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An RTC Group Publication
Tech Focus: COM Express Board Roundup
Volume 14 Number 8 August 2012
PLUS:Display Technologies Enable Complex Command Systems—Counter-IED Operations Present Data Challenges
The Journal of Military Electronics & Computing
cotsjournalonline.com
AS9100 and ISO 9001 Certifi edGSA Contract Holderwww.rtd.com [email protected]
Design, Engineering, Manufacturing & Tech Support
The products below are a sampling of RTD’s PCIe/104 and PCI/104-Express offering. All of RTD’s board-level solutions are available in ruggedized packaging with advanced heat sinking, internal raceways, and a variety of I/O configurations. Visit www.rtd.com to see our complete product listing.
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Untitled-2 1 6/4/12 1:56 PM
CONTENTS
COTS (kots), n. 1. Commercial off-the-shelf. Ter-minology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifi-cations, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customer-paid minor modification to standard COTS products to meet the customer’s unique requirements.
—Ant. When applied to the procurement of electronics for the U.S. Military, COTS is a pro-curement philosophy and does not imply commer-cial, office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.
The Journal of Military Electronics & ComputingThe Journal of Military Electronics & ComputingThe Journal of Military Electronics & Computing
Departments
Digital subscriptions available: cotsjournalonline.com
August 2012 Volume 14 Number 8
On The Cover: U.S. Army Soldiers travel through the desert in their M1126 Stryker Infantry Carrier Vehicle ( ICV) with Slat Armor cage. Both CompactPCI and VME have been used to upgrade the various Stryker variants, including VME motion controllers for the turret on the Stryker MGS. (US Army Photo)
Coming in SeptemberSee Page 72
6 Publisher’s Notebook To Partner or Not to Partner...
8 The Inside Track
64 COTS Products
74 Editorial EW and IT: An Evolving Marriage
TECHNOLOGY FOCUSCOM Express Boards
58 COM Express Continues its Quick Ascent toward Military Acceptance Jeff Child
60 COM Express Boards Roundup
SYSTEM DEVELOPMENTMilitary Instrumentation and Test
52 Hurdles for Structuring Counter-IED Data Are Many Dr. Michael Stumborg, Intelligent Software Solutions
TECH RECONDisplays and Subsystems for Command and Control
40 Display Advances Enable Larger, More Complex Command Systems Jeff Child
48 Case Study: APUs Solve Real-Time Image Processing Challenge Cameron Swen, AMD Embedded Solutions
SPECIAL FEATUREVME, VPX and cPCI Target Tech Insertion Needs
10 VME, cPCI and VPX Fuel Technology Upgrade Efforts Jeff Child
18 Managing Tech Insertion for Sensor Processing Subsystems Thomas Roberts, Mercury Computer Systems
24 VME Still the Right Choice for Radar Upgrades Andrew Reddig, Tek Microsystems
32 Many Paths Lead to Tech Refresh Success R.J. McLaren and Vincent Chuffart, Kontron
VME, VPX and cPCI Target Tech Insertion Needs10
COTS Journal | August 20124
PublisherPRESIDENT John Reardon, [email protected]
PUBLISHER Pete Yeatman, [email protected]
EditorialEDITOR-IN-CHIEF Jeff Child, [email protected]
MANAGING EDITOR/ASSOCIATE PUBLISHER Sandra Sillion, [email protected]
COPY EDITOR Rochelle Cohn
Art/Production
ART DIRECTOR Kirsten Wyatt, [email protected]
GRAPHIC DESIGNER Michael Farina, [email protected]
LEAD WEB DEVELOPER Justin Herter, [email protected]
Advertising
WESTERN REGIONAL SALES MANAGER Stacy Mannik, [email protected] (949) 226-2024
MIDWEST REGIONAL AND INTERNATIONAL SALES MANAGER Mark Dunaway, [email protected] (949) 226-2023
EASTERN REGIONAL SALES MANAGER Shandi Ricciotti, [email protected] (949) 573-7660
BILLING Cindy Muir, [email protected] (949) 226-2000
COTS Journal
HOME OFFICE
The RTC Group, 905 Calle Amanecer, Suite 250, San Clemente, CA 92673 Phone: (949) 226-2000 Fax: (949) 226-2050, www.rtcgroup.com
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Jeff Child, Editor-in-Chief 20A Northwest Blvd., PMB#137, Nashua, NH 03063 Phone: (603) 429-8301
Published by THE RTC GROUPCopyright 2012, The RTC Group. Printed in the United States. All rights reserved. All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.
The Journal of Military Electronics & Computing
Solid or Spin...we go both ways
Ruggedized VPX Drive Storage ModuleWhatever your drive mount criteria, everyone knows the reputation, value and endurance of Phoenix products. The new VP1-250X, compatible with both solid state or rotating drives, has direct point-to-point connectivity or uses the PCI Express interface with the on-board SATA controller. It is available in conduction cooled (shown), conduction with REDI covers (VITA 48) and air cooled configurations. Leading the way in rugged COTS data storage technology for decades, Phoenix keeps you on the leading edge with very innovative products!
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We Put the State of Art to Work
Untitled-3 1 5/31/12 1:57 PM
CHARGEBB-2590 MIL ITARY B ATTER IES
BB-22590 B ATTERY CHARGER
The Lind BB-2590 Battery Charger is designed to charge a single BB-2590 military battery,* with or without the SMBUS from any 12 - 32 volt DC input.
battery with SMBUS
connection with the battery contacts
To learn more about how Lind’s BB-2590 Battery Charger can meet your mobile power needs, contact Lind at 1.800.897.8994, via email at [email protected] or visit us online at www.lindelectronics.com.
* NOTE : BB-2590 military battery not included
learn more about how Lind’s BB-2590 Battery Charger can meetrur mobile power needs, contact Lind at 1.800.897.8994, via email [email protected] or visit us online at www.lindelectronics.com.* NOTE : BB-2590 military battery not included
Untitled-13 1 5/2/12 1:22:32 PM
COTS Journal | August 20126
NOTEBOOKPublisher’s
Pete Yeatman, PublisherCOTS Journal
…that is the question. I’m sitting here in the beginning of the sum-mer trying to write something that will be of interest when read at the end of the summer. It’s also the time that we set the stage for COTS Journal’s 2013 editorial focus. This always initiates a communications frenzy with our entire staff. We talk to as many respected users, primes, suppliers and pundits as we have in our contacts folders before trying to make sense of all of this year’s tea leaves. This process always unearths some interesting information.
Without rehashing all the previous words used to discuss politics, budgets and policies that will contribute to the outlook for 2013, there are some basics that will be resolute for the military electronics industry. Cost sharing, joint investment, partnering and similar catch phrases will be part of every new RFP or RFQ for new programs. These words translate into a couple things. They’re saying “we want the supplier to pay for all the develop-ment, or any costs necessary to modify their product to fit the specific needs of the program.” Not only that, they translate into “we also want them to pay for part of the overall design-in and program win process.” All this is at a time when there’s less prob-ability that new programs will be funded and moved forward into production. As such, those burdens may be a financial nut that some smaller electronics suppliers won’t be willing to support.
Until and unless there is a world crisis, most funding for new offensive tactical systems and their support systems will be sac-rificed for new defensive, surveillance and information gathering systems. That in turn forces the concept that current tactical sys-tems—along with their support systems—will have life extensions and technology upgrades to service the needs of whatever the po-litical vision is for the U.S. military. Those two concepts present two very different opportunity scenarios for electronics suppliers.
Life extensions and technology insertions to current systems will provide opportunities for board and systems suppliers that use established and entrenched architectures. With limited avail-able funding, there’s less temptation to throw out the baby with the bathwater. So that means staying with existing system archi-tectures—except when an entire subsystem can be replaced by an all-in-one system. Where extended quantity contract options on existing programs are in place, they will more than likely be exercised. Where they’re not in place new upgrade RFQs will be issued. Although there is a strong interest by the military to ob-solete or replace many programs—like the Stryker, F-18, Black Hawk and others—many of these older programs will be given a life extension instead in order to avoid the higher costs of new program developments. Much of the electronics for these exten-sions will come from old standards like VME, cPCI and PC/104.
Defensive, surveillance and information gathering sys-tems will mostly come from two ends of the performance spec-trum—limited requirements and very extreme requirements. The lower end will mostly come from small self-contained bus-less systems or mezzanine architectures. These electronics will service the growing demand for small autonomous vehicles in the air, on the ground or in the sea. These will also serve for comms and IT for the individual warfighter and small in-the-trenches units. Funding and support for this class of systems will continue to grow. These systems tend to be larger quantities, but have a smaller individual unit cost.
At the extreme performance end we will find smaller volume but very high value systems. This is an area that many primes would like to dominate with custom grounds-up designs. But with diminishing available funds, ultimately the VPX market will come into dominance here—with some life being blown back into the ATCA market for rear echelon programs. These systems will con-tain a large number of CPU cards each containing multiple mul-ticore processors. Such systems strive to interrogate high-volume, high-speed data from multiple inputs, process the data and pro-vide near real-time interpretations. That capability is critical now and will only be exponentially more critical in the near future.
When times are tight we see most companies falling into two categories: those that charge ahead and those that stay in the fox hole. Each philosophy has merits for different companies and different target markets. Unless overly confident in their funding position, users and primes are going to seek out the lowest cost-effective alternatives. Those can be either upgrades or new programs, so no supplier should sit on its laurels. Every-one designed into a program should do their utmost to defend it from their competitors trying to unseat them as the preferred supplier. Aggressive suppliers will focus on established and funded programs in an effort to unseat current suppliers to ex-isting programs. New development programs—although riskier than existing funded programs—can provide a large return to companies that have been partnered into programs if and when the programs go into production.
To Partner or Not to Partner…
8 COTS Journal | August 20128
INSIDE TRACKThe
with tactical radios developed by other vendors.
Harris Melbourne, FL. (321) 727-9100. [www.harris.com].
Army C4ISR Integration Lab Aims to Improve Ag-ile Acquisition Process
CERDEC’s new laboratory hub for C4ISR integration was of-ficially launched at the Aberdeen Proving Ground and will have the mission to ensure candidate systems for Network Integra-tion Evaluations are integrated and field ready prior to testing. The C4ISR Systems Integration Laboratory, or CSIL, is the site for all lab-based risk reduction for systems prior to NIE. It provides a powerful resource that will be lev-eraged to identify and resolve bugs
and ensure configuration settings and mission threads are validated prior to the field evaluation.
CSIL provides a simulated, advanced lab environment for engineers to assess, evaluate and integrate new capabilities onto current and next-generation tacti-cal networks. The concept for CSIL was formed in July 2011 as a way to help alleviate costs and find poten-tial problems prior to field testing. In previous NIEs, interoperability issues with capabilities had to be fixed on-site, increasing time and expenses. Fixing system integra-tion problems on the ground required lengthy travel accom-modations for Army engineers and prevented soldiers participating in NIEs from dedicating more time to their regular activities.
CERDEC Aberdeen Proving Ground, MD (443) 861-7566. [www.cerdec.army.mil].
Harris Awarded Con-tract to Maintain and Upgrade JTRS SRW
Harris has been awarded a $26 million indefinite-delivery, indefinite-quantity contract to upgrade and maintain the U.S. DoD Soldier Radio Waveform (SRW) for wideband tacti-cal communications. The U.S. government will leverage Harris’ expertise in wideband network-ing to add greater capabilities to the open-standard SRW wave-form software and make it more widely available to U.S. forces in next-generation tactical radios.
Developed by the Joint Tacti-cal Radio System (JTRS) program, SRW is a DoD voice and data waveform standard used to extend battlefield IP networks to the tac-tical edge. Under terms of the con-tract, Harris will deliver improved capabilities, maintenance and ongoing support for the waveform
over five years. Key enhancements developed by Harris will be placed in the JTRS Program Informa-tion Repository (IR), which was established to facilitate software reuse in DoD tactical radios. The Harris Falcon III AN/PRC-117G manpack (Figure 2) is NSA certi-fied for a Type-1 implementation of SRW. Additionally, Harris has integrated the AN/PRC-117G and AN/PRC-152A with the JTRS Joint Enterprise Network Manager to assure interoperability
Figure 2
The Harris Falcon III AN/PRC-117G manpack is NSA certified for a Type-1 implementation of SRW.
The new RQ-7B Shadow aircraft builds on the same architecture that has proven highly successful on the current Shadow aircraft for over almost 750,000 flight hours.
Figure 1
AAI Unmanned Aircraft Systems, an operating unit of Textron Sys-tems, announced that it has received a $358 million award from the U.S. Army’s Program Manager – Unmanned Aircraft Systems for engineering support and system upgrades that will create a fleet of 45 upgraded RQ-7B Shadow Tactical Unmanned Aircraft Systems (TUAS). Deliveries of 43 systems for the Army and two for the Marine Corps are expected to begin in late 2013.
The new RQ-7B Shadow aircraft (Figure 1) builds on the same archi-tecture that has proven highly successful on the current Shadow aircraft throughout nearly 750,000 flight hours. It is multi-mission equipped with an integrated payload for day and night imagery, as well as communi-cations relay and laser target designation capabilities. The aircraft also applies the Army’s interoperability profiles, while vastly increasing com-munications bandwidth and enabling digital data delivery. In addition, the upgraded Shadow aircraft integrates the Tactical Common Data Link for digital data dissemination and encryption.
AAI Corporation Hunt Valley, MD. (410) 666-1400. [www.aaicorp.com].
AAI Awarded $358 Million for Upgraded RQ-7B Shadow Tactical UAV
9
INSIDE TRACK
August 2012 | COTS Journal 9
Raytheon Awarded $636 million for Exo- atmospheric Kill Vehicle
Raytheon was awarded a $636 million development and sustainment contract to provide the Exoatmospheric Kill Vehicle to The Boeing Company, which is the prime contractor for the Ground-based Midcourse Defense program. Raytheon booked the award during its second quarter. EKV (Figure 3)
represents the centerpiece for the Missile Defense Agency’s GMD as the intercept component of the Ground Based Interceptor, also known as GBI, which is designed to engage high-speed ballistic missile warheads in space.
Under conditions of the contract, which extends through November 2018, Ray-theon will provide EKV de-velopment, f ielding, testing, system engineering, integra-tion, configuration manage-ment, equipment manufactur-
ing and refurbishment, and operation and sustainment. Leveraging more than two decades of kill vehicle tech-nology expertise, the EKV is
designed to destroy incoming ballistic missile threats by colliding with them, a con-cept often described as “hit to kill.”
Raytheon Waltham, MA. (781) 522-3000. [www.raytheon.com].
Figure 3
EKV is the intercept component of the Ground Based Interceptor, which is designed to engage high-speed ballistic missile warheads in space.
Military Market WatchCOTS Market Wrestles with Strengths and Weaknesses
A report from VDC Research takes a look at the revenues in the COTS VME market and analyzes some of the strengths and weaknesses of this industry. Figure 4 graphs the revenues by application area for the North American COTS VME market. According to the report, the manned aircraft area will lose 1% share as UAVs replace missions that had traditionally been conducted with manned aircraft. As a result, more expensive manned platforms will have unit volumes cut and/or de-layed. Meanwhile VDC sees UAV’s share growing from 16% to 18% as these platforms continue to increase the missions for which they are tasked. In addition to being a less costly platform, UAVs have advantages in that they can remain on station for longer periods and, if shot down, there is no pilot that can be killed or captured.
In many cases, the VME COTS systems will find roles on the ground, processing, switching and storing the data generated by the UAVs. Manned surface vessels slightly decline in share by 2%, but upgrades to existing units will still allow them to see some overall revenue growth. Fixed ground installations will likely be reduced through base closures and reduction of presence in Iraq and Afghanistan.
In terms of strengths enjoyed by the COTS market, the VDC report says that for many merchant COTS sup-pliers, their products represent their core competency and they likely have detailed knowledge and expertise on every facet of the technology. Many COTS systems suppliers are also (and perhaps primarily) COTS boards suppliers, which further increases their experience with the products and ensures perfect knowledge transfer between board engineering and systems integration. Meanwhile, merchant COTS board suppliers that have unique/proprietary form factors can leverage these products to make unique form factor systems.
On the weaknesses side, VDC says that Mil/Aero may only be a niche market for some merchant sup-pliers as compared to industrial, medical and transportation, which may be considered more lucrative. As such, they may lack experience. Merchant COTS suppliers may not have the government, DoD and Mil/Aero focused sales resources as compared to the Mil/Aero specialists. And finally, COTS suppliers may not have the political lobbyist resources as compared to the Mil/Aero specialists.
For further information about this research part of VDC Research Group’s Embedded Hardware Market Intelligence Service, contact: Chris Rommel, Vice President at [email protected].
VDC Research Group, Natick, MA. (508) 653-9000. [www.vdcresearch.com].
Airborne platforms—both manned and unmanned—represent the strongest revenue segment for COTS VME board suppliers.
Figure 4
NA COTS VME Markets by Platform(Revenues in $M)
Manned Military Aircraft
Military Unmanned AerialVehicles (UAVs)
Military Ground Vehicles
Manned Military (water)Surface Vessels
Military Fixed (ground-based) Installations
Military MannedSubmarine Vessels /
Vehicles
Military UnmannedGround Vehicles (UGVs)
Portable Systems /Devices
Military UnmannedUnderwater Vehicles
(UUVs)
Military Robotics. otherthan UAV / UGV / USV /
UUVMilitary Unmanned
(water) Surface Vehicles(USVs)
Other
$0 $50 $100 $150
2011 Total 2014 Total
SPECIAL FEATURE
COTS Journal | August 201210
VME, VPX and cPCI Target Tech Insertion Needs
While tech upgrades and tech insertion have long been a mainstay for standards-based embedded comput-ing, those activities are quickly moving to center
stage these days. In this era of constrained military budgets, there are fewer new programs and platforms that will get fund-ing. As a consequence, existing systems—on land, sea and air—will be expected to have longer deployment cycles than antici-pated. That will mean more electronics and computer systems upgrades across all branches of the military.
The “poster child” for military technology upgrades for the past couple decades or more is the VME form factor. VME has a rich and successful legacy in military systems in part because of its unique ability to remain backward compatible and facili-tate technology refresh in military programs. A new board with the latest and greatest processor, memory and I/O can easily be dropped into a slot that could be decades old. Therefore, vendors continue to roll out new VME boards that sport the latest and greatest processors and memory technology. Since its introduc-tion in 1981, the VMEbus standard has certainly satisfied the requirements of many defense systems.
Meanwhile, CompactPCI has followed in those same foot-steps. And indeed CompactPCI has carved out a respectable
August 2012 | COTS Journal 11
Jeff ChildEditor-in-Chief
With budgets tighter than ever, technology upgrade programs will dominate much military system development. VME, CompactPCI and OpenVPX each offer unique attributes for consideration in those programs.
VME, cPCI and VPX Fuel Technology Upgrade Efforts
COTS Journal | August 201212
niche in defense applications—especially in the years before VME follow on solu-tions such as VXS and VPX came into the picture. That said, upgrades became trickier as those fabric-based VITA-stan-dard boards entered the mix—and they weren’t necessarily replacing VME.
Refresh Programs AboundSlot-card technology upgrade pro-
grams are continuing to do brisk busi-ness, and such programs are expected to both expand and multiply. Because upgrade programs aren’t as sexy as new programs—and also because vendors like to guard their opportunities—many of these upgrade programs go unannounced. Among the highest profile of these include the Abrams Tank Systems Enhancement Package (SEP) upgrade, F-18 Advanced Multi-Purpose Display program, Bradley Vehicle Electronics upgrade, B-52 mission computer upgrade, Aegis Guided Missile Destroyer Sonar upgrade, B-2 Bomber Radar Upgrade, Boeing B-1B Bomber Avi-onics Upgrade, and the C-130 cockpit up-grade. Standards-based embedded com-puter solutions such as VME are used in almost all of these upgrade programs.
Exemplifying VME’s ability to serve long deployment cycles is Gen-eral Dynamics’ VME-based advanced mission computers (AMC) for the F/A-18E/F (Figure 1) and E/A-18G Su-per Hornet aircraft. For 11 years the unit has provided a reliable, open and cost-effective nerve center for the U.S. Navy’s Super Hornet. Its open architec-ture approach lets customers upgrade with the latest capability without the expense of changing the aircraft or its support systems.
Last year the U.S. Navy awarded General Dynamics Advanced Informa-tion Systems a $17.9 million contract to produce Type-3 advanced mission com-puters (AMC) for the F/A-18E/F and E/A-18G Super Hornet aircraft. General Dynamics has delivered F/A-18 advanced mission computers since 2002. The AMC performs general purpose, input/output, video, voice and graphics processing, and it is designed to operate in extreme en-vironmental conditions of today’s high-performance fighter aircraft. The com-puting in the AMC has been a series of PowerPC VME SBCs, upgraded from 400 MHz to 1 GHz PowerPCs over the years.
New Processors on VMEFeeding the need for VME refresh
computing, many vendors continue to pro-duce new VME boards that sport refreshed technologies such as processors and mem-ory. Many of these are drop-in replace-ments completely backward compatible with previous generation versions on those SBCs. As an example along those lines, Curtiss-Wright Controls Embedded Com-puting (CWCEC) last fall introduced the low-cost, ultra-rugged SVME/DMV-194 (Figure 2). The 6U VME board, based on a Freescale Power Architecture QorIQ P2020 processor with dual 1.2 GHz cores, delivers 6x the compute performance, at nearly the same cost, than was available from earlier VME designs, such as CWCEC’s SVME/DMV-179. It’s designed specifically for upgrading existing SWaP-C-constrained systems based on older PowerPC or Power Architecture processors.
The board features two 64-bit PMC/XMC sites and a large complement of I/O including Gigabit Ethernet, up to six se-rial ports, SATA, 1553 and USB 2.0 ports. To maximize compatibility with earlier SBCs, the SVME/DMV-194 provides an equivalent complement of I/O to that fea-
Figure 1
The VME-based advanced mission computer (AMC) for the F/A-18E/F and E/A-18G Super Hornet aircraft performs general purpose, input/output, video, voice and graphics processing.
SPECIAL FEATURE
August 2012 | COTS Journal 13
SPECIAL FEATURE
tured in earlier generations of CWCEC PowerPC and Power Architecture SBCs. It also has optional pin-out modes for backplane compatibility.
CompactPCI MaturesAt one time CompactPCI was the new
kid on the block, but now with nearly 20 under its belt, CompactPCI offers all the ingredients that attract military decision makers. PICMG’s original CompactPCI specification was adopted in 1995 and is mechanically based on the proven Euro-card form factor. And though cPCI isn’t ever expected to eclipse the legacy of VME in the military market, its niche remains solid. An expanding set of CompactPCI boards has emerged, among them are a wide collection of cPCI products that are available from a variety of vendors in every category including single board comput-ers, I/O boards, slot-card power supplies, storage subsystems, mezzanine carriers, DSP engines and many others.
Serial Upgrade PathProviding a path forward, the PCI In-
dustrial Manufacturers Group (PICMG) developed performance upgrade paths for cPCI, such as PICMG 2.16 and CompactPCI Express, and the PICMG 2.30 specification, called CompactPCI PlusIO. Last March, PICMG upped the ante announcing the successful comple-tion and adoption of the CompactPCI Se-rial (CPCI-S.0) specification. This speci-
fication adds greater support for serial point to point fabrics like PCI Express, SATA, Ethernet and USB in the classic CompactPCI form factor.
The specification contains defini-tions for both system and peripheral slots in 3U and 6U board sizes. It also includes definitions for eight PCI Ex-press links, eight SATA/SAS serial buses, eight USB 2.0/3.0 buses and eight Eth-ernet interfaces at system slots. The new
CompactPCI Serial specification de-veloped by PICMG member companies enables that same form factor to benefit from the latest I/O enhancements found in all modern computer silicon, and ex-tends the life of CompactPCI form factors for years to come.
Modernization Using cPCIAn example of a CompactPCI tech-
nology upgrade program, cPCI was used
Figure 2
The SVME/DMV-194 is a 6U VME SBC based on a Freescale Power Architecture QorIQ P2020 processor with dual 1.2 GHz cores. It’s designed specifically for upgrading existing SWaP-C-constrained systems based on older PowerPC or Power Architecture processors.
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Untitled-2 1 6/6/12 3:52 PM
COTS Journal | August 201214
SPECIAL FEATURE
PowerPC e500mc cores at up to 1.5 GHz all the way up to a P5020 processor with two 64-bit PowerPC e5500 cores at up to 2 GHz. Memory includes up to 16 Gbyte of DDR3-1333 ECC SDRAM in two channels and up to 512 Mbyte of NOR flash (with redun-dancy). Up to 64 Gbytes of CPU NAND flash is provided with up to 128 Gbytes of SATA NAND flash (optional). I/O includes three Gbit Ethernet ports, x4 PCI Express to XMC sites, up to four SATA ports, two USB 2.0 ports and two RS-232/422/485 se-rial ports. A XAUI to XMC site is included along with two PrPMC/XMC interfaces.
VPX Finds its PlaceUnlike CompactPCI and VME,
OpenVPX’s role as a technology upgrade technology is less straightforward. Open-VPX continues to capture acceptance by
in the Navy’s AEGIS Modernization Pro-gram. AEGIS Modernization Baseline (AMOD CR3) calls for modernizing CG 59-73 and DDG 51-78 with a new comput-ing architecture through technical inser-tion (TI 12), upgraded display consoles, computer program enhancements, and introduces increased weapon capabilities into the AEGIS Combat System through Advanced Capability Build 12 (ACB 12).
Like with VME, board vendors con-tinue to roll out new products based on the latest crop of processors. Along those lines, Extreme Engineering Solutions last month introduced the XCalibur1600 (Fig-ure 3), a 6U CompactPCI SBC supporting the Freescale QorIQ P4080 processor. The XCalibur1600 is available in conduction- or air-cooled versions. Processor configura-tions range from P4040 processor with four
military system developers. The Open-VPX spec provides implementation de-tails for VPX payload and switch mod-ules, backplane topologies and chassis products. VPX is gaining design wins in many data-intensive applications where high throughput and high-compute den-sity (size) are critical factors.
For its part, VPX, even in its pre-Open-VPX spec era, enjoyed numerous program wins—many more non-public than public. The architecture has even won some mind-share in legacy military platforms—ones where high data-centric performance needs like those of radar come into play. A par-ticularly noteworthy example was last year’s announcement that Mercury Computer Systems won a contract to deliver Open-VPX-based radar subsystems to Raytheon Integrated Defense Systems, to support its Patriot Air and Missile Defense System up-grades for Taiwan and Saudi Arabia.
Despite the strong position VPX is gaining, there’s been a misconception as to how VPX is positioned versus VME in the market. VME is used in applications that are event driven. These applications—con-trolling motors and actuators, moving gun turrets and missile launch-frames into posi-tion—are control system applications. With that in mind, VME is expected to remain the primary architecture in these platforms for many years to come. In contrast, VPX is better suited for data-intensive applications where high throughput is the priority.
VPX-VME Hybrid SystemsCertainly there are existing military
platforms already using VPX that are ripe for upgrades. But the broadest role of VPX
Figure 3
The XCalibur1600 is a 6U CompactPCI SBC supporting the Freescale QorIQ P4080 processor. The board is available in conduction- or air-cooled versions.
When it needs to be ruggedized,
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COTS Journal | August 201216
SPECIAL FEATURE
in upgrade programs will primarily be in hybrid systems. The VPX architecture is designed to simultaneously support a mix of bus segments. For example, these inte-grated bus segments can be configured in full mesh, pipeline or single or dual star topologies. It is also permissible to have some slots configured as legacy parallel VME. VITA 46.1 defines parallel VME within a VPX slot as was discussed ear-lier. The VITA 46.1 dot-spec allows the
integrator to specify how many slots will support the parallel VME signals. All slots would also conform to the basic re-quirements of VITA 46.0. An advantage of a hybrid backplane is that it permits the use of existing hardware, preserving years of development and system cost.
An example hybrid backplane so-lution is Elma Bustronic’s VPX Hybrid Backplane with five mesh slots and two legacy VME64x slots (Figure 4). The 5+2
Slot OpenVPX Hybrid backplane features a 16-layer controlled impedance stripline design. The backplane provides RTM support. Bustronic offers other VPX configurations in a 3U 6-slot, 6U 5-slot, 6U 17-slot Hybrid and has developed a wealth of custom configurations. Offer-ing a highly flexible interconnect scheme that can support either differential or sin-gle ended connections, the product sup-ports redundant meshes, pipeline topolo-gies and cluster computing. It provides built-in ESD ground protection in every slot. Signal Integrity studies are available from Elma upon request.
Curtiss-Wright Controls Defense SolutionsAshburn, VA.(703) 779-7800.[www.cwcdefense.com].
Elma Electronic SystemsFremont, CA.(510) 656-3400.[www.elma.com].
Extreme Engineering SolutionsMiddleton, WI.(608) 833-1155.[www.xes-inc.com].
Figure 4
Elma’s VPX Hybrid Backplane has five mesh slots and two legacy VME64x slots. It features a 16-layer controlled impedance stripline design and provides RTM support.
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© 2012 GE Intelligent Platforms, Inc. All rights reserved.All other brands or names are property of their respective holders.
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COTS Journal | August 201218
Defense prime contractors are seeking dramatic improvements in the capabilities of embedded
sensor processing subsystems on existing programs. They need increased process-ing power and expanded bandwidth for both I/O and internal data movement. Most critically, these improvements must be implemented quickly and on budget, with minimal program risk.
Multiple factors are driving the need to increase the capabilities of embedded sensor processing subsystems. First, there is a higher level of demand from the De-partment of Defense (DoD) to continu-ally enhance the effectiveness of existing programs, an approach that is faster and more cost-effective than developing new programs from the ground up. This shift toward shorter program procurement and upgrade cycles is driving defense prime contractors to enhance the capa-bilities of existing systems by regularly implementing new technologies.
Sensor ProcessingThe second factor exists at the techni-
cal level. New sensor technologies, includ-ing advanced antennas and wide-area EO/IR cameras, are extending the data collec-
tion capabilities of existing ISR systems by orders of magnitude. Managing these expanded streams of sensor data requires a parallel improvement in the existing em-bedded sensor processing subsystems. The Global Hawk UAV (Figure 1), for example, has electro-optical (EO), infrared (IR) and radar sensors that can extract precise imagery intelligence, and upgrades to pro-cessing on that sensor data improves the platform’s value continuously.
The third factor involves onboard multi-sensor fusion, which combines, in real-time, information from different types of sensors to achieve a higher order of situational understanding. Exploiting onboard multi-sensor fusion demands more embedded processing power, as well as more sophisticated processing ar-chitectures. Several, varied applications illustrate the advantages delivered by up-grades in sensor processing. For example, a SIGINT application might extract more information from an existing antenna ar-ray by applying more sensitive RF tuners and A/D converters with greater bit depth. More processing power is then needed to address that expanded bit stream in real time. Another example is the implementa-tion of a new EO/IR gimbal for an exist-
ing airborne platform. With more cameras in the gimbal and more pixel density for each camera, the data stream that must be processed has increased by more than an order of magnitude.
Multifunction PayloadsFinally, considering the advantages
of multi-sensor fusion, a likely enhance-ment of an ISR payload would include both SIGINT antennas and EO/IR sen-sors. Such a payload would have the po-tential to locate an RF emitter of interest and then, in real time, develop a high-res-olution image of that location. Delivering on that potential, however, demands so-phisticated embedded processing that can a) process both unique sensor streams, b) enable cross-cueing between the different sensors, and c) overlay the information of interest from both sensors onto a com-mon output format.
While every situation is unique, a common set of issues must be consid-ered for embedded sensor processing up-grades. First, there are the limits of size, weight and power (SWaP). In many cases, an ISR platform has a fixed amount of space allocated for the sensor processing subsystem. An upgrade must fit within
Thomas Roberts, Solutions Marketing ManagerMercury Computer Systems
Successfully upgrading processing functions on sensor processing subsystems is a multi-layered task. But with the right tools, techniques and standards in place, system developers can do it cost-effectively.
Managing Tech Insertion for Sensor Processing Subsystems
VME, VPX and cPCI Target Tech Insertion Needs
SPECIAL FEATURE
COTS Journal | August 201220
that space. Similarly, the weight allocated to the processing subsystem is usually within some narrow band—and for air-borne platforms, every extra pound of electronics means one less pound of fuel, thereby limiting mission duration. And lastly, the power is also limited on many platforms, sometimes very strictly. Sub-system architects must find ways to de-liver significant upgrades in processing power and sophistication while remain-ing within a program’s SWaP constraints.
Related to SWaP is the cooling issue. Cooling the electronics in a processing subsystem is a challenge that continually grows. When an existing subsystem is up-graded to one with new, faster, but more heat-intensive processing elements, the original cooling approach often will not work. Designers, therefore, must employ one or more thermal innovations—more effective use of flow-by air on some plat-forms or more efficient conduction-cool-ing that diffuses the heat to the platform. Sometimes more elaborate cooling meth-ods must be introduced, such as liquid flow-through or spray cooling. Reliable
cooling for all anticipated environmental conditions is vital to mission success.
Preserving SoftwareAnother issue important to any sen-
sor processing upgrade is the need to preserve the value of existing application software. The software component of a sensor processing application represents a huge investment of time and money. When the application is upgraded with new capabilities, typically the great ma-jority of the existing application func-tionality needs to be retained.
Fortunately, the value of the legacy software that supports that existing func-tionality can be retained by porting it from existing hardware to a new generation of processing subsystems. A successful port-ing effort means that new software invest-ments can be focused on extending the application with enhanced functionality. Needless to say, it’s a daunting task to stay on schedule while porting hundreds of thousands of lines of code to a new pro-cessing architecture—and to do so with-out introducing new operational errors.
A set of techniques has evolved to address these upgrade issues—namely SWaP, cooling and preserving software value. One longstanding technique for achieving maximum application perfor-mance is the use of specialized coproces-sors for certain operations.
Upgrade TechniquesAn example in today’s technology land-
scape is the use of general purpose graph-ics processing units (GPGPUs), which can execute huge numbers of math operations in parallel. Leveraging GPGPUs is useful for handling certain types of algorithms, such as mathematically intensive image processing filters for target detection and extraction based on electro-optical sensor input. These types of algorithms can run at speeds an order of magnitude faster than on standard CPUs. It does require some in-novation to deploy GPGPUs in ISR systems. A standard MXM connector is used with GPGPUs in common commercial environ-ments, such as a laptop. A rugged version of the connector must be used for a deployed defense application (Figure 2).
Figure 1
Global Hawk’s electro-optical (EO), infrared (IR) and radar sensors can extract precise imagery intelligence.
SPECIAL FEATURE
August 2012 | COTS Journal 21
SPECIAL FEATURE
FPGAs are another type of copro-cessor widely used in today’s sensor pro-cessing designs. Oftentimes they’re em-ployed for data reduction and protocol conversion operations. Properly config-ured FPGAs can handle repetitive, data-intensive tasks at least an order of mag-nitude more efficiently than a general purpose CPU. FPGAs can also be used to implement real-time protocol conversion, which is often needed when an upgrade involves a new family of processors or a new switch fabric.
Equipped with the right software tools and using switch fabrics that can deliver extremely high levels of intra-sys-tem bandwidth, design engineers are now combining GPUs, FPGAs and CPUs into deployable sensor processing subsystems. These multiprocessor solutions represent tremendous performance upgrades over older subsystems, while still adhering to SWaP and cooling limits.
Open Standard SolutionsAdditional SWaP and cooling ben-
efits are available when upgrade designs comply with industry standards like OpenVPX (VITA 65) and VPX-REDI (VITA 48). Open VPX is focused on de-fining a system level standard that sup-ports both high performance and in-teroperability; it defines an architecture framework that manages and constrains module and backplane designs, including clearly defined pin outs. The VPX-REDI standard incorporates support for ad-vanced cooling techniques for subsystem
electronics. This allows implementations with new generations of very powerful but heat-intensive processor technologies to be used in subsystems sized for deploy-ment on defense platforms.
Sometimes innovations like hybrid backplanes are used to combine existing technology with new technology in the same subsystem. Hybrid backplanes are used to bridge legacy solutions by bring-ing together heterogeneous backplane architectures such as fabric-based Open-VPX and legacy VME into a single chas-sis. In many cases, re-creating a custom-designed VME board as an OpenVPX module is cost-prohibitive. Industry ex-perience shows that spinning, testing, de-bugging and then re-spinning a new 6U board of moderate complexity can cost, conservatively, from $1 million to $2 mil-lion. In addition, this process takes man-years of engineering effort. Alternatively, with a hybrid backplane, development time can be cut to a matter of months with costs as low as $50,000. In addition, this hybrid backplane approach lowers the overall project risks by using proven technology for a specific function.
Addressing the legacy software value issue demands more than new technology or industry standards; it re-quires a disciplined engineering meth-odology (Figure 3). The ideal approach is to attack the software porting effort with a step-by-step process. While pro-cess specifics will vary with each situ-ation, its larger tenets should remain constant. For instance, in classic engi-
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Comparing standard and rugged MXM connectors with some parameters from the VITA 47 environmental standard.
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COTS Journal | August 201222
SPECIAL FEATURE
neering fashion, issues are isolated by making one change at a time, then test-ing, evaluating, correcting and retesting at each step. One change might involve a new real-time OS, another change might involve new processor architecture, and a third change might mean mov-ing from a bus architecture to a switch fabric. Each of these changes must be isolated during the porting process and dealt with one at a time.
Application ExamplesFor its part, Mercury Computer Sys-
tems has used multiple combinations of these techniques to help its customers im-plement timely, cost-effective technology upgrades to the sensor processing portion of their programs. The company recently worked with a leading prime contractor customer in support of their upgrade to a ground mobile missile defense radar system, enabling it to track more, and faster, targets.
The requirements for improved sensor pro-cessing performance and flexibility were stringent and the schedule was highly com-pressed. The upgraded sensor processing subsystem delivered the needed processing improvement in an OpenVPX chassis based on the RapidIO fabric. As part of the effort, Mercury helped the customer migrate ap-proximately 150,000 lines of embedded sig-nal processing code to the new platform.
In a similar fashion, Mercury helped another customer upgrade a family of air-borne maritime radar systems. These up-grades, also based on OpenVPX and Rapi-dIO, involved porting large blocks of legacy software. Mercury not only executed that porting activity but also developed a hy-brid VME-OpenVPX backplane so unique legacy hardware technology could be car-ried forward. Those are just two examples of an increasingly common approach in the defense industry: supporting capability up-grades in existing ISR programs by quickly and affordably inserting new technology into sensor processing subsystems.
Mercury Computer SystemsChelmsford, MA.(978) 967-1401.[www.mc.com].
Figure 3
Shown here is a lab-style OpenVPX subsystem used for test and debug while porting legacy software.
Untitled-18 1 5/2/12 2:03:25 PM
COTS Journal | August 201224
“Do more with less” is the new budget reality for the United States defense and intel-
ligence community across every mission area and battlespace domain. While Intel-ligence, Surveillance and Reconnaissance (ISR) requirements are often driven by technical challenges, mission success will be achieved in many cases by avoiding ex-quisite technology solutions and focusing on the right technology at the right cost for a given performance requirement.
One way to balance performance and cost is to reuse elements of systems that are already developed, but selectively ap-ply upgraded technology to reduce cost, size, weight and power while maintain-ing or improving performance. Here we explore one example of using COTS modules with the latest ADC and FPGA technology to leverage an existing VME-bus-based architecture and maintain cur-rent performance with significant reduc-tion in unit cost, size, weight and power.
FPGAs Do the WorkDigitizers with FPGA processing are
used in a wide range of defense and intel-ligence systems, including signals intel-ligence, electronic warfare and radar ap-plications. Here we consider a processing subsystem that has been used by an OEM as the building block for a family of radar
systems over a number of years. The sub-system consists of a number of process-ing slices, each with two stages: a custom developed VME module that contains an ADC to digitize the IF signals along with FPGAs for signal processing, followed
by a COTS SBC module that accepts the data from the ADC / FPGA module and performs general purpose processing of the data stream. Control setup and sta-tus monitoring is implemented using the VMEbus while the module-to-mod-
Andrew Reddig, President and CTOTek Microsystems
It’s not unrealistic to expect the same or better performance from smaller low-cost processing subsystems. VME is the ideal platform to maintain legacy systems while upgrading with more powerful FPGA and ADC performance.
VME Still the Right Choice for Radar Upgrades
VME, VPX and cPCI Target Tech Insertion Needs
SPECIAL FEATURE
VMEbus
ADC
ADC
FPGA
FPGA
ADC
ADC
FPGA
FPGA
SBC
SBC
SBC
SBCProcesingSlice #1
ProcesingSlice #2
AnalogInputs
(4)
AnalogInputs
(4)
FPDP
FPDP
Platform I/O
Display
Figure 1
This legacy system using two processing slices consists of an SBC module with a standard Intel-based processor with two PMC sites, one of which is used for the FPDP interface and the other is reserved for other platform interfaces if necessary.
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admockv11.indd 1 7/27/12 3:39 PM
COTS Journal | August 201226
SPECIAL FEATURE
ule streaming data uses dedicated Front Panel Data Port (FPDP) links. The output of the processing slice is forwarded over the VMEbus to a control processor for downstream processing and display.
Each slice accepts two channels of data from the RF front end in the form of four analog signals (two channels x I/Q). Each analog signal has IF bandwidth of 30 MHz centered on 30 MHz (i.e., signal in-formation from 15 to 45 MHz). Each ADC / FPGA module samples its analog signals using 14-bit 105 Msample/s ADC convert-ers and the resulting digital data streams are processed by two Xilinx Virtex-II Pro
VP70 FPGAs. The resulting channel-ized data is then combined into a single 40 Mbyte/s data stream and transferred through a FPDP interface to the adjacent processor module. The SBC module is a standard Intel-based processor with two PMC sites, one of which is used for the FPDP interface and the other is reserved for other platform interfaces if necessary. A block diagram of a legacy system using two processing slices is shown in Figure 1.
This processing slice architecture has been used by the OEM in multiple radar systems with different channel counts and performance requirements. This has re-
sulted in a set of FPGA firmware and gen-eral purpose processing software modules that are well integrated, mature and proven in multiple deployed systems. The matu-rity and stability of these elements are a key part of the OEM’s value proposition to customers, enabling rapid, reliable devel-opment and deployment of radar systems.
Tech Upgrade to Reduce CostIn our example, the OEM has been
asked to propose a new radar system similar in functionality to deployed sys-tems that use the existing architecture but with an aggressive unit cost target. Because this is a new design, there is an opportunity to upgrade the technology but both the overall budget and the rapid deployment schedule require that Non Recurring Engineering (NRE) be mini-mized. While technology upgrades are often driven by a need for enhanced per-formance, in this case the performance requirements are stable but the goal is primarily to reduce unit cost while also saving size, weight and power.
The existing architecture uses Intel-based SBC modules for both 2nd stage sig-nal processing, control processing and plat-form interfaces. The OEM performed an analysis of the processing workload and de-termined that the two legacy signal process-ing SBCs and the two general purpose SBCs could be combined into one quad-core SBC module provided that a suitable method for getting data from the ADC / FPGA stage into the SBC could be implemented.
Considering OptionsSeveral options were considered for
primary data transfer, including FPDP, Se-rial FPDP, Gigabit Ethernet and VMEbus. FPDP was considered unattractive because it potentially required two separate PMC modules on the SBC, which would leave no open mezzanine sites for other I/O re-quirements. Serial FPDP was a feasible op-tion, but the use of fiber optic I/O on the front panel would increase the volume of the chassis and require custom heatframes for the conduction-cooled SBC module. Gigabit Ethernet was evaluated but ruled out due to the need for a network switch and the potentially non-deterministic timing of the network fabric.
VMEbus
ADCs FPGAs
SBC
DualProcessing
Slice
AnalogInputs
(8)
Platform I/O
Display
Figure 2
Block diagram of the upgraded system using the QuiXilica-V6 board.
ADC DDR x2VMEbus
FPGA
Virtex-6FPGA
GbESwitch
ADC
ADC
ADC
Virtex-6FPGA
AnalogInputs (4)
ADC DDR x2
ADC
ADC
ADC
Virtex-6FPGA
AnalogInputs (4)
VMEP1 / P2
VXSP0
GigabitEthernet
VMEbus Serial LinkGigabit Ethernet Link
Figure 3
Block diagram of the QuiXilica-V6 module.
August 2012 | COTS Journal 27
SPECIAL FEATURE
The OEM selected VMEbus for pri-mary data transfer from the ADC / FPGA modules to the SBC because it supported the required data rate with minimum im-pact to size, weight and power. While the VMEbus interface was not an option for the legacy system due to the 80 Mbyte/s maxi-mum throughput of D64 MBLT transfers, current SBC modules support 2eSST data transfers, which quadruple throughput to 320 Mbytes/s. This makes VMEbus a vi-able option for processing subsystems with up to four processing slices.
The next question was whether to re-design the custom ADC / FPGA module to add support for 2eSST VME or to replace the custom module with a COTS module. Another tradeoff being considered was whether it would be possible to support eight analog signals per module to mini-mize the module count even further.
After reviewing the options, the OEM decided to replace two legacy ADC / FPGA modules with a QuiXilica-V6 ADC / FPGA VME module supporting eight analog inputs with FPGA processing. A
block diagram of the upgraded system is shown in Figure 2. A block diagram of the QuiXilica-V6 module is shown in Fig-ure 3, and a front view photograph of the module is shown in Figure 4. The follow-ing discussion reviews each element of the upgraded ADC / FPGA module.
Analog to Digital ConverterCurrent ADC options have signifi-
cantly improved analog performance rela-tive to the 14-bit ADC used in the legacy ADC / FPGA module, with better resolu-tion, Effective Number of Bits (ENOB), Signal-to-Noise Ratio (SNR) and Spurious Free Dynamic Range (SFDR). Because the RF input characteristics are not changing, the analog frequency range and ADC sam-ple rate are unchanged. The optimum ADC choice is a device that supports the existing bandwidth but offers better signal perfor-mance at the required sample rate. The upgraded module uses the Analog Devices AD9265, which is a 16-bit 105 Msample/s converter with improved ENOB, SNR and SFDR over the legacy 14-bit device.
In the legacy ADC / FPGA module, each pair of analog input channels is pro-cessed by a Xilinx Virtex-II Pro V2P70 FPGA, which contains 33,088 logic slices and 328 18x18 multiplier blocks. Unfor-tunately, it is difficult to directly compare Virtex-II Pro and Virtex-6 logic and DSP slice counts because the functionality of both logic and DSP slices changes with each FPGA generation, and the effective use of the hardware is also dependent on the signal processing algorithm being im-plemented. Based on analysis of represen-tative signal processing applications, we have found the ratio of V2 to V6 slices to be between 35% and 70% for logic slices and between 2 to 3x for DSP slices, prior to any allowance for the faster clock rates supported by V6 devices. After normaliz-ing to V6 slices, each V2Pro P70 therefore contains between 11,580 and 23,162 logic slices and between 110 and 164 DSP slices.
The upgraded system has three Vir-tex-6 FPGAs across eight analog channels, and each FPGA can be populated with ei-ther SX315 or SX475 devices. The legacy
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COTS Journal | August 201228
SPECIAL FEATURE
system uses Front Panel Data Port (FPDP) to provide a 40 Mbyte/s interconnect be-tween the ADC / FPGA module and the as-sociated SBC module. The FPDP interface is an open standard interface defined by ANSI/VITA 17-1998, which requires an I/O module on the SBC module to accept data.
VME 2eSST Instead of FPDPThe upgraded system uses VMEbus
2eSST data transfers to replace the FPDP interface. The required data flow is a total
of 80 Mbytes/s and the 2eSST interface supports up to 320 Mbyte/s throughput, which provides adequate headroom for overhead and for future expansion.
The VMEbus implementation in the upgraded ADC / FPGA module uses a soft IP core to provide an A32:D32 in-terface for control and status registers as well as a streaming 2eSST master inter-face for primary data transfer. The soft IP core translates VMEbus transactions into serial messages using one onboard
2.5 Gbit/s GTX link for each FPGA. The use of a soft IP core allows the VME func-tionality to be tailored if necessary and also avoids the size, power and cost of a traditional ASIC bridge solution.
For this application, the OEM imple-mented a DMA controller as part of their FPGA design that is preloaded with a list of buffer descriptors through the A32:D32 interface as a part of system setup. Each descriptor defines a target VMEbus 2eSST address, maximum buffer size, notifica-tion method and value, and a pointer to the next descriptor. Once the system is configured, the DMA controller steps through the list, filling each buffer in turn and sending notification messages as each buffer is completed. This maxi-mizes VMEbus utilization by emphasiz-ing “pushing” data and completion events with writes instead of reading status or descriptors. This results in a highly de-coupled system, where the SBC simply waits for notification events (typically mailbox interrupts) and then processes the indicated memory buffer. It also eas-ily scales to multiple cores or multiple SBC modules should that be required.
Network InterconnectThe legacy system uses Gigabit Eth-
ernet as an external interface for con-trol and status purposes. The upgraded system has additional Gigabit Ethernet ports available on the SBC, which enables a more network-enabled architecture for future technology insertions.
The upgraded ADC / FPGA module supports Gigabit Ethernet connections
Figure 4
The QuiXilica-V6 is an ADC / FPGA VME module supporting eight analog inputs with FPGA processing.
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COTS Journal | August 201230
SPECIAL FEATURE
to the front panel, the P2 backplane con-nector using a Rear Transition Module, and the P0 backplane connector if a VXS backplane is used. These network inter-faces are all connected internally to an onboard Gigabit Ethernet switch, which provides network interfaces to the system controller and to each Virtex-6 FPGA de-vice. This allows future expansion to a network-based control plane as an alter-native to the VMEbus without additional hardware.
Snapshot MemoryThe upgraded ADC / FPGA module
has six banks of DDR3 memory available with total capacity of 5 Gbytes and total throughput of 32 Gbytes/s. One of the up-graded firmware functions uses the memory to implement a “snapshot” mode, which ac-quires a large block of raw analog input data and then transmits the data over the Gigabit Ethernet network to a support processor. This improves the built-in test and diagnos-tic capabilities of the system without requir-
ing additional CPU bandwidth, interconnect options or impacting normal operation.
The net effect of the technology up-grade is a reduction in module count by a factor of three, with associated reductions in unit cost, size, weight and power while pro-viding better analog and processing perfor-mance along with a more network-enabled architecture. By switching from single core to multicore SBC technology and decoupled DMA-based data transfer, virtually all of the existing firmware and software can be reused with minor modifications to the data transfer and flow control portions.
Once this system has been imple-mented and deployed, the upgraded pro-cessing components can be reused for smaller or larger systems or for require-ments with additional signal process-ing requirements without changing the hardware modules, backplane or enclo-sure. This will allow the OEM to mix and match ADC / FPGA and SBC modules as required for different application re-quirements while maintaining common-ality across systems and optimizing size, weight and power of each configuration.
Modular Building BlocksEffective system design uses modular
building blocks based on open standards to build deployed systems that can be up-graded over time. While new systems today are increasingly based on the latest archi-tectures such as VXS and OpenVPX, there are still requirements to upgrade legacy systems and also to architect new systems that reuse existing architectures and invest-ments in software, firmware and hardware.
The same ADC and FPGA technology that enables the newest open standards can also be deployed through VME-com-patible COTS modules to incrementally upgrade legacy systems while retaining compatibility with existing components and infrastructure. This enables an evo-lutionary approach to technology refresh, which lowers cost, schedule and perfor-mance risk while leveraging the latest ADC and FPGA technology to reduce cost and improve mission capability.
TEK MicrosystemsChelmsford, MA.(978) 244-9200.[www.tekmicro.com].
©2012 Themis Computer. All rights reserved. Themis Computer, Themis and the Themis logo are trademarks or registered trademarks of Themis Computer. All other trademarks are the property of their respective owners.
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Untitled-4 1 5/9/12 10:29:48 AM
COTS Journal | August 201232
Military programs that have been designated for tech re-fresh often have very specific
technology requirements coupled with strict budgetary guidelines. One of the biggest challenges of military tech re-fresh programs is that systems need to be upgraded to handle the explosive in-crease in data volume that is shared and used to coordinate the diverse group of air, sea and land systems deployed today. The performance capabilities of many legacy systems are just not up to today’s bandwidth, graphics imaging, advanced sensor capabilities and automated system demands of the modern battlefield.
Military designers have learned that there is no “one size fits all” solution for tech refresh, but rather a range of options that need to be carefully evaluated per evolving technology requirements, appli-cation lifecycle needs and overall program goals. In step with military OEMs’ needs, embedded computing suppliers are ready to meet tech refresh demands with the lat-est COTS-based platforms—from off-the-shelf, to semi-custom and pre-validated systems. Suppliers of these COTS plat-forms also understand that there is still a constant need to deliver COTS solutions that continue to support reduced size, weight and power (SWaP) requirements in combination with increasing system per-formance, reliability and overall security.
Next-generation VME-based embed-ded platforms offer a traditional approach that makes perfect sense as a “drop-in” solution for some refresh programs. But other, more complex upgrades that need higher speed signaling, increased I/O and more sophisticated interfaces may require the additional capabilities and benefits of CompactPCI, VPX, and now even inte-grated application-ready platforms.
Strategic MigrationFor many legacy programs that are
VME based, it absolutely is the right approach to migrate to the latest high-speed serial switched fabric solutions implemented in a VPX backplane. These applications can easily make the switch
to take advantage of upgraded processor, I/O and memory capabilities. The same holds true for CompactPCI systems that have the ability to migrate to the lat-est processor architecture performance and feature set. CompactPCI is also an attractive option for designers looking to upgrade from VME-based systems. The operational aspects of CompactPCI closely resemble VME and it has been field proven.
Both VME (via the VITA 31.1 specifi-cation) and CompactPCI systems are now able to upgrade their connectivity perfor-mance with 10 Gigabit Ethernet (GbE) switches (Figure 1). These switching plat-forms increase performance of VME and CompactPCI systems based on the latest
R.J. McLaren, Product Marketing ManagerVincent Chuffart, Product Marketing ManagerKontron
Traditional and new approaches to tech refresh enable military programs to meet technology requirements under tighter budget restrictions.
Many Paths Lead to Tech Refresh Success
VME, VPX and cPCI Target Tech Insertion Needs
SPECIAL FEATURE
Figure 1
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COTS Journal | August 201234
SPECIAL FEATURE
processors for intra- and inter-communi-cation supporting the rising transaction and traffic load demands that many mili-tary system designs must handle today.
In contrast, VPX brings a new ap-proach that moves away from using par-allel bus architectures on the backplane. VPX employs 1 GbE to implement high-speed serial link point-to-point con-nections between boards for the control plane. With VPX connectors and back-planes, multi-gigahertz signals are pos-sible so full dataplane bandwidth is no longer shared between boards. For ex-ample, each board can have one or more dedicated high-speed connections via GbE, 10 GbE, or PCI Express. Amazing upgrades are now possible that can fully utilize data from advanced sensors for ra-dar, sonar and surveillance applications.
Migrating to VPXBut selecting VPX as the hardware
solution is only one part of the refresh equation. Migrating to VPX affects the backplane and all system cards, which makes this type of upgrade more chal-lenging than a simple CPU card upgrade.
Additional design expertise is needed to replace the bus-based architecture with a network-based protocol and typically requires a significant retooling of applica-tion software. Designers must now take on the challenge of integrating a wealth of interface standards such as PCI Express (PCIe), GbE and Serial RapidIO, which is not an easy task. Currently, PCIe is very popular because it is based on point-to-point serial links rather than system-wide shared parallel bus architecture, which provides a more ideal link between I/Os and processor units, as well as a native communications link in a multiprocessor environment.
In addition, faster deployment schedules dictate that migrating to new or upgraded technologies must be simpli-fied. But what resources are available to streamline the integration of these new technologies? One such resource is found with Application Program Interfaces, or APIs, which provides a thin layer of soft-ware that facilitates faster application development for IP-based transport over PCI Express. APIs provide the founda-tion to implement efficient inter-board
Figure 2
These two 3U OpenVPX SBCs provide native support for 10 Gbit Ethernet and PCI Express 3.0 to support the highest bandwidth demands of network-centric military applications. The VX3042 and VX3044 VPX boards are 100% backward and upward pin-out compatible to their predecessor VPX SBCs.
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COTS Journal | August 201236
SPECIAL FEATURE
communication at hardware processing speeds. Eliminating the need to make code changes, APIs allows existing TCP/IP-based applications to use PCI Express for higher bandwidth communication.
Kontron’s VXFabric API technology is equivalent to an Ethernet network in-frastructure, mapped over a PCI Express switch fabric technology that enables OEMs to streamline the development of high-performance OpenVPX technolo-
gies based on next-generation processor architectures (Figure 2). What this means to software engineers is that they can de-velop their systems applications over a typical Ethernet network infrastructure using their desktop PC-based hardware, and when it is ready to migrate their ap-plication onto a rugged embedded sys-tem, such as the ApexVX, they will not encounter endless migration issues. Uti-lizing an API such as the VXFabric offers
PCI fast link plug-and-play capabilities and is supported by a PCIe-based soft-ware ecosystem with broad support for peripheral interconnects.
Intelligent Military SystemsThe world of military applications
is moving toward a connected network of devices where diverse applications communicate with one another creating more intelligent systems. New COTS-based boards and modules based on the technology advancements from 3rd Gen-eration Intel Core processors offer the foundation for intelligent systems that draw on the increased computing power, graphics performance, long-term avail-ability and energy efficiency this new ar-chitecture provides.
The combination of features in these new COTS platforms enables connected solutions that bring together different form factors and usage models to benefit a variety of military operations such as communications between unmanned ve-hicles and soldiers, and improved align-ment of command and control applica-tions. That is because COTS platforms
Figure 3
The ApexVX system can include a wide range of computing options—from the core i7 processor boards to a wide range of carrier boards for either PMC/XMC, FMC or MxM. Tying this all together is a VPX backplane and PCIe / Ethernet hybrid switch that ensures a high level of board-to-board signal integrity and performance.
Untitled-12 1 1/11/12 9:50:36 AM
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leader in the design, manufacture, and integration of high quality enclosures, we offer: standard Emcor® enclosure solutionscustom Crenlo® enclosure solutions, which can be built for any application, ranging from inverter enclosures to package drop boxes. The only thing stronger than our enclosures is our commitment to customer satisfaction. At Crenlo, we see enclosures differently.
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COTS Journal | August 201238
SPECIAL FEATURE
based on 3rd generation Intel Core i7 processors provide up to 20% enhanced computing power and up to 40% in-creased performance per watt compared to designs based on the 2nd generation Intel Core processors.
In addition, these new embedded computing platforms typically exceed the requirements of reduced SwaP to enable developers to upgrade systems with in-creased processing density and I/O band-width within tight thermal envelopes. They also provide new small form factor solutions that can leverage the power of the latest quad-core Intel processors such as COM Express and 3U VPX. Designers can also take advantage of the improved precision and simplified programming provided by the increased floating point performance of the Intel Advanced Vec-tor Extensions (AVX) instruction set for signal processing and SSE-based systems.
Battlefield-Ready Tech RefreshIt is becoming more and more im-
portant for tech refresh programs to be
deployed as quickly as possible on limited budgets and with a minimum risk to the application or overall program. It is also a fact that many applications now require an integrated technology approach that provides reliable network connectivity. These systems range from weapons con-trol to handheld GPS-based radios to those that handle the real-time sharing of surveillance data.
Furthermore, the military has de-ployed systems with more and more sen-sors that deliver monumental amounts of important data that enable increased surveillance capabilities with a greater reliance on secure video imaging as an integral element to situational awareness. New applications such as mapping, secure chat and augmented reality are evolving from this available data and are further driving the need for effective networking and increased bandwidth. Ultimately, the trend of making these applications mo-bile for the individual soldier is proving highly viable and is likely to continue at a greater pace.
Pre-Qualified SystemsCOTS suppliers are now offering
pre-qualified, modular, application-ready platforms that integrate the latest technol-ogies that allow designers to drastically shorten development time for rapid de-ployment. True application-ready COTS platforms provide the ability to ease and speed development of an extensive range of mission-critical airborne system, mo-bile military vehicle, precision-guided munition, electronic warfare, UAV and C4ISR applications. An example of a bat-tlefield-ready platform is Kontron’s new multi-mission rugged computer system ApexVX (Figure 3), which allows military system designers to configure different application-ready solutions in the same rugged small form factor enclosure.
Another resource that is speed-ing the ability to go from development to deployment is a new classification of high-performance embedded comput-ing (HPEC) platforms. Designers find HPEC system-level solutions a viable re-source to meet military programs’ needs
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August 2012 | COTS Journal 39
SPECIAL FEATURE
for high-end processing such as in the requirements for an airborne surveil-lance system. Because it delivers an im-mense amount of performance in a small footprint, the 19-inch footprint HPEC platform is well suited to radar, SIGINT, sonar and video processing needs of UAV or aircraft programs.
Highly integrated HPEC systems are now available that deliver massive processing power for compute-intensive DSP-based systems. For example, the Kontron HPEC platform delivers 1.44 Teraflops of compute density. Kontron’s supercomputer-like system HPEC plat-form comprises 18 of Kontron’s VX6060 Core i7 2 GHz (or more) computing nodes including 8 Gbyte DDR3 memory on each board, in addition to 36 tightly coupled processors within the HPEC platform. Several switched fabric inter-connects are housed in the backplane.
Tech Refresh Flexibility AboundsMilitary OEMs have many COTS op-
tions today. They can choose to stay with
VME and upgrade the performance and capabilities with new processors, I/O and memory to meet tight budget guidelines. Likewise, next-generation CompactPCI boards enable a compatible tech refresh option that provides higher performance and reliability that streamlines develop-ment and reduces redesign efforts in a proven platform.
More complex tech refresh oppor-tunities need to leverage technology advances, major performance break-throughs and higher bandwidths that are fully supported by VPX. It is also smart to take advantage of standards-based tools such as APIs that simplify the integration of higher performance communication, which speeds deployment.
With the transition to more in-telligent and connected military sys-tems, designers now can tap into the performance per watt and integrated technology features offered in COTS platforms based on next-generation processor architectures. These new platforms help developers meet re-
duced SwaP requirements in small form factors such as COM Express and 3U VPX, while at the same time up-grade systems with increased process-ing density and I/O bandwidth within tight thermal envelopes.
Military OEMs that need to cost-effectively and rapidly deliver upgrade solutions without risking the overall operation of the application now have additional options in pre-qualified, modular, application-ready platforms and fully integrated HPEC systems. While there is not a “one size fits all” so-lution for tech refresh programs, there is a wealth of innovative COTS-based op-tions that support the military’s diverse and evolving technology upgrade needs in systems that improve battlefield op-erations to better protect soldiers and civilians alike.
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COTS Journal | August 201240
Leveraging cutting-edge graphics chips developed for the demanding gaming market, military graphics
subsystems are now able to offer com-plex video and graphics functionality in highly integrated board-level solutions. Command and control systems have em-braced these capabilities and now rank among the most demanding users of these advanced graphics technologies.
As it transforms itself to Network-Cen-tric operations, the U.S. military is evolv-ing its command and control into a grand scheme where every vehicle, every aircraft, every ship, every UAV and every soldier on the ground is able to quickly share data, voice and even video with almost any level of the DoD’s operation. A variety of tech-nology areas are part of the overall puzzle to make that happen, but where the network meets the users is at the displays and the dis-play subsystems that drive them. Command centers—both facility based and mobile based—along with UAV control stations are making use of advanced display sys-tems that do an unprecedented level of real-time situational awareness and command control. Figure 1 shows an elaborate U.S. Army command and control center set-up at AUSA Winter, using several large high-resolution displays and computing systems that are all part of a networked system.
For military commanders to finally put their paper maps away and trust elec-tronic displays for tactical and strategic in-formation was not an overnight transition.
But today they’ve made the leap with the ac-knowledgment that display subsystems that blend real-time video and sophisticated graphics are a vital mission requirement.
Jeff ChildEditor-in-Chief
The military continues to hunger for ever more elaborate arrays of command and control set-ups. Advances in displays and display control gear are feeding those needs.
Display Advances Enable Larger, More Complex Command Systems
Displays and Subsystems for Command and Control
TECH RECON
Figure 2
COTS Journal Editor-in-Chief Jeff Child is briefed at AUSA Winter about an elaborate U.S. Army command and control center set-up using several large high-resolution displays and computing platforms that are all part of a networked system.
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TECH RECON
In the past 12 months the trend has been toward not only supporting larger, higher res display technologies, but also seamlessly linking multiple large displays for ever more sophisticated command center capabilities.
Aggregating Multiple DisplaysExemplifying those trends, RGB Spec-
trum earlier this year announced the release of SuperWall, the latest addition to the com-pany’s family of MediaWall display proces-sors. It combines up to four of its MediaWall units with control software, which creates displays with up to 120 windows arranged over up to 48 screens. The SuperWall’s par-allel processing architecture can scale up as necessary while maintaining picture qual-ity—no pixel dropped, no frame lost. Super-Wall can handle up to four MediaWall 4500 or MediaWall 4200 processors. It offers a Java-based web control interface that supports all functions of the MediaWall processors.
The MediaWall 4500 and MediaWall 4200 display wall systems (Figure 2) are based on a custom, high-performance ar-chitecture rather than a PC, with faster up-dates, more display flexibility, robustness and security. The MediaWall 4500 video wall processor displays up to 30 graphics and video signals on up to 12 screens in a 3x4 ar-ray; the MediaWall 4200 video wall proces-sor displays up to 12 graphics and video sig-nals on up to 8 screens in a 2x4 array. Unlike other video display walls, MediaWall display wall processors have essentially no limits on
display alternatives; the multi-screen array forms a truly virtual screen in which any display of windows is possible.
Many Displays, One ControllerAs military command centers become
more sophisticated, there’s a parallel trend where even temporary field mobile com-mand centers can make use of sophisti-cated display set-ups using limited com-puting resources. Along those lines, Matrox Graphics offers its Matrox Epica TC20+ and TC48 low-profile multi-display graph-
ics cards. Working in conjunction with the Wyse Technology Z90DE7 high-perfor-mance thin client, the Epica TC20+ dual-monitor and Epica TC48 quad-monitor cards enable up to six displays from a single system when combined with Z90DE7’s two native graphics outputs. The additional monitor space allows for easier on-screen access to one or more single or multi-mon-itor published desktops or applications in such demanding virtual desktop environ-ments as command and control.
Co-validated for use with the Wyse Z90DE7 due to high energy efficiency, low thermal properties and their PCI Express bus interface design, the Epica TC20+ and TC48 graphics cards enable a wide variety of multi-display configurations and options for multi-display thin-client users. The dual-monitor TC20+ supports resolutions up to 1920x1200 (digital) and 2048x1536 (analog) per display and up to four VGA displays via an optional upgrade. The Epica TC48 meanwhile supports up to four DVI or DisplayPort monitors at resolutions up to 1920x1200, resulting in both cases up to an unprecedented six displays from a single thin client. Users can subsequently open one or multiple remote sessions on each display or span a single spreadsheet, for ex-ample, across several monitors.
Wide-Screen Rugged DisplaysThe new model of net-centric opera-
tions in the military means that sophisti-
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Untitled-3 1 7/11/12 10:46 AM
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The MediaWall 4500 and MediaWall 4200 display wall systems are based on a custom, high-performance architecture rather than a PC, with faster updates, more display flexibility, robustness and security.
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COTS Journal | August 201244
TECH RECON
cated displays are required even in harsh environment situations such has aboard a ship or aircraft. Feeding such needs, Neuro Logic Systems is now shipping the first ruggedized, rackmount 30-inch LED display (Figure 3). Designed for military, shipboard and other harsh, demanding environments, the RF-30 incorporates NLS’s proprietary LED backlight system that eliminates 80% of the heat and over 50% of the power consumption of an equivalent 30” CCFL (Cold Cathode Fluo-rescent Lamp) display while greatly ex-tending the brightness adjustment range from over 325 cd/m2 down to zero cd/m2. Compared to an equivalent CCFL display, the LED backlighting also makes the dis-play thinner at only 3.8 inches, and lighter at only 24 lbs. The RF-30 was originally de-veloped for the surveillance airplane in the air-to-ground JSTARS (Joint Surveillance Target Attack Radar System) program.
Standard input power is 95-240 VAC, 47-63 Hz via a MIL-STD MS38999 connector. Alternative power options include 28 VDC and 48 VDC and 115 VAC at 400 Hz. Power dissipation at maximum brightness is less
than 90 watts; standby power is under 5 watts. Operating temperature is -10° to +50°C and MTBF is 50,000 hours. The RF-30 is certified to MIL-STD-461E and MIL-STD-810.
Real-Time Enhanced VideoReal-time performance is becoming
mission critical in the rugged display arena. Serving those needs, Z Microsystems pro-vides its Intelligent Display Series (IDS)
flat panel displays. The LCD display pan-els use a high-powered FPGA to apply image enhancement and edge detection algorithms to incoming video streams without adding latency. A sophisticated image enhancement algorithm brings out detail in images degraded by poor visibil-ity or atmospheric interference. The edge detection algorithm identifies anomalous shapes and highlights details for surveil-lance. Operators can turn image functions on or off with the click of a button.
The thin, lightweight IDS panels are available in 24″, 21.3″ and 17″ sizes. Each display can be VESA arm-mounted, panel-mounted, rack-mounted, or attached to a specifically designed multi-display mounting frame. The mounting frame al-lows the user to rotate each display to pro-vide viewing angle adjustability from the 5th to the 95th percentile personnel per MIL-STD-1472F for vertical and horizon-tal visual fields ergonomic requirements.
Made for Vehicle UseDisplay systems mounted on mili-
tary vehicles require a unique level of rug-
Call 858.831.7000 or visit www.zmicro.com/rtev
Advanced VEGA Rugged Displays with Real-Time Video EnhancementThe VEGA Display Series from Z Microsystems features an adaptable architecture that can satisfy a complete range of rugged COTS needs.
Tough, lightweight, element-resistant, and with built-in image enhancement algorithms, VEGA displays can handle multiple inputs from a wide
range of video sources. A choice of touch screens with easy on-screen controls offers viewers on-demand access to multiple video feeds in
Picture-in-Picture (PIP), QuadView, Dual-View and full screen formats. With an armored shell manufactured from CNC machined aircraft grade
aluminum and low profile fold and lock transportation handles these displays are FIELD-READY.
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Untitled-1 1 8/2/12 2:56 PM
Figure 3
This rackmount 30-inch LED display incorporates NLS’s proprietary LED backlight system that eliminates 80% of the heat and over 50% of the power consumption of an equivalent 30-inch CCFL.
COTS Journal | August 201246
TECH RECON
gedness and compactness. GE Intelligent Platforms targets this challenge with two rugged intelligent vehicle displays (Figure 4) designed for deployment in harsh envi-ronments such as tanks and other ground combat vehicles. They are well suited for applications including embedded training, 360° situational awareness, terrain visual-ization and Force XXI Battle Command Brigade and Below (FBCB2) as well as commander and gunner display consoles.
The IVD2010 and IVD2015 from GE Intelligent Platforms also include the ad-vanced thermal management capabili-ties necessary for deployment in confined spaces. The 10.4” screen IVD2010 and 15” screen IVD2015 XGA, 1,024 x 768 resolu-tion smart displays both incorporate not only an Intel Core2 Duo processor operat-ing at 2.26 GHz but also a 96-core NVIDIA GT 240 GPU. Together with 4 Gbytes of SDRAM3 memory and four simultaneous
video inputs, this equips them to handle the most demanding, sophisticated graph-ics applications such as picture-in-picture and symbology overlay, stitching multiple videos into a single panorama, and allows high-performance GPGPU applications to be deployed directly on the display unit.
GE Intelligent PlatformsHuntsville, AL.(780) 401-7700.[www.ge-ip.com].
Matrox GraphicsDorval, Quebec, Canada.(514) 822-6000.[www.matrox.com].
Neuro Logic SystemsCamarillo, CA(805) 389-5435.[www.nlsdisplays.com].
RGB SpectrumAlameda, CA.(510) 814 7000.[www.rgb.com].
Z MicrosystemsSan Diego, CA.(858) 831-7000.[www.zmicro.com].
Figure 4
Offered in 10.4-inch and 15-inch screen sizes, these 1,024 x 768 resolution smart displays incorporate an Intel Core2 Duo processor operating at 2.26 GHz and a 96-core NVIDIA GT 240 GPU.
Small size, big performance
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The New AB3000 Rugged Computer
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The AB3000 from Ballard Technology is small, lightweight and loaded with capabilities for easy integration into today’s modern aircraft, UAVs, and ground mobile platforms. With an efficient Intel® E680T processor, MIL-STD-1553 and ARINC 429/708/717 interfaces, Ethernet, USB, video, audio, and PMC expansion, this rugged, conduction-cooled COTS device is ready to take on all of your toughest computing and interface problems.
Performance and versatility in less space ... that’s the AB3000.
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AB3000 at-a-glance
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COTS Journal | August 201248
The concept of marrying the best of CPU computing functionality with the benefits of GPU process-
ing offers a host of benefits for military real-time image processing designs. Such technology, dubbed accelerated processor units (APUs), came into play when the Company for Advanced Supercomputing Solutions (CASS) was approached by an Israeli defense contractor to create a new field video image registration solution.
The defense contractor’s executives had come to CASS with a problem: they needed high-quality, smooth, stable, real-time computer vision images delivered from ground and aero systems to back-end systems. The defense contractor’s DSP and FPGA solutions were not capable of devel-oping the high-speed, higher-resolution images that could more accurately track motion—tracking missiles as they are car-ried on a moving vehicle or detecting a per-son climbing into a bunker, for example. (See sidebar “What Is Image Registration?)
CASS was asked to create a compact system that could process a frame-by-frame 720p video input stream at 120 frames per second. While the defense contractor im-posed constraints around maximum size and maximum power consumption, CASS was otherwise unlimited in how it could design the solution. By making the right al-
gorithmic adjustments and choosing an ap-propriate architecture, the resulting appli-cation runs at real-time speeds where other competitive solutions (DSP and FPGA) failed to meet the requirements. The result-ing solution built by CASS can serve as a new-generation DSP for sensor and com-puter-vision platforms, leveraging a combi-nation of parallel and serial processing on a heterogeneous system architecture.
The Challenge“Lots of industries use graphics pro-
cessing units (GPUs) for projects that in-clude video,” said Mordechai Butrashvily, CASS chief executive officer and chief technology officer. CASS has been build-ing solutions around AMD GPUs for years and knew that for applications with a high degree of parallelism—like image processing—programmable GPUs offer
Cameron Swen, Marketing ManagerAMD Embedded Solutions
Although the technology was designed for display applications, GPUs coupled with CPUs offer solutions for real-time imaging systems in defense.
Case Study: APUs Solve Real-Time Image Processing Challenge
Displays and Subsystems for Command and Control
TECH RECON
Comparison of Overall Graphics / 3D and CPU Performance
AMD G-Series T56N
AMD G-Series T48N
AMD G-Series T40N
Intel Atom D2700
Intel Atom D525
175%
148%
117%
100%
78%
Figure 1
Graphed here is a performance comparison of various G-Series APUs vs. Intel Atom processors. Percentages in this chart were derived by normalizing the geometric mean of overall benchmark scores to the Intel Atom D2700 processor. (Source: AMD.)
COTS Journal | August 201250
TECH RECON
critical performance advantages. “But we knew a stand-alone GPU just couldn’t of-fer a solution that would meet the power consumption and size constraints of the defense contractor.”
Butrashvily and his team looked at a variety of possible solutions and realized their options were rather limited. Few manufacturers can offer the performance needed without compromising on size or power consumption. The CASS team found their research kept pointing them to the AMD Embedded G-Series APU, which combines the parallel processing capabilities of a GPU with the serial pro-cessing capabilities of a CPU in a small footprint and low-power solution. “We evaluated several solutions, and nothing else compared to the APU for size, power consumption and capabilities. No one else provides a similar solution in terms of performance per watt,” Butrashvily said. “One additional advantage of the AMD G-Series APU is that they are sold as embedded solutions, meaning a good fit for defense solutions that require long-term availability and durability in harsh environments.” Figure 1 shows a perfor-mance comparison of various G-Series APUs vs. Intel Atom processors.
Real-Time Threat DetectionAccording to CASS, the defense con-
tractor needed semiautomatic systems that could help aid pilots in making deci-sions. The way to do that is to take im-ages from both aerial and ground systems
to stabilize video streams, enabling the detection of immediate threats. They re-quired a system that was compact and low power enough to be used in unmanned aerial and ground vehicle (UAV and UGV) surround-vision systems for con-tinuous monitoring of objects and threats anywhere in the world.
The AMD G-T56N APU met the power requirements of the system and could deliver the high performance nec-essary to meet the image registration goals. Since the processor had to employ further image filtering to enhance results, CASS needed to ensure there was enough performance overhead to run additional algorithms while maintaining real-time operation. CASS selected OpenCL to implement the accelerated algorithm building blocks. In the prototype the APU served as a digital signal and image processor, and was connected to a sensor. The CASS engineers tested the APU to see if they could achieve the real-time perfor-mance the sensors required. “There was no option for delays: the signal had to be processed at the time it was being received with minimum latency,” said Butrashvily.
The entire algorithm was imple-mented in OpenCL, with the APU serv-ing as the host manager/coordinator and frame grabber. With the goal to achieve faster-than-real-time process-ing, CASS leveraged parallel processing for the intensive dense matrix opera-tions, including GEMM (matrix multi-plication), GEMV (matrix-vector mul-
What Is Image Registration?Image registration is the process of transforming a set of sequential images (video stream
acquired from a sensor) into a similar coordinate system, creating a smoother visual flow. In real life, physical conditions or normal movement affect the images a sensor gathers and may cause vibrations. Viewing a continuous frame-set from an image sensor generally looks shaky or unbalanced, as the sensor is often mobile or not stabilized. Image registration fixes this problem by smoothing the output video stream. Applications for image registration vary from defense to medical imaging and more.
Typical registration process stages include: identifying movement vectors between two rela-tive images, performing alignment, and applying further correction/enhancement filters to improve image and stream quality. In defense, sensor-based components use registration from ground to aerial systems with different applications. Adding to its complexity, defense applications require very high-performance computations (high resolutions and frame rates) and have limited space for hardware, dictating a small system size. This requires a solution with good heat dissipation and ability to consistently operate at low power.
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August 2012 | COTS Journal 51
TECH RECON
tiplication) and GESV (matrix Inverse), achieving up to 130 times the perfor-mance of running those basic building blocks with the AMD BLAS (basic lin-ear algebra subprograms) libraries on the processor alone. To verify the nu-meric stability, which is especially im-portant in long-running, mission-criti-cal operations, the arithmetic results of the APU were compared to the x86 CPU following the IEEE 754 standard. CASS found high correspondence and accu-racy, assuring that the system achieves great numerical stability.
Completing the PrototypeWithin two months CASS completed
the prototype development, including software optimization. The solution was developed to support Linux, Windows and their embedded variants. The algo-rithmic processing engine was also in-tegrated with OpenGL, delivering a live display of the processed results. Figure 2 shows an AMD G-T56N APU develop-ment module used by CASS. The perfor-mance achieved was impressive, showing nearly 150 frames per second (FPS) peak at HD resolution of 1280x720 with 16-bits per pixel, measured from input to output of corrected images.
With the AMD Embedded G-Series APU, CASS was able to achieve real-time performance and processing of 120 frames per second sustained with HD sensor in-put resolution of 720p (1280x720). The re-sulting performance is 20 to 30 times the performance of performing the entire al-gorithm on a traditional CPU. The overall
algorithm processing flow was complex, incorporating additional filters for image enhancement, therefore runtime speedup was summarized by 20 to 30 times.
For its next steps, CASS is working on support for hard real-time operating systems, hardware commercialization and board design to match sensor di-mensional constraints, and support for next-generation APUs for even higher performance and resolutions. Moreover, because the job was not proprietary to
the defense company, CASS is research-ing additional applications of its new APU-based image registration technol-ogy. Being an important core component in many image-processing systems, reg-istration has relevance for other applica-tions in defense and other markets.
AMDSunnyvale, CA.(408) 749-4000.[www.amd.com].
Figure 2
An AMD G-T56N APU development module used by the CASS engineers.
www.vita.com
XMCTM
TMTechnology For:CommunicationIndustrialInstrumentationMedicalMilitaryScientificTransportation
Untitled-9 1 4/9/12 10:05:38 AM
COTS Journal | August 201252
Counter-IED operations are like every other intelligence-driven operation in that supporting ana-
lysts must exploit both structured and unstructured data. When the data struc-ture is simple and data velocity and vol-ume are relatively low, the human mind easily exploits either variety. The analyst need not impose conditions, prerequi-sites, or standards on the structure of incoming data. Rarely is the analyst even in a position to make such demands. The problem arises when the complexity of the data structure increases beyond the analyst’s cognitive complexity level, or the data velocity and/or volume (in even a simple structure) surpasses the capacity of the analyst’s cognitive load.
Current Counter-IED operations in-creasingly violate these conditions: While smart bomb makers survive by embracing simplicity, uniformity and routine, they do increase IED complexity in response to our countermeasures. Bomb emplacers likewise do increase tactics, techniques and procedures (TTPs) complexity. IED components and IED event TTPs both serve as a “thumbprint” to identify bomb makers and their networks. The data col-lected to delineate these thumbprints is becoming increasingly complex, though not beyond the cognitive complexity level of most intelligence analysts. But the ve-
locity and volume of IED data, regardless of its complexity level, is increasing rap-idly and probably beyond the cognitive load threshold of most intelligence ana-lysts. As the worldwide dissemination of bomb-making information continues, this growth of IED data velocity and vol-ume shows no sign of abating.
As a result, data velocity and volume now burden Counter-IED analysts be-yond their intrinsic cognitive capacities. What can be done about this? Expensive labor-intensive human data exploitation makes increasing the number of ana-lysts an unattractive option. Information technology must therefore be leveraged to
collect, store, search, analyze and visual-ize IED information and disseminate ac-tionable Counter-IED intelligence.
A Question of StructureEmerging technologies may even-
tually enable machines to fully exploit unstructured data, but in the interim we must make the hard choice of either im-posing structure on our data, investing in expensive human exploitation of un-structured data, or limiting our exploita-tion of unstructured data to the meager capabilities of existing technologies. If the answer to our present dilemma is to maximize the structure of our rapidly
Dr. Michael Stumborg, Counter-IED and Weapons Technical Intelligence Mission EngineerIntelligent Software Solutions
Performing Counter-IED operations gets ever more difficult as volumes increase. Collecting and exploiting the mass of data gleaned from IED attacks poses challenging software, data structure and test problems.
Hurdles for Structuring Counter-IED Data Are Many
SYSTEM DEVELOPMENTMilitary Instrumentation and Test
Collecting Structured IED Data on the Battlefield
1. Define and agree to a data structure.2. Build the software to capture the data.3. Certify the software for DoD Information Assurance Compliance and Accreditation.4. Certify the software for potential use in targeting operations.5. Test the software in a realistic operational environment.6. Train collectors to adhere to the structure.7. Acquire and deploy the software.8. Enforce data collection standards.9. Repeat steps 1-8 when the adversary changes technology or TTPs.
Figure 1
The process for developing, fielding and using software to collect structured IED data in a military environment has nine basic steps.
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COTS Journal | August 201254
growing IED data set, what are the im-pediments to be encountered?
In theory, imposing structure on IED data collectors results in the struc-tured data sets that solve the problem. In practice, real impediments do exist. These impediments are cultural and pro-grammatic. They are rarely if ever tech-nical, so blindly replacing one hardware or software solution with another will not solve the problem. We must confront these non-technical impediments, and they may still be insurmountable, leaving us with an undesirably large fraction of unstructured data.
The significant cultural and program-matic impediments (and the compara-tively trivial technical impediments) can be understood by considering the process used to field Material solutions for captur-ing structured data. The process below focuses only on the collection of (struc-
tured) IED data. The subsequent processes of data storage, discovery, visualization, analysis, visualization and intelligence dissemination are important, but not ger-mane to the issue at hand: Can structure be imposed on IED data collectors?
A Step by Step ProcessOur process examination focuses
on software. Collection devices, fixed or mobile, paper or electronic, manual or automated, faithfully collect structured or unstructured data as designed. The cultural impediments of concern here ap-ply to the person using the device, not the device itself. The ability of a device to col-lect structured data is irrelevant if the user cannot (or will not) enter data using the required structure. This process for devel-oping, fielding and using software to col-lect structured IED data in a military en-vironment has nine basic steps (Figure 1).
It’s reasonable to expect cultural im-pediments to follow close behind cultural clashes, and that is the primary source of the impediments to collecting structured IED data resulting from step 1. The cross-organizational Counter-IED team is by definition cross-cultural. The structure of the data and the definitions of the terms within must be agreed to by Soldiers, Sail-ors, Airmen, Marines, dozens of countries, law enforcement agents, chemists, electri-cal engineers, strategic, operational and tactical intelligence analysts, EOD techni-cians, combat arms, software developers, newcomers and old hands, veterans of Iraq and Afghanistan, and even lawyers.
All are involved in the collection and analysis of IED data so all demand a say in defining the data structure. Their interests are largely synchronized, but not always. All must agree and most will compromise, but the forces of cultural inertia are pow-
Figure 2
Soldiers operate a Humvee simulator during a recent training exercise inside the Mobile Counter IED Trainer.
SYSTEM DEVELOPMENT
August 2012 | COTS Journal 55
SYSTEM DEVELOPMENT
erful. Once terms and definitions come into common use they are hard to dislodge even if they confuse and complicate down-stream data processing and analysis. (See sidebar “Wrestling with Definitions” in the web version of this article.)
Developing SchemasSoftware developers can easily code
defined data structures into collection devices or the databases they feed. Tech-nology is not the limiting factor in the collection of structured IED data. One key impediment is the inability of the multidisciplinary Counter-IED commu-nity to provide an agreed-upon structure.
The fact that only step 2 requires a technical solution supports the asser-tion that impediments to structured data are rarely technical. For the collec-tion of structured IED data, this consists mainly of developing schemas that map data from collection devices or reports into the proper location in a database. In a defined hierarchical structure this is a routine task. When data structures are modified, skilled programmers can mod-ify schemas virtually overnight. Given the years it can take to complete the other process steps, the technical “impedi-ment” of schema modification fades into triviality by comparison.
Programmatic impediments arise largely from acquisition policies. They are synonymous here with time impedi-ments, and impede Counter-IED op-erations primarily because they preclude rapid countermeasure deployment. We do relax cumbersome acquisition policies and expedite Material solution deploy-ment during wartime with the creation of mission-specific rapid acquisition cells, or in the case of Counter-IED, with an organization like JIEDDO. Nevertheless, bureaucracy inevitably creeps back into the process, even in a shooting war. As we depart Afghanistan and shift to the expected state of worldwide low-intensity conflict where Americans are not the majority target, we can expect these pro-grammatic impediments to expand and persist. Defense acquisition policies re-quire the lengthy certification processes of steps 3 and 4, so these impediments are programmatic, not technical. The time
required to modify code to correct iden-tified deficiencies is an insignificant frac-tion of the total time (Figure 2).
Counter-IED data collectors use software-enabled wireless devices in their civilian lives and expect the same capa-bilities on the job. Unfortunately, when these capabilities are not forthcoming us-ers often consider this a deficiency of the military technology, unaware that civilian wireless devices are not subject to strict DoD Information Assurance require-ments. Figure 3 shows the cycle of the DoD Information Assurance Certification and Accreditation Process (DIACAP). The im-pressive speed-to-theater and the capabili-ties of systems during testing become less impressive when those systems undergo the scrutiny of the Information Assurance Certification required to move from test-ing to full operational deployment.
While Counter-IED data collection software is not currently integrated with kinetic targeting systems, the certifica-tion in step 4 bears mentioning because one outcome of the intelligence cycle is to put ordnance on target. Other systems that tightly couple collection and engage-ment systems do require this step to avoid friendly fire and collateral damage. If one day we succeed in collecting Counter-IED data and rapidly disseminating targeting packages, the pressure to couple data col-lection systems to ordnance delivery sys-tems will be irresistible.
Problems to AvoidThe testing in step 5 creates another
time impediment, but the real danger lies in erroneous conclusions resulting from faulty test design. Skilled technology de-velopers are not necessarily skilled testers. Uninitiated developers can erroneously equate a combat environment with a real-istic operational environment. This is not always a valid assumption. For example, a system designed to collect structured IED data may show great promise after be-ing used under fire by a small number of highly trained collectors in close contact with the technology (and test) designers. But the operational environment of sys-tems deployed across a large and diverse force is quite different. In reality, IED data comes from operational reporting
conducted by large numbers of special-ized and general-purpose forces with a continuum of pre-deployment training ranging from poor to excellent.
Test Phase ChallengesIn the test environment, technology
evaluators can select and then interact with data collectors. The operational re-ality is that technology providers cannot control how “unsupervised” data collec-tors will use their products and cannot be present in perpetuity to “correct” unan-ticipated uses. Test results do not scale. In the case of software, licensing fees may not scale either. Licenses affordable to small numbers of testers during a short period may become cost-prohibitive when deployed force-wide for the dura-tion of a conflict. Experience shows that busy general-purpose forces have a low tolerance for new devices requiring spe-cialized training. They revert to what they already know how to use. In this case, the free text entry of unstructured IED data.
One might suppose that training col-lectors to adhere to the structure (step 6) solves the problem. This could be true, but regrettably is also impractical. Getting data structures defined, approved and in-serted into doctrine and training takes so long that they are likely to need changing due to adversary adaptations long before the training is in place. Additionally, when will this training occur? Basic, home-station and pre-deployment training schedules are tight. Adding new training requires sacrificing existing training. This is a difficult proposition under normal cir-cumstances. For training that may be ob-solete upon completion it is a non-starter.
An alternative to formal training is informal education. Rapidly produced pocket identification guides, field guides and training circulars make Service members quickly aware of emerging is-sues. Too often, we promulgate and ap-ply informal education inconsistently to reach affected Service members as quickly as possible. This is not condu-cive to maximizing the consistency and structure of IED data. Formal training on the other hand, has the twin advan-tages of breadth across the affected force and consistency—two attributes that do
COTS Journal | August 201256
SYSTEM DEVELOPMENT
maximize the consistency and structure of IED data. It carries the authority of doctrine. Following it is not optional.
Enforcement IssuesStep 7 is another acquisition system
time impediment, not a cultural or tech-nical impediment. Step 8 is a cultural impediment. The only way to enforce data collection standards via technology would be to limit data collection devices to those that are technically incapable of accepting unstructured data. This would have the unfortunate side effect of leaving data not conducive to structure uncol-lected and thus, unexploited. (See sidebar “Enterprise-Level Hurdles” in the web version of this article.)
Decentralized acquisition led to a proliferation of IED data collection meth-ods and devices. Some have come and gone, others endure. Some methods and devices require adherence to data struc-
tures. Others do not. Experience shows that collectors prefer tools that allow the flexibility of free text entry, so databases must ingest both structured and unstruc-tured data. Unstructured data may not be in the optimal format for exploita-tion, but it does have value. We must ac-cept and exploit it using the best available technology. Currently, this means ingest-ing and indexing it to make it search-able. This data is not readily exportable to a spreadsheet like data ingested from a structured report or a device with a drop down menu would be, but it is dis-coverable. Unfortunately, the collector’s strong and demonstrated preference for unstructured collection makes this dis-covery process labor intensive and slow.
For the reasons above, structured IED data standards have proven to be un-enforceable, and the technology available to index and search the resultant unstruc-tured data cannot cure the ills that would
vanish overnight if only our data were 100% structured. Powerful incentives impede collecting structured data. These impediments are institutional, not tech-nical. Acquisition policies, human nature and the operational environment create them. To lessen their negative impact on Counter-IED operations requires holistic action across the spectrum of doctrine, organization, training, material, leader-ship, personnel, facilities and policy. This needs to be understood and addressed when choosing the Material portion of the solution. If the non-Material dimen-sions of the problem are not considered, then new technologies may be procured at great expense and suffer the same fate as their predecessors.
Intelligent Software SolutionsColorado Springs, CO.(719) 457-0690.[www.issinc.com].
5 Decommission
Retire System
Maintain SituationalAwarness
Maintain IA Posture
Conduct Reviews (Review of IAControls must occur at least annually)
Initiate Re-accreditation
Execute DIACAP Implementation Plan
Conduct Validation Activities
Prepare POA&M
Compile Validation Results inDIACAP Scorecard
Register System with DoDComponent IA Program
Assign IA Controls
Assemble DIACAP Team
Initiate DIACAP Implementation Plan
4 Maintain Authorization toOperate and Conduct Reviews
3 Make Certification Determination& Accreditation Decision
2 Implement and ValidateAssigned IA Controls
1 Initiate and PlanIA C&A
DecommissionSystem
DoD Information Systems
· AIS Applications· Enclaves· Platform
IT Interconnections· Outsourced
IT-Based Processes
Make Certification Determination
Issue Accreditation DecisionFigure 3
Shown here is the cycle of the DoD Information Assurance Certification and Accreditation Process (DIACAP).
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COTS Journal | August 201258
In the past 12 months, COM Express has emerged as one of the common formats among new small form factor product
rollouts. The Computer-on-Module (COM) concept has found a solid and growing foot-hold in military embedded systems. COM Express adds high-speed fabric intercon-nects to the mix. COM boards provide a complete computing core that can be up-graded when needed, leaving the applica-tion-specific I/O on the baseboard. A single COM Express module can provide the same processing and graphics performance as al-ternative solutions, like a multiple PC/104 board stack. The future of COM Express looks solid, but its acceptance in military applications is so recent that it’s too soon to predict how strong a stake it will hold. How-ever it is being actively considered and is used in numerous programs already. For ex-ample, COM Express was leveraged by Syn-exxus for its Electronic Keel (EKeel) system. EKeel is a highly ruggedized data distribu-tion system used in Mine Resistant Ambush Protected (MRAP) vehicles (Figure 1).
Military system developers have three COM Express module sizes to choose from to suit their individual application require-ments. All signals are maintained on the car-rier card, where additional connectors can be
added as required per specific applications. As a macro-component, COM Express en-ables technology insertions without a large time or monetary investment, and supports easy upgrades through multiple product life-times. When COM Express was created, the spec planned for the expansion of video and display capabilities, and it provides standard connector access for a variety of high-speed interfaces. The COM Express connector supports multiple video interfaces including DisplayPort, VGA, SDVO, HDMI and DVI. This allows designers to take advantage of the latest graphics capabilities without hav-ing to worry about affecting performance.
COM Express also is designed to cope with transitions from legacy con-nectors and offers native interface sup-port for modern-day I/O interfaces. On top of offering more PCI Express and USB ports than PC/104-Express modules, additional connecters can be added for LAN, SATA, video, audio, USB and PCI Express, delivering maximum I/O flexi-bility to meet specific application require-
ments. And since signals do not have to pass through multiple connectors, the signal integrity remains intact.
In June PICMG announced the adop-tion and availability of the 2.1 revision of the COM Express specification. Accord-ing to PICMG, the COM Express Revi-sion 2.1 specification allows developers to focus on their specialized I/O require-ments, without concern for the complex interactions of CPUs, RAM, chipsets and other basic elements that occur on the module. This revision adds new features and module sizes, and helps ensure that COM Express modules are prepared for future processors and high-speed I/O evolution while accommodating back-ward compatibility with older modules. Significant enhancements of the COM Express Revision 2.1 specification include standardization of new and smaller mod-ule sizes, extended power supply range and support of the latest graphics inter-faces. USB 3.0 and CAN Bus support are also included.
Jeff ChildEditor-in-Chief
By solving the ongoing challenge of marrying quick changing computing core advances with legacy systems, COM Express is making a rapid conquest of military mindshare.
COM Express Continues its Quick Ascent toward Military Acceptance
COM Express Boards
TECHNOLOGY FOCUS
Figure 1
Electronic Keel (EKeel) is a highly ruggedized data distribution system used in Mine Resistant Ambush Protected (MRAP) vehicles.
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1553, ETHERNET AND MORE
An RTC Group Publication
MILITARY INTERCONNECT STRATEGIES COVER
1553 ETHERNET AND MOREMILITARY INTERCONNECT STRATEGIES COVER
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COTS Journal | August 201260
TECHNOLOGY FOCUS:
COM Express Module with the Latest Atom Processor-Based Platform
A Type VI compact size COM Express Basic module measures 95 mm x 95 mm (3.74” x 3.74”). The compact PCOM-B218VG from American Portwell includes the Intel Atom processor N2000 and D2000 series and the Intel NM10 Express chipset. This platform includes an integrated Intel Graphics Media Accelerator (GMA) 3600/3650 engine to enhance 3D performance for media applications such
as high-definition 1080p imaging. Also on board are two Display Ports that support multiple DP/HDMI/DVI functions; one SO-DIMM socket to support DDR3 SDRAM up to 4 Gbyte; two SATA; one Fast Ethernet. Expansion is available—via the COM Express carrier board—on four PCI-E x1, which can be configured to one PCI Express x4, LPC interface and high-definition audio interface; and a PCOM-C211 developer COM Express Type VI carrier board.
COM Express safeguards development investments and lowers total cost of ownership by enabling designers to partition commodity host-processor COM Express modules from proprietary, value-added platform building blocks, including FPGAs and specialty I/Os on custom baseboards. COM Express modules can help minimize current and future design risks because they help save development time and costs during initial phase of development, while achieving faster time-to-market, simplifying the future upgrade path and scalability, and increasing the application lifecycle.
American Portwell
Fremont, CA
(510) 403-3399.
[www.portwell.com].
COM Express Compact Module Boasts Low Power Performance
A low-power COM Express compact module is powered by the Intel Atom processors 400 and 500 Series. The new SOM 6763 B1 from Advantech B1 with Intel Atom processor N455 (512K Cache, 1.66 GHz) and Intel Atom processor D525 (1M Cache, 1.80 GHz) migrates its memory from DDR2 to DDR3 along with both 18-bit and 24-bit LVDS. The SOM-6763 B1 is suitable for portable devices, medical equipment and rugged applications.
The SOM-6763 B1 complies with COM R2.0 type 2 specification for customers targeting
lower power consumption, higher performance applications. The compact design (95 x 95 mm) is suitable for applications such as portable POS, transportation, entry-level gaming machines, patient monitoring and factory automation. SOM-6763 B1 allows customers to choose from 18-bit or 24-bit LVDS, which makes available a greater variety of displays to choose from. Advantech iManager provides a valuable suite of programmable APIs such as Multi-level Watchdog, Hardware Monitor, Smart Fan and more; all with user friendly interfaces following the EAPI 1.0 standard. Since this is a built-in solution on chip, iManager ensures functions operate even if the OS fails.
Advantech
Irvine, CA.
(949) 789-7178.
[www.advantech.com].
Rugged COM Express Card Boasts 3rd Gen Intel Core Processor
ADLINK Technology has released its latest Extreme Rugged COM Express module, the Express-IBR, for airborne and vehicle-mounted military computers and human machine interfaces (HMI) applications required to function in harsh environments. The module supports the quad-core and dual-core 3rd generation Intel Core i7 processors and Mobile Intel QM77 Express chipset. The Express-IBR is ideal for use in environments prone to severe shock, vibration, humidity and extended temperature ranges.
The Ampro by ADLINK Express-IBR is powered by a quad- or dual-core 3rd generation Intel Core processor and provides support for USB SuperSpeed 3.0, PCI Express (PCIe) Gen 3, and up to three independent displays. The COM Express module offers up to 16 Gbyte ECC 1333 MHz DDR3 memory in two SODIMM sockets; three Digital Display Interfaces can be independently configured for DisplayPort, HDMI or DVI; PCIe x16 (Gen3) for external graphics or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4); as well as two SATA 6 Gbit/s, two SATA 3 Gbit/s, Gigabit Ethernet and eight USB 2.0 interfaces. The Express-IBR with dual-core processor is validated for reliable performance in extended temperatures ranging from 40° to +85°C and features a 50% thicker printed circuit board (PCB) for high vibration tolerance. The card is compatible with the COM Express COM.0 Revision 2.0 Type 6 pinout, which is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display Interfaces (DDI), additional PCI Express lanes and reserved pins for future technologies.
ADLINK
San Jose, CA.
(408) 360-0200.
[www.adlinktech.com].
COM Express Boards Roundup
August 2012 | COTS Journal 61
COM EXPRESS BOARDS ROUNDUP
3rd Gen Core i7 Processor Rides Rugged COM Express Module
Extreme Engineering introduced the XPedite7450, a rugged COM Express module that complies with the PICMG COM Express Basic form factor (95 mm x 125 mm) and supports an enhanced Type 6 pinout. The XPedite7450 can be hosted on a standard COM Express carrier card or a custom carrier card built to include additional end-user requirements, or it can be integrated into an X-ES XPand6000 Small Form Factor (SFF) rugged system. Based on the 3rd generation Intel Core i7 quad-core processor, the XPedite7450 operates at up to 2.2 GHz to
deliver enhanced performance and efficiency, making it an excellent processor mezzanine for commercial, industrial and military applications.
Designed and tested for the harshest military, aerospace and industrial environments, the XPedite7450 incorporates the same design and manufacturing principles as all X-ES Level 5 rugged products. Designed and tested for operation from -40° to +85°C, it includes additional mounting holes for increased structural integrity. Targeting the quad-core Intel Core i7-3612QE processor with clock speeds up to 2.1 GHz, the XPedite7450 features up to 16 Gbytes of DDR3-1333/DRR3-1600 ECC SDRAM, an integrated high-performance 3D graphics controller, enhanced Type 6 pinout, five Gen2 PCI Express ports, four USB 2.0 high-speed ports, six SATA 3.0 Gbit/s ports and an Intel High Definition Audio port. The XPedite7450 is the perfect compute element for the rugged XPand6000 SFF system. Supporting natural conduction and convection cooling with minimal SWaP, an XPand6000-based system can be bolted to almost any available surface of a small UAV, ground vehicle, or heavy equipment.
Extreme Engineering Solutions
Middleton, WI.
(608) 833-1155.
[www.xes-inc.com].
EMX Form Factor SBC Enables Stackable COM Express
EmbeddedXpress is a new form factor specification for embedded computers introduced by Diamond Systems that defines an efficient stackable I/O expansion. The EmbeddedXpress (EMX) form factor combines COM Express CPU modules with stackable I/O expansion in an SBC format. EMX boards offer increased flexibility and scalability, and a rugged EMX Basic SBC is based on the Intel Atom E680T CPU running at 1.6 GHz and features dual Gigabit Ethernet ports, four
serial ports and four USB 2.0 ports. The Altair from Diamond Systems is also the first SBC to implement the new EmbeddedXpress stackable I/O standard.
The EMX specification enables flexibility, scalability and increased longevity in the final product by providing interchangeable processor modules. Altair supports 1 Gbyte or 2 Gbyte of DDR2 DRAM soldered on board and provides high-resolution LVDS and VGA graphics interfaces. Additional I/O ports include SATA, USB, serial, digital I/O and dual Gigabit Ethernet. Flexible system expansion is based on stackable EMX modules and a PCIe MiniCard socket. A socket is also provided for an optional onboard USB flash disk of up to 8 Gbyte.
Altair’s rugged features include a wide temperature operating range of -40° to +85°C, soldered-on memory plus dedicated locations on the PCB to replace configuration jumpers with 0-ohm resistors for resistance to shock and vibration. Conformal coating is also available as an added cost option. Single unit pricing starts at $795.
Diamond Systems
Mountain View, CA
(800) 367-2104.
[www.diamondsystems.com].
COM Express Type 2 Sports Atom Dual-Core Processors
An entry-level Type 2 Pin-out COM Express module is available with three variants of the new Intel Atom dual-core processor generation, which are manufactured in 32nm technology. The conga-CCA from congatec is available with the Atom N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Atom N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; or the Atom D2700 processor (1M Cache, 2.13 GHz) with 10W TDP and up to 4 Gbyte single-channel DDR3 memory (1066 MHz).
The chipset module, which is based on the Intel NM10, provides improved memory, graphics and display functionalities plus intelligent performance and greater energy efficiency.
The highlight of the COM Express module is the graphics performance of the integrated Intel GMA 3650 graphics chip. With a clock rate of 640 MHz it is twice as fast as the GPU of the previous Atom generation. In addition to VGA and LVDS, it has two digital display interfaces that can be executed for DisplayPort, HDMI or DVI.
Fan control, LPC bus for easy integration of legacy I/O interfaces and Intel High Definition Audio round off the feature set. Four PCI Express x1 lanes, two SATA 2.0, eight USB 2.0 and a Gigabit Ethernet interface enable fast and flexible system extensions. The Conga-CCA is priced starting at less than $225 in evaluation quantities.
Congatec
San Diego, CA.
(858) 457-2600.
[www.congatec.com].
COTS Journal | August 201262
COM EXPRESS BOARDS ROUNDUP
Multicore Rugged COM Board Serves Up PowerPC
COM boards are becoming a staple in a variety of military systems where slot cards are not needed. MEN Micro now offers a PowerPC-based rugged computer-on-module (COM) that offers speeds up to 1.5 GHz via multicore processing. Equipped with a Freescale QorIQ processor, the new XM51 is an extension on MEN Micro’s family of ruggedized COMs based on the space-saving ESMexpress standard, currently in preparation with ANSI/VITA as
RSE 59. The computer-on-module supports four USB 2.0 interfaces with host function and one USB client port, two Gigabit Ethernet channels, two 3 Gigabit SATA (“gen 2”) and two PCI Express x1 links with 5 Gbits/s each (PCIe 2.x), which can be made accessible on any ESMexpress carrier. The XM51 offers 16 Gbytes of soldered DDR3 SDRAM memory with ECC, which—thanks to the QorIQ technology—is controlled by one or two controllers and can be assigned to the processor cores as desired. Up to 128 Kbytes of onboard non-volatile FRAM and 256 Mbytes of flash provide more memory options, which can be expanded via USB on the carrier board.
As with all ESMexpress modules, the COM is installed in a closed, conduction-cooled housing that allows the module’s high-performance operation in temperatures from -40° to +85°C, while guaranteeing 100% EMC protection. All components are soldered against shock and vibration and prepared for coating against humidity or dust. ESMexpress is designed for extreme resistance against shock and vibration. Modules are firmly secured to the board with eight screws and come with rugged industry-proven connectors supporting high frequency and differential signals. All ESMexpress modules use a single, space-saving 95 mm x 125 mm form factor. Pricing for the XM51 is $3,370.
MEN Micro
Ambler, PA.
(215) 542-9575.
[www.menmicro.com].
COM Express Board Offers Energy Efficient Multicore Solution
A COM Express compact Computer-on-Module represents an energy efficient entry-level multicore module based on next-generation Intel Atom processors with 32 nm technology. The COMe-cCT6 from Kontron is available in three multicore performance levels up to 2x 1.86 GHz and offers an increased performance per watt ratio. The new Kontron COMe-cCT6 Computer-on-Module is equipped with 2x 1.6 GHz or 2x 1.86 GHz Intel Atom
processors (N2600, N2800 and D2550), the Intel NM10 Express chipset, and up to 4 Gbytes of fast onboard DDR3 800/1600 system memory.
The integrated Intel Graphics Media Accelerator 3600/3650 enables 1080p playback of MPEG4 Part 2, VC-1, WMV9 and H.264 videos with minimum processor load. Furthermore, the new module provides HDCP support via HDMI 1.3a and DisplayPort 1.1, enabling BluRay playback. Additionally, OEMs can connect monitors also via the common LVDS and VGA interfaces. Intel High Definition Audio complements the multimedia features. Furthermore, the Kontron COMe-cCT6 offers two SATA II 300 Mbyte/s interfaces, eight USB 2.0 ports, Gigabit Ethernet and three PCI-Express x1 lanes for custom extensions.
The platform’s enhanced power management features include Intel Deeper Sleep and Intel Rapid Start Technology, both of which further help to reduce power consumption and enable fast recovery from standby mode for intermittent usage. In combination with the Intel Smart Connect Technology, the COMe-cCT6 also enables connected usage scenarios where an instant Internet connection is available as soon as the application is (re)activated and also allows for constant updates even while in standby.
Kontron
Poway, CA.
(888) 294-4558.
[www.kontron.com].
COM Express Module Offers Choice of VIA Processors
For many military system developers, designing computing platforms into equipment for harsh environments is just part of the challenge. There’s also the added drive to reduce overall design cycles and lower validation costs. Serving those needs, GE Intelligent Platforms offers the bCOM6-L1200 Rugged Type 6 COM Express Module.
The bCOM6-L1200 offers a range of five VIA Nano and VIA Eden processor options, with performance between 800 MHz and 1.2 GHz (x2) and power consumption between 3.5W and 13.0W. Up to 8 Gbytes of DDR3 SDRAM can be configured, allowing the most demanding applications to be deployed.
The board provides a Gigabit Ethernet port supporting transmissions of 10 and 100/1000 Mbits/s. Also provided are eight USB 2.0 ports, two serial ATA Interfaces with RAID 0 and 1, or port multiplier support. The SATA interfaces are ready for SATA II drives. For superior graphic performance, the bCOM6-L1200 features integrated analog CRT and LVDS and two or three DDI ports. I/O functionality is provided through either three PCI Express x1 lanes or 1x 2+ 1x 1 lane, or a wide PCI Express x8/x4 port. The x8/x4 port can be used in applications where high-end graphic and video capabilities are required. Together with the audio port and GPIO or SD-Card interface, a wide range of multimedia implementations can be achieved.
GE Intelligent Platforms
Charlottesville, VA.
(800) 368-2738.
[www.ge-ip.com].
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August 2012 | COTS Journal 63
COM EXPRESS BOARDS ROUNDUP
Credit Card Sized COM Module Offers Compact Solution
The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices. With that in mind, VIA Technologies has an addition in the growing VIA Modular Solutions
portfolio, the VIA COMe-8X91. Measuring 84 mm x 55 mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The module combines an 800 MHz VIA Eden X2 dual core processor and the VIA VX900 media system processor (MSP).
In addition, with the VIA COMe-8X91 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs and design guide. Available in the industry standard COM Express Mini form factor of 84 mm x 55mm, the VIA COMe-8X91 module pairs an 800 MHz VIA Eden X2 dual core processor and the VIA VX900 MSP for a low-power, high-performance platform. The VIA COMe-8X91 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS and either one DisplayPort or one HDMI port (without HDCP). Onboard I/O includes two SATA II ports, one GigaLAN port, eight USB 2.0 ports shared with one USB client port, one HD audio digital interface and two serial ports. System memory includes 1 Gbyte of onboard DDR3.
VIA Technologies
Fremont, CA.
(510) 683-3300.
[www.viaembedded.com].
Type 6 COM Express Card Supports -40° to +85°C Temps
Today’s military systems are demanding higher processing and graphics capabilities to ensure optimal situational awareness on the battlefield, as well as ECC memory to ensure data integrity for mission-critical applications. These consolidated systems must meet stringent size, weight and power restrictions while providing the processing capacity to combine legacy computers that support multiple, high-
quality displays. Radisys’ extended-temperature -40° to +85°C CEQM77 module with ECC memory is specifically designed and tested to withstand extreme military conditions and meet the processing-intensive needs for these applications.
The CEQM77 combines a 3rd generation quad-core performance Intel Core i7 processor and the Mobile Intel QM77 Express chipset with Radisys design expertise to provide breakthrough processing performance on a basic size Type 6 COM Express Revision 2.0 module. The basic size 95 mm x 125 mm module is ideal for compute-intensive applications such as medical imaging, communications, military/aerospace, and test and measurement applications that require high levels of processing performance. Radisys delivers the CEQM77 module in a COM Express Revision 2.0, Type 6 pin-out, enabling customers to take advantage of new technology such as Digital Display Ports while boosting features and performance with up to 16 Gbyte memory, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM77 module provides Trusted Platform Module (TPM) support as well as support for Intel Advanced Management Technology (AMT), enabling remote access and diagnostics via the Radisys Embedded Software Platform (ESP).
RadiSys
Hillsboro, OR.
(503) 615-1100.
[www.radisys.com].
Quad-Core 3rd Generation Core Processors Ride COM Express
Two families of COM Express modules are based on the third generation Intel Core processor family formerly codenamed Ivy Bridge, which utilizes Intel’s advanced 22nm process technology with three-dimensional transistors for higher performance at lower power. The two new COM Express module
families from MSC Embedded support Type 2 (MSC CXB-6SI) and Type 6 (MSC C6B-7S) pin-outs. The first products of these module families are equipped with the quad-core Intel Core i7-3615QE processor with 45W thermal dissipation power and the Intel Core i7-3612QE processor with 35W TDP.
The Intel HD 4000 Graphics controller on the processor die offers significantly better video and graphics acceleration than the second generation Intel Core processors. One major advantage is the support of three independent displays. The MSC CXB-6SI module family uses the improved Intel 7-series chipset. Fast dual-channel DDR3 SDRAM modules (two SO-DIMM sockets)—each offer a maximum storage capacity of 8 Gbytes. The module family offers six PCI Express x1 channels, a PCI Express Graphics (PEG) x16 interface, the classical 32-bit PCI bus, eight USB 2.0 ports, HD audio, Gbit Ethernet, DisplayPort and HDMI interfaces with a resolution of up to 2560 x 1600 pixels. The pricing for the high-end quad-core Intel Core i7-3615QE will be approximately $680 in volume quantities.
MSC Embedded Computer Technology
San Bruno, CA.
(650) 616-4068.
[www.mscembedded.com].
COTS Journal | August 201264
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Chassis Mount Switching AC/DC Power Supply Delivers 50 Watts ConTech, a Division of Calex Mfg., has announced the CM50 Series of AC/DC switching power
supplies. The CM50 Series offers 50W of fully regulated output power in a chassis mount case. It features an easily accessible terminal block and output voltage adjustment potentiometer. The CM50 series has a universal input voltage range of 88 to 264 VAC. The series offers output voltages of 5, 12, 24 and 48 VDC, with efficiencies up to 84%. The CM50 series has protective features such as short circuit, over-voltage and overload protection. The metal cage type chassis mount case is designed for free air convection cooling. The CM50 series is rated for 3000 VAC isolation, is RoHS compliant, and has UL 60950 approval pending.
ConTech, Concord, CA. (925) 609-1193. [www.contech-us.com].
150W ATX Power Supply Features Compact Size Size, weight and power are important factors in today’s military
systems. And size matters even in power supplies themselves. ADL Embedded Solutions has announced the release of its small form factor ADLPS35-150, 150W ATX Power Supply. The ADLPS35-150 power supply board is designed to meet the needs of industrial and embedded motherboards by providing robust ATX voltages (5V, 5VS, 3.3V, 12V) in a small form factor power supply designed for -40° to +85°C operation. Its small 2” x 4” size (50 mm x 102 mm) allows it to fit many space-limited applications. As well, the ADLPS35-150 is tailored to sit side-by-side with their 3.5-inch product line of motherboards and can also be adapted to a PC/104 stack via an optional mounting plate.
The power supply features ATX-compliant signaling to allow ACPI/APM power management from within compliant operating systems. At 150 watts total power and just 50 mm x 102 mm in size, this small and rugged power supply will fit into most embedded applications. The ADLPS35-150 is available in two variants, one allowing an input voltage range of 7-30V but providing only the 5V, 5VS and 3.3V outputs; the other with a narrower input voltage range of 14-30V but providing 5V, 5VS, 3.3V and 12V outputs. Both variants include over-current, over-voltage and short circuit protection.
ADL Embedded Solutions, San Diego, CA. (858) 490-0597.
[www.adl-usa.com].
PrPMC/XMC Module Supports Freescale QorIQ Processors
Extreme Engineering Solutions has announced availability of the XPedite5401, a conduction-cooled PrPMC/XMC module that supports the Freescale QorIQ P3, P4 and P5 processor families. The XPedite5401 joins the existing XPedite550x line of PrPMC/XMC modules, which support the Freescale QorIQ P1 and P2 processor families. The complete line of QorIQ PrPMC/XMC modules provides processor mezzanine solutions that span a broad spectrum of embedded applications
and satisfy a wide range of power, performance and feature
requirements.The XPedite5401 supports
multiple Freescale QorIQ processors. The lowest power
solution utilizes the P3041 with four PowerPC e500mc cores at up to 1.5 GHz.
Other processor options include the P4080 with eight PowerPC e500mc cores at up to 1.5
GHz, the P5010 with one 64-bit PowerPC e5500 core at up to 2 GHz, and the P5020 with two 64-bit PowerPC
e5500 cores at up to 2 GHz. The module also provides two channels of DDR3-1333 ECC SDRAM, up to 8 Gbytes (4 Gbytes each), up to 16 Gbytes of user flash and 256 Mbytes of boot flash (with redundancy), two Gigabit Ethernet ports, a x4 PCI Express interface to P15 and two SATA 3.0 Gbit/s ports to P16.
Extreme Engineering Solutions, Middleton, WI. (608) 833-1155.
[www.xes-inc.com].
Oscilloscopes Offer 2 Mpts, 2 GS/s and 7-inch Widescreen DisplaysLeCroy has announced two lines of its popular WaveAce oscilloscope series—the WaveAce
1000 and WaveAce 2000. WaveAce 1000 oscilloscopes feature a sample rate of up to 1 Gsamples/s with 2 Mpts of memory in two-channel models from 40 MHz to 100 MHz. WaveAce 2000 oscilloscopes deliver sample rates of up to 2 Gsamples/s and 24 Kpts of
memory, and are available in two- and four-channel models from 70 MHz up to 300 MHz. All new WaveAce oscilloscopes feature a large 7” widescreen display and powerful debug tools,
such as 32 automatic measurements, waveform math capabilities, pass/fail mask testing, large internal storage, remote control and waveform recorder.
Integration with LeCroy’s logic analyzer and waveform generators provides expanded debug and testing capabilities. This powerful combination of features makes WaveAce the best oscilloscope for simplifying the debug process. The WaveAce 1000 is available in three
different models with U.S. list prices ranging from $790 to $1,190. The WaveAce 2000 is available in eight different models with U.S. list prices ranging from $1,150 to $2,975.
LeCroy, Chestnut Ridge, NY. (800) 553-2769. [www.lecroy.com].
August 2012 | COTS Journal 65
COTS PRODUCTS
19-Inch Rugged LCDs are Sunlight Readable
TRU-Vu Monitors has introduced a new 19” Sunlight Readable LCD monitor. The new SRM-19 Series monitors feature 1,000 nits brightness, enabling users to clearly see video images even in direct, bright sunlight. By comparison, laptop screens average 150-200 nits, and standard desktop monitors average 200-250 nits. The SRM-19 Series monitors are built with industrial-grade components to withstand demanding industrial and commercial environments. The SRM-19 Series monitors feature 1280 x 1024 SXGA resolution, VGA and BNC Composite video inputs, 1,000:1 contrast ratio, and operate on 12 VDC and 90-240 VAC. They are also available in touch screen and open-frame configurations.
TRU-Vu Monitors, Arlington Heights, IL.
(847) 259-2344. [www.tru-vumonitors.com].
1U Rackmount System Boosts LAN Throughput 80 PercentA 1U rackmount network security appliance supports Intel’s second generation Core i7/i5/
i3 processor with Intel H61 PCH and DMI 5 GT/s chipset, and is scalable to Intel’s latest third generation Core i7/i5/i3 processor family. The new CAR-3030 network security appliance also features dual-channel 1066/1333 MHz DDR3 memory modules up to 16 Gbytes, PCI-E x8 expansion (with up to two Generation 2.0 bypass segments), LGA-1155 socket, up to 10 Gigabit Ethernet ports, optional dual 10G SFP+LAN module, 80 Plus power supply and six onboard Ethernet ports with two bypass segments. American Portwell’s new CAR-3030 network security appliance is capable of increasing LAN throughput by an average of 80 percent when compared with previous generation platforms.
American Portwell, Fremont, CA. (877) APT-8899. [www.portwell.com].
PCI Express Synchronizes up to 256 ChannelsSynchronization is important in multichannel applications such as phased array radar, diversity
receivers, and direction finding and beamforming antennas. Serving such needs, Pentek has introduced a system synchronization and distribution amplifier, the Model 7893 PCIe board. This synchronizer is designed to support up to eight Pentek Virtex-6 Cobalt and Pentek Virtex-7 Onyx boards at sample clock rates up to 800 MHz. In the cascade mode, up to eight 7893 boards can be linked to allow 64 Onyx or Cobalt boards to receive a common clock along with timing signals for synchronizing, triggering and gating functions.
The Model 7893 is a single-slot PCIe board that uses the slot solely for physical mounting with no electrical connections; power is supplied through a standard six-pin PCIe power connector.
The 7893 accepts a user supplied external clock from a front-panel subminiature version A (SMA) connector, from the input low-voltage positive emitter-coupled logic timing bus, or from the onboard programmable voltage controlled crystal oscillator (VCXO). The VCXO can operate alone or can be phase-locked to a system reference clock signal. Each 7893 has four programmable clock outputs available via SMA connectors on the front panel for distribution of sample clocks to other boards.
Operational parameters for the 7893 are programmed through the universal serial bus (USB) port, including VCXO frequency, clock dividers and delays, so the user can make timing adjustments on the gate and synchronize signals before they are sent to buffers for output through eight timing bus connectors. The USB port can also be used to generate gate/trigger and sync/pulse per second signals for distribution to all connected boards. The Model 7893 Eight-Channel System Synchronization and Distribution Amplifier starts at $4,995 for the PCIe board.
Pentek, Upper Saddle River, NJ. (201) 818-5900. [www.pentek.com].
Extender Module Provides High Speed RS-232 over CAT-5
Aaxeon Technologies has released their newest Industrial Extender. The SED-1010S is a high-speed RS-232 over CAT-5
extender that transfers data to devices at distances up to 1.2 KM, therefore significantly extending the typical RS-232 range
of only 15m. The extender also boasts the use of CAT-5 cabling, a common cabling used in many applications, making it easier to implement and deploy with an already fixed infrastructure. The unit features an extended operating temperature of -30° to 75°C guaranteeing the device will work in numerous operating environments. It has built-in surge protection and can be used without a power adapter. An optional power supply is available for those applications that need more power than the host can provide.
Aaxeon Technologies, Brea, CA. (714) 671-9000. [www.aaxeon.com].
COTS Journal | August 201266
COTS PRODUCTS
Single Channel DataAcq System Features Analytical SoftwareiWorx Systems has introduced the IX-100BE Data Acquisition System with
LabScribe2 Software that provides high resolution/low noise recording of biopotential signals for OEM applications. With one isolated input channel and a low voltage stimulator, the system is ideal for embedded biomedical and life science applications where only one biopotential recording channel is required. The iWorx IX-100BE uses a 16-bit A/D converter to sample data over its full input range of +1V at speeds up to 200 kHz. The iWorx IX-100BE recorder is controlled by LabScribe2 software, a powerful recording and analysis software package. LabScribe2 has an intuitive, user-friendly interface for setting up acquisition screens, calibrating signals and analyzing data.
iWorx Systems, Dover, NH. (800) 234-1757. [www.iworx.com].
ATCA Blade Sports Dual Intel Xeon ProcessorsAn ATCA processor blade features robust computing power, high
throughput connectivity and accelerated packet processing capabilities. The aTCA-6250 from Adlink Technology incorporates dual 8-core Intel Xeon processors E5-2658 and E2648L (2.1 GHz/1.8 GHz) with the Intel C604 chipset, eight channels of DDR3 memory up to 128 Gbytes, and a 400W power supply subsystem. The aTCA-6250 also provides versatile connectivity, including dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE interfaces, dual front panel USB and COM ports, and onboard SATA DOM socket. Dual 10GbE ports and dual hot-swappable SAS bays on the optional aTCA R6270 Rear Transition Module (RTM) provide additional network throughput and storage capabilities.
High-speed data transfer on the PICMG 3.1 Fabric Interface is enabled by a PCI Express 2.0-capable Intel 82599EB 10GbE controller and Base Interface connectivity is provided by PCI Express 2.0-capable Intel 82576EB GbE controllers. Paired with the optional aTCA-R6270 RTM, the aTCA-6250 supports additional dual 10GbE SFP+ ports enabled by an Intel 82599ES 10GbE controller. The aTCA-6250 supports the Intel Data Plane Development Kit (Intel DPDK), a lightweight run-time environment for Intel architecture processors offering low overhead and run-to-completion mode to maximize packet processing performance.
ADLINK Technology, San Jose, CA. (408) 360-0200.
[www.adlinktech.com].
Small Rugged Embedded Computer Boasts Wide Temp Range
The new CEC4 expands the MPL Compact Embedded Computer product range with a headless industrial solution with ARM CPU. The CEC4 comes with three Gbit Ethernet interfaces. The specially designed housing allows the board to operate in harsh environments without the
need of fans or ventilation holes, and can easily be mounted on a 35mm DIN-Rail or
with a flange on a wall. The compact housing offers sufficient space to add a SSD or SATA DOM, a 5-port switch (MAGBES) with copper only or mixed with fiber, or other peripherals. The CEC4 can be tailor-made to your needs, even with IP67 housing and MIL connectors.
The operation temperature range is from -20° to +60°C and optionally even -40° to +85°C,
certainly without fan or case openings. The internal miniPCIe
slot allows various extensions—such as WLAN and GPRS. Additionally available are three USB connectors and a microSD Memory Card Slot for easy logging and/or configuration capabilities. The CEC4 can be customized over an optional backplane for additional interfaces.
MPL, Dättwil Switzerland. +41 56 483 34 34. [www.mpl.ch].
Deployable Rugged System Embeds 3U cPCI Boards, Rich I/OIn the time- and budget-constrained system development environment of today, military system developers need proven
operational computing solutions as quickly as possible. With that in mind, Curtiss-Wright Controls Defense Solutions (CWCDS) has announced the availability of its SYS-C365 Deployable Rugged System, a fully featured rugged COTS system for airborne platforms. The SYS-C365 is a compact, rugged Power Architecture (PowerPC)-based processing unit that provides a flexible array of I/O and standard multi-protocol communication channels. With no non-recurring engineering fees required
for standard SYS-C365 units, the system speeds and simplifies deployment of space/weight/power (SWaP)-constrained critical applications.
The SYS-C365 comes fully configured. Its three-slot 3U CompactPCI (cPCI) backplane supports a CWCDS DCP-124 SBC, a CWCDS DPMC-601 MIL-STD-1553 module, a dedicated discrete I/O module and a modular power supply. The system also
provides a spare 3U cPCI slot available for user configuration. The system communicates with other equipment via a variety of interfaces including MIL-STD-1553B, Gbit Ethernet, serial, USB 2.0 and a total of 51 discrete I/O lines.
The system supports an operating temperature range from -40° to +71°C, with specific emphasis on avionic requirements. It requires neither forced air-cooling nor cold-plate mounting. It supports hot starts at up to +85°C to enable immediate operation before air-conditioning brings the ambient down to +71°C. The SYS-C365 provides software support for the Wind River VxWorks 6.5 real-time operating system, enabling system integrators to write their own application software.
Curtiss-Wright Controls Defense Solutions, Ashburn, VA. (703) 779-7800. [www.cwcdefense.com].
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COTS PRODUCTS
Community-Based Development Kit Targets Xilinx Zynq-7000
A community-oriented development kit for the Xilinx Zynq-7000 Extensible Processing Platform (EPP) is targeted for designers and students who are interested in exploring and prototyping their application ideas for the new Zynq-7000 EPP architecture. Features of the ZedBoard include a Xilinx Zynq XC7Z020 EPP device with memory implemented as 512 Mbyte DDR3, 256 Mbit QSPI Flash and a 4 Gbyte SD Card. The ZedBoard also has onboard USB-JTAG programming. Interfaces include 10/100/1G Ethernet, USB OTG 2.0 and USB-UART plus PS & PL I/O expansion (FMC, Pmod, XADC). There is multiple display output capability in the form of 1080p HDMI, 8-bit VGA and 128x32 OLED and an I2S audio codec. The commercial version of the ZedBoard is available from Avnet for $395.
Avnet, Phoenix, AZ. (800) 409-1483.
[www.avnet.com].
2U Network Appliance Sports Core Processors, 28x GbE PortsA 2U rackmount platform designed for network service applications, the PL-
80460 from Win Enterprises supports single Intel 32nm i3/i5/i7 (code name Sandy Bridge) and Intel E3-xx processors. This is a modular system that will support 4 GbE LAN in its standard configuration, or up to 28 GbE in copper or 24 GbE in fiber, depending on OEM requirements. The front panel has one USB 2.0 port, one RJ-45 console port and LED indicators that monitor power and storage activities. The platform supports four unbuffered and non-ECC DDR3 1066/1333 MHz DIMM sockets with memory up to 32 Gbytes. Storage interfaces include two 3.5” SATA HDD and one CompactFlash. PL-80460 also supports one PCI expansion slot.
WIN Enterprises, North Andover, MA. (978) 688-2000. [www.win-ent.com].
FPGA-Based Ethernet Card Provides “Anything” I/O SolutionFPGAs have done a lot for military embedded computing systems, but they’re especially
useful for providing flexible I/O configurations. The MESA 7I80DB is a general purpose FPGA-based programmable industrial I/O card from MESA Electronics with a 100 BaseT Ethernet host interface. The 7I80DB is a remote Ethernet FPGA card that uses standard parallel port pinouts and four DB25 connectors for compatibility with most parallel port interfaced motion control / CNC breakout cards and multi-axis step motor drives, allowing a motion control performance boost while retaining a reliable Ethernet interface. Unlike the parallel port that the 7I80DB replaces, each I/O bit has individually programmable direction and function.
Open source FPGA firmware configurations are provided for hardware step/dir generation to 25 MHz, PWM generation, analog servo control, absolute (SSI and BiSS) and incremental encoder counting, real-time remote I/O, timing, event counting and high speed serial communication. All 68 7I80DB I/O bits are 5V tolerant. A jumper selectable PTC protected power option allows 1A of 5V power to be supplied to the external daughtercards. Four-layer construction is used to minimize radiated EMI and provide optimum ground and power integrity. A series of daughtercards is available for industrial motion control, CNC retrofit, high-speed real-time I/O, Analog I/O, RS-422 interfaces, encoder counting and other applications. The 7I80DB is available with two FPGA sizes, a XC6SLX16 (the 7I80DB-16) and a XC6SLX25 (the 7I80DB-25). Price of the 7I80DB-16 is $108 (100s). Price of the 7I80DB-25 is $122 (100s).
MESA Electronics, Richmond, CA. (510) 223-9272. [www.mesanet.com].
Top Load Socket Cuts Tooling Costs and Delivery TimesAries Electronics offers a top-load burn-in socket that saves significant time
and money (over conventional top-load sockets) for new IC pin-out designs. Aries’ new top-load socket enables designers to dramatically
reduce development and production costs that used to take up to three months and run over $30,000. Based
on a modular design, the new socket can easily be configured to accommodate devices on 0.3 mm pitch and higher, and can be employed on virtually any
SMT device including BGA, µBGA, QFN, LGA and bare dies as well as a number of other devices like those used
for MEMS testing with high acceleration rates. Contact forces are 15g per contact on a 0.30 mm to less than 0.40 mm pitch; 16g per contact on a 0.40 mm to less than 0.50 mm pitch, and 25g per contact on pitches of 0.50 mm or larger. Estimated contact life is a minimum of 500,000 cycles and operating temperature is -55° to +150°C (-67° to +302°F). Pricing for a top-load burn-in socket starts at $125.
Aries Electronics, Bristol, PA. (215) 781-9956. [www.arieselec.com].
COTS Journal | August 201268
COTS PRODUCTS
6U Dual-Power Backplane Provides Current Sense/Share Features
Pixus Technologies has announced a new power backplane with dual 47-pin connectors per PICMG 2.11 power interface specification in the 6U form factor. The power interface board has sense and current share signals to better regulate and distribute power. The new power interface board physical size comes in 6.5U or 6U height by 16HP wide, with two CompactPCI hot-pluggable slots using standard 47-pin connectors. The boards are designed for either AC or DC power to be supplied, including accommodations for rear power entry modules for 48V requirements. Wire harnesses are also available, providing +3.3V, +5V, +/-12V, GND and control signals between the backplanes. The sense lines help the power board efficiently regulate the power at the load end. The current share lines allow multiple power supplies to share current across the power backplane slots.
Pixus also offers power backplanes in single and dual 47-pin connector styles in both 3U and 6U heights. The company has additional power backplanes in sizes up to seven slots. Also, Pixus’ line of CompactPCI and VME64x backplanes have optional configurations that include pluggable 47-pin connectors in the same monolithic board. Pricing for the power interface boards starts at under $100, depending on configuration.
Pixus Technologies, Waterloo, Ontario, Canada. (519) 885-5775.
[www.pixustechnologies.com].
Network Processing Card Features Dual Xilinx 7 Series FPGAsNallatech is now shipping the PCIe-287N, a 7 Series FPGA network processing card that
features two Xilinx Kintex-7 FPGAs. The architecture of the PCIe-287N is well suited to a number of applications including real-time network filtering and high frequency trading. The two Kintex-7 FPGAs are directly coupled to four SFP+ ports supporting a range of Ethernet protocols including 1 and 10GbE, SONET and OTN. Each FPGA utilizes multiple independent banks of high-bandwidth, QDR-II+ SRAM and DDR3 SDRAM to support random access and deep storage. A third FPGA provides a PCI Express interface supporting sustained bandwidths up to 5 Gbytes/s.
Nallatech, Camarillo, CA. (805) 383-8997. [www.nallatech.com].
APU Provides Low Power, Extends Availability through 2017
The latest entry to the AMD Embedded G-Series processor family targets very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics. The
optimized design of the AMD Embedded G-T16R accelerated processing unit (APU) sips power, with consumption of just 2.3 watts on average or 4.5 watts thermal design power (TDP). The new AMD Embedded G-Series fits into small form factor boards by implementing a two-chip platform, the APU and its companion controller hub, and it offers legacy I/O card support based on a full 32-bit PCI interface and an ISA bus solution with DMA support. Along with the announcement
of the new AMD G-T16R APU, AMD is also extending the planned availability for the entire AMD Embedded G-Series processor family through 2017, resetting the five-year clock for both existing and new designs.
Advanced Micro Devices, Sunnyvale, CA. (408) 749-4000.
[www.amd.com].
6U CompactPCI Board Boasts Third Generation Core ProcessorA new 6U CompactPCI processor board sets new performance-per-watt marks for high-end applications. Based on the Intel QM77 Express Chipset
and scalable up to the quad-core third generation Intel Core i7-3615QE processor with 4 x 2.3 GHz (3.3 GHz in Turbo mode), the CP6004-SA from Kontron provides up to 20 percent enhanced computing power and increased performance per watt compared
to designs based on the second generation Core processors. Further advantages include the integrated HD 4000 graphics. OEMs and designers benefit from twice the HD media and 3-D graphics performance
by an improved user experience and stunning visuals. With support for DirectX 11, OpenGL 3.1, AVX and OpenCL 1.1, developers can now use the latest APIs to accelerate the development of their applications.
The power-optimized Kontron 6U CompactPCI processor board CP6004-SA is designed for high density, thermally constrained CompactPCI systems that require high
performance in a typical 60 watt or less power envelope. It is scalable with four processors from low-power dual-core variants up to extremely powerful quad-core technology to meet all individual
mission profiles and delivers outstanding data throughput and enables out-of-band communication through IPMI (Intelligent Platform Management Interface). Data protection is secured by the optional onboard Trusted Platform Module (TPM 1.2). In addition, there is a 6 Mbyte cache and up to 16 Gbyte of 1600 MHz DDR3 ECC SO-DIMM memory. The
CP6004-SA supports a configurable 64-bit/66 MHz PCI or PCI-X, hot swap CompactPCI interface.
Kontron, Poway, CA. (888) 294-4558. [www.kontron.com].
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August 2012 | COTS Journal 69
COTS PRODUCTS
3U CompactPCI Serial Board Transfers 5 Gbits/s on USB
A 3U CompactPCI Serial peripheral board incorporates four front-end USB 3.0 host interfaces, used to either connect fast USB 3.0 devices or to extend the 2.0 USB interfaces of the CPU board. On the G201 from MEN Micro, each port, connected via PCI Express, can handle data transfers of up to 5 Gbits/s per direction, which is a tenfold increase over USB 2.0 ports. This enhanced transfer speed makes the new G201 suitable for data-intensive applications, including connecting external storage media and devices such as high-speed cameras.
The board is not only fast but robust enough for harsh and mobile environments. Operating temperature is -40° to +85°C and it is prepared for conformal coating to protect against humidity and dust. When combined with a CompactPCI Serial or CompactPCI PlusIO CPU, the G201’s high data transfer rates meet an equally fast, serial-based, high-performance platform, making the resulting system a future-safe solution. Using the Standard-A connector for the USB ports, the 3.0 interfaces are backward compatible to USB 2.0 for additional system flexibility. Pricing for the G201 is $384.
MEN Micro, Ambler, PA. (215) 542-9575.
[www.menmicro.com].
DDR3L Modules Solve Double Refresh Rate ChallengeJEDEC stipulates that systems running memory beyond 85°C must double the memory self-refresh rate. Compared
to other current DDR3 designs, Virtium DDR3L memory modules are able to facilitate a considerable increase in system performance by removing the double refresh rate requirement. Virtium engineering solved this issue using a combination of its screening technique for lowest total electrical current (IDD), incorporating thermal-relief copper pour methodology PCB design, reducing the chip count and utilizing 1.35V DDR3L DRAM. Virtium DDR3L memory modules are available in 4 Gbyte and 8 Gbyte densities in a wide range of form factors including standard height, VLP and ULP low profile ECC SODIMM, RDIMM, UDIMM and Mini DIMM configurations.
Virtium Technology, Rancho Santa Margarita, CA. (949) 888-2444. [www.virtium.com].
Processor Enables On-the-Fly Reconfiguration in SpaceSpace-based systems have unique challenges, chief among them is that there’s no way to access a
system hands-on once it’s in orbit. Addressing just that issue, Atmel has announced the ATF697FF, the newest member of the Atmel SPARC V8 processor family and the industry’s first radiation-hardened (RAD Hard) high-performance aerospace microprocessor that can be reconfigured on-the-fly. The ability to reconfigure on-the-fly allows users to make on-going design modifications to satellites, including specification updates, in-flight adjustments during trial flights and post-launch alterations.
The new ATF697FF integrates Atmel’s proven RAD Hard AT697F processor and reconfigurable ATF280F (FPGA) unit in a single multichip module (MCM). With this MCM solution approach, engineers can reduce overall system cost and save space on the printed circuit board. The ATF697FF adds the flexibility of a reprogrammable FPGA to the reliability of a powerful core processor running application software. It is ideal for systems that require reconfiguration of peripherals and interfaces, making it easy to comply and stay up-to-date with evolving standards that are used on many space missions, such as SpaceWire, CAN or IEEE1553. The flexibility of the ATF697FF processor is also beneficial for late design modifications performed on Earth, for in-flight adjustments on satellites and for space trial operations.
The new solution combines an Atmel AT697F SPARC V8 RAD Hard processor with a RAD Hard ATF280F SRAM-based FPGA and an internal PCI link. The ATF697FF delivers best-in-class performance, running at up to 100 MHz, as well as low power, down to 0.7W, for space applications today. Atmel is currently engaging with alpha customers on the ATF697FF. The product is now available for prototyping and for flight model implementation at the end of 2012.
Atmel, San Jose, CA. (408) 441-0311. [www.atmel.com].
COM Module Features ARM Cortex-A8A feature-packed COM supports Samsung’s Exynos 3
Single S5PV210 1 GHz ARM Cortex-A8 processor as well as the PowerVR SGX540 for 3D and 2D graphics acceleration. The MXM-V210 from Embedian is combined with robust BSPs to enable OEMs to reach their product goals with minimal time and risk. Carrying the S5PV210 interfaces such as HDMI, USB 2.0, RS232, LCD, SD and LAN, the 232-pin COM interconnect also delivers a maximum performance of 1 GHz and ultra-low-power mode support.
Its integrated multimedia hardware codec supports various standards such as MPEG4, h.264 to full HD resolutions. The subsystem also enable users to significantly save on bill of material (BOM) costs as it eliminates the need for additional ASIC/FPGA.
Embedian, Taipei, Taiwan. +886 2 8712 9693. [www.embedian.com].
COTS Journal | August 201270
COTS PRODUCTS
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Programmable DC Power Supplies Boast Compact SizeTDK Corporation has announced that the new TDK-Lambda Z+ Series of programmable DC power supplies are now
available. These high-density, high-efficiency, 2U format, bench-top and rack mountable power supplies provide 400 watts of output power with an output voltage range from 0 to 100 VDC and output currents up to 40A. The Z+400 are 33% smaller and 40% lighter than the previous generation (ZUP series) and similar products, thus providing a 49% increase in power density.
The standard models are only 3.27” high by 2.76” wide, so up to six units can be installed in the optional 19” rack housing and blanking plates are available for unused slots. Later this year, 200W, 600W and 800W models with the exact same dimensions will be added to the Z+ Series. CE marked in accordance with the Low Voltage Directive, the Z+400 conducted and radiated EMI conforms to EN55022-B, FCC part-15-B, VCCI-B. Safety certifications include UL-, EN- and IEC61010-1, plus these units are designed to meet UL/EN60950-1. The Z+400 series are available now and priced from $1,460 each in 1-9 quantities.
TDK-Lambda Americas, San Diego, CA. (619) 628-2859. [www.us.tdk-lambda.com].
PXI DMM Features 6.5 Digit Measurement and 3 MS/s Digitizer
A 6.5 digit PXI digital multimeter (DMM) for high-performance measurement applications offers all of the capabilities associated with standard bench top DMMs including DCV, ACV, 2- and 4-wire resistance measurements and current measurements. Additionally, the GX2065 from Geotest features a 3 MS/s, 16-bit isolated input digitizer, which allows users to acquire and analyze waveforms. The GX2065 is supplied with a software package that includes a virtual instrument panel and Windows 32/64-bit driver libraries for ATEasy, LabView, LabView/Real-Time, C/C++, Microsoft Visual Basic, Linux 32/64, Delphi and Pascal. Compatible drivers for the Signametrics SMX2040 & SMX2060 DMMs are also supplied, allowing customers to easily upgrade existing applications to the GX2065. The GX2065 is priced at $1,895.
Geotest, Irvine, CA. (949) 263-2222. [www.geotest.com].
ARM9 System on Module for Full Range of HMIAn ARM9 System on Module supports both Linux and WinCE and
supports up to 1280 x 860 LCD with touch screen. The M-9G45A from Artila Electronics is a credit card size system on module powered by
400 MHz AT91SAM9G45 ARM Thumb Processor with memory management unit. It is equipped with 128 Mbyte DDR2 RAM, 128 Mbyte NAND Flash and 2 Mbyte DATAFlash. The touch screen feature makes users free to choose LCD size from 3.5” to 12” for their user interface design. M-9G45A also comes
with four UART ports, one 10/100 Mbit/s Ethernet, one USB 2.0 high-speed port, GPIO, SPI, I2C and I2S bus for your design of RS-232/485 communication, wired and wireless connectivity, audio I/O and digital I/O control.
Artila Electronics, New Taipei City, Taiwan. +886.2.86.67.23.40.
[www.artila.com].
Starter Kit Aids COM Express Type 6 Module DesignA new starter kit for COM Express Type 6 modules represents a complete, ready-to-run environment
for the new range of Computer-on-Module (COM) cards integrating the latest interface standard. The kit from MSC Embedded contains a COM Express Type 6 baseboard, a heat sink with fan and two 4
Gbyte DDR3 memory modules. Users of the kit are free to choose any suitable COM Express Type 6 computer module from MSC’s growing portfolio.
MSC has created the COM Express Type 6 starter kit around a Type 6 baseboard, providing an environment for computer modules implementing the new standard. The baseboard in the kit features the COM Express Type 6 module socket and a large number of peripheral connectors
supporting the most important computer interfaces. These include a PCI Express x 4 slot, an LPC bus on 10-pin header, 4x SATA connectors, 4x USB 3.0 interfaces (compliant with USB 2.0),
VGA and DVI connectors, 3x DisplayPort and 3x HDMI connectors as well as a 40-pin eDP (Embedded DisplayPort) connector.
The Ethernet connector supports 10/100/1000 Mbit/s signals, and there are 6x audio jacks and SPDIF connectors. In addition, a feature connector carries SMBus, I2C bus, a power and reset button, beeper, HD LED and other system signals, and
a 4-pin fan connector, which can drive and control the fan on the heat sink provided with the starter kit. The board is powered from a 20+4 pin ATX connector to be connected with a standard PC-type power supply. This carrier board may also be used as a Type 6 to Type 2 adapter card. It features two COM Express Type 2 module connectors soldered to the reverse side, which allow the board to be plugged into the module socket on the popular MSC CX-MB-EVA2 COM Express Type 2 baseboard. Single unit pricing is $495.
MSC Embedded, San Bruno, CA. (650) 616-6048. [www.mscembedded.com].
August 2012 | COTS Journal 71
COTS PRODUCTS
PCI/104-Express Board Series Supports CAN and LIN
Two new PCI/104-Express boards are designed specifically for use in compact industrial computers and mobile systems. The new PCI/104-Express variants from IXXAT are based on a highly modular architectural concept. In addition to a passive version for cost-sensitive applications, an active version with a powerful 32-bit microcontroller is offered. The active version is specially designed for use in applications with high demands for data preprocessing. Depending on the version, the PCI/104-Express boards are available with up to four CAN interfaces as well as with an optional switchable high-/low speed CAN interface and Local Interconnect Network (LIN) interface. All interfaces are galvanic isolated by default. In accordance with the requirements for industrial and mobile applications, the boards have an extended temperature range from -40° to +85°C.
IXXAT, Bedford, NH. (603) 471-0800.
[www.ixxat.com].
6-Slot MicroTCA System Fast Tracks Application DevelopmentConcurrent Technologies has announced the release of the latest addition to their range
of MicroTCA development systems. The SY AMC/235 is a free-standing 6-slot, single-width AdvancedMC (AMC) development system designed to fast track application development. To enable rapid development the SY AMC/235 comes pre-installed with a dual core processor SBC currently supporting the 2nd and 3rd generation Intel Core i7 processor with integrated high-performance graphics, an 8 Gbyte SATA flash drive, a MicroTCA Carrier Hub (MCH) and an optional Mass Storage AMC.
The SY AMC/235 is based on an EMC enclosure, incorporating an integrated power supply and cooling fans, providing the user with a total of six slots: one slot is reserved for the MicroTCA Carrier Hub (MCH); one slot is reserved for the system controller SBC; one slot supports an optional Mass Storage AMC. The remaining single-width slots can be populated with either two full-height or three mid-height AMC modules for system expansion. The backplane connects each of the five slots with the MCH via a PCI Express (PCIe) fat pipe on the data plane and two 1000 Base-BX (SerDes) links on the control plane.
Concurrent Technologies, Woburn, MA. (781) 933-5900. [www.gocct.com].
12.1-Inch Open Frame Panel PC Offers Full Touch ControlA 12.1-inch open frame, color flat panel PC uses a 1.66 GHz single board computer (SBC) based
on the Intel Atom processor. The PPC3-12 panel PC from WinSystems is a compact, ready-to-mount flat panel display subsystem that also includes a resistive touchscreen integrated into a chassis less than three inches deep. The open frame (i.e. without a front bezel) chassis permits flexible mounting of the system for OEMs and integrators with tight system integration and minimal space requirements. The PPC3-12 is shipped with a wired Ethernet connection plus expansion option for 802.11 wireless Ethernet and/or CDMA/GSM cellular modems. The unit will operate from -30° to +70°C without the need of a fan.
WinSystems offers a single core 1.66 GHz N455 and dual core 1.8 GHz D525 version of the SBC to serve as the computing and display engine for the Panel PC. Both SBCs support a full set of I/O interfaces including two Gigabit Ethernet ports, VGA and dual channel LVDS flat panel video, miniPCI connector to support wireless networking modules, eight USB 2.0 ports, four serial COM ports, 48 digital I/O lines, audio, LPT and PS/2 port for keyboard and mouse. The board also has PC/104 and PC/104-Plus connectors for support of additional off-the-shelf or user-designed specialty I/O modules. The system requires +12V and +5V DC and is RoHS compliant. The price configured with a 1.66 GHz single core N455-based single board computer and 2 Gbyte of system DRAM is $1,149.
WinSystems, Arlington, TX. (817) 274-7553. [www.winsystems.com].
High-Speed Storage System Targets Net Monitoring ApplicationsNetworking is a vital part of today’s military operations. A new platform for high-throughput
data recording applications provides very high sustained write-to-disk rates for solutions such as network forensics, application performance
optimization and deep packet analysis. The Nucleus RM Capture 16X3 from NextComputing offers 16 front-access removable 3.5” hard drives.
These drives are available in either SATA or SAS up to 3 Terabytes each for up to 48 Terabyte total
capacity. Additionally, the system has two more rear-access removable 2.5” hard drives, available as SATA, SAS,
or SSD up to 1 Terabyte each. These independent drives allow operating systems and applications to be installed on a separate
volume from the high-speed storage array, improving reliability and enabling maximum storage utilizing all sixteen front-access drives.
NextComputing, Nashua, NH. (603) 886-3874. [www.nextcomputing.com].
COTS Journal | August 201272
Index
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Microsoft Windows Embedded Evolve 2012 ........................................... 41 ........................ www.evolve2012tour.com
Nallatech, Inc. ....................................... 36 ...................................www.nallatech.com
Ocean Server Technology, Inc. ............. 50 ............................www.ocean-server.com
One Stop Systems, Inc. ......................... 45 .......................www.onestopsystems.com
Pentair Technical Products ................... 27 .........................................www.schroff.us
Pentek, Inc............................................. 76 ...................................... www.pentek.com
Phoenix International ............................. 4 ....................................www.phenxint.com
Pico Electronics, Inc. ............................ 21 ........................ www.picoelectronics.com
RTD Embedded Technologies, Inc. ........ 2 ..............................................www.rtd.com
RTECC ................................................... 73 ......................................... www.rtecc.com
SynQor .................................................. 35 ...................................... www.synqor.com
TE Connectivity ..................................... 34 .............................................. www.te.com
Themis Computer .................................. 30 ...................................... www.themis.com
Triple E Corporation .............................. 14 ................................. www.tripleease.com
VITA ....................................................... 51 ........................................... www.vita.com
Xembedded ........................................... 28 .............................. www.xembedded.com
Z Microsystems, Inc. ............................. 44 ...................................... www.zmicro.com
Company Page# Website
1553 Boards & PC/104 and PC/104 Family Boards Gallery ............. 53 ..................................................................
ACCES I/O Products, Inc. ..................... 22 .....................................www.accesio.com
Acromag ................................................ 16 ................................... www.acromag.com
ADLINK Technology, Inc. ...................... 29 ................................ www.adlinktech.com
Argon Corp ............................................ 47 ................................ www.argoncorp.com
Avionics Interface Technologies ............ 5 ..................................... www.aviftech.com
Azonix Corporation ............................... 49 .......................................www.azonix.com
Ballard Technology, Inc. ........................ 46 ............................... www.ballardtech.com
Calculex, Inc.......................................... 43 ....................................www.calculex.com
Calex Mfg. Co., Inc. .............................. 39 .........................................www.calex.com
Chassis Plans, LLC ............................... 25 .......................... www.chassis-plans.com
COTS Journal MILCOM2012 Embedded Pavilion ............................... 59 .....................www.cotsjournalonline.com
Crenlo Cab Products, Inc. ..................... 37 ....................................... www.crenlo.com
Critical I/O ............................................. 15 ................................... www.criticalio.com
Curtiss-Wright Controls Defense Solutions ................................. 23 .............................. www.cwcdefense.com
Data Translation, Inc. ............................ 75 .........................www.datatranslation.com
Elma Bustronic ....................................... 7 ...........................www.elmabustronic.com
Extreme Engineering Solutions, Inc. .... 33 ..................................... www.xes-inc.com
GE Intelligent Platforms, Inc. ................ 17 .........................................www.ge-ip.com
Innovative Integration ........................... 19 .........................www.innovative-dsp.com
Intelligent Systems Source ................... 57 .........www.intelligentsystemssource.com
Lauterbach ............................................ 42 ................................ www.lauterbach.com
LCR Electronics, Inc. ............................. 38 .......................................www.lcr-inc.com
Lind Electronics, Inc. ............................. 4 .......................... www.lindelectronics.com
Mercury Computer Systems, Inc. ......... 31 ............................................ www.mc.com
Microsemi Corporation ......................... 13 ................................ www.microsemi.com
Company Page# Website
COTS Journal | August 201272
Special Feature: Target Report: Processing Solutions for the Net-Centric Military A major portion of today’s U.S. military platforms is either directly or indirectly involved in communications or networking critical information between warf-ighters. The trend is toward every vehicle, every aircraft, every ship, every UAV and every soldier on the ground to be able to quickly share data, voice and even video with almost any level of the DoD’s operation. This section explores the display, computing and networking technologies that are all a part of a net-centric military.
Tech Recon: Rugged Laptops and Panel PCs in Defense Applications There’s been a major upward trend in the military toward systems that require sophisticated graphical user interfaces. Often in the form of rugged laptops and panel PCs, this is where the warfighter gets the complex situational awareness data—maps, video, images and text—interfaced directly to military weapons platforms on networks. This section explores the technology trends and capabilities of these mission-critical products.
System Development: Space-Qualified Electronics and Subsystems With the Space Shuttle program over and the commercial space industry taking the baton, the space electronics industry is certainly in a period of transition. Feeding those systems, space-based semiconductors and board-level systems must be capable of withstanding everything from intense radiation due to high-energy atoms to bombardments from neutrons and other particles. Articles in this section explore the radiation concerns facing space designers, and update readers on radiation-hardened boards and subsystems as well as ASICs, FPGAs and power components designed for those applications.
Tech Focus: Test and Instrumentation Boards For complex, high-performance military systems, the PXI bus form factor and its older cousin VXI have become staples as instrumentation and test solutions. Now the LAN-based LXI form factor is the latest stepchild in this space to emerge on the scene. This Tech Focus section updates readers on the latest trends in these technologies along with a focused product album of representative boards in these architectures.
Coming Next Month
COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 250, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices. POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 250, San Clemente, CA 92673.
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COTS Journal | August 201274
Jeff Child, Editor-in-ChiefEDITORIALCOTS
network operations. This also emphasizes why they must be co-ordinated to ensure they are applied to maximize effectiveness.
While the DoD has not yet published specific joint doctrine for cyberspace operations, it’s widely acknowledged that the threat is real. Without the proper safeguards, it’s possible for electromagnetic access to successfully penetrate the computer system. For example, an airborne weapons system could be used to deliver malicious code into cyberspace via a wireless connection. That would be character-ized as an “electronic warfare-delivered computer network attack.”
Meanwhile, the military service branches also have recognized the evolving relationship between electronic warfare and cyberspace operations. For example, to address future challenges, the U.S. Army Training and Doctrine Command conducted an assessment on how the Army’s future force will leverage cyberspace operations and found that the Army’s current vocabulary—including terms such as computer network operations, electronic warfare and information operations—will become increasingly inadequate. According to the Army, these terms are becoming outdated as the operational envi-ronment rapidly changes due to factors such as technologic conver-gence of computer and telecommunication networks, astonishing rates of technologic advancements, and the global proliferation of information and communications technology.
For its part, the Navy is first working to define the relationship between electronic warfare and electromagnetic spectrum opera-tions. The Air Force has its Instruction 10-706, Electronic Warfare Operations, which states that traditional electronic warfare capabili-ties are beginning to overlap with cyberspace areas. This is resulting in an increased number of emerging targets such as non-military leadership networks and positioning, navigation and timing net-works. Meanwhile, the message from U.S. Cyber Command officials is that it’s vital to understand how electronic warfare and cyberspace operations capabilities interact in an operational setting. Such in-formation could then inform the further development of doctrine.
As the DoD, and its various sub-elements, evolves its strategy for synching IT and EW, it’s clear that developers of military em-bedded systems for EW will need to keep pace with whatever cy-ber security and related technologies overlap into their domain. Now that the defense industry has entrenched its preference for Ethernet-based IP networks in both embedded systems and IT networks, there’s a lot of crossover already. It will be important to watch closely as the DoD updates its electronic warfare directives and policy documents to clearly manage the relationship between electronic warfare and information operations or electronic war-fare and cyberspace operations, specifically computer network operations. The marriage between them is here to stay.
Embedded computing technologies are central players in Electronic Warfare (EW) systems—everything from FPGA-based data acquisitions systems to spectral moni-
toring and multi-channel direction-finding electronics. Such systems rely on high-performance computing gear that can reconfigure and upgrade multi-mission profiles in real time—all technology areas squarely in the scope of COTS Journal’s coverage. In contrast, the IT (Information Technology) side of military operations—the sort of office-grade networking, cy-berspace warfare and related areas—is normally outside the do-main we cover. But as the worlds of electronic warfare and infor-mation technology begin to overlap, both are beginning to face challenges in coordinating and keeping pace with one another.
A recent GAO report addressed some of the issues ahead as the DoD refines its information operations to allocate electronic war-fare responsibilities. These efforts in oversight of electronic warfare capabilities can be complicated by the evolving relationship of EW with computer network operations, which is also an information operations-related capability. The goal is to ensure that all aspects of electronic warfare can be developed and integrated to achieve elec-tromagnetic spectrum control. To do so electronic warfare must be clearly and distinctly defined in its relationship to IT computer net-work operations—and the emerging domain of cyberspace.
In the DoD’s fiscal year 2011 electronic warfare strategy re-port to Congress, it delineated its electronic warfare strategy as having often co-dependent capabilities: traditional electronic warfare and computer network attack, which are part of cy-berspace operations. That said, many operations blur the lines between cyberspace operations and electronic warfare because of the continued expansion of wireless networking and the inte-gration of computers and radio frequency communications. EW capabilities may permit use of the electromagnetic spectrum as a maneuver space for cyberspace operations. For example, EW capabilities may serve as a means of accessing otherwise inac-cessible networks to conduct cyberspace operations, presenting new opportunities for offensive action as well as the need for de-fensive preparations. Some of that evolving relationship between EW and cyberspace ops is part of the DoD’s current joint doc-trine for electronic warfare, which was last updated in February.
That updated doctrine states that since cyberspace requires both wired and wireless links to transport information, both offensive and defensive cyberspace operations may require use of the electromagnetic spectrum for the enabling of effects in cyberspace. This highlights the complementary nature and po-tential synergistic effects of electronic warfare and computer
EW and IT: An Evolving Marriage
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