CHILISIN ELECTRONICS CORP.

Company Presentation 2014

1

2

Company Milestones

A Local Ferrite Producer

Business Expansion

Major Domestic Player

World-class Company

1972 1977 1990 1998 1999

Year

40,000

80,000

120,000

2002

Established

Developed Mn-Zn and Iron Core

Developed SMD Power Inductor

Public listingon TWSE

20012000

60,000

1997 2003

Re

ve

nu

e

K $USD

20072005 20112009 2013

100,000

Established second plant

Developed Wire-Wound and Multilayer

Developed High-Frequency Chip Inductor

Expanded ChinaDongGuan plant

EstablishedChinaSuZhouoffice

Constructed Hukou new HQ and plant

Established China Henan plant

Company established

EstablishedU.S. office

Established China DongGuan plant

EstablishedKorea office

Acquired Belkin Int’l

Formed strategic alliance with Yageo

Developed Moldingand Thin-Film Technology

3

$64,375

$99,433

$115,000$120,330

$124,556

$0

$20,000

$40,000

$60,000

$80,000

$100,000

$120,000

$140,000

2009 2010 2011 2012 2013

CEC Sales Revenue

$2,580

$2,216

$2,479

$2,218

$2,408

$2,000

$2,100

$2,200

$2,300

$2,400

$2,500

$2,600

$2,700

2009 2010 2011 2012 2013

Global Value

Chilisin Growth vs. Global Market($USD ’000)

($USD Million)

Source: Paumanok Publications, Inc .

3

2009~2013 Revenue Growth CAGR

Chilisin 93.49% 17.94%

2013Volume(e)

(247Bpcs)

4

Chilisin Global Ranking

2013Value(e)(2,394M

USD)

Product Coverage: wire-wound, multilayer, and thin-film inductors for power and signal applications

Chilisin: #4 global position as 2013 global total estimated volume is 246,965MpcsChilisin: #6 global position as 2013 global total estimated value is JPY246,290M (USD2,394M)

Source:株式会社マーケティング・アイ (MAKETINKUAI CORP) http://www.m-eye.co.jp/

PC22%

Mobile16%

Consumer13%

Industrial 3%

NB3% Automotive

2%

Communication 41%

Sales Breakdown 2013 – By Market Segment

5

6

Major Customers

AutomotivesAutomotives

PC / SystemsPC / Systems Consumer ElectronicsConsumer ElectronicsTelecommunicationTelecommunication

OEMs / EMSsOEMs / EMSs

*Any trademarks or logos used throughout this presentation are the property of their respective owners, Chilisin does not claim ownership or distribution rights of the above logos

7

Manufacturing and Office

Suzhou PlantSuzhou Plant

Dongguan PlantDongguan Plant

Hong Kong Office

China

Henan PlantHenan Plant

TouliuPowder Plant

TouliuPowder Plant

Korea

USA

Anyang Office

San Jose Office

HeadquarterHsinchu/Hukou Plant

HeadquarterHsinchu/Hukou Plant

Chongqing Office

Wuhan Office

Taiwan

Taipei Office

FactoryDongguan, China

Est. 1997Employee: 1,199

FactoryHenan, China

Est. 2010Employee: 518

FactorySuzhou, China

Est. 2001Employee: 96

HeadquarterHukou, Taiwan

Est. 1972Employee: 751

8

Factory Overview

Molding

Wire-Winding

Multi-layering

Thin-film

Through-hole

Manufacture Site Finished Products Inventory

----------------------------------- All factories are ISO 9001 and TS 16949 certified ----------------------------------

9

MoldingWire-winding Multi-layering Thin-film Process

Power Inductor

• Wide range• for power solution

Magnetic-resin Power Inductor• 2016~3030 size for mobile phone• 4040~5050 size for tablet PC• 6060~8080 size for TV/audio

Chip Inductor

• Ferrite core for baseband application

• Ceramic core for RF application

Common Mode Choke

• for USB2.0/3.0/HDMI

Power Inductor

• DIP type• for motherboard

Power Inductor

• SMD type• for notebook & tablet PC

New - Power Inductor• SMD Miniature type:

3225~2012 size, t: 1.0mm• for handset & ultrabook

Ferrite Bead

• Up to GHZ band• Downsize from 0402 to 0201

Chip Inductor

• For RF application• 0201 size +/-0.1nH

Product Line and Technology

Power Inductor

• 2520~1608 size, t: 0.55mm• for handset & ultrabook

Common-mode Choke

• 0805 package• for USB2.0

Chip Inductor

• Baseband &RF application• Downsize from 0402 to 0201

10

Miniaturization

High Current

Low ProfileLow Rdc

Green Compliance

RoHsREACH

40A

20A

60A

1.5mm

1.0mm

0.5mm

0402

020101005

< 1m

<5m

<10m

Product Development Trend

HF

10

Best Partner Award from Coolpad (2012) Best “Cooperate To Win” Award from Lenovo (2011) Outstanding Supplier Award from SerNet (2011) Best Supplier Award from New Kinpo (2010) Best Supplier Award from Asus (2005)(2007) Best Supplier Award from Solectron (2007) Best Supplier Award from Zyxel (2006)(2007)

TS16949 Certification (2005) ISO 14001 Certification (2004) Samsung Eco-Partner Certificate (2005) Sony Green Partner Certificate (2003)

11

Certification and Awards

1212

Trustworthy Supplier Competitive Products

Full Range of Magnetics Series Sufficient Capacity Support Vertical integration from powder mixing to inductor manufacturing World-class Quality Cost Competitiveness Quick Delivery & Flexible Logistic Support

Value-added Service

Total Solution Provider for EMI, power and RF Design-in Capability Professional Engineering Support Material Research & Development Concurrent Product Innovation

12

13

Thank you!