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Company ProfileBusiness Model Presentation
IMPT Ltd.A Michael Pupin Institute Company
http://www.embedded.rs
About Us
Spin-off company of Michael PupinInstitute (IMP), established in 1997
High-tech company, focused on embedded systems design, especially COMs and SBCs
42 employees (27 in core development team)
Own high-tech products
Proven know-how to develop prototypes based on customer’s idea
Close cooperation with Texas Instruments (TI)
Focus on quality and manufacturability
ISO 9001 and CMMI Level 2 company
Business Offering
Contract R&D
Consulting
Conceptual designsand evaluation boards/proofs of concept
Original Design Manufacturer (ODM)business model
Licensing of proprietary IP
Southeastern European R&D offshore destination
Outstanding quality/cost ratio(value for money)
Networks & Associations
TI EMEA Design House NetworkMember since March 2011
Spin off company of the Michael Pupin Institute
Serbian ICT Network Cluster (Board Chairman position)
Currently 14 embedded design companies inthe network
Products
TI OMAP5430 Pico ITX SBCBased on newest TI technology - single board computer – compact size -high performance
TI DaVinci DM8168 Qseven ModuleComputer-on-module, compact size – DSP functionality
EasyDroidAndroid based development platform
uSFPSub-miniature 10 Gbps Fibre Channel/Ethernet transceiver
Pico-ITX single board computer with TI’s OMAP5430 chip
High-performance, dual-core ARM Cortex-A15 foundation
100 mm x 72 mm (palm-of-the-hand size) – Pico ITX standard
Multi-channel HD video processing
Built-in battery charger
Wi-Fi, Bluetooth® and FM technologies
USB 3.0 SuperSpeed connectivity
DVI video out, LVDS dual channel
Serial camera input port
Linux and Android 4.1 BSP
Software compatibility with open source PandaBoard platform
Applications
...and a lot of other applications.
Ultra small and ultra mobile implementations
Intelligent camera solutions
Mobile HMIs e.g. for measuring
Set-top boxes for smart TVs
Gaming
Gesture control devices
Kiosks – POS
Kiosks - POI
TI about our OMAP5430 Pico ITX SBC
“We are proud to work with IMPT to bring the OMAP 5 processor-based EPP-
Pico-OMAP5430 module to market [...]”
“Together with IMPT, we see great promise for the Pico-ITX standard in
enabling next-generation intelligent cameras, smart-home devices and other
applications [...]”
Mike Schoonover
Industrial business development manager
OMAP platform business unit
Texas Instruments Incorporation, USA
QSeven
Why Qseven standard?
To enable the features of latest 45nm mobile chipsets and processors.
To provide the ability to use the successful Computer-On- Module concept for mobile embedded applications.
To support the latest graphic standards such as Display Port and HDMI.
Small form factor for easy integration (70 mm x 70 mm).
What is special about Qseven?
Legacy free – only new serial buses are defined.
Flexibile graphics – current graphic standards are supported.
Embedded API – Software interface for easy Interchangeability.
High-performance TI ARM/DSP solutions
High level of peripherals integration
High-speed DDR3 SDRAM memory
Cutting-edge Sitara/Integra/DaVinci processor
Dramatic BOM cost reduction trough integration
Increase overall system performance
DSP can more efficiently handle complex tasks
ARM is free to process applications
Our TI DaVinci DM8168 Qseven Module
Features:
Texas Instruments’ Netra processors deliver:
ARM Cortex A8 RISC MPU, up to 1.2 GHz
C674x Floating/Fixed point VLIW DSP, up to 1.0 GHz
Rich set of peripherals
1 GB dual-port DDR3 SDRAM memory
3D graphics engine (SGX530, 27 Mpoly/sec)
Video processing subsystem
1080p HD video output
Up to 4 GB NAND Flash
11 W maximum power consumption
5 x USB 2.0 host ports
1 x USB 2.0 client port
1 x PCIe 1.1
1 x Gbit Ethernet port
HDMI video output
LVDS display connection (Open LDI)
Camera port (feature connector)
High definition audio
Dual SATA 2.0 interface
SD/MMC card interface
SPI interface
ACPI power management signals
Qseven - Features and Interfaces
Qseven module – based on DaVinci TI SoC
Interfaces:
Android 2.3 – IMPT – FREE
Full BSP available from March 2012
SysLink (Link between DSP and ARM) availability
Linux, Open Source – IMPT – FREE
BSP available from March 2012
GA available from June 2011
C6EZAccel and C6EZRun – TI – FREE
Includes pre-optimized DSP libraries for digital filtering, complex math and image enhancement and analysis
Qseven - Software
High-end Test and Measurement (Signal/Waveform Generation and Analyses)
Machine/Industrial Vision (Automated Inspection, Identification)
Biological Vision (e.g. Cell-sorting and Analysis)
Tracking and Control (Avionics/Guidance, Radar/Sonar, Solar Tracking)
Multi-channel full HD Video Encode/Decode, Transcode/Transrate (DaVinci)
Qseven – End Applications
The goal of the project:
Implement and sell specific hardware/software development platform for Android community
Optimized for use in home automation, machine control and similar applications
Enabling Android applications to use standard/legacy interfaces like RS232, RS485, CAN, digital I/Os and other.
ARM Cortex A8 @ 1.5 GHz
1 GB RAM memory
7” Touchscreen display
Ethernet, Wi-Fi, Bluetooth, GSM
4xUSB, SD card
Camera, audio
RS232, RS485
CAN
Digital I/Os
Analog inputs
PWM outputs
EasyDroid - Android with wires
Features:
Open source
Rich and innovate user interface
Easy applications development
Internet access, communications
More than 80.000 available applications
Market share: 40 %
Expansion of Android OS on new vertical markets
Multimedia, smart houses, automotiveindustry, white goods, …
Why Android?
uSFP 10 Gbps Transceiver
Goal: To develop industry’s smallest 10 Gbps LC optical transceiver
Challenge 1: Fit electronic and electro-optical components in such small space
Challenge 2: Design hardware for 10 Gbps performance
Challenge 3: Find suitable high-speed interconnection solution
Challenge 4: Devise robust mechanical design
Challenge 5: Cost optimization
An ODM project done in cooperation with TagOn, UK.
uSFP Transceiver - Solution
Compact design: 13 x 10.5 x 27 mm
Fully SFP compatible on the electrical interface
Six-layer rigid-flex board
Microwave design –signal integrity simulation
The smallest components available (0201 passive, 3x2 mm controller, uBGA)
Thin PCB interposer used as connector solution
10 Gbps test and evaluation boards developed
uSFP - Casing Prototype
Made according to 3D STEPmodel
Electro-mechanicalco-design applied duringentire development cycle
Die-cast metal body
Lid and cage made from0.25 mm tin plate
Precise manufacturing– 20 um tolerance
Electrical connection via 0.5 mm pitch interposer
“Perfection in Embedded Design” Concept
One stop shop (turnkey design)
Electronic products development know-how
Providing COMPLETE, ready for manufacturing solutions to customer
Industrial design and design for EMC
Automated test systems development
Full competence in each phase of device design
Fast prototyping
Network of partner development companies (ICT-Net cluster)
Cooperation with University
“Perfection in Embedded Design” Concept
Commitment to Quality
Certified ISO 9001 quality management system
IT Mark quality assurance certificate
CMMI for development level 2
Agile development methodology (scrum-like)
Proprietary, well-developed design verification check lists
Strict data management and backup procedures
Own state-of-the-art laboratory equipment
Pre-compliance EMC lab
Project Management & QA
Detailed WBS
Transparent procedures
Weekly reporting
Costs tracking
Milestone status meetings
Risk management
Requirements management
Configuration management
Customer
Project Manager QA Manager
System
Design Team
HW Design
Team
Embedded
Software
Team
FPGA Design
Team
Mechanical
Design
Team
Test &
Verification
Team
Design for
Manufacturing
Team
Manufacturing
Technologies
Real-time systems design
High-speed hardware design
DSP algorithms development
Multirate DSP, software-defined radio
Embedded operating systems (Linux)
High-speed/high-density PCB Design
Microwave circuits design
Power supplies & power management
Industrial control systems
Video and multimedia systems
Open-Source Software
Linux kernel
Bootloader for custom boards (U-boot)
Porting Linux kernel for custom boards
Linux drivers developing, maintaining and modifying for exotic peripherals
Full support for our own Linux BSPs
Android
Java middleware libraries for accessing board peripherals directly from Android
Full Java API, no need for low level NDK programmingand cross-compilation
Full support and documentation
Design for EMC
Seven years of experience in the company
Cooperation with Microwave Group atthe University of Belgrade
Recognized international experts with morethan 30 years of experience
World-class 3D EM field simulation experts (developed Wipl-D, Artech House)
Extensive list of international references(DEC, Bosch, Motorola, Philips, DuPont)
Consulting in design phase
Debugging EMC problems
EMC hardening
Product certification and CE marking
Audio and Acoustics
Cooperation with Acoustics Laboratory at the University of Belgrade
Development of high-end audio electronics (preamps, amplifiers, power amplifiers, filters)
Design of loudspeakers
Audio software development (signal processing, filtering, measurement, modeling, calculations)
Room acoustic design(studios, opera halls, theatres, churches)
Research projects (partial discharge in transformers)
Audio/acoustics lab (small anechoic chamber, reverberation chamber, instruments, software)
Industrial design service
Functional, ergonomic and aesthetic aspects of the product
Conceptual ideas, selection of materials, visualization, 3D & physical modeling, mechanical design, prototyping
Cooperation with award-winning Nikola Knezevic Industrial Design studio
Listed as one of the best 40 European designers under 40 for the year 2010
Awards: IF Design, Braun Design Competition,LG Electronic Design Competition
Client list: HP, Toshiba, Polaroid, B&W
Automated Test Systems
Five years of experience
Reference - own manufacturing line with capacity of 2500 devices/month
Strategic partnership withNational Instruments
Know-how of test methodologies(in-circuit, boundary scan, self-test)
Design for Manufacturing consultancy
Development of test jigs
Tools & environments
Altium Designer
Cadence
Mentor Graphics, HyperLynx
Xilinx ISE, Sysgen
Matlab
Labview
TI’s Code Composer Studio
IAR Workbench, MPLAB IDE, Eclipse
SolidWorks 3D mechanical design
Notable Projects
STOS 3XGAEthernet thin-client enabling three independent video outputs
PECState-of-the-art real-time multichannel DSP controller
TZ-600Mission critical communication device improving safety and security of teleprotection applications in electric power transmission systems
OpCardAdd-on card for expanding capabilities of Motorola GP/GM300 radio
CTU-300Crypto telephone set and data transmission device
STOS DVA - Basic Facts
Ethernet thin-client for digital signage applications
Triple-channel VESA video output (up to WXGA resolution)
Public screen systems, video walls, transportation, control centers, expos, advertising, entertainment
Low power consumption
Compact form factor
Cost-efficient solution
Image decoding and processing
Receiving up to three compressed video streams in overlay via UDP and background images via TCP with active resize and rotate algorithmsComplete system designed
in-house for Finsoft Ltd., UK.
STOS DVA - Challenges
High-speed video hardware design
Optimization of image processing algorithmson DM64x platform
Design of application software to assure maximum utilization of resources
Assuring robust EMC performance
24/7 work cycle
Cost optimization
Design for manufacturing
Establishing of production line and automated test procedures
Specialized test jig design
Mechanical design
PEC System - Basic Facts
Power Electronic Controller
Multi-board configuration
CPU board, Digital IO board, Analog IO board and Power Board
High processing power(4800 MIPS floating-point DSP)
16 optical IO channels (10 Mbps each) on Digital IO board
16 analog channels (100 kSps) on Analog IO board
256 digital channels, 128 analog channels total
1500 pages of documentation
Full design verificationand manufacturing procedures
System concept, design and prototyping done fully in-house under custom
development contract.
PEC System - Basic Facts 2
Packet-based data transfer in the system
10 us processing cycle
6.4 Gbps LVDS communication backbone
FPGA-based communication switches and interfaces
High reliability hardware with automatic hardware malfunction detection and protection mechanisms
Completely separated real-time DSP and system control/management
Fully redundant industrial 150 W power supply
Management and monitoring subsystem
Industrial temperature and EMC environment
TZ-600 - Basic Facts
Communication solution for teleprotection applications in power transmission systems
Hard real-time system
Designed for 24/7 operation
Fast, reliable, and secure
Modular and programmable interfaces including long-range optical
DSP technology
Extremely short command transmission time
Versatile power supply
Own design, manufacturing and sales.
TZ-600 - CPU control unit
Processing board basedon TMS320C5471 dual-core processor
Embedded Linux portedon ARM7 core
DSP/BIOS on C54x core
Separate graphical user interfaceboard based on MSP430
File system and RDBMS
Web server for monitoring and maintenance
Event log function
CTU-300 - Basic Facts
Provides ciphered full-duplex voice and data transmission over analogue telephone lines
Telephone functions: caller ID, call list, phonebook, country settings, ringer settings etc.
Simple and intuitive graphical user interface
Speakerphone option
Power supplies: mains, 9V DC and built-in Ni-MH battery
USB computer interface for programming and data communication
Fast erasure of crypto algorithm
Full protection against tampering
Based on TMS320C5410A DSP
Developed and manufactured for Serbian government.
CTU-300 - Challenges
Providing real-time ciphered voice service over dial-up connection (custom data protocol, synchronization)
Short time required for initialization of crypto connection
Voice coding technology
Acoustic and line echo canceling
Advanced encryption algorithms
Implementing GUI on MSP430
Advanced power management
Mechanical design
OpCard - Basic Facts
Add-on card for expanding capabilities of Motorola GP/GM300 two-way radios (voice scrambler and VHF/UHF radio modem)
Card controls properties of radio channel, transmitter and receiver, audio signal, and user interface (keyboard and display)
Excellent EMC immunity and sound quality
Downloadable firmware (over the air)
Design based on TMS320F206 DSP
OpCard - Challenges
Offensive RF environment
Mechanical design
Robustness
Voice scrambling algorithms
Real-time operating software
PCB requirements:
Six-layered printed circuit board with buried vias
High level of integration
www.embedded.rs/teams
Thanks to our dedicated engineers
Thank you!