CMS Week, CERN, 06-10 December 2004 09 Dec 2004CMS Week - Module ProductionSalvatore Costa - Catania Report from Module Bonding Working Group Meeting Salvatore

CMS Week, CERN, 06-10 December 2004

09 Dec 2004CMS Week - Module ProductionSalvatore Costa - Catania

Report from

Module BondingWorking Group Meeting

Salvatore CostaUniversità di Catania and INFN – Sezione di Catania

09 Dec 2004CMS Week - Module Production 2 Salvatore Costa - Catania

Outline

1. Global info on production bonding of the Modules

2. Global review of Module bonding quality indicators

3. Current open issues

4. Selected highlights from individual Center reports



Global

info on production bonding


Production Summary

N. of Modules bonded(assembled after

01Dec2003)

TIB 1420

TID 2

TOB 547

TEC 921

Total 2890



Global

review of Module bonding quality


# Modules Pull Tested

Center PA TA PA-Sen Sen-Sen

Bari 103 109 n/a

Catania 51 51 n/a

Firenze 17 9 n/a

Padova 18 99 n/a

Pisa 25 57 n/a

Torino 164 53 n/a

Fermilab 148 72 45

Santa-Barbara 62 78 96

Aachen 37 41 41

Hamburg 69 50 n/a

Karlsruhe 0 20 n/a

Strasbourg 20 65 65

Vienna 76 125 n/a

Zurich 2 49 n/a


Pull Test Results

5g

Not angle-corrected yet!

Ave

rag

e f

orc

es (

g)

BA CT FI PD PI TO FL FL SB SB AA AA HA KA ST ST VI ZH

. ss ss ss ss



Current

open issues


Tool change intervals

• Original recommendation in Bonding Spec doc– change tool every 40,000 bonds– can go up to 100,000 provided bond foot is inspected

regularly

can be revised because of improved tool technology• Document [in progress], based on info gathered by

Alan, is posted on bonding web site

cms.ct.infn.it/bonding cms.ct.infn.it/bonding “Tool care & change” “Tool care & change”• 40,000 becomes recommended interval for tool

cleaning, interval for change becomes tool-manufacturer-dependent


Jigs for TEC module bonding

TEC CenterModule types to

bond (# Mod)Who made jigs

(# jigs)

Backup center for these Module

types

Who makes additional jigs

(# jigs)

Aachen R6 Aachen (1) R3,R5p,R5s Aachen (2)

Hamburg R1p,R1s, R3 Hamburg (2/2/2) R7 Hamburg (2)

Karlsruhe R5p,R5

Strasbourg R7

Vienna R2p,R2s Vienna (1) Not decided yet Not decided yet

Zurich R4 (1100) Karl./Zurich (2) R6 Karl./Zurich (1+1)

With squeezed-down time for production, the TEC community is taking steps to gain the ability to bond each given type of module in more than one TEC bonding Center. This in order to have a backup ready in case of failure or overload at any particular Center. This mainly means having duplicate jigs available at each Center. As coordinator of the Bonding WG, I was requested to look after the actual execution of the extra jigs construction.

During the Bonding Meeting we filled (partially, for lack of representatives from 2 Centers) the following Tablefollowing Table, which summarizes the status of this task. We hope the table can be completed by the next Bonding WG Meeting.



Selected highlights from

individual Center Reports


TEC centers• Aachen: Had some problems reading a few of the recently

bonded modules. It turned out that the first PA-Sen bias bond was too close to the last readout bond, thus shorting to it. Corrected by changing program for bias bonds.

• Vienna: They have bought a new (used) Delvotec 6400 to speed up production. It should arrive before Christmas.

• Zurich: Has bonded and ARCS tested 357 modules in 2004. Lately they bonded 9 R6, 12 R4 alignment modules and 2 R7 hybrids. The first R7 hybrid was bonded with standard tool which yielded rather large bond feet. Because of that there were 3 shorts. Then they got a smaller tool from Alan. With it the bond feet were smaller than the pads and the electric test was OK.


TIB centers• Catania: Suffered Hughes machine failure ~2 months ago. For a while

tried over and over to fix it by ourselves to save money, given the current stop in the flow of incoming modules, but could not get machine back to normal behavior. So we had to get service from Palomar Technologies (5 k€), which fixed and tuned mechanical parts, and from an electronic technician at the Catania Phys. Dept., who replaced degraded or failed electronics components.

• After this fixing, bonded 13 modules with excellent bond foot quality and good pull test results [not yet in DB]: 11-13 g, all First Bond Heel Breaks. Still ~30 modules awaiting bonding.

• Firenze: After fixing their Delvotec (reported at last Meeting) has resumed bonding and currently only 5 modules are yet to be bonded.

• Complained again that the filter capacitor gold bond pad is often difficult to bond on due to poor substrate quality. Perhaps we should convey this complaint to the Company producing the kapton circuit.


TIB centers• Pisa: Reported early experience with bonding of the very first TID

modules: 2 Ring1 Modules: – Variable strip pitch requires careful bonder programming

– Single bonding jig [supplied by Torino] can be used for all Module types [phi, stereo right, stereo left] of the same ring by just moving a positioning pin [pictures]

– Experience:

• Good planarity and vacuum sealing.

• Good mechanical stability of Module+Carrier+Mask+Bonding Jig [pictures] during bonding procedure.

– 6 TID modules have been builtR1 R2 R3

1 BA 1 BA 1 BA

1 PG 1 PG 1 PG

bonded


TID R1 Bonding Jig [Torino] Bonding Jig +Carrier + Adaptable Mask

Adjustable positioning pin Assembled Module… …on jig

[Pictures by A.Profeti, Pisa]


TOB centers• Santa Barbara: 1. Hybrid bonding:

– 28 TOB 6-chip – 76 TOB 4-chip

2. Module bonding: • modules bonded:

– 6 TEC R7– 18 TEC R5 stereo (10 of which got every 50th bond pull-tested)– 1 TOB 6 chip– 1 TOB 4 chip

• wrote programs for– TEC R7 modules– TOB 4 chip modules (HPK sensors)– TOB 6 chip modules (HPK sensors)

• Encountered problem with using the pattern recognition software on the HPK sensors. In the center of the sensor they use the channel number as fiducial, but the numbers on the HPK sensors are too small to be picked up by the pattern recognition software of the bonder, so they have to align the reference system on the sensors manually, this adds about 2 minutes to the bonding time per module. Note: they had asked HPK in fall to add fiducial marks to the center of the sensors, but that apparently never happened.

Documents

CMS Week, CERN, 06-10 December 2004 09 Dec 2004CMS Week - Module ProductionSalvatore Costa - Catania Report from Module Bonding Working Group Meeting Salvatore