CLD-AP202 Rev 4A Cree XLamp XHP Family LEDs · 2018. 11. 1. · 2 XLamP ® XHP FamILy LED soLDErIng & HanDLIng HanDLIng XLamP® XHP FamILy LEDs manual Handling Use tweezers to grab

SOLDERING & HANDLING

Copyright © 2015-2020 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.

Cree, Inc.4600 Silicon Drive

Durham, NC 27703USA Tel: +1.919.313.5300

WW

W.C

REE.

CO

M/X

LAM

PC

LD-A

P202 R

EV 5

Cree® XLamp® XHP Family LEDs

INTRODUCTION

This application note applies to XLamp® XHP Family LEDs,

which have order codes in the following format.

XHPxxx-xx-xxxx-xxxxxxxxx

This application note explains how XLamp XHP Family LEDs

and assemblies containing these LEDs should be handled

during manufacturing. Please read the entire document to

understand how to properly handle XLamp XHP Family LEDs.

TABLE OF CONTENTS

Handling XLamp® XHP Family LEDs ........................................2

Circuit Board Preparation & Layouts ........................................6

Case Temperature (Ts) Measurement Point ............................9

Notes on Soldering XLamp® XHP Family LEDs .................... 10

Moisture Sensitivity ............................................................... 11

XLamp® XHP Family LED Reflow Soldering

Characteristics ....................................................................... 12

Chemicals & Conformal Coatings ......................................... 13

Assembly Storage & Handling ............................................... 14

Tape and Reel ......................................................................... 15

Packaging & Labels ............................................................... 19

http://www.cree.com/Xlamp


2

XLAMP® XHP FAMILy LED SOLDERING & HANDLING

HANDLING XLAMP® XHP FAMILy LEDS

Manual HandlingUse tweezers to grab XLamp XHP Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers.

Do not push on the lens.

Do not apply more than 1000 g of shear force directly onto the lens. Excessive force on the lens could damage the LED.

PCORRECT

X WRONG

Cree recommends the following at all times when handling XLamp XHP Family LEDs or assemblies containing these LEDs:

• Avoid putting mechanical stress on the LED lens.

• Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect

the optical performance of the LED.

• Cree recommends always handling XHP Family LEDs with appropriate ESD grounding.

• Cree recommends handling XHP Family LEDs wearing clean, lint-free gloves.


3


HANDLING XLAMP® XHP FAMILy LEDS - CONTINUED

Whenever possible, Cree recommends the use of one of the following pick & place tools to remove XLamp XHP Family LEDs from the

factory tape & reel packaging. The following diagrams show examples of pick & place tools to remove XLamp XHP Family LEDs from the

factory tape & reel packaging. Cree and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane.

XHP35 High Density, XHP35.2 High DensityAll dimensions in mm [in]

Tolerance: ±0.025 [0.001]3.175[ø0.125]

3.683[ø0.145]

1.016[ø0.040]

A

A

5

[0.197]

118°

0.188[0.007]

SECTION A-A

Top View Side View

Side View

3.175[ø0.125]

3.683[ø0.145]

1.016[ø0.040]

A

A

5

[0.197]

118°

0.188[0.007]

SECTION A-A

5[0.197]

3.175[ø0.125]

3.683[ø0.145]

1.016[ø0.040]

A

A

5

[0.197]

118°

0.188[0.007]

SECTION A-A

3.175[Ø0.125]

1.016[Ø0.040]

3.683[Ø0.145] 0.188

[0.007]

118°


4



XHP35 High Intensity, XHP35.2 High IntensityCree recommends using a spring-relieved pick and place nozzle with a spring constant of 0.05 lb-ft (0.07 N-m).

All dimensions in mm

Tolerance: ±0.001

XHP50, XHP50.2All dimensions in mm [in]

.500 3.400

3.400

.500

Ø 1.000

3.300

.300

2.400

3.300.300

2.400

Top View Side View

.500 3.400

3.400

.500

Ø 1.000

3.300

.300

2.400.500 3.400

3.400

.500

Ø 1.000

3.300

.300

2.400

3.400

.500

.500 3.400

Ø1.000

90.000 ˚

2.157.650

� 5.300

� 4.991

� 3.692

5.300 [Ø 0.209]4.991

[Ø 0.196]

3.692[Ø 0.145]

2.157 [0.085]

0.650 [0.024]

90°

90.000 ˚

2.157.650

� 5.300

� 4.991

� 3.692


5



XHP70, XHP70.2All dimensions in mm

2.6950.106

1.1420.045

90°

7.3000.287

6.6840.263 4.400

0.173

A

B

C

D

CAD GENERATED DRAWING,DO NOT MANUALLY UPDATE

SCALE

SIZE

CAD FILE:

DWG. NO.A

SHEET OF

REV.

DATEAPPROVALS

DRAWN

CHECKED

RESP ENG

MFG ENG

QUAL ENG

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES

TOLERANCES ARE:DECIMALS ANGLES

XX = .002XXX = .001

MATERIAL

FINISH

32DO NOT SCALE DRAWING

ITEMNO.

PART ORIDENTIFYING NO.

NOMENCLATUREOR DESCRIPTION

MATERIAL SPECIFICATION

QTYREQD

PARTS LIST

12345678

THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OFCOUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTTHE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.

A

B

C

D

12345678

XXXX = .0002

1/2

REVISIONSRev. DESCRIPTION DATE APPROVED

A PRINT RELEASE JDL

3/9/2015

XHP 70 Nozzle Tip

3/9/2015

Tuesday, February 24, 2015 9:04:20 AM

2.6950.106

1.1420.045

90°

7.3000.287

6.6840.263 4.400

0.173

A

B

C

D

CAD GENERATED DRAWING,DO NOT MANUALLY UPDATE

SCALE

SIZE

CAD FILE:

DWG. NO.A

SHEET OF

REV.

DATEAPPROVALS

DRAWN

CHECKED

RESP ENG

MFG ENG

QUAL ENG

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES

TOLERANCES ARE:DECIMALS ANGLES

XX = .002XXX = .001

MATERIAL

FINISH

32DO NOT SCALE DRAWING

ITEMNO.

PART ORIDENTIFYING NO.

NOMENCLATUREOR DESCRIPTION

MATERIAL SPECIFICATION

QTYREQD

PARTS LIST

12345678

THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OFCOUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTTHE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.

A

B

C

D

12345678

XXXX = .0002

1/2

REVISIONSRev. DESCRIPTION DATE APPROVED

A PRINT RELEASE JDL

3/9/2015

XHP 70 Nozzle Tip

3/9/2015

Tuesday, February 24, 2015 9:04:20 AM

90°

[7.300]Ø 0.287

[2.695]Ø 0.106

[4.400]Ø 0.173

[1.142]Ø 0.045

[6.684]Ø 0.263


6


CIRCUIT BOARD PREPARATION & LAyOUTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or

soldering XLamp XHP Family LEDs onto the PCB.

The diagrams below show the recommended PCB solder pad layouts for XLamp XHP Family LEDs. All dimensions are ±.13 mm unless

otherwise indicated.

XHP35 High Density, XHP35 High Intensity, XHP35.2 High Density, XHP35.2 High Intensity

Notes:• Cree recommends using thermal pad kickouts to maximize component thermal performance.• Cree recommends using white solder mask material to minimize system optical loss.* This stencil has been tested and optimized for the avoidance of voiding when using ALPHA® LUMET® P30 Maxrel solder paste. For

other solder pastes, a “window pane” design for the thermal pad stencil may result in a lower voiding percentage. Contact your local Cree Field Applications Engineer for consultation regarding your specific application.

Recommended Copper Layout Recommended Stencil Openings*

3.45

3.45

2.65

3.50 3.30

1.501.30

.30

.30.50.50

.50

.56

.70

.50

.503.30

2.30

1.30

3.30

3.30

3.30

.56.56

.83

.18

.18

.18

3.30

.18

.50

.50

.56

.29

.43

.09

OPTICALREFERENCE

OPTICAL REFERENCE

3.50

R1.85

3.45

3.45

2.65

3.50 3.30

1.501.30

.30

.30.50.50

.50

.56

.70

.50

.503.30

2.30

1.30

3.30

3.30

3.30

.56.56

.83

.18

.18

.18

3.30

.18

.50

.50

.56

.29

.43

.09

OPTICALREFERENCE

OPTICAL REFERENCE

3.50

R1.85

Recommended Solder Pad(Solder Resist Pattern)


7


CIRCUIT BOARD PREPARATION & LAyOUTS - CONTINUED

XHP50, XHP50.2

Recommended PCB Solder Pad 12 V Configuration(thermal pad is connected to anode and cathode and is

not electrically isolated)

Recommended PCB Solder Pad 6 V Configuration (thermal pad is electrically isolated)

5.00

5.00

R2.85

4.78

4.78

.50

.50.50

2.78

2.14

.50

.73

3.58

2.78

4.78

.50 .50

.50

4.78

4.78

.50

.50

2.14

2.14

.50

.50

.50

.50

4.78

4.78

4.78 .50

.50

.80

.25

.97

.80

.25

2.14

4.78 REF.

4.78 REF.

RECOMMENDED PCB SOLDER PAD6V


RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)

6v/12v

PRIMARY ALTERNATIVE

5.00

5.00

R2.85

4.78

4.78

.50

.50.50

2.78

2.14

.50

.73

3.58

2.78

4.78

.50 .50

.50

4.78

4.78

.50

.50

2.14

2.14

.50

.50

.50

.50

4.78

4.78

4.78 .50

.50

.80

.25

.97

.80

.25

2.14

4.78 REF.

4.78 REF.




6v/12v

PRIMARY ALTERNATIVE

.50.50

.50.50

.50 .50

2.14

4.78

2.14

4.784.78

.50

.50

.50

4.78

2.78

Recommended Stencil Pattern6 V & 12 V Configurations

(hatched area is open)

5.00

5.00

R2.85

4.78

4.78

.50

.50.50

2.78

2.14

.50

.73

3.58

2.78

4.78

.50 .50

.50

4.78

4.78

.50

.50

2.14

2.14

.50

.50

.50

.50

4.78

4.78

4.78 .50

.50

.80

.25

.97

.80

.25

2.14

4.78 REF.

4.78 REF.




6v/12v

PRIMARY ALTERNATIVE

4.78

4.78

.80

2.14

.80

.97

.50

.50

.25

.25


8


CIRCUIT BOARD PREPARATION & LAyOUTS - CONTINUED

XHP70, XHP70.2

7.00

7.00

.73

R3.76

4.49

3.90

.70

6.70

.70

6.76

3.13

.50

3.90

6.70.70

.70

6.76

.706.70

.70

.70

6.76.50

3.13

3.13

.50

.70.70

6.76

.50

.70

1.24

.25.70

6.70

1.29

1.29

.25

3.13

6.70 REF.

6.76 REF.

RECOMMENDED PCB SOLDER PAD6v


6v/12vRECOMMENDED PCB SOLDER PAD

12v

PRIMARY ALTERNATIVE

7.00

7.00

.73

R3.76

4.49

3.90

.70

6.70

.70

6.76

3.13

.50

3.90

6.70.70

.70

6.76

.706.70

.70

.70

6.76.50

3.13

3.13

.50

.70.70

6.76

.50

.70

1.24

.25.70

6.70

1.29

1.29

.25

3.13

6.70 REF.

6.76 REF.




12v

PRIMARY ALTERNATIVE

6.76

6.70

6.76

6.70.70

3.13

.70 .70

.70.70

.70.70

3.13

3.90

.50.50

Recommended PCB Solder Pad 6 V Configuration (thermal pad is electrically isolated)

Recommended PCB Solder Pad 12 V Configuration (thermal pad is connected to anode and cathode and is

not electrically isolated)

Recommended Stencil Pattern6 V & 12 V Configurations

(hatched area is open)

7.00

7.00

.73

R3.76

4.49

3.90

.70

6.70

.70

6.76

3.13

.50

3.90

6.70.70

.70

6.76

.706.70

.70

.70

6.76.50

3.13

3.13

.50

.70.70

6.76

.50

.70

1.24

.25.70

6.70

1.29

1.29

.25

3.13

6.70 REF.

6.76 REF.




12v

PRIMARY ALTERNATIVE

6.76

3.13

6.70

.70 .70

.50

.25

.25

1.24

1.29

1.29


9


CASE TEMPERATURE (TS) MEASUREMENT POINT

XLamp XHP Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible.

This measurement point is shown in the picture below.

XHP35High Density

XHP35High Intensity

XHP35.2High Density

XHP35.2High Intensity

XHP50 XHP50.2

XHP70 XHP70.2

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XHP Family LED itself. In testing, Cree has

found such a solder pad to have insignificant impact on the resulting Ts measurement.


10


NOTES ON SOLDERING XLAMP® XHP FAMILy LEDS

XLamp XHP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the

PCB on a hotplate and following the reflow soldering profile listed on page 12.

Do not wave solder XLamp XHP Family LEDs. Do not hand solder XLamp XHP Family LEDs.

Solder Paste TypeCree strongly recommends using “no clean” solder paste with XLamp XHP Family LEDs so that cleaning the PCB after reflow soldering is

not required. Cree uses Kester® R276 solder paste internally.

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

Solder Paste ThicknessThe choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated

dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil

(102-μm) bond line, i.e., the solder joint thickness after reflow soldering.

X WRONG

PCORRECT

PCORRECT

PCORRECT

X WRONG

http://www.kester.com/products/product/R276-Solder-Paste/


11


NOTES ON SOLDERING XLAMP® XHP FAMILy LEDS - CONTINUED

After SolderingAfter soldering, allow XLamp XHP Family LEDs to return to room temperature before subsequent handling. Premature handling of the

device, especially around the lens, could result in damage to the LED.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After

shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder

areas should show minimum evidence of voids on the backside of the package and the PCB.

Cleaning PCBs After SolderingCree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,

Cree recommends the use of isopropyl alcohol (IPA).

Do not use ultrasonic cleaning.

MOISTURE SENSITIVITy

Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.

Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.

Once the MBP is opened, XLamp XHP Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life

in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs

in the original MBP.


12


XLAMP® XHP FAMILy LED REFLOW SOLDERING CHARACTERISTICS

In testing, Cree has found XLamp XHP Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a

general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder

paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp) 1.2 °C/second

Preheat: Temperature Min (Tsmin) 120 °C

Preheat: Temperature Max (Tsmax) 170 °C

Preheat: Time (tsmin to tsmax) 65-150 seconds

Time Maintained Above: Temperature (TL) 217 °C

Time Maintained Above: Time (tL) 45-90 seconds

Peak/Classification Temperature (Tp) 235 - 245 °C

Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds

Ramp-Down Rate 1 - 6 °C/second

Time 25 °C to Peak Temperature 4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

IPC/JEDEC J-STD-020C

TP

TL

Tem

pera

ture

Timet 25˚C to Peak

Preheatts

tS

tP

25

Ramp-down

Ramp-up

Critical ZoneTL to TP

Tsmax

Tsmin


13


CHEMICALS & CONFORMAL COATINGS

Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and

current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application

Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of

chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.

Recommended Cleaning SolutionsCree has found the following chemicals to be safe to use with XHP Family LEDs.

• Water

• Isopropyl alcohol (IPA)

Chemicals Tested as HarmfulIn general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to

XHP Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XHP Family LEDs. The

fumes from even small amounts of the chemicals may damage the LEDs.

• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• Methyl acetate or ethyl acetate (i.e., nail polish remover)

• Cyanoacrylates (i.e., “Superglue”)

• Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)

• Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)

Hermetically Sealing LuminairesFor proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment

that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically

sealing LEDs in an enclosed space is not recommended.

http://www.cree.com/led-components/media/documents/XLamp_Chemical_Comp.pdf


http://www.youtube.com/watch?v=t24bf9D_1SA



14


ASSEMBLy STORAGE & HANDLING

Do not stack PCBs or assemblies containing XLamp XHP Family LEDs so that anything rests on the LED lens. Force applied to the LED

lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XHP Family LEDs should be stacked in a way to

allow at least 1-cm clearance above the LED lens.

Do not use bubble wrap directly on top of XLamp XHP Family LEDs. Force from the bubble wrap can potentially damage the LED.

PCORRECT

X WRONG

PCORRECT


15


TAPE AND REEL

All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.

All dimensions are ±.13 mm unless otherwise indicated.

XHP35 High Density, XHP35.2 High Density

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558

4600 Silicon DriveDurham, N.C 27703

UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5

FOR SHEET METAL PARTS ONLY

.XX ± .25

.XXX ± .125X° ± .5 °

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 1.6 1/11.000

A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]

Ko - 3.00 mm [.118"]CATHODE SIDE

ANODE SIDE

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °




A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]


ANODE SIDE

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °




A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]


ANODE SIDE

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °




A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]


ANODE SIDE XHP35 High Density

Anode Side

XHP35.2 High Density

Anode Side

Loaded Pockets(500 Lamps) Leader

400 mm (min.) ofempty pockets with

at least 100 mmsealed by tape

(50 empty pockets min.)

Trailer160 mm (min.) ofempty pockets

sealed with tape(20 pockets min.)

STARTENDUser Feed Direction

Loaded Pockets(1,000 Lamps) Leader

400mm (min) ofempty pockets with

at least 100mmsealed by tape


Trailer160mm (min) ofempty pockets


STARTEND

Cathode Side

Anode Side(denoted by + and circle)

160.0

A

A

B

2.5±.1

SECTION A-A SCALE 2 : 1

1.5±.1

8.0±.1

4.0±.1

1.75±.10

12.0 .0+.3

DETAIL B SCALE 2 : 1

13mm7"

Cover Tape

Pocket Tape

User Feed Direction

User Feed Direction


16


TAPE AND REEL - CONTINUED

XHP35 High Intensity, XHP35.2 High Intensity

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZEAo - 3.70 mm [.146"]Bo - 3.70 mm [.146"]Ko - 1.20 mm [.047"]

ANODE SIDE

CATHODE SIDE

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P


ANODE SIDE

CATHODE SIDE

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P


ANODE SIDE

CATHODE SIDE

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P


ANODE SIDE

CATHODE SIDE

XHP35 High Intensity

Anode Side

XHP35.2 High Intensity

Anode Side

Loaded Pockets(1,000 Lamps) Leader

400mm (min) ofempty pockets with

at least 100mmsealed by tape


Trailer160mm (min) ofempty pockets


STARTEND

Cathode Side

Anode Side(denoted by + and circle)

160.0

A

A

B

2.5±.1

SECTION A-A SCALE 2 : 1

1.5±.1

8.0±.1

4.0±.1

1.75±.10

12.0 .0+.3

DETAIL B SCALE 2 : 1

13mm7"

Cover Tape

Pocket Tape

User Feed Direction

User Feed Direction


17



XHP50, XHP50.2

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °



SURFACE FINISH: 1.6

Trailer160mm (min) of

empty pocketssealed with tape

(15 pockets min.)

Loaded Pockets(500 Lamps)

Leader400mm (min.) of

empty pockets with at least 100mmsealed by tape


12

1.754

8 3.7

1.54

5.3

0.36

7.0"

1/13.000

A2402-00055

XHP50 LOADING SPEC

--

--

----

----

12/9/14D. CRONIN

REVISONS

REV DESCRIPTION BY DATE APP'D

END START

User Feed Direction

CATHODE SIDE

ANODE SIDE

User Feed Direction

13mm

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °



SURFACE FINISH: 1.6



(15 pockets min.)

Loaded Pockets(500 Lamps)

Leader400mm (min.) of

empty pockets with at least 100mmsealed by tape


12

1.754

8 3.7

1.54

5.3

0.36

7.0"

1/13.000

A2402-00055

XHP50 LOADING SPEC

--

--

----

----

12/9/14D. CRONIN

REVISONS


END START

User Feed Direction

CATHODE SIDE

ANODE SIDE

User Feed Direction

13mm


18



XHP70, XHP70.2

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °



SURFACE FINISH: 1.6



(100 pockets min.)

Loaded Pockets(1000Lamps)

12±.14.6

16+.3-.0

1.75±.104±.10

Leader420mm (min) of


(40 pockets min.)

7.4

0.36

"13

13mm

1/13.000

A2402-00056

XHP70 LOADING SPEC

--

--

----

----

12/9/14D. CRONIN

REVISONS


END START

User Feed Direction

CATHODE SIDE

ANODE SIDE

User Feed Direction

1.5± .1

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °



SURFACE FINISH: 1.6



(100 pockets min.)

Loaded Pockets(1000Lamps)

12±.14.6

16+.3-.0

1.75±.104±.10

Leader420mm (min) of


(40 pockets min.)

7.4

0.36

"13

13mm

1/13.000

A2402-00056

XHP70 LOADING SPEC

--

--

----

----

12/9/14D. CRONIN

REVISONS


END START

User Feed Direction

CATHODE SIDE

ANODE SIDE

User Feed Direction

1.5± .1


19


PACKAGING & LABELS

The diagrams below show the packaging and labels Cree uses to ship XLamp XHP Family LEDs. XLamp XHP Family LEDs are shipped in

tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.

XHP35, XHP35.2, XHP50, XHP50.2

Patent Label(on bottom of box)

Label with Cree Bin Code, Quantity, Reel ID


Label with Cree Order Code, Quantity, Reel ID, PO #



Unpackaged Reel

Packaged Reel

Boxed Reel

CREE Bin Code& Barcode Label

Vacuum-SealedMoisture Barrier Bag

Label with CustomerP/N, Qty, Lot #, PO #

Label with Cree Bin Code, Qty, Lot #


Vacuum-Sealed Moisture Barrier Bag

Patent Label

Label with Customer Order Code, Qty, Reel ID, PO #


20


PACKAGING & LABELS - CONTINUED

XHP70, XHP70.2



Vacuum-Sealed Moisture Barrier Bag

Dessicant (inside bag)

Humidity Indicator Card (inside bag)

Patent Label

Label with Customer Order Code, Qty, Reel ID, PO #

Patent Label






Unpackaged Reel

Packaged Reel

Boxed Reel

Documents

CLD-AP202 Rev 4A Cree XLamp XHP Family LEDs · 2018. 11. 1. · 2 XLamP ® XHP FamILy LED soLDErIng & HanDLIng HanDLIng XLamP® XHP FamILy LEDs manual Handling Use tweezers to grab