NPTH ±.002inch
True Position Tolerance ±.002inch
CCTC Manufacturing Capabilities
CONDUCTOR WIDTH
Minimum Inner Layer Width .003inch
Typical Inner Layer Width .005inch
Minimum Outer Layer Width .003inch
Typical Outer Layer Width .005inch
Minimum Trace on 3 oz base copper +/-.002
Minimum Trace on 4 oz base copper
Minimum Trace on 5 oz base copper +/-.003
CONDUCTOR SPACE
Minimum Inner Layer Space - Trace to Trace .003inch
Typical Inner Layer Space - Trace to trace .005inch
Minimum Outer Layer Space - Trace to Trace .003inch
Typical Outer Layer Space - Trace to trace .005inch
Minimum SMD Land Pattern Pitch 0.016inch
CONTROLLED IMPEDANCE
Impedance Typical - Value Ohms 50 , 75 , 100
Impedance Typical - Tolerance ±10%
Maximum Impedance Capability - Value Ohms 150
Minimum Impedance Capability - Value Ohms 28
Maximum Impedance Capability - Tolerance ±20%(value < 50 Ohms)
Minimum Impedance Capability - Tolerance±8%(single ended impedance value >
100 Ohms)
Impedance Modeling Tool (Type/Name) (I.e.True FieldSolver) Polar CITS25
Impedance Measurement Technique (Equipment/Type) Polar CITS500S
Differential Impedance Measurement Technique (Equipment/Type) Polar CITS500S
CCTC Heavy Copper Capability
Item Normal cap. Special Cap.
Layer ≤8
5oz min. line/space
Inner layer 16/16 mil 14/14 mil
Outer layer (finish) 12/12 mil 10/10 mil
3oz min. line/space
Inner layer 12/12 mil 10/10 mil
Outer layer (finish) 8/8 mil 7/7 mil
Line toleranceInner 3OZ ±2 mil ±1.5 mil
Inner 5OZ ±3 mil ±2.5 mil
Min. Drill bit mm 20 mil 16 mil
CCTC Heavy Copper Capability
ItemNormal
Cap.Special Cap.
Min. copper clearance3OZ ≥12mil
5OZ ≥15mil
Inner layer annular ring (to drill bit)
Inner 3OZ ≥9 mil ≥8mil
Inner 5OZ ≥15 mil ≥12mil
Dielectric Thickness
Inner 3OZ 、 Copper
density≥70%≥0.15mm
Inner 3OZ 、 35%≤copper density<70%
0.25mm
Inner 5OZ ≥0.2mm
CCTC Heavy Copper Capability
ItemNormal capabilit
y
Special capability
Hole to Line mil ≥9mil ≥8mil
Min. Legend width mil ≥5.5 5.0≤X ＜ 5.5
Min. Legend space mil ≥7.5 6≤X ＜ 7.5
Inner layer copper densityInner 3OZ ≥35%
Inner 5OZ ≥80%
TECHNOLOGY
Buried Vias - ConventionalYES
Blind Vias - Conventional YES
Blind Micro viasYES
- How many sequential layers of Micro vias (one side)3
Buried Micro vias (through an individual internal laminate)YES
Buried Resistors - OmegaN/A
Buried Resistors – Printed N/A
Buried CapacitanceN/A
Conductive Via Fill (CB100)N/A
Other Specify N/A
Flex (Layer Count)N/A
Rigid Flex N/A
CCTC HDI Manufacturing Capabilities
LAMINATE MATERIALS Supplier
FR4 Standard Di-Functional Tg = 180 - 185 Shengyi S1000-2, Isola HR370
FR4 Standard Multifunctional Tg = 170℃ Iteq , GW , Grace
FR4 Tetra functional Tg = 140℃ Shengyi , GW , Grace
Resin Coated Copper Tg = 140℃ LG Chemical
Getek-Nelco-13 N/A
Getek-Nelco-13 Equivalent Isola FR408HR
Polyimide Arlon , Isola
BT Epoxy Isola, MGC
Cyanate Ester N/A
PTFE - Teflon Arlon
Halogen Free Panasonic, Shengyi
Rogers RO4350 Rogers
Omega-Ply N/A
Mixed Dielectrics (specify) Rogers 4350/FR4
Metal Backed Substrates N/A
Metal Core N/A
CCTC Manufacturing Capabilities
Tg 140 FR-4Rigid LaminateTg 140 FR-4
Rigid Laminatefor Double Side Rigid Board (Not for lead free assy)
Pro
duc
t
Shengyi 1141Application
Approved LaminatesApproved Laminates
*Isola -FR-226
*Shengyi 1141 KFfor Low to Medium Layer Count Multilayer, Anti-CAF (Not for lead free assy)
for High Frequency/ Low Signal Loss
Tg 150 Multifunction Laminate
Tg 150 Multifunction Laminate
Tg 170 Td Stable Laminate
Tg 170 Td Stable Laminate
Tg 175 Td 330Tg 175 Td 330
Tg 180 Td 340Tg 180 Td 350Tg 180 Td 340Tg 180 Td 350
Tg 210 Low Dk & DfTg 210 Low Dk & Df
Tg >280 Low LossHydrocarbon/ceramicTg >280 Low Loss
Hydrocarbon/ceramic
Halogen Free Green MaterialHalogen Free
Green Material
for Medium to High (Not for lead free assy)Layer Count Multilayer, low CTE
for Medium to High Layer Count Multilayer
for High Layer Count/Dimensional Stable Back Panels ,Lead-free applications
for Thermal Reliable IC Substrate, Multilayer & Telecom PWB
for Environment Friendly PWB
for High Signal Speed/ Signal Integrity Electronics
*Shengyi 1141 150
*Shengyi 1141 170
*Shengyi S1000-2*Isola -370HR
*Isola FR408
* Rogers 4350
*Shengyi 1155*Panasonic
Tg 140 MultifunctionLaminate
Tg 140 MultifunctionLaminate
PTFE Microwave LaminatePTFE Microwave Laminate
Rogers UL22Taconic RF35
* Isola IS410
for High Frequency/ Low Signal Loss
*UL Approved
R&D
Basic Property Comparison for Various Material
According to our experiments on lead free material, the experience during
the PCB manufacturing and also the feedback from our customers during
their assembly, we compared the general property parameters of various
lead free material. Please refer to below table:
Laminate
TypeLF
HF
Tg (℃) /DSC
Td-5% (℃)
/TGA
IPC-4101B
Z-CTE/TMA
T-260 (min)/TMA
T-288 (min)/TMA
Dk/1MHz
Df/1MHz
FillAntiCAF
Res sys
a1/a2 ppm /℃)
50-260℃
IsolaPCLFR-370-HR
Y N 180 350IPC-4101B/
12645/220 2.6% 60 20 4.8
0.015
Y Y PN
Isola FR408 Y N 185 350IPC-4101B/
9919/230 3.3% 60 60 3.6
0.012
N Y MF
Shengyi S1000 Y N 150 335IPC-4101B/
9948/250 3.3% 60 10 4.7
0.011
Y Y PN
Shengyi S1000-2 Y N 180 340IPC-4101B/
12645/220 2.8% 60 20 4.8
0.013
Y Y PN
ITEQ IT158TC Y N 150 340IPC-4101B/
9940/250 3.3% 60 20 4.8
0.016
Y Y PN
ITEQ IT180ATC Y N 180 340IPC-4101B/
12645/240 2.8% 60 20 4.7
0.017
Y Y PN
ELECTRICAL TEST
Net List Extraction YES
Net List Comparison YES
Simultaneous Top and Bottom 100% Net List YES
Maximum number of Nodes 20000
Other (Specify)
PRODUCTION CYCLE TIME
Average Production Cycle Time - Days
Quick Turn Capability - Days 5-7-10 days
Average Production Lot Size (Panels) 100
Maximum Production Lot Size (Panels) 300
Minimum Production Lot Size (Panels) 80
IPC Class 2 and 3 YES
BELLCORE COMPLIANCE
SEC Testing in House YES
SEC Testing Subcontractor N/A
SIR Testing in House YES
SIR Testing Subcontractor N/A
Solderability Testing (Frequency) Per lot for shipment
Steam Age Testing Capability in House N/A
Steam Age Testing Subcontractor N/A
Gold Porosity Measurement Technique YES ,POROSITY TESTER
Gold Roughness Measurement Technique N/A
Gold Thickness Measurement Technique X-Ray
Item
Current 2011 2012
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Resin System
FR-4 Tg 180C° Yes --- Yes --- Yes ---
Halogen Free FR-4 Tg 170C° Yes --- Yes --- Yes ---
PTFE --- Yes --- Yes Yes ---
Rogers Tg 280C° Limited --- Limited --- Yes ---
BT Tg 200 C° Limited --- Limited --- Yes ---
Polyimide Tg 260C° Limited --- Limited --- Yes ---
RCC and LDP
Normal Epoxy Tg 140C° Td 310C°
Yes --- Yes --- Yes ---
Halogen Free Epoxy Tg 150C°Td 350C°
Yes --- Yes --- Yes ---
LDP 170C° Yes --- Yes --- Yes ---
Current Supplier1. Shengyi; 2. Grace; 3. Isola; 4. Rogers; 5. MEM; 6. Nanya; 7. Arlon; 8. MGC; 9. Hitachi. 10. Panasonic
CCTC Tech Roadmap
Item
Current 2011 2012
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Max. layer count 28 32 32 40 36 40
HDI N+C+N 3 4 3 4 3 4
via on buried hole/stack via
Yes --- Yes --- Yes ---
Max. Panel size 24” x 20” 28” x 22” 24” x 20” 30” x 24” 24” x 20” 30” x 24”
Max. board thickness( mm / mil )
5.6 / 220 6.35 / 250 6.35 / 250 7.0/.276 6.35/250 7.0/.276
Min. board thickness( mm / mil )
0.4/16 --- 0.4/16 --- 0.4/16 ---
Tolerance of
thickness
T ＜ 1.0 mm ± 8% ± 7% ± 8% ± 7% ± 7% ---
1.0 mm ≤ T ＜ 2.0 mm
± 8% ± 7% ± 8% ± 7% ± 7% ± 6%
T ≥ 2.0 mm ± 10% ± 8% ± 10% ± 8% ± 10% ± 8%
CCTC Tech Roadmap
Item
Current 2011 2012
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Min. core thickness ( mm / mil )
0.1 / 4 0.075 /3 0.075 / 3 0.05 /2 0.075 /3 0.05 /2
Min. Prepreg thickness ( um / mil )
50 / 2 --- 50 / 2 --- 50 / 2 ---
Min. inner layer base copper thickness ( OZ )/Thick
0.33/ 0.47 mil
--- 0.33/ 0.47 mil
--- 0.33/ 0.47 mil
---
Max. inner layer base copper thickness ( OZ )/Thick
4.0/Ltd 4.6 mil
5.0/ 7.0mil
3.0/ 3.6 mil
5.0/ 7.0mil
3.0/ 3.6 mil
5.0/ 7.0mil
Min. outer layer base copper thickness ( OZ )/Thick
0.33/ 0.47 mil
--- 0.33/ 0.47 mil
--- 0.33/ 0.47mil
---
Max. outer layer base copper thickness ( OZ )/Thick
3.0/ 3.6 mil
5.0/ 7.0mil
5.0/ 7.0 mil
---5.0/ 7.0 mil
---
CCTC Tech Roadmap
Item
Current 2011 2012
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Min. mechanical drill hole diameter ( mm / mil )
0.20/8 limited
---0.20/8 limited
--- 0.20/8 ---
Min. NPTH Tolerance +/- 25 um
+/- 1 mil ---
+/- 25 um +/- 1
mil ---
+/- 25 um +/- 1 mil
---
Min. PTH Tolerance +/- 50 um
+/- 2 mil ---
+/- 50 um +/- 2 mil
--- +/- 50 um +/- 2 mil
---
Aspect ratio of PTH hole 10:1 12:1 12:1 16:1 12:1 16:1
PTH Hole location accuracy ( um / mil )
50/2 --- 50/2 --- 50/2 ---
CCTC Tech Roadmap
Item
Current 2011 2012
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Min annular ring (mil) per side 5 3.5 5 3.5 5 3.5
Min Clearance (mil) per side 7 6 7 6 7 6
Min. Laser Drill dia.( um / mil ) 75 / 3 --- 75 / 3 --- 75 / 3 ---
Aspect ratio of Microvia 0.75:1---
1:1---
1:1---
Plate Filling Via Yes --- Yes --- Yes ---
Min. Capture Pad annular ring ( um / mil )
100 / 12 75 / 10 88 / 10 75 / 10 75 / 10 ---
Min. Target Pad annular ring ( um / mil )
100 / 12 75 / 10 88 / 10 75 / 10 75 / 10 ---
Laser drill method Large Window, Conformal Mask and Copper Direct
CCTC Tech Roadmap
Item
Current 2011 2012
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Min. Inner layer line width/space ( um / mil )
75 / 3 50 / 2 75 / 3 50 / 2 50 / 2 ---
Min. out layer line width/space ( um / mil )
75 / 3 50 / 2 75 / 3 50 / 2 50 / 2 ---
Min. SMT Pitch ( mm / mil ) 0.3 / 12 --- 0.3 / 12 --- 0.3 / 12 ---
Min. BGA Pitch ( mm / mil ) 0.4 / 16 --- 0.4 / 16 --- 0.4 / 16 ---
Min. Trace width tolerance( Trace < 0.1 mm / 4 mil ) ( um / mil )
+/- 20 +/- 0.8
+/- 12.5 +/- 0.5
+/- 20 +/- 0.8
+/- 12.5 +/- 0.5
+/- 12.5 +/- 0.5
---
Min. Layer registration ( um / mil )
50 / 2 --- 50 / 2 --- 50 / 2 ---
Min. Trace to hole ( mm / mil )
0.16 / 6.5 0.15 / 6 0.16 / 6.5 0.15 / 6 0.16 / 6.5 0.15 / 6
Min. Trace to board edge ( mm / mil )
0.25 / 10 0.2 / 8 0.25 / 10 0.2 / 8 0.2 / 8 ---
CCTC Tech Roadmap
Item
Current 2011 2012
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Solder Mask registration tolerance ( um / mil )
+/- 50 +/- 2
+/- 37.5 +/- 1.5
+/- 50 +/- 2
+/- 37.5 +/- 1.5
+/- 37.5 +/- 1.5
---
Min. Solder dam ( um / mil ) 50 / 2 --- 50 / 2 --- 50 / 2 ---
Solder Mask typeTaiyo PSR 4000, Tamura DSR 2200,
Huntsman P77ma Halogen Free S/M.Green, Blue, Black
Solder Mask Process Electrostatic Spray Coating and Silk Screen
Surface ProcessLead Free HASL, ENIG, ENIG+OSP, OSP, Electrolyte Ni/Au, ENIG + Gold
Finger, Immersion-Silver, Immersion-Tin,
Impedance control accuracy (%) ±10 ± 7 ±7 ± 5 ± 7 ± 5
Board warp & twist tolerance （ % ） 0.5 --- 0.5 --- 0.5 ---
Routing Tolerance ( mm / mil )+/- 0.1 +/-
4---
+/- 0.1 +/- 4
---+/- 0.1
+/- 4---
Punching Tolerance ( mm / mil )+/- 0.1 +/-
4---
+/- 0.1 +/- 4
---+/- 0.1
+/- 4---
CCTC Tech Roadmap
SOLDERMASK AND LEGEND
Nominal Soldermask Thickness (Measured at Crest) 0.4---1.5mil
Soldermask Type and SupplierPSR4000/Taiyo,
DSR2200/Tamura,Huntsman
Minimum Solder Mask Web 3mil
Minimum Solder Mask Clearance to Pad 2mil
Soldermask Material RoHs Compliant? Yes
Legend Material RoHs Compliant ? Yes
Legend Type and Supplier ZM-400WF/Chuanyu , 200W/Taiyo
SURFACE FINISHES
HASL YES
Electrolytic Ni/Gold YES
Electroless Ni/Immersion Gold YES
FST Dexter (Immersion Tin) YES
Immersion Tin Other Specify ATO
Soft Gold YES
OSP YES
Immersion Silver YES
Tin Lead Reflow N/A
Palladium R&D
Selective Tin Lead Reflow N/A
CCTC Manufacturing Capabilities
BUM1+N+1 design parameter BUM1+N+1
BUM1+N+1 design parameter BUM1+1+N+1+1
3-Build Up - CU Filled Via 2-Build Up - CU Filled Via
Thank you!
