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Communications in Distributed Intelligent MEMS Julien BOURGEOIS (UFC), Seth Copen Goldstein (CMU/SCS) NaNoNetworking Summit, Barcelona, June 2011
Work is funded by ANR ANR-06-ROBO-0009-03
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Outline
Introduction
The Smart Projects
– Distributed information management
Claytronics
– Electrostatics communications and actuation
Conclusion & perspectives
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Introduction
Microtechnology is now a mature technology
MEMS can be produced by thousands units
Applications:
STMicro LIS331DLH
Accelerometers
What for?
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Introduction
Microtechnology is now a mature technology
MEMS can be produced by thousands units
Applications:
TI
Digital Micromirror Device
What for?
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MEMS Classification
MEMS
Sensor MEMS
Single MEMS Distributed
MEMS
Static topology Dynamic topology
Actuator MEMS
Single MEMS Distributed
MEMS
Static topology Dynamic topology
Sensor/Actuator MEMS
Single MEMS Distributed
MEMS
Static topology Dynamic topology
DMD Accelerometer
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Flow of information
Distributed MEMS
Sensor MEMS
Static topology Dynamic topology
Actuator MEMS
Static topology Dynamic topology
Sensor/Actuator MEMS
Static topology Dynamic topology
Output only Input only Input/Output
Scalability issue
Distributed Intelligent MEMS
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Introduction
Microtechnology is now a mature technology
MEMS can be produced by thousands units
Need for embedded intelligence
New challenges:
– Coordination needs distribution paradigm
• Communication
• Programming
• Control
– Smooth integration of different technologies
Scalability up to millions!
– 1 m3 of intelligent MEMS -> internet on your table
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Some projects
Simple MEMS
Remote intelligence MEMS
Integrated intelligence MEMS
Static Distributed MEMS
Mobile Distributed MEMS
+ External PC
+ FPGA
+ Distributed
intelligence
+ Dynamic
network
topology
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Outline
Introduction
The Smart Projects
– Distributed information management
Claytronics
– Electrostatics communications and actuation
Conclusion & perspectives
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Front-side
Back-side
Smart Surface Project
Objective : Design and realization of a distributed intelligent MEMS to convey and to sort mesometric objects
560 micro-actuators, distributed intelligence
actuator surface: ~1mm²
matrix surface 35 x 35 mm²
Work is funded by ANR ANR-06-ROBO-0009-03
22 permanent researchers
5 labs (French and Japanese)
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Smart Blocks project
A MEMS-based modular and self-reconfigurable surface for fast conveying of fragile objects and medicinal products
20 permanent researchers, 4 labs, 1 company
Work funded by ANR
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Smart Blocks project
Challenges (related to communications):
– Hardware
• CMOS and MEMS integration
• Integrating processing unit, communication network, high voltage circuit in reduced space
– Software
• Co-design between distributed computing and control to manage millions of sensors/actuators.
• Optimization of the physical topology
• Developing software for computer-aided design of very large multi-domain systems
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Outline
Introduction
The Smart Projects
– Distributed information management
Claytronics
– Electrostatics communications and actuation
Conclusion & perspectives
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Objectives
Managing informations from sensors
– Distributed differenciation of objects with:
• Low computing power
• Low memory size
• High level of discretization
Managing communications
– Preserving scalability
– Fault tolerance
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Asynchronous distributed state acquisition
Distributed asynchronous state acquisition description via successive approximation method:
with
and with T(i) the set of times at which sub vector xi is updated
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Integration with control
...
...
Motion controller
Valve i
...
s k u i kon/off sensor i
on/off sensor i+1
...
...
bi k
on/off sensor i+2
bi 1 k
bi 2 k
Part reconstruction and differentiation
...
Part reconstruction and differentiation
Part reconstruction and differentiation
s k
s k
Motion controller
Motion controller
...
Valve i+1u i 1 k
Valve i+2u i 2 k
...
P2P communication
P2P communication
P2P communication
P2P communication
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Outline
Introduction
The Smart Projects
– Distributed information management
Claytronics
– Electrostatics communications and actuation
Conclusion & perspectives
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www.cs.cmu.edu/~claytronics
Claytronic Apple Real Apple
Claytronics
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CATOM = Claytonic Atom
~meters (2006)
~decimeters (2007)
~centimeters (2007)
~milimeters (2010)
Claytronics
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Shell
Chip
Catom
Catom: a rolling cylinder.
Shell
Chip
Shell: SiO2 film + Aluminum
Chip: HV SOI CMOS die
Catom (1)
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Coupling Electrodes
Two types of electrodes:
1) Coupling electrodes
2) Actuation electrodes
Actuation
Electrodes
Chip has two main functions:
1) Power
2) Actuation
Actuation
Electrodes
Catom (2)
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Outline
Introduction
The Smart Projects
– Distributed information management
Claytronics
– Electrostatics communications and actuation
Conclusion & perspectives
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Electrostatics
One mechanism: four functions
– Adhesion
– Actuation
– Communication
– Power Transfer
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Electrostatics
One mechanism: four functions
– Adhesion
– Actuation
– Communication
– Power Transfer
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0 0 1 1 1 1 0 0
shifts every T = 100ms DATA 1
1
1 0
0
0
1 0
Logic
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shifts every T = 100ms DATA 1
1
1 1
0
0
0 0
0 0 1 0 1 1 0 1
Logic
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1
0
1 1
0
1
0 0
0 0 0 0 1 1 1 1 `
shifts every T = 100ms DATA
Logic
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0
0
1 1
1
1
0 0
0 1 0 0 1 0 1 1 `
shifts every T = 100ms DATA
Logic
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0 1 0 0 0 0 0 0 `
ENABLE shifts every T/32 seconds
Logic
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1 0 0 0 0 0 0 0 `
ENABLE shifts every T/32 seconds
Logic
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0 0 0 1 0 0 0 0 `
ENABLE shifts every T/32 seconds
Logic
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0 0 1 0 0 0 0 0 `
ENABLE shifts every T/32 seconds
Logic
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0 0 0 0 0 1 0 0 `
ENABLE shifts every T/32 seconds
Logic
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0 0 0 0 1 0 0 0 `
ENABLE shifts every T/32 seconds
Logic
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0 0 0 0 0 0 0 1 `
ENABLE shifts every T/32 seconds
Logic
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0 0 0 0 0 0 1 0
shifts every T/32ms ENABLE
Logic
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0 0 1 0 0 0 0 0 `
shifts every T/32 seconds ENABLE
Two pulses in
T/32 seconds
PULSE
1 2
2 1
Logic
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Outline
Introduction
The Smart Projects
Distributed information management
Claytronics
Communications in Claytronics
Conclusion & perspectives
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Conclusion
Asynchronous communications better scale
– Better tolerance to fault
– Better scalability
Easier for developers if communications are hidden
– Ensemble principle that drives languages developed in Claytronics
Having a real working experimental plate-form is still a challenge
– Cost a lot
– Needs different skills
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Direct (physical) communications are a possibility
Perspectives
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Direct (physical) communications are a possibility
Perspectives
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Direct (physical) communications are a possibility
Perspectives
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Direct (physical) communications are a possibility
Perspectives
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Direct (physical) communications are a possibility
Perspectives
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Direct (physical) communications are a possibility
– But this lead to extremely spread-out network topologies
Perspectives
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Direct (physical) communications are a possibility
– But this lead to extremely spread-out network topologies
Perspectives
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Direct (physical) communications are a possibility
– But this lead to extremely spread-out network topologies
Perspectives
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Direct (physical) communications are a possibility
– But this lead to extremely spread-out network topologies => High delay
Perspectives
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Wireless ranged communication are much promizing
Perspectives
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Wireless ranged communication are much promizing
Perspectives
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Wireless ranged communication are much promizing
Perspectives
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Wireless ranged communication are much promizing
– Less hops are needed
Perspectives
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Wireless ranged communication are much promizing
– Less hops are needed
Perspectives
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Wireless ranged communication are much promizing
– Less hops are needed
– Natural broadcast
Perspectives
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Wireless ranged communication are much promizing
– Less hops are needed
– Natural broadcast
Perspectives
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Wireless ranged communication are much promizing
– Less hops are needed
– Natural broadcast
Perspectives
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Wireless ranged communication are much promizing
– Less hops are needed
– Natural broadcast
• Largely speed-up information dissemination
Perspectives
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Wireless ranged communication are much promizing
– Less hops are needed
– Natural broadcast
• Largely speed-up information dissemination
Perspectives
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Perspectives
Wireless ranged communication are promising
Integration of electromagnetic nano/micro communications device
Challenges still exist, particularly
– Antenna design (millimeter scale designs simply cannot be scaled down to nano size)
– Power optimization
Creation of a research community in distributed intelligent MEMS -> dMEMS workshop
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http://dmems.univ-fcomte.fr
• Topics • Design, implementation and technologies
• Control and distributed algorithms
• Network of distributed sensors and actuators
• Modelisation, simulation, verification, test and validation
• Important dates: – Deadline for paper submission: October 20th, 2011
– Acceptance notification: November 25th, 2011
– Camera ready paper due: December 9th, 2011ion
• Proceedings published by IEEE CPS, special issue of Mechatronics (Elsevier)
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Acknowledgments
All Claytronics team, but in particular:
– Emre Karagozler and David Ricketts, CMU
All Smart Surface and Smart Block teams, but in particular
– Didier El Baz, Vincent Boyer, LAAS/CNRS
– Nadine Piat, Guillaume Laurent, FEMTO-ST
– Dominique Dhoutaut, UFC
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Claytronics example CMU/INTEL/UFC