Circuit Board Laminates as a part of High Frequency … · Circuit Board Laminates as a part of High Frequency PCB ... Hardening agent Epoxy resin Varnish Blending Acceptance of

Circuit Board Laminates as a part of

High Frequency PCB

Aspocomp – Piirilevytekniikkaa 2015

Oulu on 10.2.2015

Mika Sillgren

2 © Panasonic Corporation Electronic Materials Business Division

Content

• Panasonic Electronic Materials Business Division brief

• High speed laminate trends

• Dielectric material production process

• Key Characteristics of dielectric laminates for high speed circuit boards – Resin system

• Dk/Dielectric constant

• Df/Dissipation factor

– Copper foil

• Roughness

• Inner layer treatment

– Glass cloth • Glass cloth style (E-glass vs. NE-glass)

• Spreading of Glass cloth

• Panasonic circuit board material offering for high speed applications

• Summary and Key takeaways

Panasonic Trends Process Characteristics – Resin – Copper foil – Glass cloth Materials Summary


Panasonic Corporation - Four Company System

Electronic

Materials

Business Division

4 © Panasonic Corporation Electronic Materials Business Division 4 © Panasonic Corporation Electronic Materials Business Division

Product Development from viewpoint of customer

High Reliability

Circuit Board Materials

series

IC Substrate Materials

・

・

・

・

・

(Black type)

series

series

・

・

・

Halogen free ・Halogen-free FR-4

・Halogen-free CEM-3

・Halogen-free FR-1

Acquired

Technology

Flexible Circuit Board

Materials

Advanced Films

High thermal

dissipation Materials

series

・

・

・

・Switches

・Base Stations

・etc.

Low Dk/Df and High Tg

Circuit Board Materials

PreMulti (Mass laminations)

・Laundry machines

Process

Technology

Material Design

Technology

Evaluation

and Analysis

Technology

series

series

IC Substrates

Automotive

・CSP Cards ・BOCs

・etc. ・PC-BGAs

・etc. ・Automotive

Req

uire

men

ts

Pro

du

cts

LED, Automotive, Power Device

・LED back light

・LED lightings

・ECUs, Headlamp

Networking Equipment

・Servers ・Routers

・TVs

・etc.

・DVCs

・DVD Players

・Printers

・DVD-ROM drives

・etc.

Home Appliances PC-related Devices

・Note PCs

Mobile Products

・Tablet PCs ・Note PCs

・etc.

・Smart phones ・DSCs

・Digital Audio

Players

5 © Panasonic Corporation Electronic Materials Business Division 5 © Panasonic Corporation Electronic Materials Business Division

PMF Ayutthaya

PIDM Taiwan

China

PIDM Singapore

Asia

Japan

Europe

Flexible CCL

Research & Marketing Group

N.America

CEM-3

Circuit Board

R&M

Paper Phenolic CCL

Molding Compounds

Encapsulation materials

PIDM Yokkaichi

South Factory

CEM-3

PIDM Yokkaichi

Molding Compounds

Flexible CCL

Foundation 1987 Foundation 1996

We have production bases in China, Asia, Europe and Japan to effectively support customer’s global production.

PIDM Europe PIDM Guangzhou PIDM Suzhou

Foundation 2000 Foundation 1995 Foundation 1999 Multi-layer Materials

R&M

Multi-layer Materials

R&M

PIDM Shanghai

PIDM Koriyama

PIDM Koriyama

West Factory

Foundation 1970

Foundation 2001

Foundation 1961

Foundation 1986

Advanced Film

PreMulti



Electronic Materials Business Unit




Molding Compounds Encapsulation

materials


Molding product

Global Production System

R&D


High speed laminate trends – Examples of Applications

100MHz 1GHz 10GHz 100GHz Frequency

Wave length [m]

1m

10

10cm

1-1

1cm

1-2

1mm

1-3

Mobile phones 800 Mhz – 3.8 GHz

Navigation

systems 1.2–1.6 GHz

RFID 850–950 MHz

TV broadcasting VHF: 50 - 230MHz

UHF: 470 - 890MHz

Bluetooth 2.4 GHz

Server 4-12 GHz

Router 5-14GHz

Car radar

systems 24 – 79 GHz

Optical systems >10 GHz

W-LAN 2.4 – 5.8 GHz

WIGIG 60 GHz

Networking

systems 3 – 6 GHz

D-TV satellites 11 – 15 Ghz

FM Radio 88 - 108 MHz

UHF VHF SHF EHF


High speed laminate trends – ICT segment

Source: LinLin ECWC13


High speed laminate trends – ICT segment

Source: LinLin ECWC13


Dielectric material production process – raw materials

Resin

Copper Clad

Laminate

(Fully cured)

Prepreg

(Semi-cured)

Glass cloth

Copper foil

Raw materials Products Customer products


Laminate and Prepreg Production process

Varnish Impregnation Drying Cutting

Break-down

1 2

Solvent

Catalyst

Hardening agent

Epoxy resin

Varnish Blending Acceptance of raw materials

Copper foil

Glass cloth Yarn

Epoxy resin

3 4

Build-up

Copper

Clad

Laminate

Build-up Press Inspection Packing

5 6 7 8 9

Remove the stainless plates from copper clad laminate.

Inspection of CCL appearance and packing.

Produces the varnish by blending epoxy resin, solvent, catalyst and hardening agent.

Drying of varnish-impregnated glass cloth, and detection of foreign materials by appearance inspect.

Cover prepregs by copper foil and stainless plates.

Lamination of copper foil to prepregs by pressure and heat in vacuum press.

Prepreg

Stainless plate

Copper foil

Prepregs are ready.

Lamination process for CCL.


10-5

10-4

10-3

10-2

10-1

1 2 3 4 5

Dielectric constant

Dis

sip

ati

on

fa

cto

r

PE

PTFE

Polymethylpentene

PS

PP

Epoxy

Polyimide

※@1MHz

PPO

Thermoplastics Resin

Thermosetting Resin

Electrical characteristics of resin and glass (Dk and Df)

Properties of glass

Final properties of laminates and prepregs are combination of properties of resin- and glass

cloth used.


Electrical characteristics of resin (impact of resin + glass to Dk)

Dk level of laminate is depending on resin content (ratio of glass cloth and resin) used, and is

varying even for same laminate product.


Electrical characteristics of resin – Why Low Dk/Df for HS boards?

50

60

70

80

90

100

110

120

130

140

150

2 3 4 5 Dk

Cir

cu

it w

idth

[u

m]

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

2 3 4 5D

iele

ctr

ic t

hic

kn

es

s [

mm

] Dk

Zo = 60

ln π（0.8W＋t）

5.98h

√ εr

0.25 mmt

100um

Formula for impedance

Cu thickness ：t=35μm

Impedance：50 Ω Cu thickness ：t=35μm

Impedance：50 Ω

Lower Dk ⇒ Wider circuit patterns and thinner dielectric layers

Easier manufacturability, more robust design (tolerances), product miniaturization

(thickness), etc.


Electrical characteristics of resin – Why Low Dk/Df for HS boards?

Signal transmission loss is sum of conductor loss and dielectric loss.

Dk and Df are both impacting on transmission loss.


Electrical characteristics of resin – Panasonic HS product offering


Electrical characteristics of resin - Transmission Loss comparison

-40

-35

-30

-25

-20

-15

-10

-5

0

0 1 2 3 4 5 6

R-1755V

[RT]

[RT]

[RT]

[RT] R-1566

[RT]

Tra

ns

mis

sio

n L

os

s (

dB

/m)

Frequency (GHz)

PCB construction

35um 250um

Copper type： RT

Lower Dk/Df of materials has direct impact on signal transmission loss.


Key Characteristics – Why copper foil roughness is important?

• “Skin effect is the tendency of an alternating electric current (AC) to become distributed within a

conductor such that the current density is largest near the surface of the conductor, and

decreases with greater depths in the conductor. The electric current flows mainly at the "skin" of the

conductor, between the outer surface and a level called the skin depth. The skin effect causes the

effective resistance of the conductor to increase at higher frequencies where the skin depth

is smaller, thus reducing the effective cross-section of the conductor.”

Source: Wikipedia (http://en.wikipedia.org/wiki/Skin_effect)

Higher the frequency - more significant the impact of skin effect to transmission loss.

Frequency Skin effect

depth

10 kHz 660 μm

100 kHz 210 μm

1 MHz 65 μm

10 MHz 21 μm

100 MHz 6.6 μm

1 GHz 2.1 μm

10 GHz 0.7 μm


Key Characteristics – Why copper foil roughness is important?

Copper profile is one of the main contributors for transmission loss for high frequency signals.

High frequency signals

Signal path

Low frequency signals

Signal path

Hig

her

Resi

stance

Higher Resistance


Key Characteristics – Copper profile classification by IPC

Copper profile classification

based on IPC-4562:

H-VLP

RT (Reverse Treated)

Conventional (Low

Profile)

Rz=1～2μm

Rz=6～8μm

Rz=3～4μm

Typically high frequency laminates use either Low profile or Very Low Profile copper profile types.

Low/No Peel strength limiting X-style copper usage.

Mat side

Standard (S)

>10.2 μm

Low profile (L)

5.2 – 10.2 μm

Very Low profile (V)

<= 5.1 μm

No Treatment or

Roughness (X)


Key Characteristics – Transmission loss vs. Cu foil type

Cu Thickness：35μm

Cu Type ：H-VLP, RT, Conventional

Inner treatment Type： None

・Core ： 6MIL （0.13t） (#2116x 1ply),

・Prepreg: #1080 RC64% *2ply

Line length ： 200, 100mm

Impedance ： 50 Ω

Mat side

Rz=1～2μm

H-VLP

Rz=6～8μm

Conventional

(Low Profile)

Rz=3～4μm

RT

-8

-6

-4

-2

0

0 5 10 15 20 Frequency (GHz)

Tra

nsm

issi

on l

oss

(d

B/1

00

mm

)

H-VLP

RT

Conventional

[H-VLP]

[RT]

Copper profile impact on transmission loss is getting bigger with higher frequencies.

Usage of conventional copper profile increase transmission loss significantly.


Key Characteristics – E glass vs. NE glass Dk & Df (MEG7)

NE-glass (Low Dk glass) reduces effective Dk of the material by 0.2 – 0.3 vs. E-glass.

Df of NE-glass version is slightly better than E-glass version.


Key Characteristics – E glass vs. NE glass transmission loss (MEG7)

The difference of transmission loss between E-glass and NE-glass version of MEGTRON7

material is ~4dB/m at 20GHz.

The impact is almost on the same as the difference between H-VLP and RT copper foil.


Differences in Propagation delay & loss are minimized with

Spread Glass

Key Characteristics – Spreading of glass cloth

Conventional glass cloth Spreaded glass cloth


Glass DK = 6.4 (IPC-4412) 3.1.6.1 Dielectric Constant for Base E-Glass

The DK of base E-glass to be used for printed board applications is 6.4 @ 1 GHZ (as measured by IPC-TM-650, Method 2.5.5.9)

Resin/Filler DK = 2.5 - 4.5

RC VS DK@1GHZ

2.5

3

3.5

4

4.5

5

5.5

15 25 35 45 55 65 75 85

RC%

DK @

1G

Hz

STD FR-4

FILLED FR-4

FILLED LOW LOSS A

FILLED LOW LOSS B

FILLED LOW LOSS C

FILLED LOW LOSS D

FILLED LOW LOSS E

Key Characteristics – Dk difference between glass and resin


Key Characteristics – Dk difference between glass and resin


Delay Time vs Frequency(＃１０８０)

1.22E-09

1.23E-09

1.24E-09

1.25E-09

1.26E-09

1.27E-09

1.28E-09

0 1 2 3 4 5 6

Frequency　[GHｚ]

Delay Time [sec]

Delay Time vs Frequency(＃1078)

1.22E-09

1.23E-09

1.24E-09

1.25E-09

1.26E-09

1.27E-09

1.28E-09

0 1 2 3 4 5 6

Frequency　[GHｚ]Delay Time [sec]

Max

Min

Max

Min

Delay Time vs Frequency

1080 (conventional weave) 1078 (spread weave)

Key Characteristics – Conventional Glass vs Spread Glass


Electrical characteristic of resin – Panasonic HS product offering

Dk: 3.7 / 3.4(N) Df: 0.002 / 1GHz, 0.0015 / 1GHz(N)

Dk: 3.8 Df: 0.005 / 1GHz

Dk: 3.6 / 3.4(N) Df: 0.0015/1GHz 0.001 / 1GHz (N)

Dk: 4.6 Df: 0.01 / 1GHz

Dk: 4.1 Df: 0.01 / 1GHz

Dk: 4.4 Df: 0.016 / 1GHz


Summary and Key takeaways

• Higher the frequency requirements for your

application/PCB more you need to understand

laminates used in it.

• Resin system, glass cloth and copper have all significant

impact on transmission loss in high frequency PCB‘s –

you can lose good performance by specifying wrong

property for other parameter.

• Low loss resin system, smooth copper profile and use of

spreaded glass cloth style with Low Dk/Df properties

help you tackle challenges of high frequencies.

• Panasonic comprehensive circuit board material offering

can meet your varying application requirements with

good quality and high reliability today and in future!


Documents

Circuit Board Laminates as a part of High Frequency … · Circuit Board Laminates as a part of High Frequency PCB ... Hardening agent Epoxy resin Varnish Blending Acceptance of