DALSA Semiconductor – Confidential & Proprietary 1
CCDCMOS Composition Analysis
ElectricalAnalysis
Inspection
MetrologyWafer Tape De-Tape
Wafer Grind
Wafer Stress Relief
Wafer CMP
Wafer Identification
Wafer Dicing
Wet Release
Dry Release
Self-Aligned Monolayer
Contamination
Non-Evaporable
Getter
Pre-Bond Outgassing
Bond Media
Wafer Bonder
Bond Cover
3D WLP
PECVD
SOG
Electroless UBM & Seal
Rings
Metal
Thermal Oxide
Low Stress SiN
Stress Relief Anneals
In-Situ Doped Silicon
Low Temperature
Oxide
Standard RIE
Oxide DRIE
Silicon DRIE
SOI DRIE
Metal, Nitride, Oxide Wet
Etch
Silicon Wet Isotropic
Silicon Wet Anisotropic
Microfluidics
Polymer Coat
Electrolytic BGA & Solders
HV CMOS
Polymer Strip
Polymer Develop
Polymer Expose
Membrane Transfer
Wafer Mount
3D & Roughness
LabAnalysis
CCDCMOS Composition Analysis
ElectricalAnalysis
Inspection
MetrologyWafer Tape De-Tape
Wafer Grind
Wafer Stress Relief
Wafer CMP
Wafer Identification
Wafer Dicing
Wet Release
Dry Release
Self-Aligned Monolayer
Contamination
Non-Evaporable
Getter
Pre-Bond Outgassing
Bond Media
Wafer Bonder
Bond Cover
3D WLP
PECVD
SOG
Electroless UBM & Seal
Rings
Metal
Thermal Oxide
Low Stress SiN
Stress Relief Anneals
In-Situ Doped Silicon
Low Temperature
Oxide
Standard RIE
Oxide DRIE
Silicon DRIE
SOI DRIE
Metal, Nitride, Oxide Wet
Etch
Silicon Wet Isotropic
Silicon Wet Anisotropic
Microfluidics
Polymer Coat
Electrolytic BGA & Solders
HV CMOS
Polymer Strip
Polymer Develop
Polymer Expose
Membrane Transfer
Wafer Mount
3D & Roughness
LabAnalysis
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