changing colors - Microsemi

changing colors

a network of semiconductor technology

Page 2

Agenda

• Company Snapshot

• Recent Highlights

• Company Strategy

• Overview of Products

• Overview of Competition

• Overview of Markets

• Overview of Customers

• Microsemi’s Future Focus

Page 3

Look where we are going...

PDAs

Tablets

Mobile Phones

Mobile Radios

Digital Cameras

Notebook Computers

Display Drivers• CCFL Control ICs for

Color Displays

Audio Amplifiers• Class D Audio ICs

Power Management• LDOs for Battery

Powered Appliances• Switchers

Power/Signal Conditioning• Powermite Packages• All Discrete Technologies

Transient Protection• Low Ct TVS Arrays for IC and

Data Port protection

Mobile RF Components• InGaP Power Amplifiers• EPSM/MMSM Packages• Discretes: Diodes and Transistors,• 900MHz RF power Transistors

Page 4

Snapshot•Company

– ~$250 million, 30+ design engineers, 5 PhD, capacityto grow to $450 million

•Products– Analog/mixed signal IC’s and Discrete components

•Applications– Power Management, Transient Protection, Power

Conditioning, and RF/Microwave

•Markets– Handheld Connectivity Devices, Computing,

Telecommunications, Satellite/Space, Military,Industrial and Implantable Medical

Page 5

Recent Highlights

•Acquisitions/Mergers/Start Ups– April 99 - Linfinity Microelectronics

• Power Management of Light, Sound, and Power

– June 99 - L3/Narda Microwave• RF discretes for Communication Equipment

– August 99 - Micro Power Products• Low Power Mixed Signal ASICs for Battery Powered Apps

– February 00 - Infinesse HBT Products Group• InGaP and SiGe Power Amplifiers for mobile comm

Page 6

Recent Highlights (Continued)

•Alliances– January 99 - Advanced Power Technology

• MOSFETS, IGBTs for Medical Applications

– Oct/Nov 00 - Sterling Semi• SiC Discrete devices for High Speed, High Temp applications

– December 00 - Motorola (On Semi)• Transfer of bipolar RF Mobile Radio products

– January 00 - Harris (Intersil)• Transfer of portion of Power MOSFET Line

Page 7

Philosophy

•Serve “niche” markets focusing on:– high growth end-markets (telecom, computing, industrial)

– high value end-markets (military, space, medical)

•Have an active design program to develop a constantstream of new products targeted at specific endapplications (translates to increased R&D spending).

– Product Funnels– “Must Have” Design Philosophy

Page 8

Products Categories

Commercial Hi-Rel Commercial Hi-RelBacklight Control ICs Pulse Width Modulator TVS TVS

Audio ICs Linear Regulators TVSArrays ZenersPulse Width Modulator Rad Hard ICs Zeners Current Limiters

Linear Regulators App Specific Modules Current Limiters Lightning ProtectionLDO Regulators Medical ASICs Thyristor Surge Protection Undersea Cable ProtectionSCSI Terminators

Pentium Power Switchers

Commercial Hi-Rel Commercial Hi-RelPowermite Products Diodes InGaP Power Amplifiers BiPolar RF Transistors

Diodes Rectifiers EPSM/MMSM Packages PIN DiodesRectifiers Schottkys BiPolar RF Transistors VaractorsSchottkys Solar Panel Diodes PIN Diodes RF Schottkys

Signal Diodes Germanium VaractorsMOSFETs MOSFETs RF SchottkysTransistors BiPolar Transistors LDMOS

Triacs SCRs

Power Management ICs and Modules Transient Suppression Products

Power Conditioning Products RF/Microwave Products

Page 9

Power Management








Triacs SCRs



Page 10

RangeMAX Backlight Control ICs

• >>What is RangeMAX?– RangeMAX is Microsemi’s patented high

efficiency Direct Drive Digital ControlTechnology for driving Cold CathodeFlourescent Lamps (CCFL) for portablecomputing and automotive displayapplications.

– Our patented technology offers full range100:1 dimming, versus “competitive”3:1 products

– The RangeMAX topology also eliminatesseveral components required to drive highvoltage lamps thus reducing cost.

• Applications– Palm computers, Notebooks, Automotive

Displays, Digital Cameras, Pads, Tablets

New Developments• PDA LXM Modules

– 1-2Watt

– Highestefficiency onthe market

• LX1615 Tablet Module

– 4 Watt

– Kit or Module

More info:http://www.rangemax.com

Page 11

RangeMAX Solves Problems

• Personal Digital Assistant -Efficiency, Size

• Web Pad/Tablet -Efficiency, Input Voltage

• Smart Phones -Efficiency, Size, Noise

• Fish Finder -Efficiency, Dimming

• “Auto PC” -Dimming, Temp Range

• Diagnostics/Medical Instrumentation -Efficiency, Dimming

Page 12

LCD40%

Other21%

Power Supply20%

Graphics Sys10%

CPU & Cache9%

LCD71%

Other5%

I/O System2%

Power Supply16%

Audio1%

System Mem2%

CPU & Cache3%

NoteBook PDA

Why RangeMAX for Handhelds?

Page 13

Color Palm Power Analysis

• Microsemi was able to improve the backlight efficiency by28% over their other solutions.

• The brightness range of the Palm is 6 nits to 180 nits (30:1brightness ratio)

• Power consumption is 0.21 Watts to 1.4 Watts (min to max)

• RangeMAX allowed a minimum power level of 0.21 Wattswhere standard inverter technology will allow 0.35 Watts (40%reduction in power at lowest level)

• RangeMAX will allow 2 nits of 0.07 Watts minimum if PALMdecided to offer

• The Backlight consumes approximately 90% of the total powerin this product. % Savings therefore almost flow directly to thebottom line in “play time”

Page 14

Power Management ICs

• What functions areProvided

– CMOS Low DropoutRegulators providinghigh accuracy, ultra lowground current and fastresponse in a very smallfootprint.

• Applications– CMOS efficiency for

Battery operatedappliances with minimalquiescient current whenin shut down mode

New Developments• LX82 Family LDOs

– 20-100mA

– 125mV Dropout

– Shut downcurrent < 1uA

– SOT-23 5 Lead

Page 15

High Power Class D Audio ICs• Key Benefits

– High efficiency, Low heat dissipation, SmallSize

• High Power (>10Watts up to 50 Watts)– LX1720 is a Switching Class-D Stereo Power

Amplifier Controller IC ideal for multimedia andautomotive applications

• >10WRMS Across 8W/Channel (20WRMSstereo)

• Power Limited By External FETs (SupplyVoltage)

• High Efficiency (>85%). Due To HighEfficiency, Power FETs Do Not RequireHeatsinking

• Audio Bandwidth Of 20Hz to 20kHz

New Developments• LX1710 Mono

– > 50 Watts

– > 90% efficiency

– -90dbm• Revised Stereo Chip

– > 50 Watts

– > 90% efficiency

– -90dbm

– available Q2-00

Page 16

• Microsemi’s design center in Carlsbad, CA

• Over 100 man years experience in lowpower efficient class D amplifiers forhearing aid applications

• Extending hearing aid product line tomultimedia handhelds where efficiency isneeded.

– Developing 16 Bit Class D Audio IC formobile applications (1.1 V, on ChipSwitches, low distortion- 120dbm)

Low Power Class D Audio ICs

Page 17

Transient Suppression








Triacs SCRs



Page 18

Transient Protection Products

• What is Transient Protection?– Protection against Electro Static Discharge

(ESD), Electrical Fast Transients (EFT),induced Lightning

• What does Microsemi offer?– Complete line of of devices for portable

applications

• What sets us apart?– Microsemi has the lowest capacitance of

any TVS on the market (less than 3pF/line)

• Applications– Data port (USB) and IC protection

New Developments• USB04/504 Series

– TVS

– 300W/500W

– SOT-143

• USB08/508 Series– TVS

– 300W/500W

– SOIC-8

More info:http://www.microsemi.com/TVS

Page 19

USB Protection Devices

More info:http://www.microsemi.com/TVS

Page 20

Implantable Medical Protection

• Unique solutions for protecting Implantable Pacemakers andDefibrillators from external defibrillation

– Transient Protection IC Solutions

– NEW MOSFET solutions through our joint venture with AdvancedPower Technology

Page 21

Optical Fibre Submarine Systems

• Microsemi provides Protection Devices for Lightning Surges

• Provide high voltage diodes for rectification of high voltage lines

• Opto Couplers for Channel Isolation

• Developing InGaAsP Detectors for supervisory circuits

Page 22

Power Conditioning








Triacs SCRs



Page 23

Powermite® Products• What is Powermite?

– An ultra low profile semiconductor packagewhich boasts 3 times the power handlingcapability of most competitive products

• Microsemi Growth– Microsemi has invested in equipment to

manufacture over 200 million units per year.Microsemi has developed the next generationPowermite products for lower profile

and 3 leaded products

• Licensing– On Semi (Motorola) is licensee of Powermite

• Applications– The product of choice for battery charging

protection in multi-function/mode mobilephones where 1-2 Amps is required

New Developments• Powermite Lite

– 0.8mm high, 0.5 A

– Lower cost for PCS

• Powermite 3– 3 Terminal

– FETKYs (20Volt)

– FET(30,40,500,1KV)

• Gigamite– 2 & 3 Terminal

– up to 5.7 GHz

More info:http://www.microsemi.com/powermite

Page 24

Satellite Battery Bypass

• For protecting battery strings from faultycells.

• Designed for Zero-Gravity atmosphere

• Unique patented pressure system guaranteesfaulty cell termination.

• Zero Dissipative concept is ideal for Satelliteapplications where lack of atmosphereprevents heat dissipation. Allows designersto eliminate cooling units.

Page 25

RF and Microwave








Triacs SCRs



Page 26

InGaP HBT Power Amplifiers

• Indium Gallium Phosphide HeteroJunction Bipolar Transistors for nextgeneration (3G) Mobile phones

• Single devices, Input/Output matchedmodules, Smart power Amplifiers

• Operating initially as fablesssemiconductor operation

– 3 Qualified Fabs– Allotting 25% capacity of Microsemi fab to

convert to GaAs

New Developments• Acquisition of Infinesse

– Design Group

– 100 man yrs ofexperience

– Founders fromTRW and Rockwell,now RFMD andConexant

– So Cal based

Page 27

InGaP HBT Roadmap Application Part No. Nominal Supply Gain P1dB/PAE Psat/PAE Noise Package Cost/100K Status Freq (MHz) (V) (dB) (dBm/%) (dBm/%) Fig. (dB) (US$/Ea)

CDMA Cellular SPA-701 800-900 3.2 29 30(acpr)/40 - 4mm MLP <2.00 In Test

Mobile TX PA

General Purpose

ISM Band

CDMA PCS SPA-702 1700-1900 3.2 29 29(acpr)/35 6-7 4mm MLP <2.00 To Final Iteration Fab

GSM Cellular SPA-901 800-900 3.2 29 35/55 - 4mm MLP <2.00 In DesignGSM PCS SPA-902 1700-1900 3.2 29 31/50 - 4mm MLP <2.00 “

LNA SLN-101 DC-3000 5.0 20 0/-- 1.8 Micro-X 1.50 To 1st Pass Chip Fab

2.4 GHz TX Amp SPA-1001 2400-2483 3.2 23 23/45-50 -- Module <1.00 1st Design in Test;

5.7 Data TX Amp SPA-1101 5725-5875 3.2 23 23/35 -- Module 2.00 In Design

Gain Block SGB-201 DC-6000 3.2 12 10/-- 12.5/-- 4-5 Micro-X 1.00 To Final Iteration FabGain Block SGB-202 DC-6000 5.0 13 15/-- 17/-- 4-5 Micro-X 1.00 “

LNA SLN-102 DC-6000 5.0 28 13.5/-- 2.7 Micro-X 1.00 To Final Iteration Fab

Driver Amp SDA-301 DC-3500 5.0 17 17/-- 19/-- 4-5 Micro-X 1.25 To Final Iteration FabDriver Amp SDA-302 DC-3500 5.0 18 20/-- 22/-- 4-5 Micro-X 1.50 “

CDMA Cellular SPA-701M 800-900 3.2 29 30(acpr)/40 - 6mm Module <4.00 In Design

CDMA PCS SPA-702M 1700-1900 3.2 29 29(acpr)/35 6-7 6mm Module < 4.00 In Design

2nd Ver in Design

Revision 1.2 (12 January 2000)

(Bluetooth/HomeRF)

(LAN, Point-to-Point)

W-CDMA (G3) SPA-801M 2000 3.2 29 29(acpr)/35 6-7 6mm Module <4.00 In Design

Page 28

Microsemi vs. Competition(InGaP HBT Comparison)

Vendor Cellular (800-900 MHz) PCS (1.7-1.9 GHz)

Conexant Systems Inc.(Previously Rockwell Semiconductor Systems)

RF Micro Devices

MicrosemiCorporation

E.g. RI 2308U D/C9911 (Korea)• Icq=75 mA; Vref=3.0 V• Pout=28 dBm; PAE=32%• Gain=27 dB• Chip-On-Carrier (8x8mm2)

• Test Data Not Available

1st Pass Design/Foundry • Icq75 mA; Vref=2.6 V• Pout=27.5 dBm; PAE 38% • Gain=26 dB• PSSOP-16 (MLP; 6x6mm2 COB)

Target Specs/Foundry • Icq<75 mA; Vref<2.8 V• Pout=30 dBm; PAE40%• Gain=26 dB• PSSOP-16 (MLP; 6x6mm2 COB)

• Test Data Not Available

Korea Sample• Icq=100-285 mA; Vref=2.8 V• Pout=28 dBm; PAE=37%• Gain=25 dB• MLP (4x4mm2)

Page 29

Optimizing SynergiesAdvanced “Smart” Power Amplifiers:

Optimized Linearity and Efficiency for CDMA Applications

“Smart” Power AmplifierAmplifier parameters aredynamically varied in accordancewith the signal requirements inorder to optimize performance.

Digital Control of DC-DC Converter

• Time varying power supply (and amp gain)• Equalize delay, frequency response of converter• Predistort RF input to overcome am-am conversion RF

Input

VREF

OutputAmp 2

Power Amp RFIC Chip

InputAmp

InputMatch

Bias/Matching Network

OutputAmp 1

PA Function (50 ž I/O)

RFOutput

VCC

DC-DC Boost Converter Chip(20-40 MHz)

Input Voltage VBATTERY

EnvelopeDetection

InputOutputVoltage

“Smart” Power Amp Module

Off-Chip Components(Inductor, Caps, Schottky Diode)

Converter Function

VREF

Output PA Switch Chip

Output PA Enable Function

Output PAEnable

OutputMatchAmp 1

OutputMatchAmp 2

0%

20%

40%

60%

0 5 10 15 20 25 30Pout (dBm)

Effi

cien

cy (%

)

Constant VDD

Dc\Dc Converter system

Probabilitydistribution

Page 30

EPSM/MMSM RF Packaging• What is EPSM?

– High density packaging technology forRF/Microwave applications up to 5.7 GHz

– Wire bonded/Glob top - ceramic substrate

– Fits SOD123 /SOD323 Footprints

– 3 Terminal version is SOT-23 footprint

• What is MMSM?– High density “package-less” technology for

low parasitic capacitances for high frequencybroadband applications up to 30 GHz

– Flip Chip/Microscopic Chip Scale package

• Applications– VCOs, Attenuators, Amplifier Protection,

Isolation Switching

New Developments• MPP42 Series

– 0.6 pF

– 2.5 Ohm Rs

– Switching• MPV Series

– 0.2 pF

– Q of 1500

– MMSM

– Wideband PCSVCO Apps

Page 31

Mobile RF Transistors

• MRF Series– Microsemi is now offering complete

MRF Series through alliance with OnSemi (Motorola)

– Popular types (MRF5812, MRF8372)

• UPP9401 and UPP1001 Series– Powermite PIN Diodes for antenna

switching

– High Power/High Density

• Applications– Mobile Radio applications

New Developments• MRF5812 Series

– 500 MHz

– 200mA

– 15.5 db

– 12 Volt supply

– SORF package

changing colors

a network of semiconductor technology

Page 33

Competition

Power Management

Transient Suppression

RF/Microwave

Power Conditioning

Semtech (SMTC)

Linear Tech (LLTC)

Alpha (AHAA)

IR (IRF)

Vishay (VSH)

General Semi (SEM)

Maxim (MXIM)

(MSCC)

RF Micro (RFMD)

Conexant (CNXT)

Anadigics (ANAD)

Celeritek (CLTK)

Page 34

Product Mix (FY 99)

16%

50%

23%

11%

Transient Protection

Power Conditioning

Power Management

RF/Microwave

Page 35

Channel Mix (Shipments for customers over $100K- Represents 80% of total shipments for Q1-2000)

63%

33%

4%

OEM

Distributor

Contract Mfg

Page 36

14%12%

12%

24%

12%

18%

8%

Industrial/Commercial•Audio Amplifiers•Welders•Lighting Ballast•Instrumentation•Power Supplies•Electric Vehicles

Medical•Heart Pacers/ Defibrillators•Drug Infusion Devices•Hearing Aids•MRI Equipment

Satellites•Satellites•Solar Panels•Battery Protection•Telecommunications

Telecommunications•Base Stations/Amplifiers•Cable Modems•Set-Top Boxes•Battery Chargers

Computer/Peripherals•Notebooks/PDAs•CCFL Displays•Modems•Network/PCMCIA Cards•Digital Still Cameras

Military/Aerospace•Avionics Systems•Sonar/Torpedo Systems•Missile Systems•Radar•Telecommunications

OEM Market Mix(Shipments to top 100 OEM customers-80% of total shipments for Q1-2000)

Mobile Connectivity•PDAs•Mobile Phones•Web Tablets•PCMCIA Cards

Page 37

Market Mix - FY99 vs Q1/2000

Medical13%

Industrial/Commercial15%

Computer/Peripherals18%

Telecom12%

Military/Aerospace27%

Satellites15%

Computer/Peripherals14%

Mobile Connectivity12%

Medical12%

Military/Aerospace24%

Satellites12%

Industrial/Commercial18%

Telecommunicatons8%

Page 38

14%12%

12%

24%

12%

18%

8%

Industrial/Commercial•Recoton•Coleman Powermate•Motorola Lighting•Ford Visteon•Delco

Satellites•Lockheed Martin•Boeing•Spectrolab, Tecstar•Matra, Bosch

TOP Q1-2000CUSTOMERS1 Zenitron2 Motorola3 Raytheon4 All American5 Arrow6 ACI Elec7 Future Elec8 Giga-Byte9 Mitsubishi10 Guidant Corp.11 Lockheed Martin12 Samsung13 Dynamar14 Alcatel15 Universal Semi16 Avnet17 Medtronic18 Delco19 Seagate20 Rockwell

OEM Customers(Shipments to top 100 OEM customers-80% of total shipments for Q1-2000)

Medical

Mobile Connectivity

Telecommunications

Computer/Peripherals

Military/Aerospace•Lockheed Martin•Raytheon•Boeing•Honeywell/AlliedSignal

FOCUS ondeveloping “Must Have”

products for next generationmobile internet information

appliances

Page 40

The Market• The market for mobile phones is growing:

– Today: 400 million phones

– 2003: estimated 650 million phones (estimated 33%will be W-CDMA Multimedia phones according toStrategies Unlimited)

• The market for PDAs is growing:

– Today: 5.4 million PDAs are manufactured

– 2003: estimated 18.9 million PDAs (estimated 50% willbe color displays)

• Smart Phones:– smart phones produced will increase by 88% to 330

million units in 2003 according to IGI Consulting

• Auto PC is outgrowth of this integration

Page 41

Positioned for the Change• Microsemi Linfinity is positioned to be a key supplier to hand

held computing manufacturers like Palm, Handspring, Compaq,and Psion

• Mobile phones are moving to W-CDMA broadbandcommunications, Microsemi has the the Power and RF productsrequired for next generation products (InGaP Power Amplifiers)

• Power management becomes a significant issue in next generationmobile phones where two “power hungry” circuits merge together

– RF Transmitter

– Color Displays

• We have the solutions that allow customers to actualize futuredesigns through more efficient “battery sensitive”solutions.

• Our FOCUS in on MULTIMEDIA HANDHELD WIRELESSCONNECTIVITY DEVICES.

Page 42

Focus Products for Portable/MobileInformation Appliances

PDAs

Tablets

Mobile Phones

Mobile Radios

Digital Cameras

Notebook Computers

Display Drivers• CCFL Control ICs for

Color Displays

Audio Amplifiers• Class D Audio ICs

Power Management• LDOs for Battery

Powered Appliances• Switchers

Power/Signal Conditioning• Powermite Packages• All Discrete Technologies

Transient Protection• Low Ct TVS Arrays for IC and

Data Port protection

Mobile RF Components• EPSM/MMSM Packages• Discretes: Diodes and Transistors,• 900MHz RF power Transistors

Page 43

Summary of Product Offerings for3G Multimedia Mobile

Phones/PDAsthe future for Microsemi

Part Type Avg U/P Avg # Parts Per Phone Ext Amount Powermite 1A, 40 V Schottky $0.12 2 $0.24PMOS LDO $0.30 3 $0.90Varactors $0.30 5 $1.50PIN Diodes for Antenna $0.25 2 $0.50Backlight Inverter IC $2.00 1 $2.00RF InGaP HBT 50Ohm Module $5.00 1 $5.00InGaP Gain Blocks/LNA $1.00 2 $2.00Medium Power Class D Audio IC $1.50 1 $1.50

$13.64

Page 44

Investment Opportunity

• Market diversity

• Broadest discrete product line in the world

• New Power Management product line expands Microsemipresence into high growth (>35%) portable computing markets

• Infrastructure to support growth– Increase sales to $450 mil with in-place facilities

• Premier Customer Base

• Dominance in high growth niche markets

• Historically better earnings performance than similar small andmedium-cap stocks

Page 45

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changing colors - Microsemi