design of mosfet

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    RATING OF FUSE F1

    It is calculated as:

    Ip (max) = 3.13 xPout

    Vdc

    Pout = 640 W, Vdc= 2302 = 325V

    Ip (max) = 3.13 x

    = 6.16A

    => Fuse rating = 6.16/2=4.35 A

    640

    325

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    FILTER CIRCUIT

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    FILTER CIRCUIT

    EMI suppression capacitors.

    The capacitors C1, C2, C3 and C4

    are selected as per commonlyused EMC standards.

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    FILTER CIRCUIT

    ELECTROMAGNETIC COMPATIBILITY (EMC)is the branch that studies the unintentionalgeneration, propagation and reception of

    electromagnetic energy with reference to theunwanted effects (Electromagnetic interference)that such energy may induce.

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    EMI RATING/CLASSIFICATION For residential, commercial and light industrial

    environment we consider CLASS B EMI rating. Standard values of capacitors used as per class B rating

    are:

    Across line and neutral : 220 nF.

    Across line and ground : 10 nF.

    FILTER CIRCUIT

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    TYPES OF CAPACITORS AS PER SAFETY STANDARDS

    As per INTERNATIONAL STANDARD IEC 60384 14

    capacitors are classified based on impulse testing as: X1; impulse tested for 4KV.

    Y1; impulse tested for 8KV.

    X2; impulse tested for 2.5KV.

    Y2; impulse tested for 5KV. Similarly X3, Y3 for further lower voltages, which are not

    upto safety standards.

    FILTER CIRCUIT

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    FILTER CIRCUIT

    Thus we have used following capacitors inthe ckt as per suitability.

    C1 & C2; Type X2 Capacitance = 220 nF.

    C3 & C4; Type Y2 Capacitance = 10 nF

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    RECTIFIER DESIGN

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    RECTIFIER DESIGN

    Bridge rectifier circuit changes ACvoltage into DC voltage.

    It consists of diodes D1, D2, D3 andD4 as shown.

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    INPUT CAPACITOR C5

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    INPUT CAPACITOR C5

    Cin=

    Where is the attempted efficiency of the circuit,taken as 90%.

    2 is used for the waveform being sinusoidal.

    Po

    x fac [(2Vdc(min) )2 - ( Vdc(min))

    2 ]

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    INPUT CAPACITOR C5

    Cin=

    Cin= 134.64 x 10-6 F

    = 134.64 F.

    C5 = 220 F. ( since only 110 F, 220 F avl)

    640

    0.9 x 50 [(2 x 325)2 - ( 325)2]

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    MOSFET DESIGN

    As calculated earlier, Ip = 6.16A.

    So current across the MOSFET should be in excess of

    6.16A.Also breakdown voltage > 325V, since our dc bus is at

    325 V.

    After 325 V we assume that the is a faulty overvoltage

    at the input.

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    Range of voltage as per design is 230V to 270V.

    ie the voltage can exceed till a maximum value of

    2702 = 381V. MOSFETs available are:

    MOSFET having VDSS = 350V

    MOSFET having VDSS = 500V

    Since MOSFET shouldnt breakdown under 381VSo we have selected IRFP 460 having VDSS = 500V

    MOSFET DESIGN

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    IRFP 460 has drain current Id =20A, which is more than 6.16A.

    Also RDS ON= 0.27 RDS ON is the channel resistance between drain and source in

    ON state. It is also called the dynamic resistance. Power dissipation on ground.

    I2 R = (6.16)2 x 0.27= 10.24W

    For leakage inductance spikes which are sinusoidal in nature, whichcause a lot of unaccounted power loss, a multiplication factor of 2

    is used. Thus power dissipation per MOSFET = 10.24 x 2 = 14.48W Since two MOSFETs are used, total power dissipated = 28.96W.

    Heat sink is selected keeping in mind the above value.

    MOSFET DESIGN

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    TRANSFORMER SELECTION The mechanical size of a transformer depends on thepower to be transferred and on the operatingfrequency.

    Higher the frequency , smaller is the mechanical size. Transformer is designed as.

    Core selection.

    No of primary turns Np .

    No of secondary turns Ns .

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    CORE OF TRANSFORMER Material of the core is ferrite.

    The transformer core is selected from the TDK EI databook.

    Standard transformer selected ETD 39/20/13 as per therequired parameters:

    Frequency of operation for SMPS= 100KHz.

    Pout

    = 640 W.

    .

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    NUMBER OF PRIMARY TURNS This number determines the magnetic flux density

    within the core.

    Minimum number of primary turns are calculated as.

    Where :

    Ae : effective cross-section area of the core, this is wherethe flux density is maximum.

    B : is change of flux density.

    N1 min

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    (EFFECTIVE AREA OFCORE)

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    RATE OFCHANGE OF

    FLUX DENSITY

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    Calculation of maximum on time ie Ton (max)

    We have f= 100KHz.

    => T= 1/f = 1/100 x 103 = 10s. Now max value of Ton can be 50%.

    But at 50% operation core saturates, thus txr canbecome a short circuit, leading to a failure.

    So to avoid saturation a dead time of 10% is providedsuch that: Ton Max = (50 10)% = 40% of T. So we get Ton Max = 4 s.

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    N1 min 38 turns.

    Secondary turns N2 can be calculated as:

    N2= = 80 turns

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    SELECTION OF DIODES D9 AND D10 Both the diodes D9 and D10 are ultra fast diodes having

    trr = 70ns.

    => fmax

    = 1/70 x 10 -3 =0.014 x 109 = 14 MHz.

    Such diodes are selected to cater forovershoot/undershoot in freq, since time pd forringing freq is of the order of 125ns

    => fringing = 8MHz. Thus ultra fast diodes cater for overshoot/undershoot

    in freq.

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    SELECTION OF CAPACITORS C8, C9, C10 Ripple of not more than 5% is accepted.

    Vr = => 10=

    => C = = 1.6 x 10-6 = 1.6F.

    Idc

    2 f C

    10.2

    2 x 100 x 103 x C

    3.22 x 100 x 103 x 10