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Electronics Systems
From Chip to
System From Specification
to maintenability
Electronic
design and
manufacturing
Expertise &
Consultancy
in software
security
Expertise &
Consultancy in
Electronics
ASIC design and
Manufacturing
2
3 companies in France :
1 Company in Germany : since september 2009
Created in 1991 / On Alternext Market
Turnover 2010 : 56 M€
2 M€ investment / year
10 000 m² facilities
650 Engineers & Technicians
3
GmbH
&
Turnover per company - 2009 Turnover evolution
Turnover per field of activity
4
0
10
20
30
40
50
60
70
2005 2006 2007 2008 2009 2010 2011
2005
2006
2007
2008
2009
2010
2011
Serma Technologies
25,636%
Serma Ingenierie
26,336%
ID MOS7,6
11%
Serma GmbH 12,5
17%
► Quality reference:
- ISO 9001 V2008 on all offices
- Avionics : level B, accreditation PART 21G et PART 145, FAR 145
► R&D activities :
- High temperatures electronics, PCB technologies, diagnostics, MEMS…
- Member of more than 6 “Competitivity clusters” : Aerospace Valley, Minalogic,
Move’o, ASTech, Route des lasers (Alpha),…
°
°
° °
PARIS - ILE DE FRANCE Electronics Technology
Software Safety R&D
BORDEAUX Headquarters
Electronics Technology ITSEF
R&D
TOULOUSE Electronics Technology
R&D
GRENOBLE - Minatec
Electronics Technology
Micro-Electronics
UK Sales office
TUNISIA Electronics Technology R&D
BULGARIA, ASIA (partners)
SERMA Gmbh Sales offices
Nuremberg, Berlin, Cologne
°
ITALY Sales Office
CANADA Sales office
°
Electronics design and Modeling
Electronics equipment production and
maintenability
Working model : Work packages, services,
on-site, customized platforms
Staff: 200 people including 90%
Engineers & technicians
Means: 1000 m² of technical offices
Analyse
Evaluate
Control
The functional safety of your system
►Audit of development processes
►Secutiry Analysis (APR, AMDEC, FT…)
►Security files setup
►Specifications validation (system / software)
►Software FMDS Analysis (Critical code reading, Software AMDEC)
►Tests files setup, cover evaluation
Specialist in design and production of specific integrated circuits
► Digital, analog and Mixed ASICS.
ID MOS works within its offices in Gradignan, in Tunisia and some
partners in Bulgaria and Asia.
►Expertise & Consultancy on components, boards &
Systems.
►Test and physical analysis laboratories
►Training
►R&D partnerships on innovative technologies Our Means
►Staff: 150 including 90% Engineers & Technicians
►5000 m² of laboratories
►6000 expertises per year
►25 M€ Equipments
SERMA TECHNOLOGIES works within its offices and laboratories in Pessac,
Fontenay-aux-Roses, Grenoble and in Tunisia
• Technological Analysis
– Construction Analysis
– Physical and Chemical Characterization
– Critical Process Analysis (Construction analysis of the system)
– Integrated Circuit modification with “Focused Ion Beam” (FIB)
– Components batch securing
– DPAs
– Solderability tests
– PIND Test
• Failure Analysis
– Electrical and physical defect identification
– Failure mechanism understanding
– Corrective actions plan
Certified
- Optical microscopes (up to 2400 x 2400)
- Scanning Electronic Microscope with EDX system
- Castaing Microprobe (WDS)
- Micro-Fine X-Ray
- Acoustic microscope
- X-Ray Fluorescence
- Transmission Electron Microscope
- Polishing & micro-sections
- Wet etch and plasma dry etch
- Micro-probing
- Laser Cutter
- PIND Test
- Emission microscope
(EMMI, OBIRCH)
- Pull Test, Shear Test, Ball Shear Test
- Wetting balance (solderability test)
- Focus Ion Beam
Main testing devices
components batch securing
• Level 1
– External Visual Inspection
– X-Ray Inspection
– Chemical opening on one part &
Internal visual inspection
– Chip marking record
• Level 2
– Solderability test
– Scanning Acoustic Microscopy (SAM)
– I(V) Electrical Test
A simple offer, adaptable to your needs, and up to functional test (around 7000
test programs in SERMA’s Library).
Electrical test and characterization
- Development of test solutions
- Go / NoGo Test, Upscreening (7000 test programs in
our library)
- Parametric characterization (AC / DC, Functional)
- Qualification according to standards (ESCC, MIL,
AECQ100…) including radiation tests.
- Customized evaluation (non-standard specifications)
- ESD, Latch-up, Electromigration
Verigy Pinscale 93000
Main testing devices
Logics & Memories
- Verigy Pinscale 93000 (448 digital channels, 1800MSps)
- Schlumberger EXA ITS 9000 (256 pins, 100 MHz)
- Schlumberger EXA 3000 SOC mixed (280 pins, 200 MHz)
- Schlumberger S15 – 128 pins to 20 MHz (x 2)
- Sentry 1650 (256 pins, 20/40MHz)
Analogs & Mixed
- Teradyne A370
- HP 9472
- LTS2020
- Specific test benches for IGBT,MOS,ADC/DAC components under LABVIEW
software
Main testing devices
Actives , Passives & Specifics
- Eaton & HP 9470
- Applicos ATX 7002 : Test Station for components DAC et ADC
- Various test benches for L-R-C (HP4095, HP 4094)
- ESD (Keytek MK2-SE, 256 channels, Oryx Orion)
- Latch-Up (Oryx 11000EX, 384 channels)
- Semiconductor reliability (Quali Tau)
Environmental Tests
- Thermal cycles / Thermal shocks
- Temperature & humidity
- Pressure Cooker & Hast
- High-temperature storage, Burn-in,
- HALT (-100°C / +250°C ; 70°C / mn ; 70 g)
- HASS …
- Mechanical tests
More than 15 years of expérience in « Post
Programming Burn-in »
- 700 Devices
- 100 different designs
SERMA has ACTEL’s Accreditation (on AVL
« Approved Vendor List »)
Well known families: RT1280, RT14100,
RTSX32SU, RTSX72SU, RTAX250,
RTAX1000, RTAX2000, RTAX4000
One stop solution for full back-end production
• Physical Expertise
– Physical / Chemical Analysis
– Focused ion Beam imaging
– Transmission Electron Microscopy
– Atomic Force Microscopy
– Metallic and molecular contamination
– Sample preparation
• Electrical Expertise
– Circuit Edit with FIB
– ESD expertise (Tests, Consulting,
Audits, Protection design)
– Latchup characterization
– Electromigration
– Failure Analysis on IC
– Lifetime test
Industrialization Production
Preliminary
project Maintenability R&D
R&D Technologies et composants
Supply Chain Control and management of components
Quality Insurance Obsolescence, Components database, PPAP
Training Bring technologies / Quality culture and skills to your company
Qualification Components, process, boards, system
Specifications Functional analysis, mission profile
Benchmarking Analysis
Technological choices Technologies and components
Sub-contractors selection, Lean manufacturing, Audit Assistance
Reliability, robustness, Qualification, computation, DFR/DFT Plans
Field return, root causes research Capitalization
Robustness test
plen definition
Reliability Improvment Plan
Axis : Robustness Axis : Lifetime
Reliability test plan
defintion
Quality analysis of the
Components
Assembling
Robustness tests
management and
realization
Reliability tests
management and
realization
Audit process
d’assemblage
Mission profile analysis
Constraints identification
Risk Analysis :
Components technologies
Sensitivities identification
Axe : Process
Qualification test
plan definition
Axis : Qualification
Qualification tests
management and
realization
Risk Analysis :
Components
Assembling
« 4 Axis »
Method
• Objectives
– Sub –contractor qualification
– New products integration
– New technologies introduction
• For the customer:
– Quality and reliability improvment
– Mastery of manufacturers quality
– Upgrading your suppliers in adequacy with used technologies
– Manufacturing process improvment plan definition (can be at prototype phase)
– Support for supplier qualification and choice
• Activities
– Preparation
– Audit
– Synthesis and report
Analysis and monitoring of status of obsolescence and durability of your BOMs
• TECHNOLOGIES : Lead free…
• MANUFACTURING: Board and process
• AUDIT : Manufacturing lines
• FAILURE ANALYSIS
• TECHNOLOGICAL ANALYSIS
• SUPPLIER QUALITY INSURANCE: PPAP…
• CONTROL: IPC…
• RELIABILITY: MTBF, AMDEC…
• SMART CARDS
• SOFTWARE SECURITY AND RELIABILITY
Training