Die Attach Process

Die Picking

• Die can be directly picked from the wafer after the wafer sawing process.

• Die bonder are often equipped with ejector needle system to push against the backside of the wafer to eject the die.

• Computer controller vacuum pick-up tools are used to lift the dies

Epoxy Dispensing

• Die attach epoxy is dispensed in controlled volume by dispenser to the substrate

• The viscosity of the epoxy has to be controlled.

• The location of the dispensing is controlled computer with vision control

Die Placing

• The die pick-up arm of the die attach machine will send the die to the appropriate position and load the die on the substrate.

• Die bonding pressure has to be controlled.• The substrate may be heated to facilitate

partial curing of the epoxy die attach.

Epoxy Curing

• The die bonded substrate may need to send for curing in ovens to stabilize the polymer.

• There are fast curing epoxy and also UV cured epoxy to facilitate the process.