DALSA Semiconductor – Confidential & Proprietary 1

CCDCMOS Composition Analysis

ElectricalAnalysis

Inspection

MetrologyWafer Tape De-Tape

Wafer Grind

Wafer Stress Relief

Wafer CMP

Wafer Identification

Wafer Dicing

Wet Release

Dry Release

Self-Aligned Monolayer

Contamination

Non-Evaporable

Getter

Pre-Bond Outgassing

Bond Media

Wafer Bonder

Bond Cover

3D WLP

PECVD

SOG

Electroless UBM & Seal

Rings

Metal

Thermal Oxide

Low Stress SiN

Stress Relief Anneals

In-Situ Doped Silicon

Low Temperature

Oxide

Standard RIE

Oxide DRIE

Silicon DRIE

SOI DRIE

Metal, Nitride, Oxide Wet

Etch

Silicon Wet Isotropic

Silicon Wet Anisotropic

Microfluidics

Polymer Coat

Electrolytic BGA & Solders

HV CMOS

Polymer Strip

Polymer Develop

Polymer Expose

Membrane Transfer

Wafer Mount

3D & Roughness

LabAnalysis

CCDCMOS Composition Analysis

ElectricalAnalysis

Inspection

MetrologyWafer Tape De-Tape

Wafer Grind

Wafer Stress Relief

Wafer CMP

Wafer Identification

Wafer Dicing

Wet Release

Dry Release

Self-Aligned Monolayer

Contamination

Non-Evaporable

Getter

Pre-Bond Outgassing

Bond Media

Wafer Bonder

Bond Cover

3D WLP

PECVD

SOG

Electroless UBM & Seal

Rings

Metal

Thermal Oxide

Low Stress SiN

Stress Relief Anneals

In-Situ Doped Silicon

Low Temperature

Oxide

Standard RIE

Oxide DRIE

Silicon DRIE

SOI DRIE

Metal, Nitride, Oxide Wet

Etch

Silicon Wet Isotropic

Silicon Wet Anisotropic

Microfluidics

Polymer Coat

Electrolytic BGA & Solders

HV CMOS

Polymer Strip

Polymer Develop

Polymer Expose

Membrane Transfer

Wafer Mount

3D & Roughness

LabAnalysis