ENVISION HDI 7833 - INTERCONTIfiles.interconti.cz/200000651-4df224eeda/DMSE Training for Europe.pdf · ENVISION HDI 7833 Direct Metallization ... 8510 (flex) sweller pH 7 ! adhesive&adhesiveless

MAY 2017

ENVISION HDI 7833Direct Metallization with Conductive Polymerfor Rigid and Flex Printed Circuitry

A Platform Specialty Products Company. 2

ENVISION HDI

Polyimide & All Resin Conditioner 8511

Envision Catalyst 7833(steady state)

A Platform Specialty Products Company.

ENVISION HDI

Direct Metallization Alternatives to E’less Cu

- Pd Seeding� activation on dielectrics & copper curfaces� etch-back removal of activated copper surfaces

- Graphite- & Carbon Activation � activation on dielectrics & copper curfaces� etch-back removal of activated copper surfaces

- Intrinsic Conductive Polymer (ICP)� activation on Dielectrics Only


no deposition on IL/OL copper

• Selective Activation (HDI)- dielectrics only

laminate resinglass surfaces

• Non-Selective Activation- full hole wall

laminate resinglass reinforcementcopper surface

mandatory: copper microetch

ENVISION HDI


ENVISION HDI

Perfect Copper / Copper-Adhesion

�no innerlayer connectiondefects (ICD)

�excellent connection to capture pads

�high thermal stability.

�preferred withBlind Micro Vias (BMVs)

Selective Activation


ENVISION HDI reaction sketch

- activation on dielectrics only· selective MnO2 formation (initiator)

- polymerization of· monomer - EDT· sulfonic acid - HAPSS

EDT

HAPSS

- Mn²+ / H2O

MnO2

R - SO3- H+


ENVISION HDI

selective polymer formation

Step 1Conditioner

Step 2Initiator

Step 3Catalyst

selective EDT polymerization

on MnO2

ENVISION HDIConductive

Polymer film

uniform hole wall wetting /resin surface roughening

(PI)

selective coverage of resin

and glass

selective MnO2

formation on resin

and glass


Properties of the ICP-film

• appearance- uniform dark greenish to anthracite/darkblue- thickness approximately 100 nm

• characteristics- high mechanical stability - thermal stability (400°C)- conductivity approx. 0.001 S/cm

• stability- sensitive to chemical oxidation (or reduction)- marginal loss of conductivity- holdtime: best before one week

ENVISION HDI


MachiningPlasma / Desmear

(for MLB only)

Direct Metallization Cu Plating

PI Conditioner

8511

“STD” Alternative 7310/7311

Initiator

7320

Catalyst

7833Steady state mode

Polyimide activation /

adsorption only

(e.g. FR4)

MnO2 formation on resin Conductive Polymer

on Resin

Easy and Robust Process

Sub-Module 2 Sub-Module 3Sub-Module 1

ENVISION HDI


ENVISION HDI

CONDITIONER OPTIONS

� conditioner equipment: all standard-equipment, vertical or horizontal.

� ENVISION COND-7310 : micro vias (< 0.15 mm)blind microvias (< 120 µm Ø)

� ENVISION COND-7311 : broad laminate mix, including PTFE,high-Tg FR-4 etc., in particular with MV / BMV

� ENVISION COND 8511 : all polyimide materials, any laminate,rigid-flex layups


ENVISION HDI cond. systems

Conditioner system Components Comments

7310 A adsorbant (glass)

B wetting agent

Na2CO3

alkaline, historical conditioner

globally releasedappl preferred in Asia

(KSG/ABM only part A)

7311 7310 A

7310 B

H2SO4

CuSO4

acidic

globally released

higher MnO2 uptake

NaPS can be added (softetch)

8505 (flex precond) Enthone KOH/ reductor special flex jobs JCD,Redboard

8510 (flex) sweller

pH 7 !

adhesive&adhesiveless

ACE,JCD,Redboard

only Asia released

8511 (flex & all lams) reductor,NaOH

sweller

novel allround product

to be globally released


Features Attributes More Info

• engineeredchemistry and equipment

• single pass coverage

• no special req´s on tank & line • for all PI and any laminates

•standard conditioner temp. 45 oC• excellent coverage

• short process times • cost savings by low equipment

investment, less floor space• high productivity• reduced labor cost

• same dwell time as standard conditioner

• standard tank design• drops into existing horizontal and

vertical equipment• low start-up cost

• same conditions asstandard conditioner apply

Conditioner 8511 Process Features

ENVISION HDI


ENVISION HDI

ENVISION INITIATOR 7320

• ENVISION OXY-7320 - sodium permanganate: potassium optional

• Equipment- horizontal- vertical (with modifications)

• Process Parameters- temperature 80-90 °C (for flex / rigid-flex materials)- temperature 60-70 °C (for acrylic based flex materials)- NaMnO4 concentration 100 (90-110) ml/l- boric acid 10 (8-15) g/l- pH 5.5 (5.0-6.5) adjustment with H2SO4- dwell time: 3 – 4 min vertical / 55 - 70 s horizontal


Dielectric Activation with MnO 2

• factors of MnO 2 deposition

- laminate type- surface topography / morphology- initiator conditions (in descending order)

� temperature (exponential)� solution pH � immersion time� concentrations

• ICP Conductivity

- refrain from excessive / deficient MnO2 amounts(stick to control limits)

ENVISION HDI


MnO2 Determination- process test coupon in cond/initiator- dissolve MnO2

(5% H2O2/10% H2SO4, 2 mins)- Mn analysis by AAS or ICP.- calculate MnO2 deposit

Control limits MnO 2 amounts- 2-8 mg/dm2

Coupon Design - Dimension 5x5 cm- 400-800 holes (e.g. 0,3 mm Ø)

Calculation(AAS-figure [mg/l]) x (Volume [ml]) x 1.584------------------------------------------------------------ = mg/dm2 MnO2Number of holes x Hole area [dm2 ]

ENVISION HDI


ENVISION HDI

0

2

4

6

8

10

Influence of pH on Resistance and Lateral Cu-Growth

Resistance [ KOhm/inch ] 8,5 3,8 2,8 5,5

LCG [ mm/min ] 3,4 5,5 6,8 4,5

pH 8,5 pH 7,5 pH 6,0 pH 3,5

LCG:Lateral Cu Growth

Initiator pH and Conductive Layer Properties


2 Components - EDT Monomer: ENVISION CAT-7833 Part A / AR - Sulfonic Acid: ENVISION CAT-7833 Part B /BR

Operating Parameters- temperature 15-20 °C- 7833 A-concentration 20 (20-30) ml/l- 7833 B-concentration 30 (20-80) ml/l - pH 1.8-2.2 adjust with H2SO4- Dwell time: 180-360 s vertical / 90-120 s horizontal- Bath life : steady state mode

Full Process Control- EDT by UV-spectroscopy (254 nm)- oligomer by UV-spectroscopy (870 nm)- sulfonic acid by UV-spectroscopy (227 nm)

ENVISION HDI 7833 Catalyst


ENVISION HDI 7833 Catalyst (steady state)

Concentration


ENVISION HDI 7833 Catalyst (LCG,Oli,load))

LSL of LCG

Oligomer formation: a mere timely function (must: feed on idle times > 3 days)


plating time

15 s 30 s 60 s 90 s

Backlight check

ENVISION HDI


AP-9121 adhesiveless

FQ-9121 acrylic adhesive

FNC-121 epoxy adhesive

ENVISION HDI flex apps



Initiator temperature / solder float

After solder float test:

288 oC / 10 s

60 oC 80 oC 90 oC

AP



• Polyimide multilayer: flex or rigid-flex (acrylic- or epoxy- adhesives)

• Plasma treatment plus ENVISION HDI 7833

• Standard process parameters

A Platform Specialty Products Company.

Catalyst age 8 days

Seemless coverage

Catalyst age 8 days

Seemless coverage

PI ConditionerPI Conditioner

Catalyst age 8 days

Seemless coverage

PI Conditioner

24


reliability & performance

Attribute Details Value

• selectivecoverage of PI

• excellent Cu-Cu adhesion

• Full coverage of micro cavities,highly reliable copper deposition

• no attack of PI & adhesive• no attack of Cu• soft cleaning effect

• high conductivity • quick copper plating on PI

• high MnO2 adsorption (4 mg/dm³)• best conductivity (0.001 S/cm)

Clean without attack

PI CuCu



reliability & physical properties

Attribute Detail Value

• qualification

• passed thermal shock test(10 cycles: 288 +/- 5 oC @10s solder float )

• passed thermal cycle test(10 cycles: 255+/- 5 oC @30s molten salt, 15s water /RT

• no defects (cracks)

• no hole wall pull away

• no ICDs

• fastest LCG rate • highest reliability w/t all PI brands• extended catalyst bath-life

• passed back light test (D0)

• LCG: >7mm/min

passed10 x 10sec solder dip 288°C

10µm flash after5 min@2 ASD

passed back light test: D0


ENVISION HDI laminates processed

ENVISION® Initiator 7320 Operating Parameters

Resin System Temperature oC Dwell Time (s) Typical MnO2 mg/dm2

CEM-1/CEM-3 82-88 30-55 4-6

FR-4 (Tg 140 oC) 82-88 40-60 3-5

FR-4 (Tg 170 - 180 oC) 85-90 40-60 3-5

BT 85-90 50-115 2-4

GETEK® 85-90 50-115 2-4

PTFE 85-90 100-115 2-4

Polyimide 85-90 40-55 3-6

Polyimide/Acrylic Flex 60-70 30-50 4-8

All Polyimide Flex 85-88 40-60 2-4


ENVISION HDI process steps

Process Step Application Temperature MaterialsHeating

CoolingVent Filter Comments

COND-8511 Flood 40-65 oC Polypropylene Stainless Steel

Stainless Steel Heater/Cooling

YesPolypropylene

3-5 Turn/HourUltrasonic

City Water Rinse (Triple Cascade)

Spray 15-30 oC Polypropylene No No Option

IdleDrag-back Prevention

N/A Stainless Steel No Yes No Vent Demister

OXY-7320 Flood80-90 oC

60-70 oC (acryl)

Insulated Stainless Steel PTFE

Stainless Steel Heating

Stainless Steel

3-5 Turns/Hour

City Water Rinse (Recirc Overflow)

Spray 15-30 oC Polypropylene No No Option Low pressure

City Water Rinse (Triple Cascade)

Spray 15-30 oC Polypropylene No No Option Low pressure

CAT-7833 Flood 15-22 oC PolypropyleneStainless Steel Cooling

YesPolypropylene

3-5 Turns/HourUltrasonic

DI Water Rinse

(Double Cascade)Spray 15-30 oC Polypropylene No No Option

Drying Fluid Head™ 54-63 oC Polypropylene Stainless Steel

No No No


ENVISION HDI process equipment

line length ~ 25 mline speed 2.5 m / min


ENVISION HDI process equipment


• Dosing pumps (replenishment)

• bleed pump (PLC sync.)

Part A-R

4.5 l/100m2

Part B-R2.25 l/100m2

Catalyst tank= 450 l

Total dosing volume6.75 l/100m2

Bleed pumpPump rate ≅ 6.75 l/100m2

drain

ENVISION HDI steady state process


ENVISION HDI alternatives


ENVISION HDI alternatives

throughput at 15 m line length


ENVISION HDI chasing shadows

DMSE myths comment

• Hot permanganate required to

oxidize monomer to form film

• High temps incompatible with flex

adhesives on PI

• Applicable to fewer materials (i.e.

PTFE)

• Tends to microvoid on glass

• Limited conductivity giving

dogboning on high A/R panels

• Conductivity changes with time

• Difficult to protect IP

• Suggested for FR-4 and high layer

count

• No, permanganate forms MnO2

followed by separate catalyst step

(subsequent film forming)

• No, 60 – 70 oC Initiator window for

acrylics

• No, PTFEs for Bosch, Kathrein et al.,

all laminates processable

• Not with any sound PCB shop

• Bull****, complete copper coverage

after 90 sec of plating, best-in-class λ

• No, steady state catalyst 7833

• Have been, continues to be patented

2 novel patents granted/pending

• renowned and proven for any

laminate and technology


ENVISION HDI myths&reality @ 77 GHz


ENVISION HDI reliability








ENVISION HDI CARBON Difference % Savings

1 Number of Process Steps 3 5 2 40,00%

2 Foot Print (area layout) [m2] 105 155 50 32,26%

3 Cycle Time to Dry Film [minutes] 14 22 8 36,36%

4Process Equipment Investment [EUR]

(2.5 m/min , 30.000 m2/month)450.000 500.000 50.000 10,00%

5 Energy Usage (KW/m2) 0,02 0,03 0,01 20,00%

6 Equipment MaintenanceEase of maintenance

(9)

prone to contamination

(4)5 125,00%

7

Cu Consumption [kg/100 m2]

Carbon: Flash + Pattern 25 µm Cu @ 50%

area)

29,00 30,48 1,48 4,86%

8Non-proprietary chemical consumption

[EUR/m2]0,05 0,10 0,05 50,00%

9)Proprietary chemical consumption

[EUR/m2]1,20 1,20 0,00 0,00%

10Water Usage [tons/month]

month = 26 days780 1.040 260 25,00%

11 Waste Treatment [EUR/m2] 0,27 0,35 0,08 22,86%

12Yield (%)

for DS, 4/6L PWBs100,00% 98,50% 1,50% 1,52%

13Yield (%)

for HDI/Microvia product99,80% 97,00% 2,80% 2,89%

14 HDI line capacity (%) 100,00% 70,00% 30,00% 42,86%

9) COGS Envision < Carbon / Graphite

ENVISION HDI vs Carbon (VIU)


ENVISION HDI customer references


ENVISION HDI (some..) OEMs

AmazonAnadigicsAnaren Microwave AppleApplied Micro Circuits AstecASUSBBKBoschCanonCascade Micro Tech ChanghongConexantContinental DaikinDelco Ericsson FunaiGeneral Atomics Hewlett Packard

HisenseHuaweiIBMInfineon IntelKathrein KESKyocera L3 Communications LGLockheed Martin LudtkeMagneti MarelliMaxim MeidiNational Semiconductor NewisysNokia Northrup GrummanPanasonicPhilips

PrinarionQualcomm SamsungScientific Atlantic Sharp SiemensSilicon Wave SitronicSolarTRW UnidenUnisys VtechZTE

Documents

ENVISION HDI 7833 - INTERCONTIfiles.interconti.cz/200000651-4df224eeda/DMSE Training for Europe.pdf · ENVISION HDI 7833 Direct Metallization ... 8510 (flex) sweller pH 7 ! adhesive&adhesiveless