Upload
others
View
6
Download
0
Embed Size (px)
Citation preview
Chuck RichardsonCARTS 2004
March 29, 2004San Antonio, TX
Closing Identified Technology Gaps: NEMI ProjectsClosing Identified Technology Gaps: NEMI ProjectsTo Eliminate To Eliminate Pb Pb SolderSolder
2
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI Mission StatementNEMI Mission Statement
NEMI is a North American based
consortium whose mission is dedicated
to providing leadership for the global
electronics manufacturing supply chain
for the benefit of its member companies
and the industry.
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
What Does NEMI Do?What Does NEMI Do?
Leverage the combined Power of MemberCompanies to Provide Industry Leadership
• NEMI Conducts Industry Forums on Emerging Topics
• NEMI Roadmaps the Needs of the North AmericanElectronics Industry
• NEMI Identifies Gaps (both business & technical) inthe North American Infrastructure
• NEMI Stimulates R&D Projects to fill these Gaps
• NEMI Establishes Implementation Projects toEliminate these Gaps
• NEMI Stimulates Standards to speed the Introductionof New Technology & Business Practices
4
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Industry Leaders belong to NEMI Industry Leaders belong to NEMI –– OEM/EMS OEM/EMS
5
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Industry Leaders belong to NEMI Industry Leaders belong to NEMI –– Suppliers Suppliers
6
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Industry Leaders Industry Leaders –– Consultants, Government, Consultants, Government,Organizations, and UniversitiesOrganizations, and Universities
7
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI Planning MethodologyNEMI Planning Methodology
NEMI Manufacturing System Plan
Product Sector Requirements
Global Electronics ManufacturingRoadmap
NEMI Gap Analysis
NEMI Implementation Plan
NEMI Projects
RoadmappingRoadmapping
PlanningPlanning
8
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI Roadmap Emulator ChaptersNEMI Roadmap Emulator Chapters
• 2004 Roadmap cycle will include 7 Product EmulatorChapters
• A product emulator is defined as an abstractrepresentation of a product to allow companies toshare needs without sharing proprietary productinformation
• Each chapter sets OEM requirements over the next 10years
• Requirements are presented as key product attributesin spreadsheet format and supporting text discussingbusiness and state of the art issues
9
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
2004 Product Emulator Descriptions2004 Product Emulator Descriptions
Emulators Characteristics
Portable / Consumer High volume Consumer Products for which cost is the primary driver including Hand held, battery -powered products driven by size and weight reduction
System in a Package Complete function provided in a packag e to system manufacturer
Office Systems / Large Business Systems
Products which seek maximum performance from a few thousand dollar cost limit to literally no cost limit
Network / Datacom / Telecom Products
Products that serve the networking, datacom and telecom markets and cover a wide range of cost and performance targets
Specialty Emulators Defined by Operating Environment
Medical Products Products which must operate within a high reliability environment
Automotive Products which must operate in an automotive environment
Defense and Aerospace Products which must operate in extreme environments
10
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI 2004 RoadmapsNEMI 2004 Roadmaps18 Individual Roadmap Chapters18 Individual Roadmap Chapters
• SemiconductorTechnology
• Packaging
• Mass data storage
• Board Assembly
• Final Assembly
• EnvironmentallyConscious Electronics
• Interconnect SubstratesOrganic
• Interconnect SubstratesCeramic
• Connectors
• RF Components &Subsystems
• Optoelectronics
• Passive Components
• Energy Storage Systems
• Display
• Modeling, Simulation &Design Tools
• Thermal Management
• Test, Inspection &Measurement
• Product LifecycleInformation Management
11
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI Roadmap AffiliationsNEMI Roadmap Affiliations
NEMIOptoelectronics
TWG
NEMIOptoelectronics
TWG
Optoelectronics andOptical Storage
InterconnectSubstrates—Ceramic
InterconnectSubstrates—Organ
ic
Magnetic andOptical Storage
Supply ChainManagement
Displays
Semiconductors
NEMI Roadmap
NEMIProduct Life-
CycleInformation
ManagementTWG
NEMIProduct Life-
CycleInformation
ManagementTWG
NEMIMass Data
Storage TWG
NEMIMass Data
Storage TWG
NEMI / IPCInterconnect
TWG
NEMI / IPCInterconnect
TWG
NEMI / SIAPackaging
TWG
NEMI / SIAPackaging
TWG
12
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Roadmap DevelopmentRoadmap Development
Product Emulator GroupsTWGs
Net
com
Med
ical
Pro
du
cts
Au
tom
oti
ve
Def
ense
an
d A
ero
spac
e
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
Product Sector Needs Vs. Technology Evolution
Business Processes Prod Lifecycle Information Mgmt.
Po
rtab
le /
Co
nsu
mer
Off
ice
/ Lar
ge
Sys
tem
s
Sys
tem
in a
Pac
kag
e
13
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
2004 TWG Leadership2004 TWG Leadership
Barbara Goldstein,NIST
Steve Qually, IntelPeter Peloquin, Intel
Product Lifecycle InformationManagement
Mark Newton, DellEnvironmentally consciouselectronics
Yogendra Joshi, GITTom Roth and Dr. CamMurray, 3MThermal management
Dr. KoneruRamakrishna, Mot.Dr. Sanjeev Sathe, EITModeling, simulation & design tools
Design Technologies
Co-ChairChairBusiness Processes/Technologies
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
2004 TWG Leadership (cont.)2004 TWG Leadership (cont.)
Alan K. Allan, Intel Paolo Gargini, Intel• Semiconductor Technology
Ralph Brodd, BroddarpDan Doughty, Sandia Labs• Energy Storage Systems
John MacWilliams, Consultant• Connectors
Roger F. Hoyt, IBMTom Coughlin, Consultant• Mass data storage
Dr. Norman Bardsley, USDCM. Robert Pinnel, USDC• Displays
Dr. Laura Turbini, CMAPJohn Stafford, Consultant• Optoelectronics
J. Stevenson Kenney, GIT;Eric Strid, Cascade MicrotechDr. V.J. Nair, Intel• RF components &
subsystems
Dr. Joseph Dougherty, PSUOpen• Passive components
Howard Imhoff, Metalor• Interconnect subs – ceramic
Dieter Bergman, IPCJohn T. Fisher, NEMI• Interconnect subs – organic
Bill Bottoms, 3MT Solutions Joe Adam, Skyworks• Packaging
Component/Subsystem Technologies
Dr. Reijo Tuokko, Tampere U.Mike Reagin, Delphi Delco• Final assembly
David Doyle, OrbotechMichael J. Smith, Teradyne• Test, inspection &measurement
Kirk VanDreel, Plexus
Dennis Krizman, Celestica• Board Assembly
Co-ChairChairManufacturing Technology
15
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Cellular Handset: Key Attribute NeedsCellular Handset: Key Attribute Needs
Parameter
Metric
2003
2005
2007
2013 RF section cost (for a given function)
Relative to costs in 2000
0.7
0.35
0.17
0.05
Number of freq bands 2
4
6
6
Number o f Antennas (Diversity) 1
2
2
3
Number of Modulation formats 2
4
5
5
Data transmission rate (peak)?
kb/s
14
160
1500
11,000 Transmit Peak - to - Average Ratio (worst)
dB
4 dB
5 dB
5 dB
4 dB
Talk time
minutes
90
120
160
200 Battery Voltage
V
3.3
2.7
1.5
1.2
RF section area
mm 2
1800
1200
800
500 RF component thickness
mm
2.5
1.5
1.5.MEMs
1.0,MEMS
From Portable emulator:
Average Component I/O Density
I/O per cm 2
70
80
100
140 Max Component I/O Density**
I/O per cm 2
280
320
350
450
I/O per Component, avg.
#
3.6
4.0
4.4
5.0 Package I/O Pitch (Perimeter)
mm
0.5
0.5
0.5
0.5
Package I/O Pitch ( Area array)
mm
0.5
0.4
0.25
0.2 Max I/O per package
I/O per pkg
256
288
312
360
Flip Chip I/O Pitch (Area)
mm
0.25
0.25
0.20
0.10 Substrate Lines and Spaces
microns
60
35
30
20
16
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply ChainMember Collaboration Efforts
SoftwareSolutions
Life Cycle Solutions
Materials
ComponentsCollaborative
Design
MaterialsTransformation
Substrates TIGProjects:
• High Frequency Materials Effects for HDI• Integral Passives Testing• Optical PWB Cost Modeling
Board Assembly TIGProjects:
• DPMO• Materials & Processes for High-
Performance Products• Substrate Surface Finishes for Lead-Free
Product Life Cycle Information Management TIG Projects:
• PDX Extensions & Updates• Data Exchange Convergence Project
- Industry Adoption
Optoelectronics TIGProjects:
• Fiber Optic Splice Improvement• Fiber Optic Signal Performance• Fiber Optic Splice Loss Measurement
Specification• Fiber Connector End-Face Inspection
Specifications
Environmentally Conscious Electronics TIGProjects:
• Lead-Free Assembly & Rework• Tin Whisker Accelerated Test• Tin Whisker Modeling• Tin Whisker User Group• RoHS Transition Group
Build toOrder
Equipment
China Efforts:• Sharing Best Practices• Lead-Free Transition
China Efforts:• Sharing Best Practices• Lead-Free Transition
17
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Closing Identified Technology Gaps: NEMIClosing Identified Technology Gaps: NEMIProjects To Eliminate Projects To Eliminate Pb Pb SolderSolder
• Phase 1 Projects:– 1998 Roadmap identified need for lead free processes– 1999 NEMI organized the Lead Free Assembly Project– Over a three year span; recommended Sn3.9Ag0.6Cu standard
alloy for reflow and / or Sn0.7Cu for wave solder– Followed with extensive testing to characterize the new materials
and demonstrate reliability– Since then several other alloys have been proposed by others but
most commercialized alloys vary slightly from the NEMI proposedrange.
– Tin-silver-copper formulations with silver content between 3.5%and 4.1% and copper between 0.5% and 1.0% are virtuallyindistinguishable in terms of melting point (217C) and processfeatures.
– The NEMI alloy provides a model system for industry that is wellcharacterized and in use by NEMI members (HP, Intel, Motorola,Solectron, Celestica, Sanmina-SCI, Lace Technologies)
18
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Closing Identified Technology Gaps: NEMIClosing Identified Technology Gaps: NEMIProjects To Eliminate Projects To Eliminate Pb Pb SolderSolder
• History of Pb-Free Projects Worldwide and NEMIProject Structure
• Analysis of Sn-Ag-Cu Alloy Results– Issues in processing, particularly in the transition period
– Reliability testing results
– Melting behavior of Sn-Ag-Cu alloys as function of composition
19
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
20
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
•• AT&T/ Lucent Technologies AT&T/ Lucent Technologies•• Ford Motor Company (Ford) Ford Motor Company (Ford)•• General Motors (GM) General Motors (GM) ——Hughes AircraftHughes Aircraft•• General Motors General Motors——Delco ElectronicsDelco Electronics•• Hamilton Standard, Division of United Technologies Hamilton Standard, Division of United Technologies•• National Institute of Standards and Technology (NIST) National Institute of Standards and Technology (NIST)•• Electronics Manufacturing Productivity Facility (EMPF) Electronics Manufacturing Productivity Facility (EMPF)•• Rensselaer Polytechnic Institute (RPI) Rensselaer Polytechnic Institute (RPI)•• Rockwell International Corporation Rockwell International Corporation•• Sandia Sandia National LaboratoriesNational Laboratories•• Texas Instruments Incorporated Texas Instruments Incorporated
NCMS Lead-Free Solder ConsortiumNCMS Lead-Free Solder Consortium
1993-1997
21
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI Task Group Structure: 1999-2002NEMI Task Group Structure: 1999-2002
NEMI Pb-free Assembly Task ForceEdwin Bradley, Motorola
Rick Charbonneau, StorageTek
Solder AlloyCarol Handwerker, NIST
ComponentsRich Parker, Delphi
ReliabilityJohn Sohn, NEMI
Assembly ProcessJasbir Bath, Solectron
Tin WhiskersSwami Prasad, ChipPAC
22
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI Assembly Project ParticipantsNEMI Assembly Project Participants
•OEMs/EMS•Agilent•Alcatel Canada•Celestica •Compaq•Delphi Delco•IBM•Intel•Kodak•Lucent•Motorola•Sanmina-SCI•Solectron•StorageTek
•Solder Suppliers•Alpha Metals•Heraeus•Indium•Johnson Mfg.•Kester
•Components•ChipPac•Intel•Motorola•Texas Instruments•FCI USA Electronics
Govt. & OtherNISTSUNY-B/IEECITRI (US)IPC
EquipmentBTUDEKOrbotechTeradyneUniversalVitronics-Soltec
23
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Debate on Alloy CompositionDebate on Alloy Composition
Which alloy composition should we use?
Three main effects of solder alloy composition:
During assembly:
melting, wetting, reaction, solidification
After assembly:
thermal fatigue resistance, fracture, tin
whiskers
24
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Melting Behavior of Sn-Ag-Cu soldersMelting Behavior of Sn-Ag-Cu solders
NEMI
eutecticJEIDA
25
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Melting Behavior of Sn-Ag-Cu soldersMelting Behavior of Sn-Ag-Cu solders
NEMI
eutectic
JEIDA
26
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Melting Behavior of Sn-Ag-Cu soldersMelting Behavior of Sn-Ag-Cu solders
Inside green lines -<0.5% solid
Inside red line –<1% solid < 0.5% solid
< 1% solid
NEMIJEIDA
27
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Lead-free surface finishes¸Organic surface finishes already a problem for Sn/Pbsolder¸Higher reflow temperatures with Sn-Ag-Cu is even moreof a challenge; second side reflow
Sn-Ag-Cu solders with Sn/Pb balls¸No discernable issues
Sn-Ag-Cu balls with Sn/Pb solders¸May be some issues of backward compatibility withrespect to reliability for area array joints
Sn-Ag-Cu solders with Sn/Pb surface finishes¸Through-hole fillet lifting
Transition IssuesTransition Issues
28
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Through-Hole Lead
Solder Fillet
Separation duringCooling
Through-Hole on Board
Morpholology Morpholology of Fillet Liftingof Fillet Lifting
NCMS Lead-FreeSolder Project andcollaborationbetween NIST andTsung-Yu Pan,Ford
29
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Universal Build Visual Inspection Results:Universal Build Visual Inspection Results:CBGACBGA
Visual Inspection Criteria must be changedVisual Inspection Criteria must be changed
Tin-lead paste/tin-lead CBGA(Shiny joint)
Lead-free paste/ Tin-lead CBGA(Dull joint)
Lead-free paste/lead-free CBGA(Cratered solder joint)
30
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
0
3
2
4
2a
1
5a
5
6
48 100 240352
PBGA
M2CSP(stacked)
196 (15X15 mm) 72 (8X10 mm)
Lead count
MSL
Package Vs. MSL Vs. Peak Reflow Temperature
uBGATBGA
388 (35X35 mm)
S1
S2
S1
S2
S1
S2
S1 S2S1
S1
S1
S1
S3
S2
S2
S2
S1
S3
S2
S2
S2
MSL vs Reflow Temperature: IC Packages
S1, S2, S3, etc. = S1 is existing package structure; S2 is improved package structure; S3 is further improved package structure;S1, S2, S3 may not be the same for each package tested (i.e. new mold compound, assembly equipment, die coat, etc.)
31
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Reliability Test MatrixReliability Test Matrix
ComponentSourceDescriptionReliability Testing-40 to 125°
C0 to 100°
CType 1 TSOPAMD48 Pin TSOP with leads on shortsides, SnPb and NiPd finishesSolectron2512 ResistorKoaspeerzero ohm chip resistor, SnPb andpure Sn finishesSanmina-SCI169 CSPLucent0.8mm pitch, 11x11mm, 7.7 x 7.7mm die, SnAgCu and SnPb ballsKodakLucent208 CSP(HDPUG)ChipPac0.8mm pitch, 15x15mm, 8.1 x 8.1mm die, SnAgCu and SnPb ballsKodak (bothSnAgCualloys)Sanmina-SCI256 BGA(NCMS)Amkor1.27mm pitch, 27x27 mm, 10.0 x10.0 mm die, SnAgCu and SnPbballsCelesticaSanmina-SCI256 CBGAVendorpart; IBMball attach1.27mm pitch, no die, SnAgCu andSnPb ballsMotorola
SnAgCu balls: Sn4.0Ag0.5Cu - provided by Heraeus
32
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Reliability flow chartReliability flow chart
Test PlanDesign, Procure
BoardsAssembly
Identify, ProcureComponents
CTEMeasurements
T0 Information• AOI• C-SAM• x-ray
Bend Testing
ElectrochemicalMigration Testing
ThermalCycling
Data Analysis
Failure Analysis• Post-cycling C-SAM• Cross-section• Joint characterization• Dye Penetrant Analysis
Pre-AssemblyC-SAM
Final Report
33
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
169CSP Lifetime Analyses: What are169CSP Lifetime Analyses: What areAcceleration Factors for Sn-Ag-Cu ?Acceleration Factors for Sn-Ag-Cu ?
0 °C to 100 °C cycling -40 °C to +125 °C cycling
Pb-Pb Pb-LF LF-LFh (N63) 3321 3688 8343b 7.5 2.9 4.1
Pb-Pb Pb-LF LF-LFh (N63) 1944 3046 3230b 6.6 11.3 7.7
34
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Example of Solder Joint Microstructure:Example of Solder Joint Microstructure:169CSP, LF-LF, -40 169CSP, LF-LF, -40 °°C to +125 C to +125 °°CC
Solder consists oftin dendritesseparated byCu-Sn and Ag-Snintermetallics
Sn-3.9Ag-0.6Cu
35
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
ATC Relative PerformanceATC Relative Performance
-40 to +125 0 to 100
Component Relative Performance Relative Performance
SnPb - SnPb SnPb - LF LF-LF SnPb - SnPb SnPb - LF LF-LF
AMD 48 TSOP - im Ag bds 0 - 0
AMD 48 TSOP - NiAu bds 0 + +
2512 Resistors - im Ag bds 0 0 0
2512 Resistors - NiAu bds 0
169 CSP 0 + + 0 0 +
208 CSP 0 0 + 0 + +
208 CSP - JEITA alloy 0
256 PBGA 0 0 0 0 0 0
256 Ceramic BGA 0 - +0 equivalent to SnPb-SnPb benchmark (95% confidence bounds)
- statistically worse than SnPb-SnPb benchmark
+ statistically better than SnPb-SnPb benchmark
36
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Pb-Free Project ResultsPb-Free Project Results
• Solder Alloy
– Recommended Tin-Silver-Copper alloy (Sn/Ag3.9/Cu0.6) for reflowand Tin-Copper alloy (Sn99.3/Cu0.7) for wave soldering
– Backwards compatible with lead based systems
• Components
– Maximum component temperatures of 240C for large ICs, 250C maxfor small ICs on boards £ 0.92” thick were achieved
– JEDEC revised J-STD-020B standard 250°C –5/+0
• Process
– Manufactured with existing assembly process equipment
– Performance of Pb-free pastes and fluxes are adequate
• Reliability– Demonstrated Pb-free joints are more reliable than tin-lead
37
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Closing Identified Technology Gaps: NEMIClosing Identified Technology Gaps: NEMIProjects To Eliminate Projects To Eliminate Pb Pb SolderSolder
• Phase 2 Projects:
– Lead Free Hybrid Assembly & Rework Project» Includes extensive testing of tools and processes for reworking with SnAgCu
alloys on thick substrates (up to 0.130”)» Findings showed components reaching higher than the recommended maximum
of 260C during rework» Team is developing new tools and processes to keep temperatures between 245-
250C» Testing began in December on several assemblies using two different board
thicknesses and a variety of components manufactured with the new procedures– Tin Whisker Accelerated Test Project
» Open program to devise industry standard tests for predicting tin whiskers» Completed a second round of experiments and comparing results with Soldertec
of Tin Technology Ltd. (Europe) and the Japan Electronics and InformationTechnology Industries Association (JEITA) concluded that thermal cyclingaccelerates whisker growth
» Submitted definitions of tin whiskers and measurement techniques to JEDEC forconsideration as industry standards
» The team subsequently found that whiskers can also be induced by bias» The team is presently defining testing to evaluate bias
38
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Closing Identified Technology Gaps: NEMIClosing Identified Technology Gaps: NEMIProjects To Eliminate Projects To Eliminate Pb Pb SolderSolder
– Tin Whisker Modeling Project» Attempting to understand why whiskers form and how to control them» This team continues to pursue an understanding of the mechanism(s) that cause
tin whiskers to form and grow» Published an annotated bibliography of tin whisker literature written by project
chair George Galyon (IBM)» Developed a consensus position on whisker theories» Experimentation is in process that looks at stress, crystal orientation and
material movement within tin film using laboratory prepared samples to eliminatethe variations in commercial plating processes
» The project has applied to Lawrence Livermore National Laboratory to use theirsynchrotron X-ray diffraction tool to gain insight into how whiskers form
– Tin Whiskers User Group Initiative» Formed to develop recommendations for lead free surface finishes on
components that minimize the risk of failure from tin whiskers in high reliabilityelectronic applications
» The root cause of tin whiskers is not yet fully understood so this initiative isdeveloping mitigation strategies to reduce the immediate risk
» Latest updates include: nickel-palladium or nickel palladium –gold instead of tin,use of a nickel underlay, heat treatment(150C for 1 hour) or reflow the tin coating
» Mitigation practices are continuously refined as new information is available
39
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Tin Whisker Formation¸Why? When? How?¸Is there a magic bullet?
Open IssuesOpen Issues
40
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Whisker ExamplesWhisker Examples
Odd-ShapedEruptions (OSE)
Hillocks(Lumps)
Needles
41
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Whisker ExamplesWhisker Examples
Consistent cross-section(column)
Striations Rings
42
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Whisker ExamplesWhisker Examples
Kinked Branched Initiating fromHillock
43
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
NEMI Committee StructureNEMI Committee Structure
• Tin Whisker Test Standards Committee (Test Group)– First committee formed
– Objective to develop tests/test criteria for tin whiskers– 42 companies including two governmental organizations
– Nick Vo (Chair) – Motorola
– Jack McCullen (Co-Chair) – Intel
– Mark Kwoka (Co-Chair) – Intersil
• Tin Whisker Modeling Group (Modeling Group)– Formed to gain fundamental understanding of whisker formation– 13 companies including one government organization.
– George Galyon (Chair) – IBM
– Maureen Williams (Co-Chair) – NIST
– Irina Boguslavsky (Co-Chair) – EFECT, NEMI Consultant
44
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Tin Whisker CommitteesTin Whisker Committees
• Tin Whisker Users Group (Users Group)– Formed by large companies with high reliability products to
look at mitigation techniques– Started in late 2002
– 10 companies
– George Galyon (Chair) – IBM
– Richard Coyle (Co-Chair) – Lucent
45
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Test Team MembersTest Team Members
• Agilent
• Alcatel
• Allegro Microsystems
• AMD
• Analog Devices
• Boeing
• ChipPAC
• Cooper Bussmann
• Delphi Delco
• Engelhard Clal
• Enthone
• FCI Framatome
• Flextronics
• HP
• IBM
• Indium
• Infineon AG
• Intel (Co-Chair)
• Intersil (Co-Chair)
• IPC
• ITRI Soldertec
• Kemet
• Lockheed Martin
• Microchip
• Micro Semi
• Molex
• Motorola (Chair)
• NASA Goddard
• NIST
• NEMI
• On Semi
• Philips
• Raytheon
• Soldering Tech.
• Shipley
• Solectron
• ST Micro
• SUNY Binghamton
• SUNY Buffalo
• Technic
• Texas Instruments
• US Army
46
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Overview of Whisker Committee EffortOverview of Whisker Committee Effort
• Direct:– Completed two comprehensive matrices, Phase 1 and 2, both for ICs and
Passives.
– Proposed a definition for whiskers.
– Developed an inspection protocol.
– Identified three test methods recommended for plating finishdevelopment and characterization.
– Initiated test method document for potential release by JEDEC.
– Preparing matrix for Phase 3 DOE (validation and verification).
• Indirect:– Generated considerable momentum to understand whiskers and tin
plating globally.
47
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Whisker DefinitionWhisker Definition
• Purpose:– To specify the physical and visual characteristics of a tin whisker for
use in inspection (not intended as a metallurgical definition)
• Tin Whisker:– A spontaneous columnar or cylindrical filament, which rarely branches,
of tin emanating from the surface of a plating finish.
• NOTE, For the purpose of inspection tin whiskers havethe following characteristics:– an aspect ratio (length/width) > 2;
– can be kinked, bent, twisted;
– generally have a consistent cross-sectional shape;
– rarely branch;
– and may have striations/rings around it.
48
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
RoHS Compliance Transition Issues RoHS Compliance Transition Issues –– OEM OEMExampleExample
• RoHS compliant/Pb-free SMT components must be compatible with a 260 oC peak reflow temperature. (Lower temperature requirements may be considered for some large, thick lead frame components.)
• Tin plating poses a reliability risk from Sn whisker growth which may cause electrical shorts.
• To mitigate tin whisker problems, recommended NiPdAu plating or a Ni layer (≥1.3 mm) below the Sn plating. Also, considering whether annealing Sn on Cu offers a practical technical solution.• Our test requirements are based on recommendations from NEMI’s test acceleration group. However, we have set requirements for test length and failure criteria based on our product requirements.
Note: Pb-free area array components (BGAs, CSPs, etc.) pose a reliability risk when used with today’s SnPb solder process, and should not be accepted for this process.
49
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Summary-Summary-OEM Needs For Supply Chain AlignmentOEM Needs For Supply Chain Alignment
• Work with NEMI and standards committees to adapt existing standards to meet RoHS compliance.
• Communicate RoHS compliance requirements (not just “Pb-free”) to component suppliers and EMS providers.
• RoHS compliance compatibility means both metallurgical compatibility and manufacturing process compatibility.
• Communicate need for unique part numbers for RoHS compliance, tracking, repair, etc.
Note: RoHS compliance policy and compliance testing procedures have not yet been defined
50
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Closing Identified Technology Gaps: NEMIClosing Identified Technology Gaps: NEMIProjects To Meet Projects To Meet RoHS RoHS / WEEE Directives/ WEEE Directives
• Phase 3 Projects:• Supply Chain Readiness Projects
– RoHS Assembly Process Specifications Project» Develop updated assembly/rework standards for LF assemblies» Develop process definition / component specifications documents for successful
implementation of LF assembly– RoHS Component and Board Marking Project
» Develop a standard for part marking that identifies LF status» Address components, cards and motherboards both raw material / finished
product form– RoHS Component Supply Chain Readiness
» Develop component compatibility and compliance criteria to assess readiness ofthe supply chain
» Focusing on board mounted components and PCBs for mainstream & highreliability applications
– RoHS Materials Declarations Project» EIA, EICTA, JGPSSI have drafted a Material Composition Declaration Guide and
submitted it to JEDEC for approval» Will run pilot tests to ID issues related to Declaration Guide» Recommend standard for materials declaration process / toolset» Supply automated reporting process with minimal supply chain impact
51
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
Transition to Pb-free AssemblyTransition to Pb-free Assembly
• 1998 Roadmap identified the gap.
• Phase I project developed the alloy, process, componentsand reliability from 1999-2002.
• Phase II project is expanding the technology base toinclude rework, wave-soldering, and reliability of leadfinishes.
• 2002 Roadmap identified a number of business Issues toconvert to a Pb-free supply chain.
• Phase III project teams are currently being established toaddress these supply chain transition issues.
Results:
• The NEMI efforts have accelerated the establishment ofSAC alloys as the new standard and reduced the effort ineach member company.
52
Connect with and Strengthen Your Supply ChainConnect with and Strengthen Your Supply Chain
ConclusionConclusion
• NEMI forms projects to address technology / infrastructuregaps identified through roadmapping and gap analysisactivities
• NEMI identifies areas:– Not being addressed by other industry efforts– Where members can collectively have an impact
• Projects aim to eliminate gaps through:– Accelerated deployment of new technology– Development of industry infrastructure– Dissemination of efficient business practices– Stimulation of standards
• The projects to establish an infrastructure to meet therequirements of the EU’s RoHS directive and for eliminatinglead in electronics are excellent examples of the achievementsof the NEMI process